CN106252270B - 一种可自动拾取芯片的夹具 - Google Patents

一种可自动拾取芯片的夹具 Download PDF

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CN106252270B
CN106252270B CN201610574015.8A CN201610574015A CN106252270B CN 106252270 B CN106252270 B CN 106252270B CN 201610574015 A CN201610574015 A CN 201610574015A CN 106252270 B CN106252270 B CN 106252270B
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sliding
slide damper
shovel board
spader
chip
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CN106252270A (zh
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吕耀安
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WUXI HI-NANO TECHNOLOGY Co Ltd
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WUXI HI-NANO TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Vibration Prevention Devices (AREA)
  • Load-Engaging Elements For Cranes (AREA)

Abstract

本发明公开了一种可自动拾取芯片的夹具，包括悬挂杆；所述悬挂杆的两端固定有第一定位块和第二定位块；还包括铲具；所述铲具固定在所述悬挂杆之上；所述铲具还包括倾斜状的铲板；所述铲板的两侧分别设置有一个防掉落挡板；所述防掉落挡板的外侧设置有滑动轨道；还包括滑动挡板；所述滑动挡板为凹字形框体，滑动挡板相对的两边末端都置有滑动块；两个滑动块分别嵌置于两个滑动轨道之中，并且可以在所述滑动轨道中滑动；本发明可通过滑动挡板将芯片放置于铲板之上，且可以有效放置芯片在移动时从铲板之上掉落。本发明控制过程简单，只需控制滑动挡板即可，所以也容易制造和维修。

Description

一种可自动拾取芯片的夹具
技术领域
本发明涉及半导体制造技术，具体涉及一种可自动拾取芯片的夹具。
背景技术
在半导体制造领域，尤其是芯片的封装和测试过程中，经常需要使用夹具将芯片夹起移动。在现有技术中，芯片移动夹具大多包括多个夹具爪，在移动夹具时，通过控制夹具爪松开或者收紧，将芯片边缘加紧，依靠摩擦力拾起芯片将其移动至所需要的部位。但是控制多个夹具爪，控制系统复杂，且夹具夹的紧，容易对芯片造成损坏，夹具夹的松，则容易掉落。
发明内容
针对现有技术的不足，本发明公开了一种可自动拾取芯片的夹具。
本发明的技术方案如下：
一种可自动拾取芯片的夹具，包括悬挂杆；所述悬挂杆的两端固定有第一定位块和第二定位块；还包括铲具；所述铲具通过固定块固定在所述悬挂杆之上、第一定位块和第二定位块之间；所述铲具还包括倾斜状的铲板；所述铲板的两侧分别设置有一个防掉落挡板；所述防掉落挡板的外侧设置有滑动轨道；还包括滑动挡板；所述滑动挡板为凹字形框体，滑动挡板相对的两边末端都置有滑动块；两个滑动块分别嵌置于两个滑动轨道之中，并且可以在所述滑动轨道中滑动；当滑动块滑动至滑动轨道的最后端时，滑动挡板紧靠在铲板的末端；当滑动块滑动至滑动轨道的最前端时，滑动挡板和铲板之间空出的位置大于芯片的底面积。
本发明的有益技术效果是：
本发明可通过滑动挡板将芯片放置于铲板之上，且可以有效放置芯片在移动时从铲板之上掉落。本发明控制过程简单，只需控制滑动挡板即可，所以也容易制造和维修。
附图说明
图1是本发明的示意图。
具体实施方式
图1是本发明的示意图。如图1所示，本发明包括悬挂杆1。悬挂杆1的两端固定有第一定位块11和第二定位块12。还包括铲具2。铲具2包括倾斜状的铲板21，即铲板21的下表面为水平状，而铲板21的上表面为倾斜状，从铲板21的初端至铲板21的末端，铲板21的厚度渐渐减小。铲板21的两侧分别设置有一个防掉落挡板22。防掉落挡板22的外侧设置有滑动轨道23。还包括滑动挡板3。滑动挡板3为凹字形框体，滑动挡板3相对的两边末端都置有滑动块31。两个滑动块31分别嵌置于两个滑动轨道23之中，并且可以在滑动轨道23中滑动。当滑动块31滑动至滑动轨道23的最后端时，滑动挡板3紧靠在铲板21的末端。当滑动块31滑动至滑动轨道23的最前端时，滑动挡板3和铲板21之间空出的位置大于芯片的底面积。
滑动挡板3的滑动由电机控制。
在进行芯片移动时，首先控制电机，将滑动挡板3移动至滑动块31紧靠滑动轨道23的最前端，通过控制系统，控制悬挂杆1移动直至其移动至待铲板21紧靠待移动芯片的旁侧。之后控制电机，将滑动挡板3移动直至滑动块31滑动至滑动轨道23的最后端，在滑动挡板3移动的过程中，会将芯片拨动至其位于铲板21的上表面，当滑动块31滑动至滑动轨道23的最后端时，滑动挡板3紧靠在铲板21的末端。此时通过控制系统，控制悬挂杆1移动至芯片所应该移动至的位置，在此过程中，铲板21通过防掉落挡板22和滑动挡板3的共同阻挡，不会掉落。到了位置后，控制电机，再次移动滑动挡板3，直至滑动块31紧靠滑动轨道23的最前端，由于铲具2的铲板21为倾斜状，则放置在铲板21之上的芯片会自动滑落出铲板21之外，完成移动过程。
以上所述的仅是本发明的优选实施方式，本发明不限于以上实施例。可以理解，本领域技术人员在不脱离本发明的精神和构思的前提下直接导出或联想到的其他改进和变化，均应认为包含在本发明的保护范围之内。

