JP2004193389A - Cooling member and electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that it is necessary to improve heat transference between a coolant and a heat sink or to uniform retention temperature for cooling a plurality of electronic components with temperature dependency in the cooling sturtcure of a conventional electronic component and the flow rate of the coolant and pressure loss increase, thus inducing a large-sized cooling apparatus for supply the cooling to the electronic component and an increase in energy consumption. <P>SOLUTION: The heat sink is formed so that heat transference between a coolant flowing inside corresponding to the arrangement position of the electronic component to be cooled and itself may change according to a position in the flow direction, thus cooling the electronic component. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a cooling member for indirectly cooling an electronic device having an electronic component mounted therein, and an electronic device provided with the cooling member.
[0002]
[Prior art]
For example, in the case of an array antenna device in which a plurality of element antennas are arranged, a plurality of modules corresponding to each element antenna for amplifying a signal received by each element antenna and performing required processing are mounted at high density. Modules are compactly mounted with high-density semiconductor elements and high-heat-generating semiconductor elements and electronic components whose performance depends on temperature.To maintain the performance of electronic equipment, all the components mounted inside the equipment are required. It is necessary to keep the electronic components housed in the module in a specified temperature range.
[0003]
Conventionally, in an array antenna device mounted with such a module, as a method of cooling a module mounted at a high density in a small space, cooling is performed by contacting a thin flat heat sink through which a coolant flows inside the module. An indirect cooling system is applied (for example, see Patent Document 1).
[0004]
[Patent Document 1]
JP-A-8-264981 (page 2, FIG. 5, FIG. 6)
[0005]
FIG. 8 shows a structure of an array antenna device as an example of a conventional electronic device. 8A is a perspective view of a conventional electronic device, FIG. 8B is a cross-sectional view taken along line AA of FIG. 8A, and FIG. 8C is a cross-sectional view taken along line BB of FIG. It is. In the figure, reference numeral 1 denotes a module, 2 denotes electronic components mounted inside the module 1 such as a high-power amplifier and a low-noise amplifier, etc., and 30 denotes a heat sink arranged so as to be in contact with the module 1 and through which a coolant flows. Reference numeral 5 denotes a chassis of the electronic apparatus.
[0006]
The cooling structure of the conventional electronic device is configured as described above, and the heat generated from the electronic component 2 mounted inside the module 1 in the chassis 5 is applied to the heat sink 30 from the contact surface of the module 1 with the heat sink 30. The heat is transmitted to the refrigerant flowing in the direction indicated by 41 inside the heat sink 30.
[0007]
[Problems to be solved by the invention]
The indirect cooling structure of the electronic apparatus configured as described above has the following problems. In the case of the cooling structure as shown in FIG. 8, since the refrigerant 4 absorbs the heat generated in the module 1 on the downstream side of the flow in the heat sink 30, the refrigerant temperature becomes higher than the upstream side and A temperature difference occurs on the downstream side. For example, when an electronic component whose performance depends on temperature is mounted inside the module 1 such as an array antenna device, and the temperature difference of the module 1 mounted inside the device causes deterioration of the performance of the device, the electronic component is mounted inside the device. It is required to make the temperature of many modules 1 uniform.
[0008]
However, the temperature difference between the refrigerants 4 causes a temperature difference between the module arranged on the upstream side and the module arranged on the downstream side, which is a factor that hinders the uniformization of the module temperature. As a solution to this, a method of increasing the flow rate of the refrigerant with respect to the calorific value and suppressing a rise in the temperature of the refrigerant on the downstream side as much as possible can be considered. Yes, the load on the refrigerant circulation system of the cooling device was increased, and the required value of refrigerant pressure resistance for the refrigerant piping system in the device was increased.
[0009]
The present invention has been made to solve such a problem, and an object of the present invention is to provide an indirect cooling structure of an electronic device that enables the temperature of an electronic component mounted therein to be uniform. .
