CN106197096A - Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig - Google Patents
Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig Download PDFInfo
- Publication number
- CN106197096A CN106197096A CN201510218161.2A CN201510218161A CN106197096A CN 106197096 A CN106197096 A CN 106197096A CN 201510218161 A CN201510218161 A CN 201510218161A CN 106197096 A CN106197096 A CN 106197096A
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- heat
- transfer substrate
- heat transfer
- exchanger rig
- exchange fin
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Abstract
The present invention provides a kind of heat-exchanger rig and has the semiconductor refrigerating equipment of this heat-exchanger rig.Specifically, the present invention provides a kind of heat-exchanger rig, including at least two heat transfer substrate, at least two heat pipes and multiple heat exchange fin.Every heat pipe is respectively provided with the end section that centre portion hot linked with one of them heat transfer substrate and two are extended along the length direction of this heat transfer substrate respectively by the two ends of centre portion.Multiple heat exchange fins are arranged in the end section of heat pipe, to distribute the heat transmitted from centre portion to end section.The heat pipe being respectively provided with at least heat pipe, and at least two heat transfer substrate on each heat transfer substrate at least two heat transfer substrate shares the plurality of heat exchange fin, thus saves the space that heat exchange fin takies.The present invention also provides for a kind of semiconductor refrigerating equipment, including defining the casing of room between storing, at least two semiconductor chilling plate and the hot linked heat-exchanger rig with the hot junction of semiconductor chilling plate.
Description
Technical field
The present invention relates to heat transfer technology, particularly relate to a kind of heat-exchanger rig and there is partly leading of this heat-exchanger rig
System cool equipment.
Background technology
In recent years, semiconductor refrigerating equipment is widely used due to its superior performance, such as quasiconductor system
Cold refrigerator, semiconductor refrigerating refrigerator-freezer etc..Semiconductor refrigerating equipment utilizes the automatic pressure-transforming of semiconductor chilling plate to become
Flow control technology realizes refrigeration, realizes heat radiation by heat pipe and conduction technique, it is not necessary to refrigeration working medium and machine simultaneously
Tool moving component.Therefore, semiconductor refrigerating equipment does not has Working medium pollution and mechanical vibration etc. in application process
Traditional mechanical refrigeration plant series of problems in application.
But, while the cold end of semiconductor chilling plate produces cold, its hot junction can produce substantial amounts of heat.
In order to ensure that semiconductor chilling plate is reliably continued for work, need to distribute the heat that its hot junction produces in time
Amount.A kind of radiating mode of the prior art is to arrange a heat-radiating substrate in the hot junction of semiconductor chilling plate to carry out
Heat radiation, is embedded with many heat pipes in heat-radiating substrate, the end of many heat pipes is located in heat exchange fin.But
Many heat pipes are all embedded in a heat-radiating substrate, and the layout difficulty of heat pipe is bigger.And when semiconductor refrigerating sets
Standby need to reach relatively low cryogenic temperature or need when making that between different storings, room realizes different refrigeration,
Typically require two or more semiconductor chilling plate.Each semiconductor chilling plate needs a heat radiation base
Plate, each heat-radiating substrate needs single heat exchange fin to carry out auxiliary heat dissipation, and the space that heat exchange fin takies is relatively
Greatly, the volume causing semiconductor refrigerating equipment is bigger.
Summary of the invention
One purpose of first aspect present invention is intended to overcome at least one defect of existing heat-exchanger rig, it is provided that
A kind of heat-exchanger rig, it has at least two and shares the heat transfer substrate of heat exchange fin, to improve what heat pipe was arranged
Motility, saves heat exchange fin and takes up room, thus reduce the volume of heat-exchanger rig.
One of first aspect present invention further objective is that the uniformity of heat-exchanger rig heat exchange to be improved.
Another of first aspect present invention further objective is that the heat exchange efficiency of heat-exchanger rig to be improved.
