CN106206549B - Chip and electronic equipment - Google Patents
Chip and electronic equipment Download PDFInfo
- Publication number
- CN106206549B CN106206549B CN201610375785.XA CN201610375785A CN106206549B CN 106206549 B CN106206549 B CN 106206549B CN 201610375785 A CN201610375785 A CN 201610375785A CN 106206549 B CN106206549 B CN 106206549B
- Authority
- CN
- China
- Prior art keywords
- chip
- storage circuit
- sensing
- electrostatic
- conducting piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005611 electricity Effects 0.000 claims abstract description 12
- 230000003068 static effect Effects 0.000 claims abstract description 10
- 238000004806 packaging method and process Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 14
- 238000005538 encapsulation Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000008280 blood Substances 0.000 description 2
- 210000004369 blood Anatomy 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000006213 oxygenation reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/4917—Crossed wires
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
The invention discloses a kind of chip and electronic equipments.The chip includes storage circuit and electrostatic conducting piece.The storage circuit is for storing data.The electrostatic conducting piece is arranged above the storage circuit, is used for static electricity discharge, to avoid electrostatic from causing to damage or damage the storage circuit, and the electrostatic conducting piece structure is simple, the cost of material is low.Correspondingly, the electronic equipment with the chip equally can avoid electrostatic and cause damage or damage to the storage circuit, and the electrostatic conducting piece structure is simple, and the cost of material is low.
Description
Technical field
The present invention relates to technical field of semiconductors more particularly to a kind of chips and electronic equipment.
Background technique
Currently, chip, such as biosensing device have been increasingly becoming the standard configuration of electronic equipment, particularly mobile terminal.It is raw
Object senser element, such as fingerprint sensing devices need user in contact with or close to biosensor when executing biological information sensing
Part, so that biosensing device can obtain sufficiently strong sensing signal.
However, static electricity on human body can be used for in biosensing device when user is in contact with or close to biosensing device
The storage circuit of storing data is caused to damage or be damaged, and biosensing device discrimination is caused to reduce or fail.
Summary of the invention
It can prevent electrostatic from storage circuit is caused to damage or be damaged in order to solve the above technical problems, the present invention provides one kind
Chip and electronic equipment.
The present invention provides a kind of chip, it is characterised in that: the chip includes:
Storage circuit, for storing data；With
Electrostatic conducting piece is arranged above storage circuit, is used for static electricity discharge.
In some embodiments, the electrostatic conducting piece is conducting wire.
In some embodiments, the chip includes the sensing face for receiving user's input, the electrostatic conducting piece setting
Between the sensing face and the storage circuit.
In some embodiments, the electrostatic conducting piece is for being connected directly or indirectly to ground, with static electricity discharge to ground.
In some embodiments, the storage circuit is the memory of ultraviolet light erasable.
In some embodiments, the storage circuit is one-time programmable memory or muptiple-use programmable deposits
Reservoir.
In some embodiments, the electrostatic conducting piece is positioned partially or entirely in the surface of the storage circuit.
In some embodiments, the chip includes bare die, and the storage circuit is arranged in the bare die, described quiet
Electrical conduction is positioned partially or entirely in the top of the bare die.
In some embodiments, when the electrostatic conducting piece is conducting wire, the both ends of the conducting wire are respectively positioned on described naked
On piece；Or, one end of the conducting wire is located on the bare die, the other end is located at the side of the bare die；Or, the two of the conducting wire
Opposite two sides of the bare die are arranged in end.
In some embodiments, the bare die further comprises substrate, pad, the first insulating layer and second insulating layer,
The storage circuit, the pad are respectively provided with over the substrate, and first insulating layer and second insulating layer setting exist
In the storage circuit, on the first insulating layer, first insulating layer is located at the storage circuit for the pad setting
Between the pad, the second insulating layer setting on the first insulating layer, and is set in the position of the correspondence pad
It is equipped with through-hole, the electrostatic conducting piece is connect by the through-hole with the pad.
In some embodiments, the chip further comprises packaging body, for encapsulating the bare die and the electrostatic
Conducting piece fills the gap between the bare die and the electrostatic conducting piece.
In some embodiments, the chip includes capacitive sensing chip, optical profile type sensing chip, ultrasonic type biography
One or more of sense chip.
The present invention also provides a kind of electronic equipment, including chip described in above-mentioned any one embodiment.
In some embodiments, the chip be used for sense user input biological information, the electronic equipment according to
The biological information correspondence that the chip is sensed controls whether to execute preset function.
Since the top of storage circuit is arranged in the electrostatic conducting piece in chip of the present invention, it is used for static electricity discharge, to keep away
Exempt from electrostatic and the storage circuit is caused to damage or be damaged, and the electrostatic conducting piece structure is simple, the cost of material is low.Correspondingly,
Electronic equipment with the chip equally can avoid electrostatic and the storage circuit caused to damage or be damaged, and the electrostatic conducts
Part structure is simple, and the cost of material is low.
Although multiple embodiments are disclosed, including its variation, by the way that explanation disclosed by the invention has shown and described
The following detailed description of embodiment, other embodiments disclosed by the invention will be readily apparent to those skilled in the art.It will
It recognizes, the present invention, which discloses, to be modified in various obvious aspects, and all modifications are all without departing from spirit of the invention
And range.Correspondingly, attached drawing and detailed description should substantially be considered as illustrative and not restrictive.
Detailed description of the invention
Its example embodiment is described in detail by referring to accompanying drawing, other feature of the invention and advantage will become brighter
It is aobvious.
Fig. 1 is the diagrammatic cross-section of one embodiment of bio-sensing module of the present invention.
