CN106197097A - Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig - Google Patents
Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig Download PDFInfo
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- CN106197097A CN106197097A CN201510218165.0A CN201510218165A CN106197097A CN 106197097 A CN106197097 A CN 106197097A CN 201510218165 A CN201510218165 A CN 201510218165A CN 106197097 A CN106197097 A CN 106197097A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 96
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000005057 refrigeration Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000004899 motility Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
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Abstract
The present invention provides a kind of heat-exchanger rig and has the semiconductor refrigerating equipment of this heat-exchanger rig.Specifically, the present invention provides a kind of heat-exchanger rig, including at least one heat transfer substrate, at least first heat pipe, at least second heat pipe and multiple heat exchange fin.First heat pipe has the end section that centre portion hot linked with one of them heat transfer substrate and two are extended along the length direction of this heat transfer substrate respectively by the two ends of centre portion.Second heat pipe have first end hot linked with one of them heat transfer substrate and by the first end along this heat transfer substrate length direction extend the second end.Multiple heat exchange fins are arranged on the end section of the first heat pipe and the second end of the second heat pipe, to distribute the heat transmitted from centre portion to end section.The present invention also provides for a kind of semiconductor refrigerating equipment, including defining the casing of room between storing, at least one semiconductor chilling plate and the hot linked heat-exchanger rig with the hot junction of semiconductor chilling plate.
Description
Technical field
The present invention relates to heat transfer technology, particularly relate to a kind of heat-exchanger rig and there is partly leading of this heat-exchanger rig
System cool equipment.
Background technology
In recent years, semiconductor refrigerating equipment is widely used due to its superior performance, such as quasiconductor system
Cold refrigerator, semiconductor refrigerating refrigerator-freezer etc..Semiconductor refrigerating equipment utilizes the automatic pressure-transforming of semiconductor chilling plate to become
Flow control technology realizes refrigeration, realizes heat radiation by heat pipe and conduction technique, it is not necessary to refrigeration working medium and machine simultaneously
Tool moving component.Therefore, semiconductor refrigerating equipment does not has Working medium pollution and mechanical vibration etc. in application process
Traditional mechanical refrigeration plant series of problems in application.
But, while the cold end of semiconductor chilling plate produces cold, its hot junction can produce substantial amounts of heat.
In order to ensure that semiconductor chilling plate is reliably continued for work, need to distribute the heat that its hot junction produces in time
Amount.A kind of radiating mode of the prior art is to arrange a heat-radiating substrate in the hot junction of semiconductor chilling plate to carry out
Heat radiation, is embedded with multiple heat pipe with two condensation ends in heat-radiating substrate, the condensation end of multiple heat pipes wears
In radiating fin.The plurality of heat pipe generally uses the mode of Juxtaposition and Superimposition to arrange, is not easy to heat radiation, and heat
Pipe quantity is more.If multiple heat pipes staggered interting arranges, then easily interfere between heat pipe, arrange phase
Work as difficulty.
Summary of the invention
One purpose of first aspect present invention is intended to overcome at least one defect of existing heat-exchanger rig, it is provided that
A kind of heat-exchanger rig, it, by reasonably selecting the type of heat pipe, improves the motility that heat pipe is arranged.
One of first aspect present invention further objective is that and effectively to utilize heat transfer space, reduces heat pipe number
Amount, reduces cost.
Another of first aspect present invention further objective is that the uniformity of heat-exchanger rig heat exchange to be improved.
One purpose of second aspect present invention aims to provide a kind of semiconductor refrigerating with heat-exchanger rig and sets
Standby.
According to the first aspect of the invention, the invention provides a kind of heat-exchanger rig, including:
At least one heat transfer substrate, each described heat transfer substrate is respectively provided with heat-transfer surface hot linked with thermal source, with
Heat is received from corresponding thermal source；
At least first heat pipe, described first heat pipe has hot linked with heat transfer substrate one of them described
Centre portion and two are extended along the length direction of this heat transfer substrate by the two ends of described centre portion respectively
End section；
At least second heat pipe, described second heat pipe has hot linked with heat transfer substrate one of them described
First end and by described first end along this heat transfer substrate length direction extend the second end；And
Multiple radiating fins, are simultaneously located at the end section of described first heat pipe and the of described second heat pipe
On two ends, to distribute described end section and the heat of described second end.
