CN205911307U - Chip and electronic equipment - Google Patents
Chip and electronic equipment Download PDFInfo
- Publication number
- CN205911307U CN205911307U CN201620512389.2U CN201620512389U CN205911307U CN 205911307 U CN205911307 U CN 205911307U CN 201620512389 U CN201620512389 U CN 201620512389U CN 205911307 U CN205911307 U CN 205911307U
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- China
- Prior art keywords
- chip
- conducting piece
- storage circuit
- sensing
- nude film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Semiconductor Memories (AREA)
Abstract
The utility model discloses a chip and electronic equipment. This chip includes memory circuit and static transmitter. This memory circuit is used for storage data. Static transmitter sets up the memory circuit top for the static of releasing, thus avoid static to cause damage or damage to this memory circuit, and this static transmitter simple structure, material cost is low. Correspondingly, the electronic equipment who has this chip can avoid static to cause damage or damage to this memory circuit equally, and this static transmitter simple structure, and material cost is low.
Description
Technical field
The utility model is related to technical field of semiconductors, more particularly, to a kind of chip and electronic equipment.
Background technology
At present, chip, such as biosensing device have been increasingly becoming the standard configuration of electronic equipment, particularly mobile terminal.Raw
Thing senser element, such as fingerprint sensing devices, when executing biological information sensing, need user's contact or close to biology sensor
Part, so that biosensing device can obtain sufficiently strong sensing signal.
However, in user's contact or during close to biosensing device, static electricity on human body can be to being used in biosensing device
The storage circuit of data storage causes to damage or damages, and leads to biosensing device discrimination to reduce or lost efficacy.
Utility model content
For solve above-mentioned technical problem, the utility model provide one kind be prevented from electrostatic storage circuit is caused damage or
The chip of damage and electronic equipment.
The utility model provide a kind of chip it is characterised in that: described chip includes:
Storage circuit, for data storage；With
Electrostatic conducting piece, is arranged on above storage circuit, for static electricity discharge.
In some embodiments, described electrostatic conducting piece is wire.
In some embodiments, described chip includes the sensing face of receiving user's input, described electrostatic conducting piece setting
Between described sensing face and described storage circuit.
In some embodiments, described electrostatic conducting piece is used for being connected directly or indirectly to ground, with static electricity discharge to ground.
In some embodiments, described storage circuit is the memory of ultraviolet light erasable.
In some embodiments, described storage circuit is one-time programmable memory or muptiple-use programmable deposits
Reservoir.
In some embodiments, described electrostatic conducting piece is positioned partially or entirely in the surface of described storage circuit.
In some embodiments, described chip includes nude film, and described storage circuit is arranged in described nude film, described quiet
Electrical conduction is positioned partially or entirely in the top of described nude film.
In some embodiments, when described electrostatic conducting piece is wire, the two ends of described wire are respectively positioned on described naked
On piece；Or, one end of described wire is located on described nude film, the other end is located at the side of described nude film；Or, the two of described wire
End is arranged on two sides relatively of described nude film.
In some embodiments, described nude film further includes substrate, pad, the first insulating barrier and the second insulating barrier,
Described storage circuit, described pad are respectively provided with over the substrate, and described first insulating barrier and described second insulating barrier are arranged on
In described storage circuit, described pad is arranged on described first insulating barrier, and described first insulating barrier is located at described storage circuit
And described pad between, described second insulating barrier is arranged on described first insulating barrier, and sets in the position of corresponding described pad
It is equipped with through hole, described electrostatic conducting piece is connected with described pad by described through hole.
In some embodiments, described chip further includes packaging body, for encapsulating described nude film and described electrostatic
Conducting piece, fills the gap between described nude film and described electrostatic conducting piece.
In some embodiments, described chip includes capacitive sensing chip, optical profile type sensing chip, ultrasonic type biography
One or more of sense chip.
The utility model also provides a kind of electronic equipment, including the chip described in above-mentioned any one embodiment.
In some embodiments, described chip is used for sensing the biological information of user input, described electronic equipment according to
The biological information correspondence that described chip is sensed controls whether to execute default function.
Because the electrostatic conducting piece in the utility model chip is arranged on the top of storage circuit, for static electricity discharge, from
And avoid electrostatic described storage circuit to be caused damage or damage, and this electrostatic conducting piece structure is simple, the cost of material is low.Accordingly
Ground, the electronic equipment with described chip equally can avoid electrostatic described storage circuit to be caused damage or damage, and this electrostatic
Conducting piece structure is simple, and the cost of material is low.
Although disclosing multiple embodiments, including its change, by illustrate and describing disclosed in the utility model
The following detailed description of embodiment is described, other embodiment disclosed in the utility model will to those skilled in the art show and
It is clear to.It will be recognized that, the utility model is open can be changed at various obvious aspects, and all modifications are all without departing from this
The spirit and scope of utility model.Correspondingly, accompanying drawing and detailed description substantially should be considered illustrative rather than restricted
's.