Fig. 2 is the diagrammatic cross-section of another embodiment of bio-sensing module of the present invention.
Fig. 2 a is the top view of one embodiment of pin distribution mode of bio-sensing module of the present invention.
Fig. 2 b is the top view of another embodiment of pin distribution mode of bio-sensing module of the present invention.
Fig. 2 c is the top view of another embodiment of pin distribution mode of bio-sensing module of the present invention.
Fig. 2 d is the top view of another embodiment of pin distribution mode of bio-sensing module of the present invention.
Fig. 3 is the diagrammatic cross-section of another embodiment of bio-sensing module of the present invention.
Fig. 3 a is the top view of an embodiment of the electrostatic conducting piece set-up mode of bio-sensing module of the present invention.
Fig. 3 b is the top view of another embodiment of the electrostatic conducting piece setting of bio-sensing module of the present invention.
Fig. 4 is the diagrammatic cross-section of an embodiment of bio-sensing chip of the present invention.
Fig. 5 is the diagrammatic cross-section of another embodiment of bio-sensing chip of the present invention.
Fig. 6 is the diagrammatic cross-section of the another embodiment of bio-sensing chip of the present invention.
Fig. 7 is the perspective view of electronic equipment of the present invention.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein.On the contrary, thesing embodiments are provided so that the present invention will
Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.It is for convenience or clear,
It may exaggerate, omit or be schematically illustrated in every layer shown in the drawings of thickness and size and schematically illustrate related elements
Quantity.However, the size of element not exclusively reflects that the quantity incomplete reaction of actual size and related elements is practical in attached drawing
Quantity.Identical appended drawing reference indicates same or similar structure in the accompanying drawings.The component being represented by dashed line in attached drawing is entity
Internal component, the present invention describe corresponding technical solution for convenience and are drawn, and actually the dashed component is from the appearance
For the component that can't see.
In the description of the present invention, it is to be understood that: " multiple " are defined as two and two or more, unless otherwise clear
Specific to limit, accordingly, this definition is suitable for the terms such as " a variety of ", " a plurality of "." connection " can for electrical connection, mechanical connection,
It the numerous embodiments such as couples, be directly connected to and be indirectly connected with, remove the following special instructions of non-present invention, otherwise do not do especially
Limitation.In addition, the words such as " first " that occurs in each element title, " second " are not the sequencing for limiting element and occurring,
But named for convenience of element, each element is clearly distinguished, so that description is more succinct.
In the present invention, term " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal",
The orientation or positional relationship of the instructions such as "top", "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For the convenience of describing the present invention and simplifying the description, rather than the device or element of indication or suggestion meaning must have specific side
Position is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
In addition, described feature, structure can be incorporated in any suitable manner in one or more embodiments.
In the following description, many details are provided to provide and fully understand to embodiments of the present invention.However, ability
Field technique personnel will be appreciated that it is one or more in no specific detail, or using other structures, constituent element etc.,
Technical solution of the present invention can also be practiced.In other cases, known features or operation are not shown in detail or describe to keep away
Exempt from the fuzzy present invention.
Chip provided by the invention includes storage circuit, and in particular, the storage circuit is ultraviolet light (Ultraviolet
Rays) erasable memory.The memory of the ultraviolet light erasable is, for example, One Time Programmable (One Time
Program, OTP) memory, and the electronic equipment with the chip is at work, user needs in contact with or close to the core
Piece.Correspondingly, when the chip package, such as the electrostatic conducting piece being grounded by routing formation is in the storage circuit
Surface or across the top of the storage circuit, flow to the storage to absorb when user contacts the top of the chip
The electrostatic of circuit.
Citing ground, the chip include the input face for receiving user's input, and the electrostatic conducting piece is arranged in the input
Between face and the storage circuit.
The electrostatic conducting piece flows to the electrostatic of the chip when being used to absorb user in contact with or close to the input face.
The chip is, for example, one of capacitive sensing chip, optical profile type sensing chip, ultrasonic type sensing chip
Or it is a variety of.The capacitive sensing chip, optical profile type sensing chip, ultrasonic type sensing chip are, for example, above-mentioned bio-sensing core
Piece.So, the chip and it is confined to herein listed sensing chip, can also is the chip of other suitable types.
In the following, being illustrated by taking bio-sensing module, bio-sensing chip as an example.
Bio-sensing module provided by the invention is used to sense the biological information of target object input.Preferably, the life
Object sensing module is entirely formed in a bio-sensing chip (Chip).Specifically, the bio-sensing chip includes that biology passes
Feel bare die (Die) and electrostatic conducting piece.The bio-sensing bare die includes storage circuit, and the storage circuit is for storing number
According to.The data are, for example, the model etc. of the initialization data of the circuit in the bio-sensing chip, product.The electrostatic
Conducting piece is positioned partially or entirely on the bio-sensing bare die.Preferably, the electrostatic conducting piece is located at the storage circuit
Surface, lug boss or tip are formed in the top of storage circuit, and be connected directly or indirectly to ground, with static electricity discharge.
Further, the bio-sensing chip further comprises packaging body, for encapsulate the bio-sensing bare die and
Electrostatic conducting piece.The electrostatic conducting piece is between the bio-sensing bare die and the packaging body.The packaging body filling
Gap between the electrostatic conducting piece and the bio-sensing bare die.
One side surface of the packaging body make a living object sensing chip receive user input a side surface, define the encapsulation
The side surface that body receives user's input is sensing face.The electrostatic conducting piece is compared to the storage circuit closer to the sense
Survey face.When user is near to or in contact with the sensing face, the electrostatic conducting piece is released user's electrostatic, prevents electrostatic to storage electricity
It causes to damage or damage in road.