One purpose of second aspect present invention is to provide a kind of semiconductor refrigerating equipment with heat-exchanger rig.
According to the first aspect of the invention, the invention provides a kind of heat-exchanger rig, including:
At least two heat transfer substrate, each described heat transfer substrate is respectively provided with heat-transfer surface hot linked with thermal source, with
Heat is received from corresponding thermal source；
At least two heat pipes, every heat pipe is respectively provided with the centre fixing to be connected with heat transfer substrate one of them described
The end that section and two are extended along the length direction of this heat transfer substrate by the two ends of described centre portion respectively
Section；And
Multiple heat exchange fins, be arranged on described at least two heat pipes end section on, to distribute from described
Between the heat that transmits to described end section of section；Wherein
At least described heat pipe it is respectively provided with on each heat transfer substrate in described at least two heat transfer substrate, and
Heat pipe in described at least two heat transfer substrate shares the plurality of heat exchange fin.
Alternatively, the plurality of heat exchange fin is distributed in the two ends of described at least two heat transfer substrate, to be formed
Two independent heat exchange fin modules.
Alternatively, described at least two heat transfer substrate include being arranged in said two heat exchange fin module it
Between space in two heat transfer substrates, each heat transfer substrate is provided with many described heat pipes.
Alternatively, many be located in same described heat exchange fin module in said two heat transfer substrate
Heat pipe is configured to its at least part of centre portion and is embedded wherein in a described heat transfer substrate, so that these are many
At least one end section of every heat pipe in root heat pipe is positioned at two ends of other at least heat pipe
Between section.
Alternatively, the end section being located in many heat pipes in same described heat exchange fin module is configured to
Along the length direction of described heat exchange fin to be equidistantly spaced.
Alternatively, at least one perforation running through its width, institute it are equipped with in each described heat transfer substrate
At least part of centre portion stating at least heat pipe is embedded in described perforation.
Alternatively, the heat-transfer surface of each described heat transfer substrate is respectively provided with at least one and runs through described heat transfer substrate width
The card holding trough in degree direction, the centre portion of described at least heat pipe is embedded in described card holding trough.
Alternatively, described heat pipe takes the shape of the letter U, so that the two of described heat pipe end section are by its centre portion
Two ends extend in parallel towards the same one end of its place heat transfer substrate.
Alternatively, the plurality of heat exchange fin is vertically extending, and its place plane is conducted heat with described at least two
The heat-transfer surface of substrate is vertical；And
The lamellar body of each described heat exchange fin is each formed with air vent, and the ventilation of adjacent two heat exchange fins
Hole forward is relative.
According to the second aspect of the invention, present invention also offers a kind of semiconductor refrigerating equipment, including:
Casing, defines room between the storing for storing article in it；
At least two semiconductor chilling plate, room thermally coupled between its cold end and described storing, think between described storing
Room provides cold；And
Heat-exchanger rig described in any of the above, the heat-transfer surface of its at least two heat transfer substrate respectively with described at least
The hot junction thermally coupled of two semiconductor chilling plates, to distribute the heat that described hot junction produces.
The heat-exchanger rig of the present invention shares the heat transfer substrate of heat exchange fin owing to arranging at least two, on the one hand,
At least two heat transfer substrate can be that heat pipe offer is more embedded space, it is simple to arranges heat pipe neatly；Another
Aspect, at least two heat transfer substrate shares heat exchange fin, can save the heat exchange fin of at least one heat transfer substrate,
Thus reduce the space shared by heat exchange fin, and then reduce the volume of heat-exchanger rig.
Further, owing to, in the heat-exchanger rig of the present invention, being located in same heat exchange fin module many
With the end section of heat pipe is configured to the length direction along heat exchange fin to be equidistantly spaced, therefore, heat
Heat or cold in pipe can balancedly distribute to heat exchange fin, thus realized more equal by heat exchange fin
Even heat transfer effect.