Brief description
Describe its example embodiment by referring to accompanying drawing in detail, further feature of the present utility model and advantage will become more
Plus substantially.
Fig. 1 is the generalized section of the utility model bio-sensing module one embodiment.
Fig. 2 is the generalized section of another embodiment of the utility model bio-sensing module.
Fig. 2 a is the top view of pin distribution mode one embodiment of the utility model bio-sensing module.
Fig. 2 b is the top view of another embodiment of pin distribution mode of the utility model bio-sensing module.
Fig. 2 c is the top view of another embodiment of pin distribution mode of the utility model bio-sensing module.
Fig. 2 d is the top view of another embodiment of pin distribution mode of the utility model bio-sensing module.
Fig. 3 is the generalized section of another embodiment of the utility model bio-sensing module.
Fig. 3 a is the top view of an embodiment of electrostatic conducting piece set-up mode of the utility model bio-sensing module.
Fig. 3 b is the top view of another embodiment of electrostatic conducting piece setting of the utility model bio-sensing module.
Fig. 4 is the generalized section of an embodiment of the utility model bio-sensing chip.
Fig. 5 is the generalized section of another embodiment of the utility model bio-sensing chip.
Fig. 6 is the generalized section of the another embodiment of the utility model bio-sensing chip.
Fig. 7 is the stereogram of the utility model electronic equipment.
Specific embodiment
It is described more fully with example embodiment referring now to accompanying drawing.However, example embodiment can be with multiple shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein.On the contrary, these embodiments are provided so that this practicality is new
Type fully and completely, and the design of example embodiment will comprehensively be conveyed to those skilled in the art.For convenience or
Clear, may exaggerate, omit or be schematically illustrated in the thickness of every layer shown in accompanying drawing and size and schematically illustrate correlation
The quantity of element.However, the size of element not exclusively reflects actual size in accompanying drawing, and the quantity of related elements is not exclusively anti-
Answer actual quantity.Identical reference represents same or similar structure in the accompanying drawings.The part being represented by dashed line in accompanying drawing
Part within entity, the utility model describes corresponding technical scheme for convenience and is drawn, actually this dotted line part
Part is the part that can't see from the appearance.
Of the present utility model description in it is to be understood that: " multiple " are defined as two and two or more, unless otherwise
Clearly specifically limit, accordingly, this definition is applied to the terms such as " multiple ", " a plurality of "." connection " can for electrical connection, machinery even
The numerous embodiments such as connect, couple, be directly connected to and be indirectly connected with, unless the following special instruction of the utility model, otherwise simultaneously
It is not particularly limited.In addition, the word such as " first ", " second " of occurring in each element title is not to limit the elder generation that element occurs
Order afterwards, but for convenience of element name, clearly distinguish each element so that description is more succinct.
In the utility model, term " thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " water
Flat ", " top ", " bottom ", " interior ", the orientation of instruction such as " outward " or position relationship be based on orientation shown in the drawings or position relationship,
It is for only for ease of description the utility model and simplifies description, rather than the device of instruction or hint indication or element must have
Specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.
Additionally, described feature, structure can combine in one or more embodiments in any suitable manner.
In the following description, provide many details thus being given, embodiment of the present utility model to be fully understood.However,
One of ordinary skill in the art would recognize that, there is no one of described specific detail or more, or adopt other structures, constituent element
Deng it is also possible to put into practice the technical solution of the utility model.In other cases, it is not shown in detail or describes known features or behaviour
Make to avoid fuzzy the utility model.
The chip that the utility model provides includes storage circuit, and in particular, described storage circuit is ultraviolet
(ultraviolet rays) erasable memory.The memory of described ultraviolet light erasable is, for example, One Time Programmable
(one time program, otp) memory, and there is the electronic equipment of described chip operationally, user need contact or
Close to described chip.Correspondingly, when described chip package, for example, the electrostatic conducting piece of ground connection is formed in institute by routing
State surface or the top across described storage circuit of storage circuit, with absorb user contact described chip top when stream
Electrostatic to described storage circuit.
Citing ground, described chip includes the input face of receiving user's input, and described electrostatic conducting piece is arranged on described input
Between face and described storage circuit.
Described electrostatic conducting piece be used for absorbing user's contact or close to described input face when flow to the electrostatic of described chip.
Described chip is, for example, one of capacitive sensing chip, optical profile type sensing chip, ultrasonic type sensing chip
Or it is multiple.Described capacitive sensing chip, optical profile type sensing chip, ultrasonic type sensing chip are, for example, above-mentioned bio-sensing core
Piece.So, described chip be confined to sensing chip listed herein, the chip of alternatively other suitable type.
Below, illustrate taking bio-sensing module, bio-sensing chip as a example.