Alternatively, described at least first heat pipe includes many first heat pipes, described at least one second heat
Pipe includes many second heat pipes, and
Second end of every described second heat pipe is respectively positioned on two institutes on the length direction of described radiating fin
State between the end section that the two of which of the first heat pipe is adjacent.
Alternatively, the plurality of radiating fin is distributed in the two ends of at least one heat transfer substrate described, to be formed
Two independent radiating fin modules.
Alternatively, at least one end region of every first heat pipe being arranged in same radiating fin module
Section is positioned at two end section of other at least first heat pipe on the length direction of described radiating fin
Between.
Alternatively, the end section of the first heat pipe extended towards at least one heat transfer substrate described with one end and
Second end of the second heat pipe is configured to be arranged in same with equidistant interval along the length direction of described radiating fin
In one described radiating fin module.
Alternatively, at least one heat transfer substrate described includes between said two radiating fin module also
Row and spaced two heat transfer substrates；Wherein
Each heat transfer substrate is provided with at least two described first heat pipes and at least described second heat
Manage, and the end section of described at least two first heat pipes is respectively interposed in different radiating fin modules.
Alternatively, at least one end section of the first heat pipe being embedded in a described heat transfer substrate wherein
Between at least two end section of the first heat pipe being embedded in heat transfer substrate another described.
Alternatively, it is provided with at least two in described heat transfer substrate and runs through the perforation of its width, described first
At least part of centre portion of heat pipe and the first end of described second heat pipe are embedded respectively in described at least two
In perforation.
Alternatively, described at least first heat pipe includes many first heat pipes, described at least one second heat
Pipe includes many second heat pipes, and
At least part of second end of the plurality of second heat pipe is all arranged in the end of described heat exchange fin, every
One of them end section of described first heat pipe is positioned at two ends of other at least one described first heat pipes
Between portion's section.
According to the second aspect of the invention, present invention also offers a kind of semiconductor refrigerating equipment, including:
Casing, defines room between the storing for storing article in it；
At least one semiconductor chilling plate, room thermally coupled between its cold end and described storing, think between described storing
Room provides cold；And
Heat-exchanger rig described in any of the above, the heat-transfer surface of its at least one heat transfer substrate with described at least one
The hot junction thermally coupled of semiconductor chilling plate, to distribute the heat that described hot junction produces.
Owing to the heat-exchanger rig of the present invention includes having the first heat pipe of two end section and has one the
Two kinds of heat pipes of the second heat pipe of two ends, therefore, when arranging heat pipe on heat transfer substrate, can be spaced and be alternately arranged
First heat pipe and the second heat pipe, i.e. choice arrangement the second heat pipe in the space being not enough to arrange the first heat pipe,
Thus take full advantage of heat pipe arrangement space, and the heat pipe produced when avoiding being arranged only with the first heat pipe
Between interference problem, improve heat pipe arrange motility and conveniency.
Further, owing to can unrestricted choice the first heat pipe and/or the second heat pipe enter in the heat-exchanger rig of the present invention
Row is arranged, and at least one end section of the first heat pipe is positioned at two ends of other at least first heat pipe
Between portion's section, the second end of the second heat pipe is positioned at the end section that the two of which of two the first heat pipes is adjacent
Between, that is to say, the first heat pipe and the second heat pipe staggered interting in heat transfer space is arranged, effectively to utilize
The heat transfer space at heat pipe place, thus reach preferable heat transfer effect with less heat pipe quantity, reduce and change
The cost of thermal.
Further, due to the end section and the of the second heat pipe of the first heat pipe of heat-exchanger rig of the present invention
Two ends are located in two the radiating fin modules being positioned at heat transfer substrate two sections respectively, increase fin heat-transfer surface
Long-pending, improve heat exchange efficiency.
According to below in conjunction with the accompanying drawing detailed description to the specific embodiment of the invention, those skilled in the art will
More understand the above-mentioned of the present invention and other purposes, advantage and feature.