Further, owing to, in the heat-exchanger rig of the present invention, heat exchange fin is distributed at least two heat transfer substrate
Two ends, define two independent heat exchange fin modules, increase fin heat exchange area, improve heat exchange
Efficiency.
According to below in conjunction with the accompanying drawing detailed description to the specific embodiment of the invention, those skilled in the art will
More understand the above-mentioned of the present invention and other purposes, advantage and feature.
Accompanying drawing explanation
Some describing the present invention the most by way of example, and not by way of limitation in detail are concrete
Embodiment.Reference identical in accompanying drawing denotes same or similar parts or part.Art technology
Personnel are it should be understood that what these accompanying drawings were not necessarily drawn to scale.In accompanying drawing:
Fig. 1 is the schematic diagram of heat-exchanger rig according to an embodiment of the invention；
Fig. 2 is the schematic diagram of the heat pipe of heat-exchanger rig according to an embodiment of the invention.
Detailed description of the invention
Fig. 1 is the schematic diagram of heat-exchanger rig according to an embodiment of the invention.As it is shown in figure 1,
Heat-exchanger rig 100 includes: at least two heat transfer substrate, at least two heat pipes and multiple heat exchange fin 30.Often
Individual heat transfer substrate is respectively provided with heat-transfer surface hot linked with thermal source, to accept heat from corresponding thermal source.Every heat
Pipe is respectively provided with the centre portion being connected with one of them heat transfer substrate and two respectively by the two ends of centre portion
The end section extended along the length direction of this heat transfer substrate.Multiple heat exchange fins 30 are arranged at least two
In the end section of heat pipe, to distribute the heat transmitted from centre portion to end section.Especially, at least
Each heat transfer substrate in two heat transfer substrates is respectively provided with the heat at least heat pipe, and two heat transfer substrates
Pipe shares the plurality of heat exchange fin 30.Thus, at least two heat pipes can at least two heat transfer substrate flexibly
Arrange, improve the conveniency that heat pipe is installed.Meanwhile, at least two heat transfer substrate shares heat exchange fin, can save
Save part heat exchange fin, to reduce the space that heat exchange fin takies, thus reduce the volume of heat-exchanger rig 100.
In some embodiments of the invention, as it is shown in figure 1, multiple heat exchange fin 30 is distributed at least two
The two ends of individual heat transfer substrate, to form two independent heat exchange fin modules, thus increase heat exchange fin
Array area, it is ensured that effective natural heat dissipation.Thus, it is embedded at least two at least two heat transfer substrate
What root heat pipe can be divided into along at least two heat transfer substrate length direction is respectively facing at least two heat transfer substrate
Two groups of heat pipes that two ends extend.Often organize the end section of heat pipe to be all located in and be positioned at least two heat transfer substrate
In the heat exchange fin module of respective end, consequently facilitating the layout of at least two heat pipes and installation, also fill simultaneously
Divide and make use of the heat transfer space between two heat exchange fin modules.
Further, at least two heat pipes can be handed in the heat transfer space between two heat exchange fin modules
Wrong interting is arranged, and is covered with this heat transfer space with irregular or regular form, thus is effectively utilized this heat exchange
Space, improves heat transfer effect, decreases heat pipe quantity.
In some embodiments of the invention, at least two heat transfer substrate includes being arranged in two heat exchange wings
Two heat transfer substrates in space between sheet module, the specially first heat transfer substrate 11 and the second heat transfer base
Plate 12, is provided with many heat pipes in each heat transfer substrate.First heat transfer substrate 11 and the second heat transfer substrate
12 between two heat exchange fin modules side by side and interval is arranged so that the length direction of two heat transfer substrates and
Width is all consistent, the first heat transfer substrate 11 and the second heat transfer substrate 12 along its width side by side and
Arrange at a certain distance.Further, at least one end of the heat pipe being embedded in the first heat transfer substrate 11
Portion's section is being embedded between at least two end section of the heat pipe of the second heat transfer substrate 12, so that two
The heat pipe of individual heat transfer substrate staggered interting is arranged, it is provided that radiating effect.