[0010]
[Means for Solving the Problems]
In order to achieve the above object, a cooling member according to the present invention is thermally indirectly connected to each of a plurality of heat-generating electronic components arranged at different positions to form an internal flow path for a coolant. A cooling member having an inner wall surface, wherein a heat transfer coefficient of an inner wall surface of the cooling member is changed in a flow direction of the refrigerant.
[0011]
The cooling member has at least two or more flat plates arranged to face each other to form an inner wall surface of the internal flow path, and has a plurality of projections formed on a surface of the flat plate that contacts the flow path. To form a plurality of flow passage reducing portions in which the width of the flow passage is reduced, and the width of the flow passage of the flow passage reducing portion may be changed in the flow direction of the refrigerant.
[0012]
The cooling member has a tubular inner wall surface forming an internal flow path, has a plurality of protrusions formed on the inner wall surface, and has a plurality of flow paths in which the diameter of the flow path is reduced by the protrusions. You may comprise a reduction part and may change the diameter of the flow path of the said flow path reduction part in the flow direction of a refrigerant | coolant.
[0013]
Further, the cooling member may have a plurality of protrusions on an inner wall surface forming an internal flow path, and may change a pitch between protrusions adjacent in the flow direction of the refrigerant in the flow direction of the refrigerant.
[0014]
Further, the cooling member has a plurality of cooling pipes connected to each other, and an O-ring that seals a connection portion of the cooling pipes and protrudes into the internal flow path of the cooling pipe, and reduces the amount of crushing of the O-ring by the refrigerant. It may be changed in the flow direction.
[0015]
Further, in this cooling member, a wire fin having a plurality of fins protruding may be arranged in the internal flow path, and the pitch between adjacent fins may be changed in the flow direction of the refrigerant.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Embodiment 1 FIG.
FIG. 1A is a diagram showing a cooling structure of an electronic device in which a module having built-in heat-generating electronic components, such as an array antenna device, is regularly arranged in the first embodiment of the present invention.
[0017]
In the figure, reference numeral 1 denotes a module as an electronic unit which incorporates heat-generating electronic components and needs to be cooled in order to maintain its performance. In the figure, each of a plurality of modules 1 is referred to as a module 1-1 to 1-n It is illustrated in FIG. Reference numeral 3 denotes a heat sink which is a cooling member which is arranged in contact with n modules 1 on one side to cool the module 1 and has a flow path for the refrigerant therein, and 41 denotes a flow direction of the refrigerant. The heat sink 3 is in thermal contact with the respective outer wall surfaces of the module 1 with the contact surface Sa on the wall surface 3a side forming the heat sink and the contact surface Sb on the wall surface 3b side forming the heat sink interposed therebetween.
[0018]
That is, a plurality of electronic components (for example, the electronic components 2 shown in FIG. 8) provided inside the module 1 are arranged on both sides of the heat sink 3, and are indirectly cooled by contacting the heat sink 3. The heat sink 3 wastes heat transmitted from the module 1 through the refrigerant 4. The internal flow path is configured such that the heat transfer coefficient between the inner surface of the heat sink and the refrigerant 4 changes depending on the position in the flow direction of the refrigerant (see FIG. 2 for the detailed structure of the internal flow path). Will be described later). The heat sink 3 has approximately the same size as the heat sink 30 in FIG. 8, and is arranged in the chassis 5 in the same manner as the arrangement of the heat sink 30 in FIG.
[0019]
FIGS. 1B to 1E are diagrams showing cooling characteristics of an application example according to the present embodiment with respect to the configuration of FIG. 1A. In FIG. This shows the cooling characteristics of. As an application example of the related art, it is assumed that the cross section of the coolant flow path is a fixed shape, or that the fins of a fixed shape are regularly arranged at regular intervals inside the heat sink. Note that it is assumed that the plurality of modules 1 mounted on the electronic apparatus have the same heat value and are arranged at equal intervals.