Accompanying drawing explanation
Some describing the present invention the most by way of example, and not by way of limitation in detail are concrete
Embodiment.Reference identical in accompanying drawing denotes same or similar parts or part.Art technology
Personnel are it should be understood that what these accompanying drawings were not necessarily drawn to scale.In accompanying drawing:
Fig. 1 is the schematic diagram of heat-exchanger rig according to an embodiment of the invention；
Fig. 2 is the schematic diagram of the first heat pipe of heat-exchanger rig according to an embodiment of the invention；
Fig. 3 is the schematic diagram of heat-exchanger rig in accordance with another embodiment of the present invention.
Detailed description of the invention
Fig. 1 is the schematic diagram of heat-exchanger rig according to an embodiment of the invention.As it is shown in figure 1,
Heat-exchanger rig 100 includes: at least one heat transfer substrate, at least first heat pipe 21, at least one second
Heat pipe 22 and multiple heat exchange fin 30.Heat transfer substrate has heat-transfer surface hot linked with thermal source, with from thermal source
Accept heat.First heat pipe 21 has the centre portion being connected with one of them heat transfer substrate and two difference
By the two ends of centre portion along this heat transfer substrate length direction extend end section.Second heat pipe 22 has
There is first end hot linked with one of them heat transfer substrate and by the first end along the length direction of this heat transfer substrate
The second end extended.Multiple heat exchange fins 30 are arranged in the end section of heat pipe, to distribute from mesozone
The heat that section transmits to end section.
Owing to the heat-exchanger rig 100 in the embodiment of the present invention includes first heat pipe 21 with two end section
With 22 two kinds of heat pipes of the second heat pipe with second end.Therefore, when heat transfer substrate arranges heat pipe,
Can in the space being not enough to arrange the first heat pipe 21 choice arrangement the second heat pipe 22, thus take full advantage of
Interference between heat pipe arrangement space, and the heat pipe produced when avoiding being arranged only with the first heat pipe 21
Problem, improves motility and conveniency that heat pipe is arranged.
In some embodiments of the invention, as it is shown in figure 1, at least first heat pipe 21 includes many
First heat pipe 21, at least second heat pipe 22 includes many second heat pipes 22.Every first heat pipe 21
At least one end section on the length direction of radiating fin, be respectively positioned on other at least first heat pipe
Between two end section of 21, the second end of every second heat pipe 22 is on the length direction of radiating fin
It is respectively positioned between the end section that the two of which of two the first heat pipes 21 is adjacent.It is to say, the present invention
Many first heat pipes 21 staggered the interting of the heat-exchanger rig 100 in embodiment is arranged, the first heat pipe 21 and the
Two heat pipe 22 intervals are alternately arranged, thus while avoiding heat pipe to arrange that generation is interfered, are effectively utilized
The heat transfer space at heat pipe place, thus reach preferable heat transfer effect with less heat pipe quantity, reduce and change
The cost of thermal.
In some embodiments of the invention, multiple heat exchange fins 30 are distributed at least one heat transfer substrate
Two ends, to form two independent heat exchange fin modules, thus increase the array area of heat exchange fin, protect
Demonstrate,prove effective natural heat dissipation.Heat-exchanger rig 100 includes at least two heat pipes, thus, is embedded at least one
The first heat pipe 21 and the second heat pipe 22 in heat transfer substrate can be divided into the difference along heat transfer substrate length direction
The two groups of heat pipes extended towards at least one heat transfer substrate two ends.Often organize end section and/or second end of heat pipe
All it is located in the heat exchange fin module of the respective end being positioned at least one heat transfer substrate, consequently facilitating first
Heat pipe 21 and the layout of the second heat pipe 22 and installation, also take full advantage of simultaneously and be positioned at two heat exchange fin moulds
Heat transfer space between group.
Further, at least one of every first heat pipe 21 being arranged in same radiating fin module
End section is positioned at two ends of other at least first heat pipe 21 on the length direction of radiating fin
Between section, make multiple first heat pipe 21 be formed and arrange staggered interting, and make it with irregular or regular
Form is covered with this heat transfer space, thus is effectively utilized this heat transfer space, improves heat transfer effect, decreases
Heat pipe quantity.