In some embodiments of the invention, two heat transfer substrates are located in same heat exchange fin module
In many heat pipes be configured to its at least part of centre portion and be embedded wherein in a heat transfer substrate so that
At least one end section of every heat pipe in these many heat pipes is positioned at two of other at least heat pipe
Between end section.In embodiments of the present invention, the first heat transfer substrate 11 is embedded with at least three heat pipes,
Two heat pipes are wherein had to be located in the heat exchange fin module of right-hand member.Second heat transfer substrate 12 has a heat
Pipe is located in the heat exchange fin module of right-hand member.First heat transfer substrate 11 and the second heat transfer substrate 12 are embedded
At least one end section of every heat pipe of this three heat pipes be positioned at two ends of other two heat pipes
Between section.
Further, the end section being located in many heat pipes in same heat exchange fin module is configured to edge
The length direction of heat exchange fin 30 is to be equidistantly spaced.It is to say, heat pipe is towards two heat transfer bases
Multiple end section that plate extends with one end along heat exchange fin 30 length direction with equidistant compartment of terrain successively
Arrangement.In other words, heat exchange fin 30 can be divided into isometric by the plurality of end section along its length
If stem portion so that the even heat of heat pipe end section be transferred to heat exchange fin 30.Namely make to change
The heat that hot fin 30 receives is more uniform, it is simple to its more uniformly heat exchange, improves heat exchange efficiency.
Further, in some embodiments of the invention, at least part of centre portion of every heat pipe is arranged
Wherein on a heat transfer substrate, so that at least one end section of every heat pipe is at heat exchange fin 30
On length direction between two end section of other at least heat pipe.In the embodiment of the present invention, extremely
Few two heat pipes can include the first heat pipe 21 and the second heat pipe 22.The centre portion 211 of the first heat pipe 21
Mid portion is embedded in heat transfer substrate 11, equally, and the pars intermedia of the centre portion 221 of the second heat pipe 22
Divide and be embedded in heat transfer substrate 11.One of them end section 212 of first heat pipe 21 is positioned at the second heat pipe
Between end section 222 and the other end section 223 of 22；The end section of the second heat pipe 22 222
Between the end section 212 and the other end section 213 of the first heat pipe 21.Thus, two heat pipes are handed over
Mistake wears setting, to increase heat pipe and the contact area of heat transfer space residing for it, real with less heat pipe quantity
Now preferable heat transfer effect, reduces the cost of heat-exchanger rig.
Fig. 2 is the schematic diagram of the heat pipe of heat-exchanger rig 100 according to an embodiment of the invention.?
In the embodiment of the present invention, the first heat pipe 21 is roughly the same with the structure of the second heat pipe 22, below with the first heat
As a example by pipe 21, its structure is described in detail.The centre portion 211 of the first heat pipe 21 has along heat transfer base
First linear type sub-segments the 2111, second linear type sub-segments 2112 and that the width of plate is sequentially connected with
3rd linear type sub-segments 2113.First linear type sub-segments the 2111, second linear type sub-segments 2112 and
3rd linear type sub-segments 2113 can be located on same straight line, it is possible to lays respectively on different straight lines,
Can also be positioned on two straight lines with certain angle for adjacent two sub-segments.First linear type sub-segments
2111, the length of the second linear type sub-segments 2112 and the 3rd linear type sub-segments 2113 can be isometric, it is possible to
Length discrepancy.