[0020]
In the figure, the horizontal axis indicates the positions of the modules 1-1 to 1-n arranged in the flow direction in FIG. 1A, the temperature of the refrigerant in FIG. 1B, and the position of the heat sink 3 in FIG. FIG. 1D shows the set heat transfer coefficient between the inner surface of the heat sink and the refrigerant, FIG. 1D shows the pressure loss of the refrigerant per unit length in the flow direction, and FIG.
[0021]
In this embodiment, since the temperature of the refrigerant rises toward the downstream of the flow, the heat of the heat sink 3 and the heat of the refrigerant are assumed on the assumption that the temperature of the module located at the most downstream of the flow is cooled below the allowable temperature Ta. The flow rate (flow rate) of the refrigerant is given so that the transmission rate is set. In the prior art, the heat transfer coefficient ha is set in consideration of the cooling of the module located at the most downstream side, and the heat transfer coefficient ha is configured to be applied uniformly at all positions in the flow direction of the heat sink 3. ing. For this reason, the temperature of the module located upstream is lowered according to the refrigerant temperature, and a temperature difference occurs between the module located upstream and the module located downstream.
[0022]
In such a case, according to the present invention, as shown in FIG. 1 (c), the heat transfer coefficient is set to be low at the upstream of the low refrigerant temperature, and to be high at the downstream of the high refrigerant temperature, as in the conventional technique. As a result, the temperature of the module located downstream is maintained at a temperature equal to or lower than the allowable temperature Ta in the same manner as in the related art, while the temperature of the module located upstream increases and the module temperature difference generated due to the position in the flow direction is increased. Can be reduced without increasing the flow rate of the refrigerant.
[0023]
On the other hand, in recent years, with the increase in output of electronic components to be mounted and the high-density mounting of electronic components in the module, the amount of heat generated by the module 1 tends to increase. For example, application of a cooling structure as shown in FIG. In the configuration example of FIG. 9, the flow path of the heat sink 3 is provided with a flow path rapid reduction portion 32 using the projections 31 at predetermined intervals to make the flow turbulent, and heat transfer between the heat sink 3 and the refrigerant 4. This has the effect of improving the rate.
[0024]
However, if the cooling member is configured in this way for indirect cooling of the electronic apparatus, the cooling performance is improved, but the turbulence of the flow causes an increase in pressure loss in the cooling plate. In particular, when the flow rate of the refrigerant is increased to increase the pressure loss in order to reduce the temperature difference of the module caused by the position in the flow direction, the load of the refrigerant circulation system is further increased, and the cooling device is increased. This leads to an increase in size and energy consumption.
[0025]
For this reason, in the present embodiment, by providing the heat sink having the characteristics shown in FIG. 1C, it is possible to reduce the module temperature difference generated due to the position in the flow direction without increasing the flow rate of the refrigerant. Can be. In general, since the heat transfer coefficient between the heat sink 3 and the refrigerant 4 is increased with an increase in pressure loss, the heat transfer coefficient is set to be lower toward the upstream region as in the present embodiment. I do. As a result, the pressure loss per unit length is reduced as shown in FIG. 1D (particularly, reduced on the upstream side), and the pressure loss is lower than that of the heat sink having the same heat transfer coefficient in the flow direction in FIG. Loss can be reduced.
[0026]
2A and 2B are diagrams showing a detailed structure of the heat sink according to the first embodiment. FIG. 2A is a perspective view showing a configuration of the heat sink, and FIG. 2B is a cross-sectional view taken along line CC of FIG. It is. The dotted lines in the figure indicate imaginary lines of the modules 1-1 and 1-n arranged so as to contact the outer wall surface of the heat sink 3. An arrow X in FIG. 2 indicates a downward direction in FIG. 1A.