In some embodiments of the invention, the first heat pipe extended towards at least one heat transfer substrate with one end
The end section of 21 and the second end of the second heat pipe 22 are configured to the length direction along radiating fin with equidistantly
Interval is arranged in same radiating fin module.It is to say, the first heat pipe 21 prolongs towards same direction
Second end of the end section stretched and the second heat pipe 22 towards direction extension is along the length of heat exchange fin 30
Direction is arranged in order with equidistant interval.In other words, the end that the first heat pipe 21 extends towards same direction
Second end of portion's section and the second heat pipe 22 towards direction extension is by heat exchange fin 30 along its length
If being divided into isometric stem portion so that the even heat of the first heat pipe 21 and the second heat pipe 22 be transferred to
Heat exchange fin 30.The heat namely making heat exchange fin 30 receive is more uniform, it is simple to it is more uniform
Ground heat exchange, improves heat exchange efficiency.
In some embodiments of the invention, at least one heat transfer substrate includes being positioned at two radiating fin modules
Between arranged side by side and spaced two heat transfer substrates, the specially first heat transfer substrate 11 and the second heat transfer
Substrate 12, the first heat transfer substrate 11 has the first heat-transfer surface 111, and the second heat transfer substrate has the second heat exchange
Face 121.Each heat transfer substrate is provided with at least two first heat pipes 21 and at least second heat pipe
22, and the end section of at least two first heat pipes 21 is respectively interposed in different radiating fin modules.The
One heat transfer substrate 11 and the second heat transfer substrate 12 be arranged side by side and interval setting between two heat exchange fin modules,
So that the length direction of two heat transfer substrates is the most consistent with width, the first heat transfer substrate 11 and second passes
Hot substrate 12 is the arranged side by side and setting that keeps at a certain distance away along its width.Further, it is embedded in the first biography
At least one end section of the first heat pipe 21 in hot substrate 11 is positioned at and is embedded at the second heat transfer substrate 12
The first heat pipe 21 at least two end section between so that the first heat pipe 21 of two heat transfer substrates is handed over
Wrong interting is arranged, it is provided that radiating effect.
Further, in embodiments of the present invention, the first heat pipe 21 can be substantially u-shaped, so that every
Two end section of one heat pipe 21 are extended in parallel in the same direction by the two ends of its centre portion, and then make
Two end section obtaining every first heat pipe 21 are all located in same heat exchange fin module.Specifically,
The end section 212 of the first heat pipe 21 and another end section 213 are by the two ends of its centre portion 211
Along the length direction of heat transfer substrate 11 towards same one end (right-hand member of state shown in Fig. 1) of heat transfer substrate 11
Extend, thus end section 212 and another end section 213 are all located in the heat exchange fin being positioned at this end
In module.Second heat pipe 22 can be substantially L-shaped, so that the second end 222 of every second heat pipe 22 is by it
First end 221 along heat transfer substrate 11 length direction towards heat transfer substrate 11 any one end extend.
Fig. 2 is the schematic knot of the first heat pipe 21 of heat-exchanger rig 100 according to an embodiment of the invention
Composition.In conjunction with Fig. 1 and Fig. 2, the centre portion 211 of the first heat pipe 21 has the width along heat transfer substrate 11
First linear type sub-segments the 2111, second linear type sub-segments 2112 and the 3rd that degree direction is sequentially connected with is straight
Line style sub-segments 2113.First linear type sub-segments the 2111, second linear type sub-segments 2112 and the 3rd is straight
Line style sub-segments 2113 can be located on same straight line, it is possible to lays respectively on different straight lines, it is also possible to
It is positioned on two straight lines with certain angle for adjacent two sub-segments.First linear type sub-segments 2111,
The length of the second linear type sub-segments 2112 and the 3rd linear type sub-segments 2113 can be isometric, it is possible to Length discrepancy.
Two adjacent the first heat pipes 21 are embedded in heat transfer substrate 11 with its different linear type sub-segments respectively,
So that at least two the first heat pipe 21 staggered interting is arranged.