As it is shown in figure 1, the centre portion 221 of the second heat pipe 22 also has the width side along heat transfer substrate 11
To the first linear type sub-segments being sequentially connected with, the second linear type sub-segments and the 3rd linear type sub-segments.The
Second linear type sub-segments 2112 of one heat pipe 21 is embedded in the first heat transfer substrate 11, the second heat pipe 22
The second linear type sub-segments be embedded in the second heat transfer substrate 12.It is to say, the first heat pipe 21 and
Two heat pipes 22 stagger setting on the width of two heat transfer substrates, it is to avoid the two superposition side by side, thus
Other in addition to the section being embedded in two heat transfer substrates of the first heat pipe 21 and the second heat pipe 22 can be made
Each section is both exposed in heat transfer space or is located in heat exchange fin 30, and then makes the first heat pipe 21 He
The section as much as possible of the second heat pipe 22 all can carry out heat exchange, i.e. with heat transfer space or heat exchange fin 30
Realize the maximization of heat transfer space, reach preferable heat transfer effect.
In some embodiments of the invention, it is equipped with at least one in each heat transfer substrate and runs through its width side
To perforation, at least part of centre portion of at least heat pipe is embedded in this perforation.Implement in the present invention
In example, the centre portion of at least two heat pipes is embedded respectively in the perforation of two heat transfer substrates.In the present invention
In other embodiment, multiple perforation running through its width in each heat transfer substrate, can be provided with, for
Many heat pipes are embedded wherein.Preferably, the plurality of perforation is to be equidistantly spaced, with by heat transfer substrate edge
Its length direction is divided into three isometric parts so that the even heat in heat transfer substrate be transferred to many heat
Pipe.The big I of perforation matches with the external diameter of heat pipe, with after heat pipe is embedded in perforation, makes heat pipe
Outer surface and the heat transfer substrate being positioned at perforation are in close contact, so that realizing effective transmission of heat.
It will be understood by those skilled in the art that in other embodiments of the present invention, the first heat transfer substrate tool
Having the first heat-transfer surface 111, the second heat transfer substrate has the second heat-transfer surface 121.The heat exchange of each heat transfer substrate
Face is respectively provided with at least one card holding trough running through this heat transfer substrate width, the mesozone of at least heat pipe
Section is embedded in this card holding trough.In embodiments of the present invention, the centre portion of at least two heat pipes is embedded respectively
In the card holding trough of two heat transfer substrate heat-transfer surfaces.In other embodiment of the present invention, each heat transfer base
Multiple card holding trough running through its width can be provided with in plate, be embedded wherein for many heat pipes.Preferably,
The plurality of card holding trough is to be equidistantly spaced, so that heat transfer substrate to be divided into isometric three along its length
Part so that the even heat in heat transfer substrate be transferred to many heat pipes.The dimensional configurations of card holding trough becomes to make
Heat pipe can block dress under external force and is embedded, and keep this heat pipe, it is to avoid it automatically disengages card holding trough.
In some embodiments of the invention, in conjunction with Fig. 1 and Fig. 2, the first heat pipe 21 and the second heat pipe 22
Can all be substantially u-shaped so that the two of every heat pipe end section by the two ends of its centre portion towards same side
To extending in parallel, and then two end section of every heat pipe are made all to be located in same heat exchange fin module
In.As a example by the first heat pipe 21, its end section 212 and another end section 213 are by its mesozone
The two ends of section 211 are along the length direction of heat transfer substrate 11 towards same one end of heat transfer substrate 11 (shown in Fig. 1
The right-hand member of state) extend, thus end section 212 and another end section 213 are all located in and are positioned at this
In the heat exchange fin module of end.It will be understood by those skilled in the art that in other embodiment of the present invention,
First heat pipe 21 and the second heat pipe 22 also can be the most Z-shape.That is to say, two ends of every heat pipe
Section respectively by the two ends of its centre portion along the length direction of heat transfer substrate towards two differences of heat transfer substrate
End extends, so that the two of every heat pipe end section are located in respectively and are positioned at the two of heat transfer substrate two ends
In individual heat exchange fin module.Certainly, in other the embodiment other of the present invention, the first heat pipe 21
Can be substantially u-shaped, the second heat pipe 22 can be the most Z-shape, and the first heat pipe 21 and the second heat pipe 22 interlock
Intert and arrange.
In some embodiments of the invention, each heat exchange fin in multiple heat exchange fins 30 is all along at least
The width of two heat transfer substrates extends, and its place plane is vertical with the heat-transfer surface of at least two heat transfer substrate
Directly.The lamellar body of each heat exchange fin is each formed with air vent, and the air vent of adjacent two heat exchange fins is just
To relatively, it is simple to the circulation of air, thus improve heat transfer efficiency.Further, multiple heat exchange fins 30
In adjacent two heat exchange fins keep at a certain distance away setting, pre-to be formed between adjacent two heat exchange fins
Fixed gap, so that the heat on heat exchange fin can distribute in the space between adjacent two heat exchange fins
To space, improve heat exchange efficiency further.Preferably, the spacing between adjacent two heat exchange fins is preferred
It is 10～20mm.
Further, in some embodiments of the invention, each heat transfer substrate is also provided with axial flow wind
Fan (not shown), to promote air to flow towards the heat exchange fin being positioned at heat transfer substrate both sides, and leads to
Cross the air vent on heat exchange fin 30 and realize the forced-convection heat transfer between heat exchange fin 30 and air, it is achieved
Jumbo exchange capability of heat, improves heat exchange efficiency further.
The present invention also provides for a kind of semiconductor refrigerating equipment, including casing, at least two semiconductor chilling plate and
Heat-exchanger rig 100.Room between the storing for storing article is defined in casing.At least two semiconductor refrigerating
Room thermally coupled between the cold end of sheet and storing, thinks that between this storing, room provides cold.Heat-exchanger rig 100 is at least
The heat-transfer surface of two heat transfer substrates and the hot junction thermally coupled of at least two semiconductor chilling plate, to distribute this hot junction
The heat produced.
In some embodiments of the invention, the cold end of semiconductor chilling plate can be close to room between storing inwall or
Outer wall, the heat-transfer surface of heat transfer substrate can be close in the hot junction of semiconductor chilling plate.Heat transfer substrate is towards heat-transfer surface
Side is provided with screw fixing hole, for fixing the hot junction of semiconductor chilling plate, it is ensured that this hot junction fills with heat exchange
The reliable thermally coupled put.In embodiments of the present invention, heat-exchanger rig 100 can be heat abstractor, in the present invention
In other embodiment, heat-exchanger rig 100 can be also cold scattering device.
It will be understood by those skilled in the art that the semiconductor refrigerating equipment related in the embodiment of the present invention can be ice
Case, refrigerator-freezer, freezing and refrigeration tank or other utilize semiconductor chilling plate to carry out the equipment freezed.
It should also be understood by those skilled in the art that in case of no particular description, alleged by the present invention " on ",
D score, "left", "right", " front " and " afterwards " are all to be arranged in semiconductor refrigerating equipment
For on the basis of the normal operating condition of heat-exchanger rig 100.
So far, although those skilled in the art will appreciate that and the most detailed illustrate and describing the present invention's
Multiple exemplary embodiments, but, without departing from the spirit and scope of the present invention, still can be according to this
Disclosure of invention directly determines or derives other variations or modifications of many meeting the principle of the invention.Cause
This, the scope of the present invention is it is understood that and regard as covering other variations or modifications all these.
Claims (10)
1. a heat-exchanger rig, including:
At least two heat transfer substrate, each described heat transfer substrate is respectively provided with heat-transfer surface hot linked with thermal source, with
Heat is received from corresponding thermal source；
At least two heat pipes, every heat pipe is respectively provided with the centre portion being connected with heat transfer substrate one of them described
With two respectively by the two ends of described centre portion along this heat transfer substrate length direction extend end section；
And
Multiple heat exchange fins, be arranged on described at least two heat pipes end section on, to distribute from described
Between the heat that transmits to described end section of section；Wherein
At least described heat pipe it is respectively provided with on each heat transfer substrate in described at least two heat transfer substrate, and
Heat pipe in described at least two heat transfer substrate shares the plurality of heat exchange fin.
Heat-exchanger rig the most according to claim 1, wherein,
The plurality of heat exchange fin is distributed in the two ends of described at least two heat transfer substrate, to form two independences
Heat exchange fin module.
Heat-exchanger rig the most according to claim 2, wherein,
Described at least two heat transfer substrate includes the sky being arranged between said two heat exchange fin module
Two interior heat transfer substrates, are provided with many described heat pipes in each heat transfer substrate.
Heat-exchanger rig the most according to claim 3, wherein,
The many heat pipes being located in same described heat exchange fin module in said two heat transfer substrate are joined
It is set to its at least part of centre portion be embedded wherein in a described heat transfer substrate, so that these many heat pipes
In at least one end section of every heat pipe be positioned at other at least heat pipe two end section it
Between.
Heat-exchanger rig the most according to claim 4, wherein,
The end section being located in many heat pipes in same described heat exchange fin module is configured to along described
The length direction of heat exchange fin is to be equidistantly spaced.
Heat-exchanger rig the most according to claim 1, wherein,
At least one perforation running through its width it is equipped with in each described heat transfer substrate, described at least one
At least part of centre portion of root heat pipe is embedded in described perforation.
Heat-exchanger rig the most according to claim 1, wherein,
The heat-transfer surface of each described heat transfer substrate is respectively provided with at least one and runs through described heat transfer substrate width
Card holding trough, the centre portion of described at least heat pipe is embedded in described card holding trough.
Heat-exchanger rig the most according to claim 1, wherein,
Described heat pipe takes the shape of the letter U so that the two of described heat pipe end section by the two ends of its centre portion towards it
The same one end of place heat transfer substrate extends in parallel.
Heat-exchanger rig the most according to claim 1, wherein,
The plurality of heat exchange fin is vertically extending, and its place plane is changed with described at least two heat transfer substrate
Hot side is vertical；And
The lamellar body of each described heat exchange fin is each formed with air vent, and the ventilation of adjacent two heat exchange fins
Hole forward is relative.
10. a semiconductor refrigerating equipment, including:
Casing, defines room between the storing for storing article in it；
At least two semiconductor chilling plate, room thermally coupled between its cold end and described storing, think between described storing
Room provides cold；And
Heat-exchanger rig described in any one of claim 1-9, the heat-transfer surface of its at least two heat transfer substrate is respectively
With the hot junction thermally coupled of described at least two semiconductor chilling plate, with distribute described hot junction produce heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510218161.2A CN106197096A (en) | 2015-04-30 | 2015-04-30 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510218161.2A CN106197096A (en) | 2015-04-30 | 2015-04-30 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106197096A true CN106197096A (en) | 2016-12-07 |
Family
ID=57458518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510218161.2A Pending CN106197096A (en) | 2015-04-30 | 2015-04-30 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106197096A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102005442A (en) * | 2009-08-27 | 2011-04-06 | 株式会社日立制作所 | Power conversion device |
| US20150075184A1 (en) * | 2013-09-16 | 2015-03-19 | Phononic Devices, Inc. | Enhanced heat transport systems for cooling chambers and surfaces |
| CN204694128U (en) * | 2015-04-30 | 2015-10-07 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
-
2015
- 2015-04-30 CN CN201510218161.2A patent/CN106197096A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102005442A (en) * | 2009-08-27 | 2011-04-06 | 株式会社日立制作所 | Power conversion device |
| US20150075184A1 (en) * | 2013-09-16 | 2015-03-19 | Phononic Devices, Inc. | Enhanced heat transport systems for cooling chambers and surfaces |
| CN204694128U (en) * | 2015-04-30 | 2015-10-07 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
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