[0027]
In the figure, the two wall surfaces 3a and 3b are both formed of flat plates, and the two flat plates are arranged to face each other so as to form an internal flow path. A plurality of projections 31 are provided on the inner wall surfaces of the flat wall surfaces 3a and 3b. The protrusion 31 provided on the wall surface 3a and the protrusion 31 provided on the wall surface 3b constitute a rapidly reducing portion 32 of the internal flow path. The rapid reduction portion 32 of the flow path improves the heat transfer coefficient between the refrigerant 4 and the inner surface of the heat sink 3. In this embodiment, the width of the flow path of the rapid reduction portion 32 is changed depending on the position in the flow direction 41 of the refrigerant. The figure shows an example in which the flow direction is divided into three regions I, II and III in the flow direction, and the flow path width of the rapid reduction portion 32 in each region is changed stepwise so as to satisfy a relationship of d1>d2> d3. ing.
[0028]
When the rapid reduction portion 32 formed by the protrusion 31 is provided in the flow path in the heat sink 3, the heat transfer coefficient increases as the width of the rapid reduction portion 32 decreases, and the heat transfer coefficient between the inner surface of the heat sink 3 and the refrigerant 4 improves. The pressure loss also increases. In the example of FIG. 2, in order to simplify the processing of the heat sink 3, the heat sink 3 is divided into three regions I, II, and III in the flow direction, and the flow path width of the rapid reduction portion 32 is changed stepwise. The pressure loss per unit length is changed depending on the area.
[0029]
For example, similarly to the example of FIG. 1A, the modules 1 having the same heat generation amount are arranged at equal intervals, and the outer wall surfaces of the wall surfaces 3a and 3b constituting the heat sink 3 of FIG. I have. At this time, the heat sink 3 and the module 1 are mounted by setting the narrow side of the flow path rapid contraction portion 32 to be located on the downstream side of the refrigerant, so that the electronic component (module) mounted in the electronic apparatus is mounted. The temperature difference between 1) and the pressure loss of the entire heat sink 3 can be reduced.
[0030]
In the above description, an application example has been described in which the heat-generating components have the same calorific value and are arranged at equal intervals in the flow direction of the refrigerant. However, for example, electronic components or modules having different calorific values do not fit on one substrate. Even in the case where the electronic components are arranged in a rule, the heat transfer coefficient of the heat sink immediately below the electronic component to be cooled is set in consideration of the heat generation amount and the temperature of the refrigerant immediately below the electronic component, so that the electronic component mounted in the electronic device device is set. The temperature difference between them and the pressure loss across the heat sink can be reduced.
[0031]
In this embodiment, as described above, the heat sink configured to change the heat transfer coefficient in the flow direction of the refrigerant is used, and the indirect cooling of the electronic device is performed, so that the heat sink is used in the conventional heat sink. Within the limited space, the temperature difference between the electronic components mounted in the electronic device can be reduced without increasing the flow rate, and the pressure loss of the entire heat sink can be reduced.
[0032]
Also, by setting the width of the flow path reduced portion formed by the projection provided inside the flat heat sink in consideration of the heat generation amount of the electronic component and the temperature of the refrigerant immediately below each electronic component, the conventional heat sink can be used. Within the limited space, a heat sink having a relatively simple structure can be used to reduce the temperature difference between electronic components mounted in the electronic device without increasing the flow rate, and the pressure of the entire heat sink can be reduced. Loss can be reduced.
[0033]
Embodiment 2 FIG.
FIG. 3 is a view showing Embodiment 2 of the present invention, and is a perspective view showing an internal structure of a heat sink 3 which is a cooling member according to this embodiment. An arrow X in FIG. 3 indicates a downward direction in FIG. 1A. The heat sink 3 has approximately the same size as the heat sink 30 in FIG. 8, and is arranged in the chassis 5 in the same manner as the arrangement of the heat sink 30 in FIG.
[0034]
In this embodiment, a rapid reduction portion of the flow path is provided by the projection 31 provided in the tubular heat sink 3 to improve the heat transfer coefficient between the refrigerant and the inner surface of the heat sink. At this time, the diameter of the flow path of the rapid reduction portion is changed depending on the position in the flow direction 41 of the refrigerant. The figure shows an example in which the flow direction is divided into three regions I, II, and III in the flow direction, and the diameter of the flow path in the rapid reduction portion is changed stepwise.
