CN114425665B - Water-guided laser system and double-layer material cutting method - Google Patents
Water-guided laser system and double-layer material cutting method Download PDFInfo
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- CN114425665B CN114425665B CN202210133762.3A CN202210133762A CN114425665B CN 114425665 B CN114425665 B CN 114425665B CN 202210133762 A CN202210133762 A CN 202210133762A CN 114425665 B CN114425665 B CN 114425665B
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- 239000000463 material Substances 0.000 title claims abstract description 92
- 238000005520 cutting process Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000002101 nanobubble Substances 0.000 claims abstract description 62
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 52
- 230000008878 coupling Effects 0.000 claims description 26
- 238000010168 coupling process Methods 0.000 claims description 26
- 238000005859 coupling reaction Methods 0.000 claims description 26
- 239000007921 spray Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 81
- 238000000576 coating method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000010892 electric spark Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000002355 dual-layer Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The application discloses a water-guided laser system and a double-layer material cutting method, wherein the water-guided laser system comprises a bubble generator, and the bubble generator can generate micro-nano bubbles. When the water-guided laser device cuts or punches one layer of the double-layer material, the generated micro-nano bubbles are filled into gaps between the double-layer material by utilizing the bubble generator, and a plurality of concentrated laser beams penetrate one layer to the gaps and then are scattered or refracted by a large amount of micro-nano bubbles to form scattered laser beams with weakened energy, so that the other layer of material is protected from being burnt.
Description
Technical Field
The application relates to the technical field of cutting, in particular to a water-guided laser system and a double-layer material cutting method.
Background
Cutting is a mode of industrial appliance processing and has wide application, when one layer of some double-layer materials with gaps is cut, the other layer needs to be protected from being damaged, for example, an air film hole of an aircraft blade is processed, the aircraft blade is made of the double-layer materials, gaps are formed between the double-layer materials, a coating layer is arranged on the surface of the aircraft blade, and when the aircraft blade is cut, the process is required to be used for efficiently finishing one layer of cutting, but the other layer of material cannot be damaged.
In the prior art, common precision cutting methods include electric spark machining, femtosecond laser or picosecond laser, and water-guided laser. The electric spark machining has obvious thermal effect, the material with the coating cannot be cut, the coating is needed to be made after the material is cut, but the diameter of the air film hole is very small, and the cut small hole is easy to be blocked or the size of the small hole is easy to be changed after the air film hole is cut.
Femtosecond/picosecond lasers can directly process coated materials, but have obvious cone angles and recast layers, and the laser can directly irradiate another layer of material after penetrating through a cutting layer, so that the other layer of material is burnt.
The water guide laser is a novel laser processing technology for conducting laser by taking water as a medium, has the advantages of no taper angle, small thermal effect, large effective cutting depth, no recast layer and the like compared with the traditional laser cutting, has the advantages of small kerf, low energy consumption and good controllability compared with the traditional water jet cutting, and has important popularization and application prospects in the processing fields of metal materials, semiconductors, glass, ceramics, carbon fiber composite materials and the like due to the characteristics of the water guide laser, but the water guide laser can burn a coating of one layer of the double-layer materials after penetrating the other layer of the double-layer materials.
Disclosure of Invention
The application aims to provide a water guide laser system and a double-layer material cutting method, which are used for solving the problems in the prior art.
In order to solve the above-mentioned problems, according to an aspect of the present application, there is provided a water-guided laser system that can be used to cut one layer of material in a double layer of material with a gap therebetween, characterized in that the water-guided laser system includes:
a water-guided laser device for cutting one of the two layers of material;
and a bubble generator configured to generate micro-nano bubbles and to fill the gap between the two layers of material.
In one embodiment, the micro-nano bubbles generated by the bubble generator have a diameter of less than 300um.
In one embodiment, the flow rate of the micro-nano bubbles generated by the bubble generator is 0.1m 3 /h to 50m 3 /h。
In one embodiment, the power of the bubble generator ranges from 0.1kw to 30kw.