The electrostatic conducting piece is, for example, conducting wire, and the lug boss or tip are to be formed by routing.So, the electrostatic passes
Guiding element, which is not limited thereto, locates the conducting wire, can also be other shapes of conducting element.
The storage circuit is, for example, the memory of ultraviolet light erasable.The memory of the ultraviolet light erasable is, for example,
One Time Programmable (One Time Program, OTP) memory or/and it is muptiple-use it is programmable (Multi Time Program,
MTP) memory.So, it is not limited to which this, the storage circuit can also be the memory of other suitable types.The ultraviolet light
Erasable memory is the memory of other suitable types.
In the present invention, by taking bio-sensing chip is fingerprint sensor (Chip) as an example, storage circuit is generally arranged
In the fingerprint sensing bare die (Die) of fingerprint sensor, electrostatic is caused to damage or be damaged, fingerprint to storage circuit in order to prevent
Electrostatic conducting piece is arranged in sensing chip above the position of corresponding storage circuit, to absorb the electrostatic for flowing to storage circuit.Wherein,
The electrostatic conducting piece is, for example, metallic conductive element, so, is not limited to metallic conductive element.
It in particular, is ultraviolet light (Ultraviolet Rays) erasable memory for storage circuit, this sentences OTP
It is illustrated for memory, after fingerprint sensing bare die flow is returned, before being packaged into fingerprint sensor, needs
Fingerprint sensing bare die is tested, wherein need that data are written to otp memory to test its quality, when test OTP is deposited
Reservoir is the data of write-in otp memory when utilizing test before ultraviolet erasing after qualified product.Due to fingerprint
When sensing bare die is tested, ultraviolet light is needed to wipe otp memory, therefore, fingerprint sensing bare die itself is in correspondence
Hardware cannot be provided with above the position of otp memory.
When the fingerprint sensing bare die is encapsulated into fingerprint sensor (it should be noted that the fingerprint that the place is said passes
In sense chip and the not set electrostatic conducting piece) after, when user near to or in contact with the fingerprint sensor carry out fingerprint letter
When breath sensing, as not there is blocking for hardware and compared with vulnerable to damage caused by static electricity on human body above the otp memory
Wound or damage, scrap so as to cause the fingerprint sensor.
In view of the above technical problems, the present invention proposes encapsulating fingerprint after fingerprint sensing bare die is tested qualified
When sensing bare die is fingerprint sensor, electrostatic conducting piece is formed above fingerprint sensing bare die.Preferably, the electrostatic conduction
Part is located at the surface of otp memory or across otp memory.Next, encapsulating the electrostatic conducting piece using packaging body
With the bio-sensing bare die in one, bio-sensing chip is formed.To when user is conducted in contact with or close to electrostatic
When the bio-sensing chip of part, electrostatic conducting piece can absorb user introducing flow to the electrostatic of otp memory, to prevent electrostatic
Otp memory is caused to damage or be damaged.
In a specific embodiment, the both ends of the conducting wire are both formed on the bio-sensing bare die.
In still another embodiment, one end in the both ends of the conducting wire is formed on the bio-sensing bare die,
The other end is formed in the side of the bio-sensing bare die.
In still another embodiment, the both ends of the conducting wire are respectively formed at the two sides of the bio-sensing bare die.
Preferably, the both ends of the conducting wire are respectively formed at the opposite sides of the bio-sensing bare die.That is, the conducting wire is across described
Bio-sensing bare die.
It should be noted that when the one or both ends of conducting wire are formed in the one or both sides of bio-sensing bare die, it is described
The one or both ends of conducting wire are not formed on the bio-sensing bare die.For example, when bio-sensing chip uses ball bar battle array
When column encapsulation (Ball Grid Array Package, abbreviation BGA), the bio-sensing chip further comprises a circuit board,
The bio-sensing bare die and the electrostatic conducting piece are formed between the circuit board and the packaging body.The one of the conducting wire
End or both ends can be formed on the circuit board.
Due to bio-sensing chip packaged type there are many, for example, quad flat non-pin package (Quad Flat
No-lead Package, abbreviation QFN), accordingly, the bio-sensing chip may not include the circuit board, but in biology
Lead frame (Frame) is formed with around sensing bare die.
The bio-sensing module includes fingerprint sensing module, blood oxygen sensing module, heartbeat sensing module, pressure sensing mould
One of block, humidity sensor module, temperature sensing module, iris sensing module are a variety of.Correspondingly, the biological information packet
Include one of finger print information, blood oxygenation information, heartbeat message, pressure information, humidity information, temperature information, iris information or more
Kind.
The finger of the target object for example user, can also be user's body other parts, as eyes, heartbeat, palm,
Toe, ear etc., or be the combination of any several parts on aforementioned user's body, or even can also be the object of other suitable types
Body, and it is not limited to human body.
In the following, carrying out the further specific understanding present invention incorporated by reference to attached drawing.
Referring to Fig. 1, Fig. 1 is the diagrammatic cross-section of one embodiment of bio-sensing module of the present invention.The bio-sensing mould
Block 100 includes sensing unit 10, storage circuit 20, pad 30 and electrostatic conducting piece 40.
The sensing unit 10 be used for sense target object near to or in contact with when biological information.The storage circuit 20 is used
In storing data.The initialization data of circuit of the data for example including bio-sensing module 100, product type etc..Institute
Pad 30 is stated for being connected directly or indirectly to ground.The pad 30, can also position for example around the storage circuit 20
In the top of the storage circuit 20.In the present embodiment, the pad 30 is set to the top of the storage circuit 20, is located at
The outside of the storage circuit 20.The electrostatic conducting piece 40 is connect with the pad 30.The electrostatic conducting piece 10 is for letting out
Electrostatic discharge is extremely.Describedly be, for example, application the bio-sensing module 100 electronic equipment 400 (see Fig. 7) systematically or
Equipment, usually it is loaded as 0V (volt) voltage.When the pad 30 is indirect earthed, such as it can be grounded by modulation circuit, or
Be grounded by power supply etc..