The bio-sensing module that the utility model provides is used for sensing the biological information of target object input.It is preferred that institute
State bio-sensing module to be entirely formed in a bio-sensing chip (chip).Specifically, described bio-sensing chip includes giving birth to
Thing sensing nude film (die) and electrostatic conducting piece.Described bio-sensing nude film includes storage circuit, and described storage circuit is used for storing
Data.The initialization data of circuit in described data for example, described bio-sensing chip, model of product etc..Described quiet
Electrical conduction is positioned partially or entirely on described bio-sensing nude film.It is preferred that described electrostatic conducting piece is located at described storage electricity
The surface on road, forms lug boss or tip above storage circuit, and is connected directly or indirectly to ground, with static electricity discharge.
Further, described bio-sensing chip further includes packaging body, for encapsulate described bio-sensing nude film and
Electrostatic conducting piece.Described electrostatic conducting piece is located between described bio-sensing nude film and described packaging body.Described packaging body filling
Gap between described electrostatic conducting piece and described bio-sensing nude film.
One side surface of described packaging body is made a living a side surface of thing sensing chip receiving user's input, defines described encapsulation
One side surface of body receiving user's input is sensing face.Described electrostatic conducting piece is compared to described storage circuit closer to described sense
Survey face.When user is near to or in contact with described sensing face, described electrostatic conducting piece is released user's electrostatic, prevents electrostatic to storage electricity
Road is caused to damage or is damaged.
Described electrostatic conducting piece is, for example, wire, and described lug boss or tip are to be formed by routing.So, described electrostatic passes
Guiding element is not limited thereto the described wire in place, alternatively other shapes of conducting element.
Described storage circuit is, for example, the memory of ultraviolet light erasable.The memory of described ultraviolet light erasable is, for example,
One Time Programmable (one time program, otp) memory or/and muptiple-use programmable (multi time program,
Mtp) memory.So it is not limited to this, described storage circuit is alternatively the memory of other suitable type.Described ultraviolet
Erasable memory is the memory of other suitable type.
In the utility model, as a example with bio-sensing chip as fingerprint sensor (chip), storage circuit typically quilt
It is arranged in the fingerprint sensing nude film (die) of fingerprint sensor, in order to prevent electrostatic from storage circuit is caused damage or damage,
Fingerprint sensor arranges electrostatic conducting piece above the position of corresponding storage circuit, to absorb the electrostatic flowing to storage circuit.
Wherein, described electrostatic conducting piece is, for example, metallic conductive element, so, is not limited to metallic conductive element.
In particular, it is ultraviolet (ultraviolet rays) erasable memory for storage circuit, this sentences otp
Illustrate as a example memory, after fingerprint sensing nude film flow is returned, before being packaged into fingerprint sensor, need
Fingerprint sensing nude film is tested, wherein it is desired to its quality is tested to otp memory write data, when test otp deposits
After reservoir is qualified product, using the data of write otp memory when testing before ultraviolet erasing.Due to fingerprint
When sensing nude film is tested, need ultraviolet that otp memory is wiped, therefore, fingerprint sensing nude film is originally in correspondence
Hardware can not be provided with above the position of otp memory.
When described fingerprint sensing nude film is encapsulated into fingerprint sensor (it should be noted that the fingerprint described at this passes
In sense chip and be not provided with described electrostatic conducting piece) after, when user carries out fingerprint letter near to or in contact with described fingerprint sensor
During breath sensing, due to there not being blocking of hardware to be relatively vulnerable to the damage that static electricity on human body causes above described otp memory
Wound or damage, thus lead to described fingerprint sensor to be scrapped.
For above-mentioned technical problem, the utility model proposes when fingerprint sensing nude film tested qualified after, encapsulation
When fingerprint sensing nude film is fingerprint sensor, form electrostatic conducting piece above fingerprint sensing nude film.It is preferred that described electrostatic
Conducting piece is located at the surface of otp memory or across otp memory.Next, being passed using the described electrostatic of packaging body encapsulation
Guiding element and described bio-sensing nude film, in one, form bio-sensing chip.Thus, when user's contact or close to having electrostatic
During the bio-sensing chip of conducting piece, electrostatic conducting piece can absorb the electrostatic flowing to otp memory of user's introducing, thus preventing
Electrostatic causes to otp memory to damage or damages.
In a specific embodiment, the two ends of described wire are both formed on described bio-sensing nude film.
In still another embodiment, the one end in the two ends of described wire is formed on described bio-sensing nude film,
The other end is formed at the side of described bio-sensing nude film.
In still another embodiment, the two ends of described wire are respectively formed at the both sides of described bio-sensing nude film.
It is preferred that the two ends of described wire are respectively formed at the opposite sides of described bio-sensing nude film.That is, described wire is across described
Bio-sensing nude film.
