CN101727569A - Planar semiconductor fingerprint sensing device - Google Patents
Planar semiconductor fingerprint sensing device Download PDFInfo
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- CN101727569A CN101727569A CN200810170778A CN200810170778A CN101727569A CN 101727569 A CN101727569 A CN 101727569A CN 200810170778 A CN200810170778 A CN 200810170778A CN 200810170778 A CN200810170778 A CN 200810170778A CN 101727569 A CN101727569 A CN 101727569A
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Abstract
The invention provides a planar semiconductor fingerprint sensing device. In the planar semiconductor fingerprint sensing device, a plurality of fingerprint sensing units are positioned on a silicon substrate, and read the fingerprint of a finger above the silicon substrate and generate a plurality of electric signals; a group of integrated circuits are formed on a substrate, and process the electric signals; a plurality of first weld pads are positioned on the substrate and are electrically connected to the group of the integrated circuits; a first insulating layer is positioned under the plurality of first weld pads; a plurality of through electrodes pass through the substrate and are electrically and respectively connected with the plurality of first weld pads; a second insulating layer is formed on the substrate and between the plurality of through electrodes and the substrate; a plurality of second weld pads are formed on a back side of the second insulating layer and are electrically connected with the plurality of first weld pads through the plurality of electrodes respectively; and a protective layer is positioned on the substrate, and covers the fingerprint sensing units and forms a flat external surface to be touched by the finger.
Description
Technical field
The present invention relates to a kind of fingerprint acquisition apparatus, relate in particular to a kind of planar semiconductor fingerprint sensing device.
Background technology
Known fingerprint reading method, the most ancient the old utilizes finger by ink, be stamped on the paper, utilize in the optical scanning input computing machine again and compare with the database of fingerprint figure, its disadvantage is for reaching the purpose of real-time processing, therefore can't satisfy the demand of more and more real-time authentications, for example: network authentication, ecommerce, portable electric product is maintained secrecy, the IC-card personal identification, safety system or the like.
Real-time fingerprint reading method just becomes the gordian technique in the biological identification market.Traditional real-time fingerprint is read as optical mode, sees also United States Patent (USP) numbering 4,053,228 and 4,340,300, yet volume is too huge and image deception that forged easily is its shortcoming.
For this reason, utilize the fingerprint acquisition apparatus of silicon semiconductor to arise at the historic moment, overcome the shortcoming of above-mentioned optical profile type.Based on considering of silicon integrated circuit manufacturing process, condenser type or other electric field fingerprint read chip becomes the most direct and simple method.
Fig. 1 shows a kind of synoptic diagram of traditional silicon semiconductor fingerprint acquisition apparatus.As shown in Figure 1, the fingerprint acquisition apparatus 100 of silicon semiconductor comprises a base plate for packaging 110, a fingerprint sensing device 120, a plurality of connecting lines 130 and an encapsulated layer 140.Fingerprint sensing device 120 is positioned on the base plate for packaging 110.These connecting lines 130 are electrically connected to a plurality of weld pads 122 of fingerprint sensing device 120 on a plurality of weld pads 112 of base plate for packaging 110.
The restriction of traditional fingerprint acquisition apparatus in encapsulation process needs to have the surface of exposing exactly, and contacts and the image of sensing finger lines with finger.Therefore, in the encapsulation process in, must use special dies and flexible material layer to protect the sensing face of fingerprint sensing chip, and the both sides of the product after having encapsulated or can be higher than all around the centre the sensing face part, shown in the both sides of Fig. 1.
For the foregoing reasons, the packaging cost height of traditional fingerprint acquisition apparatus, and need to use special board.In addition,, the ability of its anti-electrostatic breakdown and anti-collision is reduced, cause in the use of product to have inconvenience because the outside surface of fingerprint sensing chip need expose, and the shortening in the life-span of product.
The application synoptic diagram of the fingerprint acquisition apparatus of Fig. 2 displayed map 1.As shown in Figure 2, fingerprint sensing device 100 is installed on the notebook, is used as the device of fingerprint sensing and cursor control, just can move by sensing finger and control moving of screen cursor.Because the upper surface of the fingerprint sensing device of Fig. 1 is non-to be whole plane, so must design on the notebook special slideway 200 is arranged.However, the slippage of the finger action slippage action of the left and right directions of Fig. 1 (particularly along) still can be subjected to the restriction of the lug boss of both sides, causes user's mouse beacon cursor indiscriminately ad. as one wishes.