In one embodiment, the bubble generator further comprises a plurality of different sized nozzles for accommodating the different sized gaps.
In one embodiment, the water guided laser system further comprises a control module signally connecting the water guided laser device and the bubble generator and arranged to control operation of the water guided laser device and the bubble generator.
In one embodiment, the water guided laser apparatus includes:
a laser generator for emitting a plurality of concentrated laser lights;
the coupling device comprises a coupling cavity, a water inlet channel and a nozzle, wherein the coupling cavity is arranged in the light path direction of the plurality of laser beams gathered by the laser generator, the water inlet channel is communicated with the coupling cavity, the nozzle is connected with the coupling cavity, and the coupling cavity is arranged to couple the laser beams gathered and spray out through the nozzle.
The application also relates to a method for cutting a double-layer material, wherein a gap is formed between the double-layer material, and the method comprises the following steps:
s1, opening the micro-nano bubble generator in the claim 1, so that the micro-nano bubble generator fills micro-nano bubbles into gaps between double-layer materials;
s2, starting the water guide laser device in claim 1, and cutting one layer of the double-layer material.
In one embodiment, in the step S1, the flow rate of the micro-nano bubbles generated by the bubble generator is 0.1m 3 /h to 50m 3 /h。
In one embodiment, in the step S1, the power of the bubble generator ranges from 0.1kw to 30kw.
The water-guided laser system of the application comprises a bubble generator which can generate micro-nano bubbles. When the water-guided laser device cuts or punches one layer of the double-layer material, the generated micro-nano bubbles are filled into gaps between the double-layer material by utilizing the bubble generator, and a plurality of concentrated laser beams penetrate one layer to the gaps and then are scattered or refracted by a large amount of micro-nano bubbles to form scattered laser beams with weakened energy, so that the other layer of material is protected from being burnt.
Drawings
FIG. 1 is a schematic diagram of a water guided laser system according to one embodiment of the application.
Fig. 2 is a partial enlarged view of the region a in fig. 1.
Reference numerals: 100. a water-guided laser system; 1. a water-guided laser device; 11. a laser generator; 12. a coupling device; 121. a coupling cavity; 122. a water inlet channel; 123. a nozzle; 13. a plurality of concentrated lasers; 131. a divergent laser; 2. a bubble generator; 21. a spray head; 22. micro-nano bubbles; 200. a bilayer material.
Detailed Description
The preferred embodiments of the present application will be described in detail below with reference to the attached drawings, so that the objects, features and advantages of the present application will be more clearly understood. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the application, but rather are merely illustrative of the true spirit of the application.
In the following description, for the purposes of explanation of various disclosed embodiments, certain specific details are set forth in order to provide a thorough understanding of the various disclosed embodiments. One skilled in the relevant art will recognize, however, that an embodiment may be practiced without one or more of the specific details. In other instances, well-known devices, structures, and techniques associated with the present application may not be shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.
Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
In the following description, for the purposes of clarity of presentation of the structure and manner of operation of the present application, the description will be made with the aid of directional terms, but such terms as "forward," "rearward," "left," "right," "outward," "inner," "outward," "inward," "upper," "lower," etc. are to be construed as convenience, and are not to be limiting.
The present application relates to a water guided laser system 100, which water guided laser system 100 can be used to cut one layer of material in a bilayer material 200 without damaging the other layer of material. The gap between the two layers of material 200 is such that the water guided laser system 100 of the present application cuts any one layer of material without burning the other layer of material.
The water guided laser system 100 comprises a water guided laser device 1 and a bubble generator 2.