It should be noted that when the one or both ends of wire are formed at the one or both sides of bio-sensing nude film, described
The one or both ends of wire are not formed on described bio-sensing nude film.For example, when bio-sensing chip adopts ball bar battle array
During row encapsulation (ball grid array package, abbreviation bga), described bio-sensing chip further includes a circuit board,
Described bio-sensing nude film and described electrostatic conducting piece are formed between described circuit board and described packaging body.The one of described wire
End or two ends can be formed on described circuit board.
Due to the packaged type of bio-sensing chip have multiple, for example, quad flat non-pin package (quad flat
No-lead package, abbreviation qfn), accordingly, described bio-sensing chip may not include described circuit board, but in biology
It is formed with lead frame (frame) around sensing nude film.
Described bio-sensing module includes fingerprint sensing module, blood oxygen sensing module, heartbeat sensing module, pressure sensing mould
One or more of block, humidity sensor module, temperature sensing module, iris sensing module.Correspondingly, described biological information bag
Include one of finger print information, blood oxygenation information, heartbeat message, pressure information, humidity information, temperature information, iris information or many
Kind.
The described target object such as finger for user, the alternatively other parts of user's body, such as eyes, heartbeat, palm,
Toe, ear etc., or the combination for the arbitrarily several parts on aforementioned user's body, or even it is alternatively the thing of other suitable type
Body, and it is not limited to human body.
Below, incorporated by reference to accompanying drawing, specifically to understand further the utility model.
Refer to Fig. 1, Fig. 1 is the generalized section of the utility model bio-sensing module one embodiment.Described biological biography
Sense module 100 includes sensing unit 10, storage circuit 20, pad 30 and electrostatic conducting piece 40.
Described sensing unit 10 be used for sense target object near to or in contact with when biological information.Described storage circuit 20 is used
In data storage.Described data for example includes the initialization data of the circuit of bio-sensing module 100, product type etc..Institute
State pad 30 to be used for being connected directly or indirectly to ground.Described pad 30 is for example located at described storage circuit 20 around, also can position
Top in described storage circuit 20.In the present embodiment, described pad 30, located at the top of described storage circuit 20, is located at
The outside of described storage circuit 20.Described electrostatic conducting piece 40 is connected with described pad 30.Described electrostatic conducting piece 10 is used for letting out
Electrostatic discharge is to ground.For example, apply describedly described bio-sensing module 100 electronic equipment 400 (see Fig. 7) systematically or
Equipment ground, is generally loaded as 0v (volt) voltage.When described pad 30 is indirect earthed, for example, can be grounded by modulation circuit, or
It is grounded by power supply.
The extension mode of described electrostatic conducting piece 40 is not limited to as shown in Figure 1: by described weldering after electrical connection pad 30
Disk 30 extends toward described storage circuit 20 top, and the extension mode of described electrostatic conducting piece 40 can be also after electrical connection pad 30
Extended vertically upwards by described pad 30.In addition, the extension mode of described electrostatic conducting piece 40 is alternatively other suitable extensions
Mode.
Described electrostatic conducting piece 40 is wire, and described wire is metal wire, and the material of this metal wire is, for example, gold, copper or aluminium
Deng it is, of course, also possible to be other suitable materials.Described conductor structure is simple, and material usage is few, reduces material cost.In addition,
Described electrostatic conducting piece 40 also and is limited as wire, the conducting element of alternatively other suitable shapes.
Further, described wire has the lug boss 41 higher than described storage circuit 20.It should be higher than described storage circuit
20 lug boss 41 is formed by routing.Described lug boss 41 is in pointed shape or arc, to guide user using lightning rod principle
To described lug boss 41 release electrostatic, then this electrostatic is introduced by ground terminal by described pad 30, thus preventing electrostatic to described
Storage circuit 20 causes to damage or damages.
Described pad 30 can be one or more.The material of described pad 30 for example include aluminium, copper, Au Ag Pt Pd,
One of nickel etc. or two or more.Certainly, described pad 30 material can also be other suitable materials.
In the present embodiment, described storage circuit 20 is ultraviolet (ultraviolet rays) erasable storage
Device.The memory of described ultraviolet light erasable be, for example, One Time Programmable (one time program, otp) memory or/
With muptiple-use programmable (multi time program, mtp) memory.So it is not limited to this, described storage circuit 20
Can be the memory of other suitable type.The memory of described ultraviolet light erasable is the memory of other suitable type.
Described bio-sensing module 100 can further include the first insulating barrier 50, and this first insulating barrier 50 is arranged on described
Storage circuit 20 and the top of sensing unit 10.Described pad 30 is located at the top of the first insulating barrier 50.So, in other embodiment party
In formula, described first insulating barrier 50 may also be arranged on the top of one of described storage circuit 20 and sensing unit 10 person.And or
Person, described first insulating barrier 50 omits, and described pad 30 is arranged on storage circuit 20 around.