Therefore, provide a kind of planar semiconductor fingerprint sensing device, and do not need special dies and conventional package, real solution for institute of the present invention desire realization.
Summary of the invention
An object of the present invention is to provide a kind of planar semiconductor fingerprint sensing device, it has smooth sensitive surface fully, and its volume can be effectively reduced.
For reaching above-mentioned purpose; the invention provides a kind of planar semiconductor fingerprint sensing device, it comprises a silicon substrate, a plurality of fingerprint sensings unit, one group of integrated circuit, a plurality of first weld pad, one first insulation course, a plurality of through electrode, one second insulation course, a plurality of second weld pad and protective seam at least.Silicon substrate has a positive and back side.These fingerprint sensing unit are positioned at the front of silicon substrate, and read a side's placed thereon lines of pointing and produce a plurality of electric signal.This group integrated circuit is formed at the front of silicon substrate, and handles electric signals.These first weld pads are positioned on the front of silicon substrate, and integrated circuit is so far organized in electrical connection.First insulation course is positioned at these first weld pad belows.These through electrodes connect silicon substrate and are electrically connected to these first weld pads respectively.Second insulation course is formed on the back side of silicon substrate, and between these through electrodes and the silicon substrate.These second pad-shaped are formed in a back side of second insulation course, and these second weld pads are electrically connected to these first weld pads by these through electrodes respectively.Protective seam is positioned on the front of silicon substrate, and covers these fingerprint sensing unit, and forms a flat outer surface for contacting usefulness with finger.
By fingerprint acquisition apparatus of the present invention, can effectively simplify industrial design, more tool is not restricted can to allow user's operation, and can effectively dwindle the volume and the area of fingerprint acquisition apparatus.
Description of drawings
Fig. 1 shows a kind of synoptic diagram of traditional fingerprint acquisition apparatus.
The application synoptic diagram of the fingerprint acquisition apparatus of Fig. 2 displayed map 1.
Fig. 3 shows the sectional perspective synoptic diagram according to the fingerprint acquisition apparatus of first embodiment of the invention.
Fig. 4 shows the schematic perspective view according to the fingerprint acquisition apparatus of first embodiment of the invention.
Fig. 5 shows the schematic perspective view according to the fingerprint acquisition apparatus of second embodiment of the invention.
Fig. 6 shows the calcspar according to the integrated circuit of various embodiments of the present invention.
Fig. 7 shows the synoptic diagram according to a kind of application of the fingerprint acquisition apparatus of various embodiments of the present invention.
Fig. 8 shows the synoptic diagram of using according to the another kind of the fingerprint acquisition apparatus of various embodiments of the present invention.
Accompanying drawing number
F: finger
1: fingerprint acquisition apparatus
2: outside surface
3: mobile phone
3A: display device
3B: cursor
3C: cursor
10: silicon substrate
10B: the back side
10F: front
15: the fingerprint sensing unit
20: integrated circuit
21: control logic circuit
22: amplifier
23: analog/digital converter
24: treatment circuit
25: input/output interface
30: the first weld pads
40: the first insulation courses
50: through electrode
60: the second insulation courses
70: the second weld pads
70B: the back side
80: protective seam
90: solder projection
100: fingerprint acquisition apparatus
110: base plate for packaging
112: weld pad
120: the fingerprint sensing device
122: weld pad
130: connecting line
140: protective seam
200: slideway
Embodiment
For foregoing of the present invention can be become apparent, a preferred embodiment cited below particularly, and cooperate appended accompanying drawing, be described in detail below.
Fig. 3 shows the sectional perspective synoptic diagram according to the fingerprint acquisition apparatus of first embodiment of the invention.Fig. 4 shows the schematic perspective view according to the fingerprint acquisition apparatus of first embodiment of the invention.Shown in Fig. 3 and 4, the planar semiconductor fingerprint sensing device 1 of present embodiment comprises a silicon substrate 10, a plurality of fingerprint sensings unit 15, one group of integrated circuit 20, a plurality of first weld pad 30, one first insulation course 40, a plurality of through electrode 50, one second insulation course 60, a plurality of second weld pad 70 and protective seam 80 at least.