[0035]
In the case where a suddenly reduced portion formed by the protrusion 31 is provided in the flow path in the heat sink 3, as the diameter of the rapidly reduced portion is smaller, the heat transfer coefficient between the inner surface of the heat sink 3 and the refrigerant is improved, and the pressure loss is also increased.
[0036]
Further, in this embodiment, similarly to the first embodiment, the diameter of the channel reducing portion formed by the protrusion 31 provided inside the tubular heat sink 3 is determined by determining the calorific value of the electronic component and the temperature of the refrigerant immediately below each electronic component. It is set with consideration. As a result, the temperature difference between the electronic components mounted in the electronic device can be reduced without increasing the flow rate within the space used in the conventional heat sink, and the pressure loss of the entire heat sink can be reduced. Can be reduced.
[0037]
Embodiment 3 FIG.
FIG. 4 is a view showing a fourth embodiment of the present invention. FIG. 4 (a) is a perspective view showing an internal structure of a heat sink 3 which is a cooling member according to this embodiment, and FIG. It is DD sectional drawing of (a). An arrow X in FIG. 4 indicates a downward direction in FIG. 1A.
[0038]
In this embodiment, as shown in FIG. 4, a rapid reduction portion 32 of the flow path is provided by a projection 31 provided in the flat heat sink 3 to improve the heat transfer coefficient between the refrigerant 4 and the inner surface of the heat sink 3. ing. The arrangement pitch of the rapid reduction portion 32 is changed depending on the position in the flow direction 41 of the refrigerant. In the drawing, as an example, an example is shown in which the flow direction is divided into three regions I, II, and III, and the pitch of the rapid reduction section 32 in each region is changed stepwise so as to satisfy the relationship of p1>p2> p3. ing.
[0039]
In the case where the rapid reduction portion 32 formed by the projection 31 is provided in the flow path in the heat sink 3, the heat transfer rate and the pressure between the coolant 4 and the inner surface of the heat sink 3 can be changed by changing the arrangement pitch of the rapid reduction portion 32. Losses also vary. In the example of FIG. 4, in order to simplify the processing of the heat sink 3, the heat sink 3 is divided into three regions in the flow direction 41, and the arrangement pitch of the rapid reduction portion 32 is changed in a stepwise manner. The pressure loss is changed depending on the region.
For example, the heat sink 3 shown in FIG. 4 is used to cool the modules having the same heat value arranged at equal intervals as in the example of the first embodiment, By setting and mounting the side on which the arrangement pitch is set on the downstream side of the flow of the coolant, it is possible to reduce the temperature difference between the electronic components mounted in the electronic apparatus and the pressure loss of the entire heat sink.
[0040]
This embodiment is configured as described above, and in order to perform indirect cooling of the electronic apparatus, a projection is provided inside the flat heat sink, and the arrangement pitch of the flow path reducing portion by this projection is set immediately below each electronic component. It is set in consideration of the heat value of the electronic component and the temperature of the refrigerant. As a result, the temperature difference between the electronic components mounted in the electronic device can be reduced without increasing the flow rate within the space used in the conventional heat sink, and the pressure loss of the entire heat sink can be reduced. Can be reduced.
[0041]
Embodiment 4 FIG.
FIG. 5 is a view showing Embodiment 4 of the present invention, and is a perspective view showing an internal structure of a heat sink 3 as a cooling member according to this embodiment. An arrow X in FIG. 5 indicates a downward direction in FIG. 1A. The heat sink 3 has approximately the same size as the heat sink 30 in FIG. 8, and is arranged in the chassis 5 in the same manner as the arrangement of the heat sink 30 in FIG.
[0042]
In this embodiment, a rapid reduction portion of the flow path is provided by the protrusion 31 provided in the tubular heat sink 3 to improve the heat transfer coefficient between the refrigerant and the inner surface of the heat sink 3. At this time, the arrangement pitch of the rapid reduction portion is changed depending on the position in the refrigerant flow direction 41. The figure shows an example in which the area is divided into three regions I, II, and III in the flow direction, and the arrangement pitch of the rapid reduction portion is changed stepwise.