See also Fig. 2-Fig. 2 d, Fig. 2 is the generalized section of another embodiment of the utility model bio-sensing module.
Fig. 2 a is the top view of pad distribution mode one embodiment of the utility model bio-sensing module.Fig. 2 b is the utility model life
The top view of another embodiment of pad distribution mode of thing sensing module.Fig. 2 c is the pad of the utility model bio-sensing module
The top view of another embodiment of distribution mode.Fig. 2 d is another enforcement of pad distribution mode of the utility model bio-sensing module
The top view of example.
As shown in Fig. 2 described pad 30 includes the first sub- pad 31 and being arranged on the surrounding of described storage circuit 20
Two sub- pads 32, for receiving ground signalling.The two ends of described electrostatic conducting piece 40 respectively with the described first sub- pad 31, institute
State the second sub- pad 32 to electrically connect.
The mode that described first sub- pad 31, described second sub- pad 32 are used for ground connection can be the described first sub- pad
31st, one of described second sub- pad 32 or both directly as earth terminal or described first sub- pad 31, described
One of second sub- pad 32 or both electrically connect with the earth terminal of described storage circuit 20 or described sensing unit 10, also may be used
Be one of the described first sub- pad 31, described second sub- pad 32 or both with systematically electrically connect.The utility model
Described first sub- pad 31, the earthing mode of described second sub- pad 32 do not limit to the mode of listed ground connection herein, can be also
The mode of other suitable ground connection.
Described first sub- pad 31 and described second sub- pad 32 be respectively arranged on any both sides of described storage circuit 20 with
Make described electrostatic conducting piece 40 across the top of described storage circuit 20, for example, described first sub- pad 31 and described second son
Pad 32 is respectively arranged on the adjacent both sides of described storage circuit 20 or relative both sides etc..Citing ground, as shown in Figure 2 a, described the
One sub- pad 31 and described second sub- pad 32 are respectively arranged on the adjacent both sides of described storage circuit 20 so that the conduction of described electrostatic
Part 40 is across described storage circuit 20.As shown in Figure 2 b, described first sub- pad 31 and described second sub- pad 32 are symmetrically set in
The both sides of described storage circuit 20 are so that described electrostatic conducting piece 40 is across described storage circuit 20.
As shown in Figure 2 c, change ground, described first sub- pad 31 and described second sub- pad 32 can also be respectively arranged on
Described storage circuit 20 diagonal.
As shown in Figure 2 d, change ground, described first sub- pad 31 and described second sub- pad 32 can also be spaced located at
The side of described storage circuit 20, need not be respectively arranged on the both sides of described storage circuit 20.
Change ground, in other embodiments it is also possible to by the described first sub- pad 31 in described storage circuit 20
One jiao, described second sub- pad 32 is located at the side of described storage circuit 20.In Fig. 2, Fig. 2 b, Fig. 2 c, described first son
Pad 31, located between described storage circuit 20 and described sensing unit 10, changes ground, in other embodiments, described first
Sub- pad 31 may also be arranged on the top just to described storage circuit 20 or described sensing unit 10.
Described first sub- pad 31 of the present utility model, the distribution mode of described second sub- pad 32 are not limited to above-mentioned
Distribution mode, can be also other suitable distribution modes, the both sides of such as each two or three circuit are respectively provided with described first
Sub- pad 31 and described second sub- pad 32.Accordingly, described two or three circuit are all correspondingly arranged an electrostatic electric-conductor
40 with respectively with the described first sub- pad 31 and described second sub- pad 32.
It should be noted that the profile of bio-sensing module 100, described storage circuit 20 and described sensing unit 10 is not
It is limited as the rectangle shown in Fig. 2 a- Fig. 2 d, it can also be the shape of the rule such as square, hexagon, octagon, also
Can be irregular shape or other suitable shape.In addition, described first sub- pad 31, described second sub- pad 32 are not yet
Circle shown in limitation Fig. 2 a- Fig. 2 d or the shape of the rule such as square, rectangle, can also be irregular
Shape or other suitable shape.
See also Fig. 3-Fig. 3 b, Fig. 3 is the generalized section of another embodiment of the utility model bio-sensing module.
Fig. 3 a is the top view of an embodiment of electrostatic conducting piece set-up mode of the utility model bio-sensing module.Fig. 3 b is this reality
Top view with another embodiment of the electrostatic conducting piece setting of new bio sensing module.