These through electrodes 50 connect the two sides and first insulation course 40 of silicon substrate 10, and are electrically connected to these first weld pads 30 respectively.
Fig. 5 shows the schematic perspective view according to the fingerprint acquisition apparatus of second embodiment of the invention.As shown in Figure 5, present embodiment is similar to first embodiment, difference is that the planar semiconductor fingerprint sensing device 1 of present embodiment more comprises a plurality of solder projections 90, is electrically connected to these second weld pads 70 respectively and is positioned at a plurality of back side 70B of these second weld pads 70.
Fig. 6 shows the calcspar according to the integrated circuit of various embodiments of the present invention.As shown in Figure 6, this group integrated circuit 20 comprises an amplifier 22, an analog/digital converter 23 (A/D converter), a treatment circuit 24, an input/output interface 25 and a control logic circuit 21 at least.Amplifier 22 is electrically connected to these fingerprint sensing unit 15, and amplifies the electric signals of these fingerprint sensing unit 15 outputs.Analog/digital converter 23 is electrically connected to amplifier 22, and analog signal conversion is become digital signal.Treatment circuit 24 is electrically connected to analog/digital converter 23, and handle these digital signals, these treatment circuit 24 major functions are that the digital signal of input is made preposition Flame Image Process, for example strengthen the contrast quality of image, or with successional output signal do association processing, also or accumulate many fragment figure pictures to store the image of complete fingerprint.Input/output interface 25 is electrically connected to treatment circuit 24, and the output of the digital signal that will handle.Control logic circuit 21 is electrically connected to these fingerprint sensing unit 15, amplifier 22, analog/digital converter 23, treatment circuit 24 and input/output interface 25, and controls the running of these fingerprint sensing unit 15, amplifier 22, analog/digital converter 23, treatment circuit 24 and input/output interface 25.
Fig. 7 shows the synoptic diagram according to a kind of application of the fingerprint acquisition apparatus of various embodiments of the present invention.As shown in Figure 7, this fingerprint acquisition apparatus is installed in the notebook.Because fingerprint acquisition apparatus has the sensitive surface of whole plane, so the panel of notebook does not need to design special slideway, and the glide direction of finger can not be limited and produces situation about having some setbacks.
Fig. 8 shows the synoptic diagram of using according to the another kind of the fingerprint acquisition apparatus of various embodiments of the present invention.As shown in Figure 8, fingerprint acquisition apparatus 1 also can be installed on the mobile phone 3, so that the navigation function of the cursor 3B on the display device 3A to be provided.Utilize the slippage of finger F, can make cursor 3B can be moved into cursor 3C.So fingerprint acquisition apparatus does not need to design special slideway, and finger moves in all directions and can not be limited and produce situation about having some setbacks.
Another advantage of apparatus of the present invention shared area on be assembled in PCB the time is quite little, the rough real area that is equal to whole sensor chip circuit design, this to present electronic product emphasize compact be very important, in brief, apparatus of the present invention are designed to point the contact sensing face by the through electrode design with the silicon substrate front, and the silicon substrate back side is designed to the surface of contact with PCB assembling, therefore is fit to very much be applied on the miniaturized electronics (mobile phone).
Therefore, fingerprint acquisition apparatus of the present invention has the following advantages.The first, fingerprint acquisition apparatus can effectively be simplified industrial design.The second, the fingerprint acquisition apparatus of whole plane can allow user's operation, and more tool is not restricted.The 3rd, the volume of fingerprint acquisition apparatus and area can be effectively reduced.The 4th, can finish the wafer-class encapsulation of sensing apparatus by through electrode design, do not need as traditional die package consume material and cost.
The only convenient explanation of the specific embodiment that in the detailed description of preferred embodiment, is proposed technology contents of the present invention, but not with narrow sense of the present invention be limited to the foregoing description, in the situation that does not exceed spirit of the present invention and claim, the many variations of being done is implemented, and all belongs to scope of the present invention.