[0043]
In the case where a sudden reduction portion provided by the protrusion 31 is provided in the flow path in the heat sink 3, if the arrangement pitch of the rapid reduction portion is changed, the heat transfer coefficient and the pressure loss between the inner surface of the heat sink 3 and the refrigerant also change.
For example, in the cooling of the heat sinks shown in FIG. 5 in the same manner as in the first embodiment, the cooling pitch of the modules having the same calorific value is set, and the arrangement pitch of the flow path sharply reducing portions is set so as to increase the heat transfer coefficient. By setting the side to the downstream side of the flow of the refrigerant and mounting it, it is possible to reduce the temperature difference between the electronic components mounted in the device and the pressure loss of the entire heat sink.
[0044]
In this embodiment, the arrangement pitch of the flow path reducing portions is set immediately below each electronic component in consideration of the calorific value of the electronic component and the temperature of the refrigerant. As a result, the temperature difference between the electronic components mounted in the electronic device can be reduced without increasing the flow rate within the space used in the conventional heat sink, and the pressure loss of the entire heat sink is reduced. can do.
[0045]
Embodiment 5 FIG.
FIG. 6 shows a fifth embodiment of the present invention, and is a cross-sectional view showing an internal structure of a heat sink 3 as a cooling member according to the fifth embodiment. An arrow X in FIG. 6 indicates a downward direction in FIG. 1A. The heat sink 3 has approximately the same size as the heat sink 30 in FIG. 8, and is arranged in the chassis 5 in the same manner as the arrangement of the heat sink 30 in FIG.
[0046]
In this embodiment, a plurality of tubes 33 are connected to form a heat sink. The O-ring 34 for sealing disposed in the connecting portion is provided with the rapid reduction portion 32 of the flow path by projecting into the internal flow path in the pipe. The rapid reduction 32 of the flow path improves the heat transfer coefficient between the refrigerant and the inner surface of the heat sink. At this time, the amount by which the O-ring 34 protrudes into the pipe 33 is changed by changing the squeezing amount of the O-ring 34 depending on the position in the flow direction 41 of the refrigerant.
[0047]
In the drawing, as an example, a gap in which the O-ring 34 fits (for crushing the O-ring 34) for managing the amount of crushing of the O-ring 34 is divided into three regions of I, II, and III in the flow direction. , A1>a2> a3, an example is shown in which the flow path diameter of the rapid reduction portion is changed stepwise.
[0048]
When the O-ring is provided with a sharply reduced portion in the flow path in the heat sink, the heat transfer coefficient between the inner surface of the heat sink and the refrigerant improves as the crush amount of the O-ring is increased and the diameter of the rapidly reduced portion is reduced. , The pressure loss also increases.
[0049]
In this embodiment, the crush amount of the O-ring is set in consideration of the heat generation amount of the electronic component and the temperature of the refrigerant immediately below each electronic component. As a result, the temperature difference between the electronic components mounted in the electronic device can be reduced without increasing the flow rate within the space used for the conventional heat sink, and the pressure loss of the entire heat sink can be reduced. Can be reduced.
[0050]
Embodiment 6 FIG.
FIG. 7 is a view showing Embodiment 6 of the present invention, and is a perspective view showing an internal structure of a heat sink 3 which is a cooling member according to this embodiment. An arrow X in FIG. 7 indicates a downward direction in FIG. 1A. The heat sink 3 has approximately the same size as the heat sink 30 in FIG. 8, and is arranged in the chassis 5 in the same manner as the arrangement of the heat sink 30 in FIG.