The extension mode of the electrostatic conducting piece 40 is not limited to as shown in Figure 1: after being electrically connected pad 30 by the weldering
For disk 30 toward extending above the storage circuit 20, the extension mode of the electrostatic conducting piece 40 can also be for after being electrically connected pad 30
It is extended vertically upwards by the pad 30.In addition, the extension mode of the electrostatic conducting piece 40 can also be other suitable extensions
Mode.
The electrostatic conducting piece 40 is conducting wire, and the conducting wire is metal wire, and the material of the metal wire is, for example, gold, copper or aluminium
Deng it is, of course, also possible to be other suitable materials.The conductor structure is simple, and material utilization amount is few, reduces material cost.In addition,
The electrostatic conducting piece 40 also and is limited as conducting wire, can also be the conducting element of other suitable shapes.
Further, the conducting wire has the lug boss 41 higher than the storage circuit 20.The storage circuit should be higher than
20 lug boss 41 is formed by routing.The lug boss 41 is in pointed shape or arc, to guide user using lightning rod principle
To 41 release electrostatic of lug boss, the electrostatic is then introduced by ground terminal by the pad 30, to prevent electrostatic to described
Storage circuit 20 is caused to damage or be damaged.
The pad 30 can be one or more.The material of the pad 30 for example including aluminium, copper, Au Ag Pt Pd,
One or more of nickel etc..Certainly, 30 material of pad can also be other suitable materials.
In the present embodiment, the storage circuit 20 is ultraviolet light (Ultraviolet Rays) erasable storage
Device.The memory of the ultraviolet light erasable be, for example, One Time Programmable (One Time Program, OTP) memory or/
With muptiple-use programmable (Multi Time Program, MTP) memory.So, it is not limited to this, the storage circuit 20
It can be the memory of other suitable types.The memory of the ultraviolet light erasable is the memory of other suitable types.
The bio-sensing module 100 can further comprise the first insulating layer 50, which is arranged described
The top of storage circuit 20 and sensing unit 10.The pad 30 is set to the top of the first insulating layer 50.So, in other embodiment party
In formula, first insulating layer 50 may also be arranged on the top of one of the storage circuit 20 and sensing unit 10 person.And or
Person, first insulating layer 50 omit, and the pad 30 is arranged in around storage circuit 20.
- Fig. 2 d referring to Figure 2 together, Fig. 2 are the diagrammatic cross-sections of another embodiment of bio-sensing module of the present invention.Fig. 2 a
It is the top view of one embodiment of pad distribution mode of bio-sensing module of the present invention.Fig. 2 b is bio-sensing module of the present invention
The top view of another embodiment of pad distribution mode.Fig. 2 c is another implementation of pad distribution mode of bio-sensing module of the present invention
The top view of example.Fig. 2 d is the top view of another embodiment of pad distribution mode of bio-sensing module of the present invention.
As shown in Fig. 2, the pad 30 includes the first sub- pad 31 for being arranged in around the storage circuit 20 and the
Two sub- pads 32, for receiving ground signalling.The both ends of the electrostatic conducting piece 40 respectively with the described first sub- pad 31, institute
The second sub- pad 32 is stated to be electrically connected.
The mode of the first sub- pad 31, the second sub- pad 32 for ground connection can be the described first sub- pad
31, one or both of described second sub- pad 32 is directly as ground terminal, is also possible to the described first sub- pad 31, described
One or both of second sub- pad 32 is electrically connected with the ground terminal of the storage circuit 20 or the sensing unit 10, may be used also
To be one or both of the described first sub- pad 31, the second sub- pad 32 and be systematically electrically connected.It is of the present invention
First sub- pad 31, the second sub- pad 32 earthing mode do not limit to the listed mode being grounded herein, can also be other
The mode being suitably grounded.
The first sub- pad 31 and the second sub- pad 32 be respectively arranged on any two sides of the storage circuit 20 with
Make the electrostatic conducting piece 40 across the top of the storage circuit 20, for example, the first sub- pad 31 and second son
Pad 32 is respectively arranged on the adjacent two sides of the storage circuit 20 or opposite two sides etc..Citing ground, as shown in Figure 2 a, described the
One sub- pad 31 and the second sub- pad 32 are respectively arranged on the adjacent two sides of the storage circuit 20 so that the electrostatic conducts
Part 40 is across the storage circuit 20.As shown in Figure 2 b, the described first sub- pad 31 and the second sub- pad 32 are symmetrically set in
The two sides of the storage circuit 20 so that the electrostatic conducting piece 40 across the storage circuit 20.
As shown in Figure 2 c, ground is changed, the first sub- pad 31 and the second sub- pad 32 can also be respectively arranged on
The storage circuit 20 it is diagonal.
As shown in Figure 2 d, ground is changed, the first sub- pad 31 and the second sub- pad 32 can also be spaced and be set to
The side of the storage circuit 20, without being respectively arranged on the two sides of the storage circuit 20.
Ground is changed, in other embodiments, the described first sub- pad 31 can also be set in the storage circuit 20
One jiao, the second sub- pad 32 be set to the storage circuit 20 side.In Fig. 2, Fig. 2 b, Fig. 2 c, first son
Pad 31 is set between the storage circuit 20 and the sensing unit 10, changes ground, in other embodiments, described first
Sub- pad 31 may also be arranged on the top of storage circuit 20 or the sensing unit 10 described in face.