Claims (12)
1. a planar semiconductor fingerprint sensing device is characterized in that, described planar semiconductor fingerprint sensing device comprises at least:
One silicon substrate, it has a positive and back side;
A plurality of fingerprint sensings unit is positioned at the described front of described silicon substrate, and reads a side's placed thereon lines of pointing and produce a plurality of electric signal;
One group of integrated circuit is formed at the described front of described silicon substrate, and handles described a plurality of electric signal;
A plurality of first weld pads are positioned on the described front of described silicon substrate, and are electrically connected to described group of integrated circuit;
One first insulation course is positioned at described a plurality of first weld pads below;
A plurality of through electrodes, it connects described silicon substrate and described first insulation course, and is electrically connected to described a plurality of first weld pad respectively;
One second insulation course is formed on the described back side of described silicon substrate, and between described a plurality of through electrode and the described silicon substrate;
A plurality of second weld pads are formed at the back side of described second insulation course, and described a plurality of second weld pads are electrically connected to described a plurality of first weld pad by described a plurality of through electrodes respectively; And
One protective seam is positioned on the described front of described silicon substrate, and covers described a plurality of fingerprint sensings unit, and forms a flat outer surface for contacting usefulness with described finger.
2. planar semiconductor fingerprint sensing device as claimed in claim 1 is characterized in that, described planar semiconductor fingerprint sensing device more comprises:
A plurality of solder projections are electrically connected to described a plurality of second weld pad respectively and are positioned at a plurality of back sides of described a plurality of second weld pads.
3. planar semiconductor fingerprint sensing device as claimed in claim 1 is characterized in that, described protective seam more covers described group of integrated circuit and described a plurality of first weld pad.
4. planar semiconductor fingerprint sensing device as claimed in claim 3 is characterized in that, described protective seam covers described group of integrated circuit and described a plurality of first weld pad fully.
5. planar semiconductor fingerprint sensing device as claimed in claim 1 is characterized in that the material of described first insulation course comprises monox, dielectric material or insulating polymeric material.
6. planar semiconductor fingerprint sensing device as claimed in claim 1 is characterized in that the material of described second insulation course comprises monox, dielectric material or insulating polymeric material.
7. planar semiconductor fingerprint sensing device as claimed in claim 1 is characterized in that the material of described second insulation course comprises a macromolecular material.
8. planar semiconductor fingerprint sensing device as claimed in claim 1 is characterized in that, described group of integrated circuit comprises at least:
One amplifier is electrically connected to described a plurality of fingerprint sensings unit;
One analog/digital converter is electrically connected to described amplifier;
One treatment circuit is electrically connected to described analog/digital converter;
One input/output interface is electrically connected to described treatment circuit; And
One control logic circuit is electrically connected to described a plurality of fingerprint sensings unit, described amplifier, described analog/digital converter, described treatment circuit and described input/output interface, and controls its running.
9. planar semiconductor fingerprint sensing device as claimed in claim 1 is characterized in that, the contact angle of described flat outer surface and water is greater than 60 degree.
10. planar semiconductor fingerprint sensing device as claimed in claim 1 is characterized in that the material of described protective seam has the characteristic of hydrophobic and oleophobic.
11. planar semiconductor fingerprint sensing device as claimed in claim 1 is characterized in that, the material of described protective seam comprises nano-macromolecule material or stupalith.
12. planar semiconductor fingerprint sensing device as claimed in claim 1 is characterized in that, the material of described protective seam comprises pi, epoxy resin or class brill carbon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810170778A CN101727569A (en) | 2008-10-29 | 2008-10-29 | Planar semiconductor fingerprint sensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810170778A CN101727569A (en) | 2008-10-29 | 2008-10-29 | Planar semiconductor fingerprint sensing device |