In some embodiments of the invention, it is equipped with at least two in each heat transfer substrate and runs through its width side
To perforation, at least part of centre portion of the first heat pipe 21 and the first end 221 of the second heat pipe 22 are embedded
In this perforation.Preferably, this at least two bore a hole to be equidistantly spaced, with by heat transfer substrate along it
Length direction is divided into three isometric parts so that the even heat in heat transfer substrate be transferred to the first heat pipe
21 and second heat pipe 22.The big I of perforation and the external diameter of the first heat pipe 21 and the second heat pipe 22 phase respectively
Coupling, with after the first heat pipe 21 and the second heat pipe 22 are embedded in perforation so that it is outer surface be positioned at
Heat transfer substrate in perforation is in close contact, so that realizing effective transmission of heat.
It will be understood by those skilled in the art that in other embodiment of the present invention, also can be at heat transfer substrate
The card holding trough running through heat transfer substrate width is offered, for the first heat pipe 21 and the second heat pipe on heat-transfer surface
22 are embedded at wherein.The dimensional configurations of card holding trough becomes to make the first heat pipe 21 and the second heat pipe 22 can be in external force
The lower card dress of effect is embedded, and keeps this first heat pipe 21 and the second heat pipe 22, it is to avoid it automatically disengages
Card holding trough.
In some embodiments of the invention, at least one heat transfer substrate is also provided with blower fan, to order about
Air-flow flows towards multiple heat exchange fins 30, so that air and multiple heat exchange fins 30 occur forced convertion
Heat exchange, improves heat exchange efficiency.
Further, the lamellar body of each heat exchange fin 30 is each formed with air vent 31, and adjacent two are changed
The air vent forward of hot fin 30 is relative.Each heat exchange fin 30 can be formed multiple air vent 31, phase
The co-located air vent forward of adjacent two heat exchange fins 30 is relative.It is to say, multiple heat exchange
The co-located air vent of fin 30 is located along the same line, in order to air is by multiple heat exchange
The air vent circulation of fin 30, strengthens the exchange capability of heat of heat exchange fin 30, thus improves heat-exchanger rig 100
Heat exchange efficiency.
Further, heat exchange fin 30 can extend along the width of at least one heat transfer substrate, and its institute
Vertical, so that the air vent in multiple heat exchange fin 30 is positioned in the heat-transfer surface of heat transfer substrate in plane
On along heat transfer substrate length direction and parallel with heat-transfer surface straight line, in order to be arranged on heat transfer substrate
On blower fan along air vent 31 to heat exchange fin 30 blow flow, improve the flow velocity of air-flow, it is simple to air with
Forced-convection heat transfer is carried out between heat exchange fin 30.
In some embodiments of the invention, between adjacent two heat exchange fins in multiple heat exchange fins
Away from the minimum spacing threshold value predetermined more than.It is to say, adjacent two in multiple heat exchange fins 30 are changed
Hot fin keeps at a certain distance away setting, to form predetermined gap between adjacent two heat exchange fins.This makes a reservation for
Minimum spacing threshold value be preferably 10～20mm.
Fig. 3 is the schematic diagram of heat-exchanger rig in accordance with another embodiment of the present invention.As it is shown on figure 3,
In other embodiments of the present invention, at least first heat pipe 21 includes many first heat pipes 21, extremely
Few second heat pipe 22 includes many second heat pipes 22.At least part of second end of multiple second heat pipes 22
All being arranged in the end of heat exchange fin, at least part of end section of many first heat pipes 21 is positioned at many
Between second end of two heat pipes 22, in order to arrange the first heat pipe 21 and the second heat pipe 22.Every first heat
One of them end section of pipe 21 be positioned at other at least one the first heat pipes 21 two end section it
Between.In embodiments of the present invention, heat-exchanger rig 100 includes the first heat transfer base with the first heat-transfer surface 111
Plate 11 and second heat transfer substrate 12 with the second heat-transfer surface 121, be all embedded with two in each heat transfer substrate
Root the second heat pipe 22 and two first heat pipes 21.Of second heat pipe in the most each heat transfer substrate
Two ends are arranged in one of them heat exchange fin module and are positioned at the end of heat exchange fin 30, and another is years old
Second end of two heat pipes is arranged in another heat exchange fin module and is positioned at and is embedded at two heat transfer substrates
Between adjacent two end section of two the first heat pipes.Specifically, second in heat transfer substrate 11
Second end 222 of heat pipe 22 is arranged in one of them heat exchange fin module and is positioned at heat exchange fin 30
End, the first end 221 of the second heat pipe 22 is embedded in heat transfer substrate 11.The end of the first heat pipe 21
Section 212 and another end section 213 are located in same radiating fin module respectively, its mesozone
Section 211 is embedded in heat transfer substrate 11.