Described electrostatic conducting piece 40 can be one or more.When described electrostatic conducting piece 40 is a plurality of, described a plurality of
Electrostatic conducting piece 40 interval setting.This interval can be the interval on vertical plane or the interval on horizontal plane.Citing
Ground, such as Fig. 3 are that a plurality of electrostatic conducting piece 40 forms interval setting in the projection of vertical plane；If Fig. 3 a is a plurality of electrostatic conducting piece 40
Form interval setting in the projection of horizontal plane.It should be noted that every in Fig. 3 described electrostatic conducting piece 40 is relatively described depositing
The height on storing up electricity road 20 is different, however, its shape, size can identical naturally it is also possible to differ.Described in Fig. 3 a every
The length that electrostatic conducting piece 40 projects in the horizontal plane is identical, however, its physical length, shape, size, can be highly phase
With or differ.
Described a plurality of electrostatic conducting piece 40 can be arranged in array, such as matrix form arrangement.Certainly, also can be in Else Rule side
Formula or non-regular arrangement.However, changing ground, as shown in Figure 3 b, described a plurality of electrostatic conducting piece 40 can also interlock and set
Put.
It should be noted that the described electrostatic conducting piece 40 in Fig. 3-3b only draws two as an example, a plurality of in practice
Electrostatic conducting piece 40 does not limit to two or more than two.Correspondingly, the first sub- pad 31 and the second sub- pad 32
Quantity is corresponding to be increased.In addition, electrostatic conducting piece 40 set-up mode described in the utility model does not limit to above-mentioned set-up mode yet,
Can be also other suitable set-up modes.
See also Fig. 2 and Fig. 4, Fig. 4 is the generalized section of the utility model bio-sensing chip.The utility model
A kind of bio-sensing chip 300 is provided.Described bio-sensing chip 300 includes the bio-sensing module 100 of above-mentioned embodiment.
Described bio-sensing chip 300 includes bio-sensing nude film 200 and described electrostatic conducting piece 40.Described electrostatic conduction
Part 40 is arranged on described bio-sensing nude film 200.
Described bio-sensing nude film 200 includes storage circuit 20.It is preferred that described electrostatic conducting piece 40 partly or entirely sets
Put the surface in described storage circuit 20, for static electricity discharge to ground.
Described bio-sensing nude film 200 further includes that substrate 310, sensing unit 10, the first insulating barrier 50, second insulate
Layer 60 and pad 30.Described storage circuit 20 is arranged on described substrate 310.Described first insulating barrier 50 and described second exhausted
Edge layer 60 is arranged in described storage circuit 20.Described storage circuit 20 is located at described substrate 310 and described first insulating barrier 50
Between.Described pad 30 is arranged on the first insulating barrier 50.Described second insulating barrier 60 is arranged on described first insulating barrier 50,
And the position of corresponding pad 30 is provided with through hole h.Described electrostatic conducting piece 40 passes through described through hole h with described pad 30 even
Connect.Described substrate 310 is, for example, Semiconductor substrate, and described Semiconductor substrate is such as silicon substrate.Described substrate 310 is for example alternatively
The substrate of other suitable type, for example, dielectric substrate.
Described second insulating barrier 60 covers described storage circuit 20, citing ground, and this second insulating barrier 60 can only cover institute
State storage circuit 20 it is also possible to continue to extend toward described sensing unit 10 top to cover described sensing unit 10 simultaneously, now
Can prevent bio-sensing nude film 200 from causing mechanically or chemically to injure during being packaged into bio-sensing chip 300.
Described bio-sensing chip 300 of the present utility model can include single nude film, may also comprise many nude films.Citing
Ground, when described bio-sensing chip 300 includes single nude film, described storage circuit 20 is formed at described bio-sensing nude film
In 200；When described bio-sensing chip 300 includes many nude films, it is naked that described storage circuit 20 may be separately formed a storage
Piece, and it is arranged on outside described bio-sensing nude film 200, correspondingly, storage nude film 30 can be not provided with the first insulating barrier 50 He
Second insulating barrier 60, a pad 30 may be formed on bio-sensing nude film 200, and a pad is formed at circuit board 330 (seeing below)
On, and be located at the left side of described storage nude film, electrostatic conducting piece 40 across the top of described storage nude film, or, positioned at depositing
The pad 30 of storage nude film both sides is both formed on circuit board 330.
A number of the nude film included by described bio-sensing chip 300 and generation type do not limit to an above-mentioned cited number
And generation type, can also be other suitable numbers and generation type, for example, when described bio-sensing chip 300 includes two
During nude film, described storage circuit 20 also can be formed in a control nude film (not shown), and described control nude film is used for controlling institute
State bio-sensing nude film 200 execution sensing function.
It should be noted that the bio-sensing module 100 in the utility model bio-sensing chip 300 is variable more going up
State the bio-sensing module 100 described in any one embodiment, be not limited to the described bio-sensing module of above-mentioned Fig. 2 embodiment
100.