The sub- pad 31 of of the invention described first, the second sub- pad 32 distribution mode do not limit to above-mentioned distribution
Mode can also be other suitable distribution modes, such as the first son weldering is respectively set in the two sides of every two or three circuits
Disk 31 and the second sub- pad 32.Accordingly, described two or three circuits be correspondingly arranged an electrostatic conduct piece 40 with
Respectively with the described first sub- pad 31 and the second sub- pad 32.
It should be noted that the profile of bio-sensing module 100, the storage circuit 20 and the sensing unit 10 is not
It is limited as the rectangle shown in Fig. 2 a- Fig. 2 d, may be the shape of the rule such as square, hexagon, octagon, also
It can be irregular shape or other suitable shapes.In addition, the first sub- pad 31, the second sub- pad 32 are not yet
Limit to circle shown in Fig. 2 a- Fig. 2 d, is also possible to the shape of the rule such as square, rectangle, can also be irregular
Shape or other suitable shapes.
It is the diagrammatic cross-section of another embodiment of bio-sensing module of the present invention also referring to Fig. 3-Fig. 3 b, Fig. 3.Fig. 3 a
It is the top view of an embodiment of the electrostatic conducting piece set-up mode of bio-sensing module of the present invention.Fig. 3 b is that biology of the invention passes
Feel the top view of another embodiment of the electrostatic conducting piece setting of module.
The electrostatic conducting piece 40 can be one or more.It is described a plurality of when the electrostatic conducting piece 40 is a plurality of
The setting of the interval of electrostatic conducting piece 40.The interval can be the interval on vertical plane, be also possible to the interval on horizontal plane.Citing
Ground, if Fig. 3 is projection formation interval setting of a plurality of electrostatic conducting piece 40 in vertical plane；If Fig. 3 a is a plurality of electrostatic conducting piece 40
Interval setting is formed in the projection of horizontal plane.It is deposited it should be noted that every electrostatic conducting piece 40 in Fig. 3 is relatively described
The height on storage road 20 is different, however, its shape, size can be identical, naturally it is also possible to not identical.Described in every in Fig. 3 a
The length that electrostatic conducting piece 40 projects in the horizontal plane is identical, however, its physical length, shape, size, highly can be phase
Together, it is also possible to not identical.
The a plurality of electrostatic conducting piece 40 can arrange in array, as matrix form is arranged.It certainly, can also be in Else Rule side
Formula or non-regular arrangement.However, changing ground, as shown in Figure 3b, a plurality of electrostatic conducting piece 40 can also staggeredly be set
It sets.
It should be noted that the electrostatic conducting piece 40 in Fig. 3-3b only draws two as an example, it is a plurality of in practice
Electrostatic conducting piece 40 does not limit to two, is also possible to two or more.Correspondingly, the first sub- pad 31 and the second sub- pad 32
Quantity is corresponding to be increased.In addition, 40 set-up mode of electrostatic conducting piece of the present invention does not limit to above-mentioned set-up mode yet, may be used also
For other suitable set-up modes.
Referring to Figure 2 together and Fig. 4, Fig. 4 be bio-sensing chip of the present invention diagrammatic cross-section.The present invention provides one kind
Bio-sensing chip 300.The bio-sensing chip 300 includes the bio-sensing module 100 of above embodiment.
The bio-sensing chip 300 includes bio-sensing bare die 200 and the electrostatic conducting piece 40.The electrostatic conduction
Part 40 is arranged on the bio-sensing bare die 200.
The bio-sensing bare die 200 includes storage circuit 20.Preferably, the electrostatic conducting piece 40 is partly or entirely set
It sets in the surface of the storage circuit 20, for static electricity discharge to ground.
The bio-sensing bare die 200 further comprises substrate 310, sensing unit 10, the insulation of the first insulating layer 50, second
Layer 60 and pad 30.The storage circuit 20 is arranged on the substrate 310.First insulating layer 50 and described second is absolutely
Edge layer 60 is arranged in the storage circuit 20.The storage circuit 20 is located at the substrate 310 and first insulating layer 50
Between.The pad 30 is arranged on the first insulating layer 50.The second insulating layer 60 is arranged on first insulating layer 50,
And the position of corresponding pad 30 is provided with through-hole H.The electrostatic conducting piece 40 is connected by the through-hole H and the pad 30
It connects.The substrate 310 is, for example, semiconductor substrate, the semiconductor substrate for example silicon substrate.The substrate 310 for example can also be
The substrate of other suitable types, for example, insulating substrate.
The second insulating layer 60 covers the storage circuit 20, citing ground, which can only cover institute
Storage circuit 20 is stated, can continue to extend with toward above the sensing unit 10 while covering the sensing unit 10, at this time
It can prevent bio-sensing bare die 200 from causing mechanically or chemically to injure during being packaged into bio-sensing chip 300.
The bio-sensing chip 300 of the invention may include single bare die, may also comprise more bare dies.Citing ground,
When the bio-sensing chip 300 includes single bare die, the storage circuit 20 is formed in the bio-sensing bare die 200
In；When the bio-sensing chip 300 includes more bare dies, the storage circuit 20 may be separately formed a storage bare die,
And be arranged except the bio-sensing bare die 200, correspondingly, the first insulating layer 50 and second can be not provided on bare die 30 by storing
Insulating layer 60, a pad 30 may be formed on bio-sensing bare die 200, and a pad is formed on circuit board 330 (seeing below), and
Positioned at it is described storage bare die left side, electrostatic conducting piece 40 across it is described storage bare die top, or, be located at storage bare die
The pad 30 of two sides is both formed on circuit board 330.