In other embodiments of the present invention, each heat exchange fin module is divided into upper and lower two parts, wears
The first heat pipe 21 end section and the second heat pipe 22 second end in each part are configured to along heat exchange fin
The length direction of 30 is to be equidistantly spaced.It is to say, the first heat pipe 21 end section and the second heat
Each part in each heat exchange fin module can be divided into isometric by pipe 22 second end along its length
If stem portion, so that the even heat ground transmission of the first heat pipe 21 end section and the second heat pipe 22 second end
To heat exchange fin.The heat namely making heat exchange fin receive is more uniform, it is simple to it more uniformly changes
Heat, improves heat exchange efficiency.Specifically, the upper part heat exchange fin of two heat exchange fin modules is positioned at heat transfer base
The two ends, left and right of plate 11, the lower part heat exchange fin of two heat exchange fin modules is positioned at other heat transfer substrates 12
Two ends, left and right, with the heat of two heat transfer substrates that dispel the heat equably.
The present invention also provides for a kind of semiconductor refrigerating equipment, including casing, at least one semiconductor chilling plate and
Heat-exchanger rig 100.Room between the storing for storing article is defined in casing.The cold end of semiconductor chilling plate
And room thermally coupled between storing, thinks that between this storing, room provides cold.At least one heat transfer of heat-exchanger rig 100
The heat-transfer surface of substrate and the hot junction thermally coupled of at least one semiconductor chilling plate, to distribute the heat that this hot junction produces
Amount.
In some embodiments of the invention, the cold end of semiconductor chilling plate can be close to room between storing inwall or
Outer wall, the heat-transfer surface of heat transfer substrate can be close in the hot junction of semiconductor chilling plate.Each heat transfer substrate is towards heat exchange
The side in face is provided with screw fixing hole, for fixing the hot junction of semiconductor chilling plate, it is ensured that this hot junction with change
The reliable thermally coupled of thermal 100.In embodiments of the present invention, heat-exchanger rig 100 can be heat abstractor,
In other embodiment of the present invention, heat-exchanger rig 100 can be also cold scattering device.
It will be understood by those skilled in the art that the semiconductor refrigerating equipment related in the embodiment of the present invention can be ice
Case, refrigerator-freezer, freezing and refrigeration tank or other utilize semiconductor chilling plate to carry out the equipment freezed.
It should also be understood by those skilled in the art that in case of no particular description, alleged by the present invention " on ",
D score, "left", "right", " front " and " afterwards " are all to be arranged in semiconductor refrigerating equipment
For on the basis of the normal operating condition of heat-exchanger rig 100.
So far, although those skilled in the art will appreciate that and the most detailed illustrate and describing the present invention's
Multiple exemplary embodiments, but, without departing from the spirit and scope of the present invention, still can be according to this
Disclosure of invention directly determines or derives other variations or modifications of many meeting the principle of the invention.Cause
This, the scope of the present invention is it is understood that and regard as covering other variations or modifications all these.
Claims (10)
1. a heat-exchanger rig, including:
At least one heat transfer substrate, each described heat transfer substrate is respectively provided with heat-transfer surface hot linked with thermal source, with
Heat is received from corresponding thermal source；
At least first heat pipe, described first heat pipe has hot linked with heat transfer substrate one of them described
Centre portion and two are extended along the length direction of this heat transfer substrate by the two ends of described centre portion respectively
End section；
At least second heat pipe, described second heat pipe has hot linked with heat transfer substrate one of them described
First end and by described first end along this heat transfer substrate length direction extend the second end；And
Multiple radiating fins, are simultaneously located at the end section of described first heat pipe and the of described second heat pipe
On two ends, to distribute described end section and the heat of described second end.