The water-guided laser apparatus 1 may be used to cut any one of the two layers of material 200, although it is also possible to cut one or more of the layers of material. The bubble generator 2 may generate micro-nano bubbles, and may also fill the generated micro-nano bubbles 22 into the gaps between the double-layered materials 200 to be cut. In use, the micro-nano bubbles 22 generated by the bubble generator 2 can be filled into the gaps between the two layers of material 200. When the water-guided laser is used for cutting one layer of material, a plurality of concentrated laser beams in the water-guided laser can penetrate one layer of material in the double-layer material 200 and then be projected onto the micro-nano bubbles 22 in the gaps between the double-layer material 200, after being scattered by the micro-nano bubbles 22, the concentrated laser beams 13 are refracted or scattered by different micro-nano bubbles 22 to form divergent laser beams 131, and the energy is reduced, so that the other layer of material is not damaged. In particular, the laser generates a large amount of energy only when the beam is very concentrated, i.e. the plurality of concentrated lasers 13 are able to generate energy to cut the material. The micro-nano bubbles 22 used in the application have smaller diameters, so that a large number of micro-nano bubbles 22 can be accommodated in the gaps between the double-layer materials 200, and after the laser 13 collected by the water-guided laser device 1 is scattered by the micro-nano bubbles 22, laser spots are diffused, so that the energy of the laser 13 collected by the laser is dispersed, the energy intensity is obviously reduced, and the second-layer materials are not damaged when the laser after multiple scattering is projected to the second-layer materials.
The bilayer material may be an aircraft blade having a bilayer structure with a coating on a surface thereof, and a gap between the bilayer structures of the aircraft blade. When the aircraft blade is cut and punched, the process requires high efficiency to cut one layer of air film holes with accurate size, the diameter of the air film holes is generally required to be between 0.2mm and 0.8mm, and the other layer of material cannot be damaged during cutting. In the prior art, the high-precision air film hole can be cut through electric spark machining, but the electric spark machining cannot cut the material with the coating, the aircraft blade material needs to be cut and then coated, but the diameter of the air film hole is very small, the cut air film hole is easily blocked or the size of the air film hole is easily changed through the coating after cutting, and the size precision of the air film hole cannot be guaranteed. The water-guided laser can process materials with coatings and can process high-precision air film holes, but has a thermal effect, and one layer of materials of the aircraft blade can be burnt when being cut.
The water-guided laser system 100 of the application can cut one layer of the aircraft blade to form the air film hole, and can ensure that the other layer of the material of the aircraft blade is not burnt. Specifically, the air bubble generator 2 is used for filling micro-nano bubbles 22 in the gap of the aircraft blade, then the water-guide laser device 1 is used for processing the air film hole on one side of the aircraft blade, the energy of a plurality of laser beams 13 which are gathered is greatly reduced when the laser beams reach the other layer after being refracted or scattered by a large number of micro-nano bubbles 22, the other layer of material can be protected from being burnt, and the water-guide laser device is used for processing the air film hole of the aircraft blade, so that the air film hole has no taper angle and no recast layer, and the diameter and the size of the air film hole are ensured to meet the requirements.
The micro-nano bubbles 22 are micro-scale and nano-scale water bubbles, which are generated when bubbles occur in water by using a physical principle, and may be called micro-nano bubbles 22, micro-bubbles or nano-bubbles according to the diameter range thereof. The diameter of the common water molecular group is 200-400um (micrometers), and the diameter of the micro-nano bubbles can be less than 50 micrometers, which is 2.5-10% of the common water molecular group. Because the volume of the bubbles reaches the nano level, the bubbles have the physical and chemical characteristics which are not possessed by the conventional macro-sized large bubbles, the specific surface area of the bubbles is increased by tens of thousands times, and the oxygen solubility in water can be further improved rapidly. Moreover, the micro-nano bubbles 22 have small volume, almost negligible buoyancy and can stay in water for a long time so as not to easily float up to the water surface to break. The micro-nano bubbles 22 rise slowly, can move laterally, upwards or downwards, can burst to release burst energy after being pressed, form smaller micro-nano bubbles 22, and can continuously exist in water.