The number and generation type of bare die included by the bio-sensing chip 300 do not limit to above-mentioned cited number
And generation type, it can also be other suitable numbers and generation type, for example, when the bio-sensing chip 300 includes two
When bare die, the storage circuit 20 can also be formed in a control bare die (not shown), and the control bare die is for controlling institute
It states bio-sensing bare die 200 and executes sensing function.
It should be noted that the bio-sensing module 100 in bio-sensing chip 300 of the present invention is more above-mentioned variable
It anticipates bio-sensing module 100 described in an embodiment, is not limited to the bio-sensing module 100 of above-mentioned Fig. 2 embodiment.
Please continue to refer to Fig. 4, the bio-sensing chip 300 can further comprise circuit board 330 and packaging body 320.Institute
Bio-sensing bare die 200 is stated to be arranged on the circuit board 330.The packaging body 320 encapsulates 200 He of bio-sensing bare die
The electrostatic conducting piece 30 is in the bio-sensing chip 300.Wherein, the packaging body 320 fills the electrostatic conducting piece
Gap between 30 and the bio-sensing bare die 200, so that the electrostatic conducting piece 40 is fixed in the packaging body 30.
The material of the packaging body 320 is, for example, epoxy resin material or other insulating materials.The circuit board 330
For example printed circuit board.
The encapsulation step of the bio-sensing chip 300 is for example are as follows: the bio-sensing bare die 200 is first electrically connected to institute
State circuit board 330；Then the both ends of the electrostatic conducting piece 40 are connected between two pads 30 by routing mode；It again will carrying
The circuit board 320 of the bio-sensing chip 300 is placed in the injection mold equipped with epoxy resin material；Finally mold with
Plastic packaging is carried out to the intracorporal bio-sensing chip of mold cavity 300.However, the encapsulation of bio-sensing chip 300 of the present invention walks
Suddenly do not limit to step described herein, can also be other suitable encapsulation steps.
One side surface S of the packaging body 320 back to the storage circuit 20 is used to receive the touch of target object or connects
Nearly input, defining the surface S is sensing face.The electrostatic conducting piece 40 is compared to the storage circuit 20 close to the sensing
Face S.Since the electrostatic conducting piece 40 is arranged between the storage circuit 20 and the packaging body 320, work as object
Body introduce electrostatic when, electrostatic by electrostatic conducting piece 40 imported into ground, thus avoid electrostatic to storage circuit 20 cause damage or
Damage.
In addition, the bio-sensing chip 300 includes described when the bio-sensing chip 300 is using BGA package mode
Circuit board 330.When the bio-sensing chip uses QFN packaged type, the bio-sensing chip 300 may not include circuit
Plate 330, but the lead frame including being arranged in around bio-sensing bare die 200.
Referring to Fig. 5, Fig. 5 is the diagrammatic cross-section of another embodiment of bio-sensing chip of the present invention.Change ground, institute
The one end for stating electrostatic conducting piece 40 is arranged on bio-sensing bare die 200, and the other end is arranged on circuit board 330.The electrostatic
Conducting piece 40 is across the top of the storage circuit 20.
Correspondingly, the quantity of the pad 30 be it is multiple when, can part pad 30 be arranged in the bio-sensing bare die
On 200, part pad 30 is arranged on the circuit board 330.The electrostatic conducting piece 40 is connect with the pad 30.
When the bio-sensing chip 300 is using QFN packaged type, pad 300 on circuit board 330 is arranged in can be with
Replace with lead frame.
Referring to Fig. 6, Fig. 6 is the diagrammatic cross-section of the another embodiment of bio-sensing chip of the present invention.Change ground, institute
The two sides of bio-sensing bare die 200 are arranged in the both ends for stating electrostatic conducting piece 40, preferably, the both ends of the electrostatic conducting piece 40
It is separately positioned on the opposite sides of bio-sensing bare die 200.Correspondingly, the electrostatic conducting piece 40 is naked across the bio-sensing
Piece 200.40 part of electrostatic conducting piece is located at the surface of the storage circuit 20.
In the present embodiment, the pad 30 being connected with electrostatic conducting piece 40 is provided on the circuit board 330.It is described
Pad is connected directly or indirectly to ground.
When the bio-sensing chip 300 is using QFN packaged type, pad 300 on circuit board 330 is arranged in can be with
Replace with lead frame.
Technical idea of the invention be also not limited to apply bio-sensing module 100 described in embodiment of above,
It in bio-sensing chip 300, is also applicable in the chip of other suitable types, the chip includes storage circuit 20, especially
Ground, the storage circuit 20 is the memory of ultraviolet light erasable, and the electronic equipment with the chip is at work, user
It needs in contact with or close to the chip.Correspondingly, when the chip package, such as the electrostatic formed by routing
Conducting piece 40 contacts institute in the surface of the storage circuit 20 or across the top of the storage circuit 20 to absorb user
The electrostatic of the storage circuit 20 is flowed to when stating the top of chip.
The chip is, for example, one of capacitive sensing chip, optical profile type sensing chip, ultrasonic type sensing chip
Or it is a variety of.
Referring to Fig. 7, Fig. 7 is the perspective view of electronic equipment of the present invention.The present invention provides a kind of electronic equipment 400, packet
Include bio-identification chip 300 described in above-mentioned any one embodiment.In the present embodiment, the electronic equipment 400 is mobile phone.