Please continue to refer to Fig. 4, described bio-sensing chip 300 can further include circuit board 330 and packaging body 320.Institute
State bio-sensing nude film 200 to be arranged on described circuit board 330.Described packaging body 320 encapsulates described bio-sensing nude film 200 He
Described electrostatic conducting piece 30 is in described bio-sensing chip 300.Wherein, described packaging body 320 fills described electrostatic conducting piece
Gap between 30 and described bio-sensing nude film 200 is so that described electrostatic conducting piece 40 is fixed in described packaging body 30.
The material of described packaging body 320 is, for example, epoxy resin material or other insulating materials.Described circuit board 330
As for printed circuit board (PCB).
The encapsulation step of described bio-sensing chip 300 is, for example: first described bio-sensing nude film 200 is electrically connected to institute
State circuit board 330；Then by routing mode, the two ends of described electrostatic conducting piece 40 are connected between two pads 30；To carry again
The circuit board 320 of described bio-sensing chip 300 is placed in the injection mold equipped with epoxy resin material；Last matched moulds with
Plastic packaging is carried out to the bio-sensing chip 300 in cavity body of mould.However, the envelope of bio-sensing chip 300 described in the utility model
Dress step does not limit to step described herein, can also be other suitable encapsulation step.
Described packaging body 320 is used for receiving the touch of target object or connecing back to a side surface s of described storage circuit 20
Nearly input, the described surface s of definition is sensing face.Described electrostatic conducting piece 40 is compared to described storage circuit 20 close to described sensing
Face s.Because described electrostatic conducting piece 40 is arranged between described storage circuit 20 and described packaging body 320, therefore, work as object
Body introduce electrostatic when, electrostatic pass through electrostatic conducting piece 40 import to ground, thus avoid electrostatic storage circuit 20 is caused damage or
Damage.
In addition, when described bio-sensing chip 300 adopts bga packaged type, described bio-sensing chip 300 includes described
Circuit board 330.When described bio-sensing chip adopts qfn packaged type, described bio-sensing chip 300 may not include circuit
Plate 330, but include the lead frame being arranged on around bio-sensing nude film 200.
Refer to Fig. 5, Fig. 5 is the generalized section of another embodiment of the utility model bio-sensing chip.Change
Ground, one end of described electrostatic conducting piece 40 is arranged on bio-sensing nude film 200, and the other end is arranged on circuit board 330.Described
Electrostatic conducting piece 40 is across the top of described storage circuit 20.
Correspondingly, when the quantity of described pad 30 is multiple, described bio-sensing nude film can be arranged on by part pad 30
On 200, part pad 30 is arranged on described circuit board 330.Described electrostatic conducting piece 40 is connected with described pad 30.
When described bio-sensing chip 300 adopts qfn packaged type, the pad 300 being arranged on circuit board 330 is permissible
Replace with lead frame.
Refer to Fig. 6, Fig. 6 is the generalized section of the another embodiment of the utility model bio-sensing chip.Change
Ground, the two ends of described electrostatic conducting piece 40 are arranged on the both sides of bio-sensing nude film 200, it is preferred that described electrostatic conducting piece 40
Two ends be separately positioned on the opposite sides of bio-sensing nude film 200.Correspondingly, described electrostatic conducting piece 40 is across described biology
Sensing nude film 200.Described electrostatic conducting piece 40 part is located at the surface of described storage circuit 20.
In the present embodiment, described circuit board 330 is provided with the pad 30 being connected with electrostatic conducting piece 40.Described
Pad is connected directly or indirectly to ground.
When described bio-sensing chip 300 adopts qfn packaged type, the pad 300 being arranged on circuit board 330 is permissible
Replace with lead frame.
Technological thought of the present utility model is also not limited to apply the bio-sensing module described in embodiment of above
100th, in bio-sensing chip 300, it is also applicable in the chip of other suitable type, described chip includes storage circuit 20,
In particular, described storage circuit 20 is the memory of ultraviolet light erasable, and has the electronic equipment of described chip operationally,
User needs contact or close to described chip.Correspondingly, when described chip package, for example, formed described by routing
Electrostatic conducting piece 40 in the surface of described storage circuit 20 or across described storage circuit 20 above, connect with absorbing user
The electrostatic of described storage circuit 20 is flowed to during the top touching described chip.
Described chip is, for example, one of capacitive sensing chip, optical profile type sensing chip, ultrasonic type sensing chip
Or it is multiple.
Refer to Fig. 7, Fig. 7 is the stereogram of the utility model electronic equipment.The utility model provides a kind of electronic equipment
400, it includes the bio-identification chip 300 described in above-mentioned any one embodiment.In the present embodiment, described electronic equipment
400 is mobile phone.
It should be noted that electronic equipment 400 of the present utility model can produce for portable electronic product, household formula electronics
Product or vehicle electronics product.However, described electronic equipment does not limit to listed electronic product, can also be that other is suitably electric
Sub- product.Described portable electronic product is, for example, mobile terminal, and described mobile terminal is, for example, mobile phone, panel computer, notes
The suitable mobile terminal such as this computer, Wearable product.Described household formula electronic product be, for example, intelligent door lock, TV, refrigerator,
The suitable household formula electronic product such as desktop computer.Described vehicle electronics product is, for example, Vehicular display device, drive recorder, leads
The suitable vehicle electronics product such as boat instrument, car refrigerator.