Heat-exchanger rig the most according to claim 1, wherein,
Described at least first heat pipe includes many first heat pipes, and described at least second heat pipe includes many
Root the second heat pipe, and
Second end of every described second heat pipe is respectively positioned on two institutes on the length direction of described radiating fin
State between the end section that the two of which of the first heat pipe is adjacent.
Heat-exchanger rig the most according to claim 2, wherein,
The plurality of radiating fin is distributed in the two ends of at least one heat transfer substrate described, to form two independences
Radiating fin module.
Heat-exchanger rig the most according to claim 3, wherein,
At least one end section of every first heat pipe being arranged in same radiating fin module is in institute
State on the length direction of radiating fin between two end section of other at least first heat pipe.
Heat-exchanger rig the most according to claim 4, wherein,
The end section of the first heat pipe extended with one end towards at least one heat transfer substrate described and the second heat
Second end of pipe is configured to be arranged in same institute along the length direction of described radiating fin with equidistant interval
State in radiating fin module.
Heat-exchanger rig the most according to claim 3, wherein,
At least one heat transfer substrate described include between said two radiating fin module side by side and
Every two heat transfer substrates arranged；Wherein
Each heat transfer substrate is provided with at least two described first heat pipes and at least described second heat
Manage, and the end section of described at least two first heat pipes is respectively interposed in different radiating fin modules.
Heat-exchanger rig the most according to claim 6, wherein,
At least one end section being embedded the first heat pipe in a described heat transfer substrate wherein is positioned at embedding
It is located between at least two end section of the first heat pipe in another described heat transfer substrate.
Heat-exchanger rig the most according to claim 1, wherein,
Being provided with at least two in described heat transfer substrate and run through the perforation of its width, described first heat pipe is extremely
First end of small part centre portion and described second heat pipe is embedded respectively in described at least two is bored a hole.
Heat-exchanger rig the most according to claim 1, wherein,
Described at least first heat pipe includes many first heat pipes, and described at least second heat pipe includes many
Root the second heat pipe, and
At least part of second end of the plurality of second heat pipe is all arranged in the end of described heat exchange fin, every
One of them end section of described first heat pipe is positioned at two ends of other at least one described first heat pipes
Between portion's section.
10. a semiconductor refrigerating equipment, including:
Casing, defines room between the storing for storing article in it；
At least one semiconductor chilling plate, room thermally coupled between its cold end and described storing, think between described storing
Room provides cold；And
Heat-exchanger rig described in any one of claim 1-9, the heat-transfer surface of its at least one heat transfer substrate and institute
State the hot junction thermally coupled of at least one semiconductor chilling plate, to distribute the heat that described hot junction produces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510218165.0A CN106197097A (en) | 2015-04-30 | 2015-04-30 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510218165.0A CN106197097A (en) | 2015-04-30 | 2015-04-30 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
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| CN106197097A true CN106197097A (en) | 2016-12-07 |
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|---|---|---|---|
| CN201510218165.0A Pending CN106197097A (en) | 2015-04-30 | 2015-04-30 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11241893A (en) * | 1998-02-25 | 1999-09-07 | Mitsubishi Electric Corp | Semiconductor element cooling device |
| CN102005442A (en) * | 2009-08-27 | 2011-04-06 | 株式会社日立制作所 | Power conversion device |
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| CN204612556U (en) * | 2015-04-30 | 2015-09-02 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
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- 2015-04-30 CN CN201510218165.0A patent/CN106197097A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11241893A (en) * | 1998-02-25 | 1999-09-07 | Mitsubishi Electric Corp | Semiconductor element cooling device |
| CN102005442A (en) * | 2009-08-27 | 2011-04-06 | 株式会社日立制作所 | Power conversion device |
| US20150075184A1 (en) * | 2013-09-16 | 2015-03-19 | Phononic Devices, Inc. | Enhanced heat transport systems for cooling chambers and surfaces |
| CN204046999U (en) * | 2014-07-03 | 2014-12-24 | 山东超越数控电子有限公司 | A kind of heat pipe-type heat radiation module |
| CN204612556U (en) * | 2015-04-30 | 2015-09-02 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
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Application publication date: 20161207 |
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