It should be noted that electronic equipment 400 of the invention can for portable electronic product, household formula electronic product,
Or vehicle electronics product.However, the electronic equipment does not limit to listed electronic product, it can also be that other suitable electronics produce
Product.The portable electronic product is, for example, mobile terminal, and the mobile terminal is, for example, mobile phone, tablet computer, notebook electricity
The suitable mobile terminals such as brain, wearable product.The household formula electronic product is, for example, intelligent door lock, TV, refrigerator, desk-top
The suitable household formula electronic product such as computer.The vehicle electronics product is, for example, Vehicular display device, automobile data recorder, navigation
The suitable vehicle electronics product such as instrument, car refrigerator.
Despite describing the disclosure with reference to each embodiment, it will be appreciated that these embodiments are illustrative, and
The scope of the present invention is not limited only to them.Many variations, modification, addition and improvement are all possible.More generally, root
It is described in the context of specific embodiments according to each embodiment disclosed by the invention.Function can be disclosed by the invention each
In embodiment in the process in different ways separately or in combination, or using different terms it describes.These and other variations,
Modification, addition and improvement can be in the ranges disclosed by the invention as defined in subsequent claims.
Claims (11)
1. a kind of chip, it is characterised in that: the chip includes:
Storage circuit, for storing data；With
Electrostatic conducting piece is arranged above storage circuit, is used for static electricity discharge；
The chip includes bare die, and the storage circuit is arranged in the bare die, the part or all of position of electrostatic conducting piece
In the top of the bare die；
The bare die further comprises substrate, pad, the first insulating layer and second insulating layer, the storage circuit, the pad
It is respectively provided with over the substrate, first insulating layer and the second insulating layer are arranged in the storage circuit, the weldering
Disk is arranged on the first insulating layer, and first insulating layer is between the storage circuit and the pad, and described the
Two insulating layers are arranged on the first insulating layer, and the position of the correspondence pad is provided with through-hole, the electrostatic conduction
Part is connect by the through-hole with the pad.
2. chip according to claim 1, it is characterised in that: the electrostatic conducting piece is conducting wire.
3. chip according to claim 1, it is characterised in that: the chip includes the sensing face for receiving user's input, institute
Electrostatic conducting piece is stated to be arranged between the sensing face and the storage circuit.
4. chip according to claim 1, it is characterised in that: the electrostatic conducting piece is for being connected directly or indirectly to
Ground, with static electricity discharge to ground.
5. chip according to claim 1, it is characterised in that: the storage circuit is the memory of ultraviolet light erasable.
6. chip according to claim 5, it is characterised in that: the storage circuit be one-time programmable memory or
Muptiple-use programmable memory.
7. chip according to claim 1, it is characterised in that: the electrostatic conducting piece is positioned partially or entirely in the storage
The surface of circuit.
8. chip according to claim 1, it is characterised in that: when the electrostatic conducting piece is conducting wire, the conducting wire
Both ends are respectively positioned on the bare die；Or, one end of the conducting wire is located on the bare die, the other end is located at the one of the bare die
Side；Or, opposite two sides of the bare die are arranged in the both ends of the conducting wire.
9. chip according to claim 1, it is characterised in that: the chip further comprises packaging body, for encapsulating
Bare die and the electrostatic conducting piece are stated, the gap between the bare die and the electrostatic conducting piece is filled.
10. chip according to claim 1, it is characterised in that: the chip includes capacitive sensing chip, optical profile type biography
One or more of sense chip, ultrasonic type sensing chip.
11. a kind of electronic equipment, including chip described in any one of claim 1-10.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610375785.XA CN106206549B (en) | 2016-05-30 | 2016-05-30 | Chip and electronic equipment |
| PCT/CN2017/086646 WO2017206911A1 (en) | 2016-05-30 | 2017-05-31 | Chip and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610375785.XA CN106206549B (en) | 2016-05-30 | 2016-05-30 | Chip and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106206549A CN106206549A (en) | 2016-12-07 |
| CN106206549B true CN106206549B (en) | 2019-06-28 |
Family
ID=57453262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610375785.XA Active CN106206549B (en) | 2016-05-30 | 2016-05-30 | Chip and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106206549B (en) |
| WO (1) | WO2017206911A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206549B (en) * | 2016-05-30 | 2019-06-28 | 深圳信炜科技有限公司 | Chip and electronic equipment |
| CN106062951B (en) * | 2016-05-30 | 2019-06-28 | 深圳信炜科技有限公司 | Bio-sensing module, bio-sensing chip and electronic equipment |
| CN211124064U (en) * | 2017-11-11 | 2020-07-28 | 深圳信炜科技有限公司 | Contact sensor and electronic device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200406712A (en) * | 2002-05-17 | 2004-05-01 | Authentec Inc | Fingerprint sensor having enhanced ESD protection and associated methods |
| TW200945539A (en) * | 2008-04-29 | 2009-11-01 | Advanced Semiconductor Eng | Packaging part of sensing device |
