CN106206388B - 一种无爪芯片移动夹具 - Google Patents

一种无爪芯片移动夹具 Download PDF

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CN106206388B
CN106206388B CN201610576371.3A CN201610576371A CN106206388B CN 106206388 B CN106206388 B CN 106206388B CN 201610576371 A CN201610576371 A CN 201610576371A CN 106206388 B CN106206388 B CN 106206388B
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CN106206388A (zh
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吕耀安
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WUXI HI-NANO TECHNOLOGY Co Ltd
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WUXI HI-NANO TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0425—Test clips, e.g. for IC's
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Furnace Details (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

本发明公开了一种无爪芯片移动夹具，包括悬挂杆；所述悬挂杆的一端固定有相互紧靠的第一卡位块和第二卡位块；所述悬挂杆的中部固定有第三卡位块；所述悬挂杆的另一端固定有第四卡位块；还包括铲具；所述铲具通过连接件固定在所述悬挂杆之上、所述第一卡位块和所述第二卡位块之间；所述铲具的铲板为倾斜状；所述铲板的两侧设置有防掉落挡板；还包括拨片；所述拨片悬挂在所述悬挂杆之上、所述第三卡位块和所述第四卡位块之间；所述拨片由电机控制，可在所述第三卡位块和所述第四卡位块之间移动。本发明控制更加简单。且芯片在移动过程中可有效阻止芯片掉落，使得芯片移动更加安全。

Description

一种无爪芯片移动夹具
技术领域
本发明涉及半导体领域，具体涉及一种无爪芯片移动夹具。
背景技术
在半导体制造领域，尤其是芯片的封装和测试过程中，经常需要使用夹具将芯片夹起移动。在现有技术中，芯片移动夹具大多包括多个夹具爪，在移动夹具时，通过控制夹具爪松开或者收紧，将芯片边缘加紧，依靠摩擦力拾起芯片将其移动至所需要的部位。但是控制多个夹具爪，控制系统复杂，且夹具夹的紧，容易对芯片造成损坏，夹具夹的松，则容易掉落。
发明内容
针对现有技术的不足，本发明公开了一种无爪芯片移动夹具。
本发明的技术方案如下：
一种无爪芯片移动夹具，包括悬挂杆；所述悬挂杆的一端固定有相互紧靠的第一卡位块和第二卡位块；所述悬挂杆的中部固定有第三卡位块；所述悬挂杆的另一端固定有第四卡位块；
还包括铲具；所述铲具通过连接件固定在所述悬挂杆之上、所述第一卡位块和所述第二卡位块之间；所述铲具的铲板为倾斜状；所述铲板的两侧设置有防掉落挡板；
还包括拨片；所述拨片悬挂在所述悬挂杆之上、所述第三卡位块和所述第四卡位块之间；所述拨片由电机控制，可在所述第三卡位块和所述第四卡位块之间移动；
所述第三卡位块的固定位置与铲板的末端位置相对齐。
本发明的有益技术效果是：
本发明通过拨片，将芯片扫入铲具。在控制过程中，只需控制拨片一个部件即可，控制更加简单。且芯片在移动过程中，是拖靠在铲具中的，且有拨片靠近在铲具边缘，可有效阻止芯片掉落，使得芯片移动更加安全。
附图说明
图1是本发明的示意图。
具体实施方式
图1是本发明的示意图。如图1所示，本发明包括悬挂杆1。悬挂杆1的一端固定有相互紧靠的第一卡位块11和第二卡位块12。悬挂杆1的中部固定有第三卡位块13。悬挂杆1的另一端固定有第四卡位块14。
还包括铲具2。铲具通过连接件21固定在悬挂杆1之上、第一卡位块11和第二卡位块12之间。铲具2的铲板22为倾斜状，即铲板22的底部为水平状，顶部由初端至末端高度渐渐减小。铲板22的两侧设置有防掉落挡板23。
还包括拨片3。拨片3悬挂在悬挂杆1之上、第三卡位块13和第四卡位块14之间。拨片3由电机控制，可在第三卡位块13和第四卡位块14之间移动。
第三卡位块13的固定位置与铲板22的末端位置相对齐。
在进行芯片移动时，首先控制电机，将拨片3移动至其紧靠第四卡位块14，通过控制系统，控制悬挂杆1移动直至其移动至待铲板22紧靠待移动芯片的旁侧，而拨片3位于移动芯片的另一旁侧。之后控制电机，将拨片3移动至其紧靠第三卡位块13，在拨片3移动的过程中，会将芯片拨动至其位于铲板22的上表面，由于第三卡位块13的固定位置与铲板22的末端位置对齐，所以当拨片3紧靠第三卡位块13的时候，其同时会紧靠铲板22的末端。此时通过控制系统，控制悬挂杆1移动至芯片所应该移动至的位置，在此过程中，铲板22通过防掉落挡板23和拨片3的共同阻挡，不会掉落。到了位置后，控制电机，再次将拨片3移动至其紧靠第三卡位块13，由于铲具2的铲板22为倾斜状，则放置在铲板22之上的芯片会自动滑落出铲板22之外，完成移动过程。
以上所述的仅是本发明的优选实施方式，本发明不限于以上实施例。可以理解，本领域技术人员在不脱离本发明的精神和构思的前提下直接导出或联想到的其他改进和变化，均应认为包含在本发明的保护范围之内。

Claims (1)

1.一种无爪芯片移动夹具，包括悬挂杆(1)、铲具(2)和拨片(3)，其特征在于，所述悬挂杆(1)的一端固定有相互紧靠的第一卡位块(11)和第二卡位块(12)；所述悬挂杆(1)的中部固定有第三卡位块(13)；所述悬挂杆(1)的另一端固定有第四卡位块(14)；
所述铲具(2)通过连接件(21)固定在所述悬挂杆(1)之上、所述第一卡位块(11)和所述第二卡位块(12)之间；所述铲具(2)的铲板(22)为倾斜状；所述铲板(22)的两侧设置有防掉落挡板(23)；
所述拨片(3)悬挂在所述悬挂杆(1)之上、所述第三卡位块(13)和所述第四卡位块(14)之间；所述拨片(3)由电机控制，可在所述第三卡位块(13)和所述第四卡位块(14)之间移动；
所述第三卡位块(13)的固定位置与铲板(22)的末端位置相对齐。
CN201610576371.3A 2016-07-20 2016-07-20 一种无爪芯片移动夹具 Active CN106206388B (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2281531A (en) * 1993-09-02 1995-03-08 Esseplast Spa Procedure for producing a shovel of plastic material having a flexible front edge
CN2833881Y (zh) * 2005-08-05 2006-11-01 华南理工大学 全自动上芯机
CN103094172A (zh) * 2012-12-21 2013-05-08 东莞市中镓半导体科技有限公司 半导体及微电子行业耐高温防滑夹具

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4392203B2 (ja) * 2003-07-15 2009-12-24 株式会社森精機製作所 工作機械

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2281531A (en) * 1993-09-02 1995-03-08 Esseplast Spa Procedure for producing a shovel of plastic material having a flexible front edge
CN2833881Y (zh) * 2005-08-05 2006-11-01 华南理工大学 全自动上芯机
CN103094172A (zh) * 2012-12-21 2013-05-08 东莞市中镓半导体科技有限公司 半导体及微电子行业耐高温防滑夹具

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