Despite with reference to each embodiment, the disclosure to be described, it will be appreciated that these embodiments are illustrative, and
Scope of the present utility model is not limited only to them.Many changes, modification, interpolation and improvement are all possible.More typically and
Speech, according to disclosed in the utility model, each embodiment describes in the context of specific embodiments.Function can be in this reality
With in new disclosed each embodiment during in a different manner separately or in combination, or described using different terms.
These and other change, modification, add and improve can the utility model as defined in subsequent claims public affairs
In the range of opening.
Claims (13)
1. a kind of chip it is characterised in that: described chip includes:
Storage circuit, for data storage；With
Electrostatic conducting piece, is arranged on above storage circuit, for static electricity discharge.
2. chip according to claim 1 it is characterised in that: described electrostatic conducting piece be wire.
3. chip according to claim 1 it is characterised in that: described chip includes the sensing face of receiving user's input, institute
State electrostatic conducting piece to be arranged between described sensing face and described storage circuit.
4. chip according to claim 1 it is characterised in that: described electrostatic conducting piece is used for being connected directly or indirectly to
Ground, with static electricity discharge to ground.
5. chip according to claim 1 it is characterised in that: described storage circuit be ultraviolet light erasable memory.
6. chip according to claim 5 it is characterised in that: described storage circuit be one-time programmable memory or
Muptiple-use programmable memory.
7. chip according to claim 1 it is characterised in that: described electrostatic conducting piece is positioned partially or entirely in described storage
The surface of circuit.
8. the chip according to any one in claim 1-7 it is characterised in that: described chip includes nude film, described deposits
Storing up electricity road is arranged in described nude film, and described electrostatic conducting piece is positioned partially or entirely in the top of described nude film.
9. chip according to claim 8 it is characterised in that: when described electrostatic conducting piece be wire when, described wire
Two ends are respectively positioned on described nude film；Or, one end of described wire is located on described nude film, the other end is located at the one of described nude film
Side；Or, the two ends of described wire are arranged on two sides relatively of described nude film.
10. chip according to claim 8 it is characterised in that: described nude film further includes substrate, pad, first exhausted
Edge layer and the second insulating barrier, described storage circuit, described pad are respectively provided with over the substrate, described first insulating barrier and institute
State the second insulating barrier to be arranged in described storage circuit, described pad is arranged on described first insulating barrier, described first insulation
Layer is located between described storage circuit and described pad, and described second insulating barrier is arranged on described first insulating barrier, and right
The position answering described pad is provided with through hole, and described electrostatic conducting piece is connected with described pad by described through hole.
11. chips according to claim 10 it is characterised in that: described chip further includes packaging body, for encapsulating
Described nude film and described electrostatic conducting piece, fill the gap between described nude film and described electrostatic conducting piece.
12. chips according to claim 1 it is characterised in that: described chip include capacitive sensing chip, optical profile type pass
One or more of sense chip, ultrasonic type sensing chip.
13. a kind of electronic equipments, including the chip described in any one in claim 1-12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620512389.2U CN205911307U (en) | 2016-05-30 | 2016-05-30 | Chip and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620512389.2U CN205911307U (en) | 2016-05-30 | 2016-05-30 | Chip and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205911307U true CN205911307U (en) | 2017-01-25 |
Family
ID=57815630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620512389.2U Withdrawn - After Issue CN205911307U (en) | 2016-05-30 | 2016-05-30 | Chip and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205911307U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206549A (en) * | 2016-05-30 | 2016-12-07 | 深圳信炜科技有限公司 | Chip and electronic equipment |
| WO2017206035A1 (en) * | 2016-05-30 | 2017-12-07 | 深圳信炜科技有限公司 | Biosensing module, biosensing chip, and electronic device |
-
2016
- 2016-05-30 CN CN201620512389.2U patent/CN205911307U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206549A (en) * | 2016-05-30 | 2016-12-07 | 深圳信炜科技有限公司 | Chip and electronic equipment |
| WO2017206911A1 (en) * | 2016-05-30 | 2017-12-07 | 深圳信炜科技有限公司 | Chip and electronic device |
| WO2017206035A1 (en) * | 2016-05-30 | 2017-12-07 | 深圳信炜科技有限公司 | Biosensing module, biosensing chip, and electronic device |
| CN106206549B (en) * | 2016-05-30 | 2019-06-28 | 深圳信炜科技有限公司 | Chip and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20170125 Effective date of abandoning: 20190628 |
|
| AV01 | Patent right actively abandoned |