The bubble generator 2 is used for injecting gas and liquid into the dissolved air tank from the bottom of the dissolved air tank respectively, mixing and stirring the gas and the liquid, so that the contact area of the gas and the liquid is increased, and cutting and crushing the volume of the gas by stirring, so that the volume of the gas is reduced to the micro-nano level. After the micro-nano bubbles 22 are filled into the gaps in the double-layer material 200, the micro-nano bubbles can stay in the gaps in the double-layer material 200 for a long time, when the water-guided laser device 1 cuts any layer in the double-layer material 200, a plurality of concentrated laser beams 13 penetrate into the gaps, a large number of micro-nano bubbles 22 are contacted, the energy scattered by the large number of micro-nano bubbles 22 is gradually decreased, a plurality of scattered laser beams 131 are formed after scattering or refraction, and when the scattered laser beams reach another layer of material, the energy of the scattered laser beams 131 hardly causes any damage to the other layer of material. And since the micro-nano bubbles 22 can stay in the water for a long time, the water-guided laser long-time cutting operation can be allowed after the micro-nano bubbles 22 are filled into the gap of the double-layered material 200. Of course, the bubbles may be filled while cutting.
It will be appreciated that the more the concentrated laser light 13 passes through a layer of bilayer material 200 to reach the interior of the gap of bilayer material 200, the more the energy is reduced after scattering or refracting by more micro-nano bubbles 22, the more the layer of material that is not cut is protected from burning. Thus, with a certain gap size between the bilayer materials 200, the smaller the diameter of the micro-nano bubbles 22, the more micro-nano bubbles 22 can be accommodated by the gap between the bilayer materials 200, preferably the micro-nano bubbles 22 have a diameter of less than 300um.
The power and flow rate of the bubble generator 2 are different, the power of the bubble generator 2 affects the speed of bubble generation and the size of the micro-nano bubbles 22, and in order to ensure that the size of the micro-nano bubbles 22 meets the requirements, the power of the bubble generator 2 is controlled to be 0.1kw to 30kw.
The flow rate of the bubble generator 2 will also affect the burst of micro-nano bubbles 22 and the duration of the bubbles, too large a flow rate will cause more micro-nano bubbles 22 to burst, not be present in the liquid, and smaller flow rates will affect the production rate. Preferably, the flow rate is controlled at 0.1m 3 /h to 50m 3 At/h, the micro-nano bubbles 22 can be ensured to continuously exist in the liquid, and the bursting rate of the micro-nano bubbles 22 is reduced.
In addition, the size of the gap between the different bilayer materials 200 may be different, and in order to increase the practicality of the water guided laser system 100, the bubble generator 2 may be configured with a plurality of different sized nozzles 21 for accommodating the different sized gaps. The shape of the head 21 may be set to be cylindrical or flat, without restricting the shape of the head 21.
Furthermore, in order to fully automatically control the water guide laser apparatus 1 and the bubble generator 2, a control module may be added to control the operation of the water guide laser apparatus 1 and the bubble generator 2. Specifically, the control module is in signal connection or electric connection with the water guide laser device 1 and the bubble generator 2, and controls the operation speed, power and operation time of the bubble generator 2, and can also control the power and cutting track of the water guide laser.
It can be appreciated that various sensors can be further arranged to sense the filling position of the micro-nano bubbles 22 and the flow rate of the micro-nano bubbles 22, the various sensors can be connected with a control module, the collected information is transmitted to the control module, and the control module can control the operation of the water-guided laser device 1 according to the information of the sensors.
The water-guided laser device 1 generally comprises a laser generator 11 and a coupling means 12. Wherein the laser generator 11 may be adapted to emit a plurality of concentrated laser light 13 and the coupling means 12 may receive the laser light emitted by the laser emitter and conduct it through the water beam. Specifically, the coupling device 12 includes a coupling cavity 121, a water inlet channel 122, and a nozzle 123, where the coupling cavity 121 is disposed in a direction of an optical path of a plurality of concentrated laser lights emitted from the laser generator 11, and the plurality of concentrated laser lights 13 can be coupled through the coupling cavity 121. The water inlet channel 122 is communicated with the coupling cavity 121, and external water flow can flow into the coupling cavity 121 through the water inlet channel 122. The nozzle 123 is connected to the coupling cavity 121, and the water flow can be ejected out through the nozzle 123 after passing through the coupling cavity 121. The multiple concentrated laser beams 13 are transmitted from the laser generator 11 to the coupling cavity 121 for coupling, and then can be ejected through the nozzle 123.