| US8012868B1 (en) * | 2008-12-15 | 2011-09-06 | Amkor Technology Inc | Semiconductor device having EMI shielding and method therefor |
| US9025301B1 (en) * | 2012-04-30 | 2015-05-05 | Amkor Technology, Inc. | Wire fence fingerprint sensor package and fabrication method |
| CN104700067A (en) * | 2013-12-09 | 2015-06-10 | 茂丞科技股份有限公司 | Proximity sensor with hidden-looking coupling electrode and method for producing the same |
| CN205028275U (en) * | 2015-09-23 | 2016-02-10 | 深圳信炜科技有限公司 | Chipset and electronic equipment |
| CN105428339A (en) * | 2015-12-01 | 2016-03-23 | 华天科技（西安）有限公司 | Antistatic fingerprint sensor chip packaging structure and manufacturing method |
| CN205911307U (en) * | 2016-05-30 | 2017-01-25 | 深圳信炜科技有限公司 | Chip and electronic equipment |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008010636A (en) * | 2006-06-29 | 2008-01-17 | Rohm Co Ltd | Light receiving module |
| US20080014678A1 (en) * | 2006-07-14 | 2008-01-17 | Texas Instruments Incorporated | System and method of attenuating electromagnetic interference with a grounded top film |
| CN101727569A (en) * | 2008-10-29 | 2010-06-09 | 神盾股份有限公司 | Planar semiconductor fingerprint sensing device |
| CN103150053A (en) * | 2013-03-08 | 2013-06-12 | 友达光电股份有限公司 | Touch panel with static protection function |
| TWI486843B (en) * | 2013-09-13 | 2015-06-01 | Henghao Technology Co Ltd | Touch panel |
| CN104049392B (en) * | 2014-06-10 | 2017-01-18 | 京东方科技集团股份有限公司 | Device used for preventing display panel paradoxical discharge and display panel preparation system |
| CN205911305U (en) * | 2016-05-30 | 2017-01-25 | 深圳信炜科技有限公司 | Biosensor chip and electronic equipment |
| CN106062951B (en) * | 2016-05-30 | 2019-06-28 | 深圳信炜科技有限公司 | Bio-sensing module, bio-sensing chip and electronic equipment |
| WO2017206034A1 (en) * | 2016-05-30 | 2017-12-07 | 深圳信炜科技有限公司 | Biosensing chip and electronic device |
| CN106206549B (en) * | 2016-05-30 | 2019-06-28 | 深圳信炜科技有限公司 | Chip and electronic equipment |
| CN205911306U (en) * | 2016-05-30 | 2017-01-25 | 深圳信炜科技有限公司 | Biosensing module, biosensing chip and electronic equipment |
-
2016
- 2016-05-30 CN CN201610375785.XA patent/CN106206549B/en active Active
-
2017
- 2017-05-31 WO PCT/CN2017/086646 patent/WO2017206911A1/en active Application Filing
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200406712A (en) * | 2002-05-17 | 2004-05-01 | Authentec Inc | Fingerprint sensor having enhanced ESD protection and associated methods |
| TW200945539A (en) * | 2008-04-29 | 2009-11-01 | Advanced Semiconductor Eng | Packaging part of sensing device |
| US8012868B1 (en) * | 2008-12-15 | 2011-09-06 | Amkor Technology Inc | Semiconductor device having EMI shielding and method therefor |
| US9025301B1 (en) * | 2012-04-30 | 2015-05-05 | Amkor Technology, Inc. | Wire fence fingerprint sensor package and fabrication method |
| CN104700067A (en) * | 2013-12-09 | 2015-06-10 | 茂丞科技股份有限公司 | Proximity sensor with hidden-looking coupling electrode and method for producing the same |
| CN205028275U (en) * | 2015-09-23 | 2016-02-10 | 深圳信炜科技有限公司 | Chipset and electronic equipment |
| CN105428339A (en) * | 2015-12-01 | 2016-03-23 | 华天科技（西安）有限公司 | Antistatic fingerprint sensor chip packaging structure and manufacturing method |
| CN205911307U (en) * | 2016-05-30 | 2017-01-25 | 深圳信炜科技有限公司 | Chip and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017206911A1 (en) | 2017-12-07 |
| CN106206549A (en) | 2016-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106068516B (en) | Bio-sensing chip and electronic equipment | |
| CN205911305U (en) | Biosensor chip and electronic equipment | |
| CN106062951B (en) | Bio-sensing module, bio-sensing chip and electronic equipment | |
| CN106206549B (en) | Chip and electronic equipment | |
| US8653640B2 (en) | Semiconductor package apparatus | |
| US8569875B2 (en) | Integrally molded die and bezel structure for fingerprint sensors and the like | |
| US9235747B2 (en) | Integrated leadframe and bezel structure and device formed from same | |
| CN104700067B (en) | Proximity sensor with hidden-looking coupling electrode and method for producing the same | |
| CN103178036B (en) | Semiconductor device and manufacture method thereof | |
| CN205911306U (en) | Biosensing module, biosensing chip and electronic equipment | |
| CN205911307U (en) | Chip and electronic equipment | |
| CN104937713B (en) | Circuit unit | |
| CN101378046B (en) | Structure, method and substrate for packaging touch-slide type thin type fingerprint identifier | |
| CN207690105U (en) | Fingerprint module and electronic equipment equipped with the fingerprint module | |
| CN209962254U (en) | Biosensor chip and electronic device | |
| CN215068271U (en) | Narrow strip-shaped fingerprint chip, side-edge type fingerprint chip module and electronic equipment | |
| CN209044625U (en) | Bio-sensing chip and electronic equipment | |
| US7075188B2 (en) | Circuit device and method for manufacturing the same | |
| CN211124064U (en) | Contact sensor and electronic device | |
| CN113065390A (en) | Narrow strip-shaped fingerprint chip, side-edge type fingerprint chip module and electronic equipment | |
| JP3130639U (en) | Semiconductor package structure | |
| CN215068272U (en) | Chip, chip module and electronic equipment | |
| CN109768017A (en) | A kind of memory card radiator structure and its processing technology | |
| CN213601232U (en) | Optical fingerprint module | |
| CN216697344U (en) | Capacitive fingerprint sensing module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210524 Address after: 545000 No.108, 2nd floor, building 2, 29 Xinliu Avenue, Liuzhou City, Guangxi Zhuang Autonomous Region Patentee after: Liuzhou Zibo Technology Co.,Ltd. Address before: 518055 Shenzhen, Nanshan District, Guangdong Xili Street Honghua Ling Industrial Zone 2 District 1 District 5 Building (Xi Bian) Patentee before: SHENZHEN XINWEI TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |