JPH11241893A - Semiconductor element cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To unify the heat distribution of a heat receiving block for a semiconductor element cooling device by a method wherein the cooling device is provided with a U-shape heat pipe, in which the flow passage of cooling medium is formed between heat sinks and both sides of a heat receiving block of a turning unit, formed at the middle part of the flow passage, are buried into the heat receiving block while both ends of the same are connected to the heat sinks. SOLUTION: A semiconductor element cooling device is provided with a plurality of heat sinks 5, arranged with a space between each other and the flow passage of cooling medium is formed between the same 5, a heat receiving block 2, on which a semiconductor element 3 is mounted and the heat of the semiconductor element 3 is transmitted, and a U-shape heat pipe 4, in which a turning unit is formed at the middle part of the same and both sides of the turning unit are buried into the heat receiving block 2 while both ends of the same are connected to the heat sinks 5. One ends 4j of two sets of U-shape heat pipes 4 are connected to the upstream side of air (upstream side) of the flow passage 7 of air as cooling medium (flow passage of cooling medium) while both end units 4k are connected to the downstream side of air (downstream side) of the flow passage of running air respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device cooling device for cooling a semiconductor device via a heat dissipation block to which the semiconductor device is attached.

[0002]

2. Description of the Related Art FIG. 12 is a perspective projection view showing a conventional semiconductor device cooling device, and FIG. 13 is a diagram showing the relationship between the configuration of the conventional semiconductor device cooling device and the temperature rise distribution of a heat radiation block. . FIG. 14 is a side view showing a conventional semiconductor device cooling device. 12 and FIG.
Is a semiconductor device cooling device, 12 is a heat receiving block of the semiconductor device cooling device, 13 is a plurality of semiconductor devices mounted on the heat receiving block 12 of the semiconductor device cooling device, and 14 is inserted and attached to the heat receiving block 12 of the semiconductor device cooling device. One or more heat pipes, 14a is an evaporator of the heat pipe, 14b is a refrigerant sealed in the heat pipe, 1
4c is a heat radiating portion of the heat pipe, 15 is a heat pipe 14
The radiating fins inserted in the radiating portion, 16 indicate natural convection of air generated by a rise in temperature of the radiating portion, and 17 indicates convection of air generated by traveling of the vehicle.

Next, the operation will be described. Semiconductor element 1
The heat generated in 3 is transferred to the heat receiving block 12 of the semiconductor element cooling device made of a material having good heat conduction characteristics, such as copper or aluminum, in order to facilitate heat collection or dispersion. Further, the transferred heat is transferred to one or more heat pipes 14 inserted into the heat receiving block 12 of the semiconductor device cooling device.
Is transferred to the heat pipe evaporating section 14a of the heat pipe 1
Refrigerant 14b enclosed in 4 takes latent heat, and conducts heat to radiating fins 15 inserted in radiating portion 14c of heat pipe 14 by the heat operation of the heat pipe. The heat conducted to the radiation fins 15 causes natural convection 16 of air from the radiation fins 15 and traveling wind convection 17 generated by traveling of the vehicle.
As a result, heat is released to the atmosphere to complete the cooling of the element.

[0004]

In a conventional semiconductor device cooling device, a heat receiving block of the semiconductor device cooling device transfers heat generated by one or a plurality of semiconductor devices to an evaporating portion of a heat pipe inserted therein. It had an effect of dispersing and transferring heat. Therefore, a heat receiving block larger than the heat transfer area of the semiconductor element is provided, and the number of heat radiating heat pipes is determined according to the amount of heat radiated.

In recent years, however, the amount of heat dissipation has increased due to the increase in the number of semiconductor elements and the increase in capacity. There is a need to actively use the traveling wind. In particular, when a plurality of semiconductor elements are arranged, the parallel connection arrangement is performed by increasing the capacity. However, in order to secure the element performance, it is necessary to make the temperature of the block surface between the elements of the parallel connection uniform. In the method of dispersing heat to the evaporating portion of each heat-dissipating heat pipe only by the heat-receiving block, the heat-receiving block includes a semiconductor element mounted on the windward side of the traveling wind convection and a semiconductor element mounted on the leeward side. Has a problem that the temperature distribution becomes uneven and the cooling performance of the semiconductor element cooling device is reduced. Further, in the case of a plurality of semiconductor elements, there is a problem that the temperature of the block surface between the semiconductor elements in the parallel connection arrangement is unbalanced and the element performance of the semiconductor elements is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and provides a semiconductor device cooling device capable of achieving a uniform heat distribution of a heat receiving block of a semiconductor device cooling device and obtaining high cooling performance. It is intended to provide a device.

[0007]

According to the present invention, there is provided a semiconductor device cooling apparatus, comprising: a heat radiating plate in which a plurality of heat radiating plates are arranged at intervals from each other; The element is mounted, a heat receiving block where heat from the semiconductor element is conducted, and a folded part is formed in the middle part, both sides of this folded part are embedded in the heat receiving block and both ends are connected to the heat sink. U
And a heat pipe in the shape of a letter.

The U-shaped heat pipe is characterized in that one end is connected to a heat radiating plate at one end on the upstream side of the flow path and the other end is connected at the downstream side of the flow path.

[0009] Further, the invention is characterized in that only one U-shaped heat pipe is arranged.

[0010] A plurality of the U-shaped heat pipes are arranged.

Further, the plurality of U-shaped heat pipes are characterized in that another U-shaped heat pipe is sequentially arranged inside one U-shaped heat pipe at intervals.

Further, one end of each heat pipe is sequentially connected to the heat radiating plate from the upstream side to the downstream side of the heat radiating flow path, and the heat pipes are connected in the reverse order. Each of the other ends is connected.

Further, the plurality of U-shaped heat pipes are sequentially connected to a radiator plate from an upstream side to a downstream side of the flow path.

Further, one end and the other end of each heat pipe are connected to the heat radiating plate alternately and sequentially from the upstream side to the downstream side of the heat radiating flow path.

Further, one or more I-shaped heat pipes are arranged inside the U-shaped heat pipe.

The U-shaped heat pipe and I
It is characterized in that a plurality of rows composed of letter-shaped heat pipes are provided.

Further, one or more I-shaped heat pipes are arranged between the U-shaped heat pipe and the U-shaped heat pipe.

Further, a plurality of rows comprising the U-shaped heat pipe and the I-shaped heat pipe are provided.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a diagram showing the relationship between the configuration of the semiconductor element cooling device and the temperature rise distribution of the heat dissipation block. FIG. 2 is a plan view of the semiconductor device cooling device 1. In FIG. 1, 1 is a semiconductor element cooling device, 2 is a heat receiving block of a semiconductor device cooling device as a heat receiving block, 3 is a plurality of semiconductor elements mounted on the surface of a heat receiving block 3 of the semiconductor device cooling device, and 4 is a U-shaped. Heat pipe, 4a is an evaporator of a U-shaped heat pipe, 4b is a refrigerant sealed in the U-shaped heat pipe, and 4c is a U-shaped heat pipe.
The heat radiating portion of the L-shaped heat pipe, 5 is a heat radiating fin as a heat radiating plate inserted in the heat radiating portion of the L-shaped heat pipe, 6 is natural convection of air generated by heat radiated by the heat radiating fin, and 7 is vehicle running. It is a traveling wind convection as a flow path of the generated cooling medium. In FIG. 1, two U-shaped heat pipes 4 are provided, one end 4j of which is located on the windward side (upstream side) of a traveling wind convection 7 (flow path of the cooling medium) of air as a cooling medium, and the other. The ends 4k are respectively connected to the leeward side (downstream side). As shown in FIG. 1, two U-shaped heat pipes are provided inside a space surrounded by one (outer) U-shaped heat pipe and the radiation fin 5.
It is arranged so that a letter-shaped heat pipe enters. That is, one end of each heat pipe 4 is provided on the radiation fins 5 from the windward side to the leeward side of the traveling wind convection 7 of the air as the cooling medium (from the upstream side to the downstream side of the heat radiation flow path). 4j are sequentially connected, and in the reverse order,
The other end 4k of each heat pipe 4 is connected.

Next, the operation of the present invention will be described. The heat generated in the plurality of semiconductor elements 3 is transmitted to the heat receiving block 2 of the semiconductor element cooling device made of a material having good heat conduction characteristics, such as copper or aluminum, in order to facilitate heat collection or dispersion. Further, the conducted heat is conducted to the evaporating portions 4a of a plurality of U-shaped heat pipes inserted inside the heat receiving block 2 of the semiconductor device cooling device, and the refrigerant 4b sealed in the heat pipes 4 becomes latent heat. And the semiconductor element is cooled. The heat taken by the refrigerant 4b is conducted to the heat pipe radiator 4c by the heat operation of the heat pipe, and further,
The heat is transferred to the radiating fins 5 inserted into the heat pipe radiating portion 4c.

The heat conducted to the radiating fins 5 is converted into natural convection 6 of air generated by the heat generated by the radiating fins 5,
Traveling wind convection 7 generated in the radiation fins 5 by running of the vehicle
As a result, the cooling of the semiconductor element is completed by radiating heat to the atmosphere. At this time, the heat pipe radiator disposed downstream of the traveling convection 7 (ie, downstream of the air flow path as the cooling medium) The cooling performance of the heat pipe evaporator 4c is reduced because the cooling performance of the heat pipe evaporator 4c is reduced due to the effect of the heat radiated by the radiating fins 5 of the heat pipe radiator 4c arranged on the windward side (upstream of the same flow path). Although the temperature distribution of the heat pipe 4a tends to be non-uniform, since the heat pipe 4 is U-shaped, the temperature of the same heat pipe evaporator 4a becomes equal, and as shown in the characteristic diagram of FIG. Can be equalized, and the cooling efficiency of each semiconductor element can be equalized.

Thus, it is possible to prevent a local cooling capacity shortage of the semiconductor device cooling device and to make the heat radiation density uniform, thereby improving the cooling efficiency of the semiconductor device cooling device. As described above, since the temperature rise of the heat receiving block 2 of the semiconductor element cooling device can be made uniform, the surface temperature of the heat receiving block 2 between the semiconductor elements connected in parallel becomes uniform, and the semiconductor performance can be maintained. FIG. 1 shows a semiconductor device cooling apparatus in which one of two U-shaped heat pumps is arranged inside the other, but one U-shaped heat pump is formed by using three or more U-shaped heat pumps. Another U-shaped heat pipe may be sequentially arranged inside the pipe, and the same effect can be obtained in such a case.

Embodiment 2 FIG. FIG. 3 is a plan view showing a configuration of a semiconductor device cooling device according to Embodiment 2 of the present invention. Further, in the first embodiment, two U-shaped heat pipes are used, and one is arranged inside the other. However, as shown in FIG. 3, only one U-shaped heat pipe is arranged. In such a case, the same effect as in the first embodiment can be obtained.

Embodiment 3 FIG. FIG. 4 is a diagram showing a relationship between a configuration of a semiconductor element cooling device according to Embodiment 3 of the present invention and a temperature rise distribution of a heat radiation block. In the second embodiment, only one U-shaped heat pipe is arranged. However, as shown in FIG. 4, the radiation fins are arranged from the upstream side to the downstream side of the traveling wind convection 7 (the flow path of the cooling medium). 5, two U-shaped heat pipes are arranged in order, that is, the heat radiation fins 5 are arranged from the upstream side to the downstream side of the traveling wind convection 7 (the flow path of the cooling medium) (the flow path of the heat radiation flow path). One end 4j and the other end 4k of each heat pipe 4 are alternately and sequentially connected (from the upstream side to the downstream side). In the semiconductor device cooling device in which the heat pipes 4 are arranged as described above,
The same effect as in the first embodiment can be obtained. FIG. 4 shows a semiconductor device cooling device in which two U-shaped heat pipes are arranged in order from the upstream side to the downstream side of the traveling wind convection 7 (flow path of the cooling medium). The above-mentioned U-shaped heat pipes may be connected to the radiation fins 5 in order from the upstream side to the downstream side of the flow path, and the same effect can be obtained in such a case.

Embodiment 4 FIG. 5 is a plan view showing a configuration of a semiconductor element cooling device according to Embodiment 4 of the present invention. In the first embodiment, two U-shaped heat pipes 4
Are arranged, but the same effect can be obtained by arranging two or more as shown in FIG.

Embodiment 5 FIG. 6 is a plan view showing a configuration of a semiconductor element cooling device according to Embodiment 5 of the present invention. In the first embodiment, two U-shaped heat pipes are arranged one inside the other. However, as shown in FIG. 6, one I-shaped heat pipe 8 is provided inside the U-shaped heat pipe. Alternatively, the same effect as in the first embodiment can be obtained even if a plurality of the members are arranged.

Embodiment 6 FIG. FIG. 7 is a plan view showing a configuration of a semiconductor element cooling device according to Embodiment 6 of the present invention. In the fifth embodiment, one row composed of a U-shaped heat pipe and an I-shaped heat pipe is arranged. However, even if two or more rows are arranged as shown in FIG. be able to.

Embodiment 7 FIG. 8 is a plan view showing a configuration of a semiconductor element cooling device according to Embodiment 7 of the present invention. In the second embodiment, only one U-shaped heat pipe is arranged. However, even if one or more I-shaped heat pipes 8 are arranged inside the U-shaped heat pipe as shown in FIG. The same effect as in the second embodiment can be obtained.

Embodiment 8 FIG. 9 is a plan view showing a configuration of a semiconductor element cooling device according to Embodiment 8 of the present invention. In Embodiment 7, one row composed of a U-shaped heat pipe and an I-shaped heat pipe is arranged. However, as shown in FIG. 9, the same effect can be obtained by arranging two or more rows. The same effect can be obtained by arranging two or more rows of the U-shaped heat pipe and the I-shaped heat pipe.

Embodiment 9 FIG. 10 is a plan view showing a configuration of a semiconductor element cooling device according to Embodiment 9 of the present invention. In the first embodiment, two U-shaped heat pipes are used, and one is arranged inside the other. However, as shown in FIG. 10, a U-shaped heat pipe and a U-shaped heat pipe are combined. An I-shaped heat pipe 8 between them,
The same effect as in the first embodiment can be obtained by arranging one or a plurality. FIG. 10 shows only one structure in which the I-shaped heat pipe 8 is provided between the U-shaped heat pipe and the U-shaped heat pipe. Good.

Embodiment 10 FIG. FIG. 11 is a plan view showing a configuration of a semiconductor device cooling device according to Embodiment 10 of the present invention. Further, in the first embodiment, the arrangement of the U-shaped heat pipes is composed of only a plurality of layers. However, even if the inner U-shaped heat pipes are arranged in a plurality of rows as shown in FIG. The same effect as described above can be obtained.

[0032]

According to the semiconductor device cooling apparatus of the present invention, a plurality of heat radiating plates are arranged at intervals from each other, and a heat radiating plate having a cooling medium flow path formed between the heat radiating plates and a semiconductor element are mounted. A heat receiving block through which heat from the semiconductor element is conducted, and a folded portion formed at an intermediate portion. Both sides of the folded portion are embedded in the heat receiving block, and both ends are connected to a heat sink. Since the heat pipe is provided with the heat pipe, a high cooling performance can be obtained, and the semiconductor performance can be maintained.

The U-shaped heat pipe is characterized in that one end is connected to a heat radiating plate at one end on the upstream side of the flow path and the other end is connected at the downstream side of the flow path. In addition, the temperature distribution of the heat receiving block is equalized, high cooling performance can be obtained, the temperature of the heat receiving block can be evenly increased, and the surface temperature of the heat receiving block 2 between the semiconductor elements connected in parallel becomes uniform. Maintenance becomes possible.

Further, since only one U-shaped heat pipe is provided, a semiconductor device cooling device having a simple device structure and high cooling efficiency can be provided.

Further, since a plurality of the U-shaped heat pipes are arranged, a semiconductor device cooling device having higher cooling efficiency can be provided.

Further, the plurality of U-shaped heat pipes are characterized in that one U-shaped heat pipe and another U-shaped heat pipe are sequentially arranged at intervals inside the U-shaped heat pipe. A good semiconductor device cooling device can be provided.

Further, one end of each heat pipe is sequentially connected to the heat radiating plate from the upstream side to the downstream side of the heat radiating flow path, and each heat pipe is connected in the reverse order. Since each other end is connected,
A semiconductor device cooling device with good cooling efficiency can be provided.

Further, the plurality of U-shaped heat pipes are sequentially connected to the heat radiating plate from the upstream side to the downstream side of the flow path, so that the semiconductor element having higher cooling efficiency is provided. A cooling device can be provided.

Further, the heat sink is characterized in that one end and the other end of each heat pipe are connected alternately and sequentially from the upstream side to the downstream side of the heat radiating flow path. A semiconductor device cooling device with good cooling efficiency can be provided.

Further, since one or more I-shaped heat pipes are arranged inside the U-shaped heat pipe, a semiconductor device cooling device with good cooling efficiency can be provided.

The U-shaped heat pipe and the I-shaped heat pipe
Since a plurality of rows of letter-shaped heat pipes are provided, a semiconductor device cooling device with good cooling efficiency can be provided.

Further, since one or more I-shaped heat pipes are disposed between the U-shaped heat pipes and the U-shaped heat pipes, a semiconductor device cooling device with high cooling efficiency is provided. be able to.

Further, since a plurality of rows of the U-shaped heat pipes and the I-shaped heat pipes are provided, a semiconductor device cooling device with high cooling efficiency can be provided.

[Brief description of the drawings]

FIG. 1 is a diagram showing a relationship between a configuration of a semiconductor device cooling device according to Embodiment 1 of the present invention and a temperature rise distribution of a heat radiation block.

FIG. 2 is a side view showing a configuration of the semiconductor device cooling device according to the first embodiment of the present invention.

FIG. 3 is a plan view showing a configuration of a semiconductor element cooling device according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a relationship between a configuration of a semiconductor element cooling device according to Embodiment 3 of the present invention and a temperature rise distribution of a heat radiation block.

FIG. 5 is a plan view showing a configuration of a semiconductor element cooling device according to a fourth embodiment of the present invention.

FIG. 6 is a plan view showing a configuration of a semiconductor element cooling device according to a fifth embodiment of the present invention.

FIG. 7 is a plan view showing a configuration of a semiconductor device cooling device according to Embodiment 6 of the present invention.

FIG. 8 is a plan view showing a configuration of a semiconductor element cooling device according to a seventh embodiment of the present invention.

FIG. 9 is a plan view showing a configuration of a semiconductor element cooling device according to an eighth embodiment of the present invention.

FIG. 10 is a plan view showing a configuration of a semiconductor element cooling device according to a ninth embodiment of the present invention.

FIG. 11 is a plan view showing a configuration of a semiconductor element cooling device according to Embodiment 10 of the present invention.

FIG. 12 is a perspective projection view showing a conventional semiconductor device cooling device.

FIG. 13 is a diagram showing a relationship between a configuration of a conventional semiconductor device cooling device and a temperature rise distribution of a heat radiation block.

FIG. 14 is a side view showing a conventional semiconductor device cooling device.

[Explanation of symbols]

2 heat receiving block, 3 semiconductor elements, 4 U-shaped heat pipe, 5 radiating fins (radiator plate), 8 I-shaped heat pipe.

Claims (12)

[Claims] A plurality of radiating plates arranged at intervals from each other, a radiating plate having a cooling medium flow path formed between the radiating plates, a semiconductor element mounted thereon, and heat from the semiconductor elements being dissipated. A heat receiving block to be conducted, and a folded portion is formed in an intermediate portion, and both sides of the folded portion are embedded in the heat receiving block, and both ends of the U-shaped heat pipe are connected to the heat sink. A semiconductor device cooling device comprising: 2. The two ends of the U-shaped heat pipe are connected to the heat sink at one end on the upstream side of the flow path and at the other end on the downstream side of the flow path. The semiconductor device cooling device according to claim 1, wherein: 3. The semiconductor device cooling apparatus according to claim 2, wherein only one U-shaped heat pipe is arranged. 4. The semiconductor device cooling device according to claim 2, wherein a plurality of said U-shaped heat pipes are arranged. 5. The U-shaped heat pipe according to claim 4, wherein, in the plurality of U-shaped heat pipes, another U-shaped heat pipe is sequentially arranged inside one U-shaped heat pipe at intervals. Semiconductor device cooling device. 6. One end of each heat pipe is sequentially connected to the heat radiating plate from the upstream side to the downstream side of the heat radiating channel, and the heat pipes are connected in the reverse order. The semiconductor device cooling device according to claim 4, wherein the other ends of the heat pipes are connected. 7. The semiconductor according to claim 4, wherein the plurality of U-shaped heat pipes are sequentially connected to the radiator plate from an upstream side to a downstream side of the flow path. Element cooling device. 8. The heat radiation plate, wherein one end and the other end of each of the heat pipes are alternately and sequentially connected from an upstream side to a downstream side of the heat radiation flow path. Item 5. A semiconductor device cooling device according to item 4. 9. The semiconductor element cooling device according to claim 2, wherein one or more I-shaped heat pipes are arranged inside said U-shaped heat pipe. 10. The semiconductor device cooling apparatus according to claim 9, wherein a plurality of rows each including the U-shaped heat pipe and the I-shaped heat pipe are provided. 11. The semiconductor device according to claim 2, wherein one or more I-shaped heat pipes are arranged between the U-shaped heat pipes and the U-shaped heat pipes. Cooling system. 12. The semiconductor device cooling apparatus according to claim 11, wherein a plurality of rows each including the U-shaped heat pipe and the I-shaped heat pipe are provided.