The application also relates to a method for cutting a double-layer material 200, wherein a gap is formed between the double-layer material 200, and the method comprises the following steps:
s1, opening the micro-nano bubble generator 2 to enable the micro-nano bubble generator to fill micro-nano bubbles 22 into gaps between the double-layer materials 200;
s2, starting the water guide laser device 1 and cutting one layer of the double-layer material 200.
The dual-layer material 200 may be made of various materials, such as metal materials, semiconductors, glass, ceramics, and carbon fiber composite materials, and any material that can be cut by the water-guided laser may be used in the cutting method of the present application, and the material of the dual-layer material 200 is not limited. It should be understood that the cutting method of the present application may also be adapted to multi-layer materials, and not only refer to two-layer materials, such as one or more layers of multi-layer materials to be cut, but also may be used to fill the micro-nano bubbles 22 between a layer to be cut and a layer to be protected from burn, as desired.
Wherein in the step S1, the size of the flow rate material gap of the micro-nano bubbles 22 generated by the bubble generator 2 is different and can be selectively controlled to be 0.1m 3 /h to 50m 3 /h。
In addition, in step S1, the power of the bubble generator 2 is controlled to be 0.3kw to 10kw.
The water guided laser system 100 of the present application includes a bubble generator 2, and the bubble generator 2 can generate micro-nano bubbles 22. When the water-guiding laser device 1 cuts or perforates one layer of the double-layer material 200, the bubble generator 2 is used for filling the generated micro-nano bubbles 22 into the gaps between the double-layer material 200, and a plurality of concentrated laser beams 13 penetrate one layer to the gaps and then are scattered or refracted through a large number of micro-nano bubbles 22 to form scattered laser beams with weakened energy, so that the other layer of material is protected from being burnt.
While the preferred embodiments of the present application have been described in detail, it will be appreciated that those skilled in the art, upon reading the above teachings, may make various changes and modifications to the application. Such equivalents are also intended to fall within the scope of the application as defined by the following claims.
Claims (1)
1. The double-layer material cutting method is characterized in that the water guide laser system is applied to the field of double-layer blade processing, a gap is reserved between the double-layer materials, the water guide laser system comprises a water guide laser device and a bubble generator, and the water guide laser device is used for cutting one layer of the double-layer materials; the bubble generator is configured to generate micro-nano bubbles and to fill the gaps between the bilayer materials; the diameter of the micro-nano bubbles generated by the bubble generator is smaller than 300um; the flow rate of the micro-nano bubbles generated by the bubble generator is 0.1m 3 /h to 50m 3 And/h, comprising the steps of:
s1, opening the bubble generator to enable the bubble generator to fill the micro-nano bubbles into gaps between the double-layer materials;
s2, starting the water guide laser device and cutting one layer of the double-layer material;
in the step S1, the power of the bubble generator ranges from 0.1kw to 30kw;
the bubble generator further comprises a plurality of spray heads with different specifications, wherein the spray heads with different specifications are used for adapting to the gaps with different sizes;
the water guide laser system further comprises a control module which is in signal connection with the water guide laser device and the bubble generator and is arranged to control the operation of the water guide laser device and the bubble generator;
the water-guided laser apparatus includes:
a laser generator for emitting a plurality of concentrated laser lights;
the coupling device comprises a coupling cavity, a water inlet channel and a nozzle, wherein the coupling cavity is arranged in the light path direction of the plurality of laser beams gathered by the laser generator, the water inlet channel is communicated with the coupling cavity, the nozzle is connected with the coupling cavity, and the coupling cavity is arranged to couple the laser beams gathered and spray out through the nozzle.
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Denomination of invention: Water guided laser system and double-layer material cutting method Granted publication date: 20231110 Pledgee: Bank of Shanghai Limited by Share Ltd. Pudong branch Pledgor: Shanghai Saika Pml Precision Mechanism Ltd. Registration number: Y2024310000200 |