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| Publication Number | Publication Date |
|---|---|
| CN101727569A true CN101727569A (en) | 2010-06-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810170778A Pending CN101727569A (en) | 2008-10-29 | 2008-10-29 | Planar semiconductor fingerprint sensing device |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102670241A (en) * | 2011-03-17 | 2012-09-19 | 周正三 | Active biological characteristic sensor and electronic equipment using same |
| CN104050462A (en) * | 2014-07-02 | 2014-09-17 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detection assembly and electronic device thereof |
| CN104063094A (en) * | 2014-07-02 | 2014-09-24 | 南昌欧菲生物识别技术有限公司 | Touch screen with fingerprint recognition function, terminal device and fingerprint recognition method |
| CN105320922A (en) * | 2014-08-04 | 2016-02-10 | 旭景科技股份有限公司 | Method for reinforcing surface characteristics of fingerprint sensor and structure applying method |
| CN106062951A (en) * | 2016-05-30 | 2016-10-26 | 深圳信炜科技有限公司 | Biological sensing module, biosensor chip and electronic equipment |
| CN106068516A (en) * | 2016-05-30 | 2016-11-02 | 深圳信炜科技有限公司 | Bio-sensing chip and electronic equipment |
| CN106158672A (en) * | 2015-04-01 | 2016-11-23 | 深南电路股份有限公司 | The substrate of embedment fingerprint recognition chip and processing method thereof |
| CN106206549A (en) * | 2016-05-30 | 2016-12-07 | 深圳信炜科技有限公司 | Chip and electronic equipment |
| CN106326807A (en) * | 2015-06-24 | 2017-01-11 | 神盾股份有限公司 | Fingerprint sensor |
| CN107381494A (en) * | 2016-05-16 | 2017-11-24 | 神盾股份有限公司 | fingerprint sensor and packaging method thereof |
| CN104933396B (en) * | 2014-03-18 | 2018-07-10 | 茂丞科技股份有限公司 | All-plane sensor with exposed pigment layer and electronic device using same |
| WO2021007971A1 (en) * | 2019-07-18 | 2021-01-21 | 武汉华星光电技术有限公司 | Recognition module and display panel |
-
2008
- 2008-10-29 CN CN200810170778A patent/CN101727569A/en active Pending
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102670241B (en) * | 2011-03-17 | 2014-12-10 | 周正三 | Active biological characteristic sensor and electronic equipment using same |
| CN102670241A (en) * | 2011-03-17 | 2012-09-19 | 周正三 | Active biological characteristic sensor and electronic equipment using same |
| CN104933396B (en) * | 2014-03-18 | 2018-07-10 | 茂丞科技股份有限公司 | All-plane sensor with exposed pigment layer and electronic device using same |
| CN104063094B (en) * | 2014-07-02 | 2017-05-10 | 南昌欧菲生物识别技术有限公司 | Touch screen with fingerprint recognition function, terminal device and fingerprint recognition method |
| CN104050462A (en) * | 2014-07-02 | 2014-09-17 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detection assembly and electronic device thereof |
| CN104063094A (en) * | 2014-07-02 | 2014-09-24 | 南昌欧菲生物识别技术有限公司 | Touch screen with fingerprint recognition function, terminal device and fingerprint recognition method |
| CN104050462B (en) * | 2014-07-02 | 2017-12-19 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detection components and its electronic installation |
| CN105320922A (en) * | 2014-08-04 | 2016-02-10 | 旭景科技股份有限公司 | Method for reinforcing surface characteristics of fingerprint sensor and structure applying method |
| CN105320922B (en) * | 2014-08-04 | 2018-07-06 | 旭景科技股份有限公司 | For strengthening the structure of the method for fingerprint sensor surface characteristic and application this method |
| CN106158672B (en) * | 2015-04-01 | 2019-01-15 | 深南电路股份有限公司 | It is embedded to the substrate and its processing method of fingerprint recognition chip |
| CN106158672A (en) * | 2015-04-01 | 2016-11-23 | 深南电路股份有限公司 | The substrate of embedment fingerprint recognition chip and processing method thereof |
| CN106326807A (en) * | 2015-06-24 | 2017-01-11 | 神盾股份有限公司 | Fingerprint sensor |
| CN106326807B (en) * | 2015-06-24 | 2020-02-11 | 神盾股份有限公司 | Fingerprint sensor |
| CN107381494A (en) * | 2016-05-16 | 2017-11-24 | 神盾股份有限公司 | fingerprint sensor and packaging method thereof |
| CN106206549A (en) * | 2016-05-30 | 2016-12-07 | 深圳信炜科技有限公司 | Chip and electronic equipment |
| WO2017206911A1 (en) * | 2016-05-30 | 2017-12-07 | 深圳信炜科技有限公司 | Chip and electronic device |
| CN106068516A (en) * | 2016-05-30 | 2016-11-02 | 深圳信炜科技有限公司 | Bio-sensing chip and electronic equipment |
| CN106062951A (en) * | 2016-05-30 | 2016-10-26 | 深圳信炜科技有限公司 | Biological sensing module, biosensor chip and electronic equipment |
| WO2021007971A1 (en) * | 2019-07-18 | 2021-01-21 | 武汉华星光电技术有限公司 | Recognition module and display panel |
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Application publication date: 20100609 |