Claims (1)

1.一种可自动拾取芯片的夹具，其特征在于，包括悬挂杆(1)；所述悬挂杆(1)的两端固定有第一定位块(11)和第二定位块(12)；还包括铲具(2)；所述铲具(2)通过固定块(24)固定在所述悬挂杆(1)之上、第一定位块(11)和第二定位块(12)之间；所述铲具(2)还包括倾斜状的铲板(21)；所述铲板(21)的两侧分别设置有一个防掉落挡板(22)；所述防掉落挡板(22)的外侧设置有滑动轨道(23)；还包括滑动挡板(3)；所述滑动挡板(3)为凹字形框体，滑动挡板(3)相对的两边末端都置有滑动块(31)；两个滑动块(31)分别嵌置于两个滑动轨道(23)之中，并且可以在所述滑动轨道(23)中滑动；当滑动块(31)滑动至滑动轨道(23)的最后端时，滑动挡板(3)紧靠在铲板(21)的末端；当滑动块(31)滑动至滑动轨道(23)的最前端时，滑动挡板(3)和铲板(21)之间空出的位置大于芯片的底面积。
CN201610574015.8A 2016-07-20 2016-07-20 一种可自动拾取芯片的夹具 Active CN106252270B (zh)

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CN109950195B (zh) * 2019-04-12 2021-12-17 江苏微迈思半导体科技有限公司 一种oled材料安装用具有保护夹固结构的安装平台

Citations (4)

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Publication number Priority date Publication date Assignee Title
GB2281531A (en) * 1993-09-02 1995-03-08 Esseplast Spa Procedure for producing a shovel of plastic material having a flexible front edge
CN2833881Y (zh) * 2005-08-05 2006-11-01 华南理工大学 全自动上芯机
CN103094172A (zh) * 2012-12-21 2013-05-08 东莞市中镓半导体科技有限公司 半导体及微电子行业耐高温防滑夹具
CN103344794A (zh) * 2013-06-24 2013-10-09 上海华力微电子有限公司 一种多功能半导体样品夹具

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Publication number Priority date Publication date Assignee Title
JP4392203B2 (ja) * 2003-07-15 2009-12-24 株式会社森精機製作所 工作機械

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2281531A (en) * 1993-09-02 1995-03-08 Esseplast Spa Procedure for producing a shovel of plastic material having a flexible front edge
CN2833881Y (zh) * 2005-08-05 2006-11-01 华南理工大学 全自动上芯机
CN103094172A (zh) * 2012-12-21 2013-05-08 东莞市中镓半导体科技有限公司 半导体及微电子行业耐高温防滑夹具
CN103344794A (zh) * 2013-06-24 2013-10-09 上海华力微电子有限公司 一种多功能半导体样品夹具

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