[0051]
In this embodiment, as shown in FIG. 7, a fin is formed by fixing a heat conductive wire 35 such as aluminum to the inner wall surfaces 3a and 3b with a wire bonding device or the like on the inner surface of the flat heat sink 3. The heat transfer coefficient between the heat sink 3 and the inner surface is improved. The pitch at which the wires 35 are fixed is changed according to the position in the flow direction 41 of the refrigerant. In the drawing, as an example, an example is shown in which the region is divided into three regions I, II, and III in the flow direction, and the pitch for fixing the wire 35 is changed stepwise.
[0052]
When the fins are provided by fixing the wires 35 in the flow path in the heat sink 3, the smaller the pitch at which the wires 35 are fixed, the higher the heat transfer coefficient between the inner surface of the heat sink 3 and the refrigerant, and the higher the pressure loss. . In the example of FIG. 7, in order to simplify the manufacture of the heat sink 3, the heat sink 3 is divided into three regions of I, II, and III in the flow direction. Both are changed stepwise, and the heat transfer coefficient and the pressure loss per unit length are changed depending on the region.
[0053]
For example, when cooling the heat sink 3 of FIG. 7 to the modules having the same calorific value and arranged at equal intervals as in the example of the first embodiment, the side having the smaller pitch for fixing the wires 35 is set to the downstream side of the refrigerant. By mounting, it is possible to reduce the pressure loss of the entire heat sink 3 and the temperature difference between electronic components mounted in the device.
[0054]
In addition, the method of manufacturing the fins using the wire 35 is different from the method of manufacturing the fins using a mold such as casting or forging, which is conventionally often used in the manufacture of the fins. In this method, the pitch is set, and the fins are fixed to the wall surfaces 3a, 3b.
[0055]
When the fin arrangement pitch is changed corresponding to the electronic component to be cooled as in this embodiment, the program can be easily changed without changing the mold or increasing the number of types as in the conventional fin manufacturing method. Fins can be manufactured.
[0056]
This embodiment is configured as described above. In order to perform indirect cooling of the electronic device, the pitch at which the fins are fixed by the wires provided inside the flat heat sink is set to be directly below each electronic component. It is set in consideration of the amount and the temperature of the refrigerant. As a result, the temperature difference between the electronic components mounted in the electronic device can be reduced without increasing the flow rate within the space used in the conventional heat sink, and the pressure loss of the entire heat sink is reduced. can do.
[0057]
Further, since the pitch at which the fins are fixed can be easily set by a program such as a wire bonding apparatus, it is easy to manufacture a heat sink having fins corresponding to the arrangement of electronic components to be cooled.
[0058]
【The invention's effect】
As described above, according to the present invention, the heat transfer coefficient between the inner surface of the cooling member and the refrigerant in the indirect cooling structure of the electronic device is changed according to the position in the flow direction of the refrigerant, so that the refrigerant flow rate is increased. The temperature difference between the electronic components mounted in the electronic device can be reduced without increasing, and the pressure loss of the entire heat sink can be reduced.
[Brief description of the drawings]
FIG. 1 is a diagram showing a first embodiment of the present invention.
FIG. 2 is a perspective view and a sectional view of a heat sink according to the first embodiment of the present invention.
FIG. 3 is a perspective view of a heat sink according to a second embodiment of the present invention.
FIG. 4 is a perspective view and a sectional view of a heat sink according to a third embodiment of the present invention.
FIG. 5 is a perspective view of a heat sink according to a fourth embodiment of the present invention.
FIG. 6 is a sectional view of a heat sink according to a fifth embodiment of the present invention.
FIG. 7 is a perspective view of a heat sink according to a sixth embodiment of the present invention.
FIG. 8 is a perspective view and a sectional view showing a cooling structure of a conventional electronic device.
FIG. 9 is a cross-sectional view illustrating an example of a heat sink having a cooling structure of the electronic apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Module 2 Electronic component 3 Heat sink 4 Refrigerant 5 Chassis 31 Projection 32 Rapid reduction section 33 Tube 34 O-ring 35 Wire 41 Flow direction

Claims (10)

A cooling member having an inner wall surface that is indirectly thermally connected to each of the plurality of heat-generating electronic components disposed at different positions and forms an internal flow path through which a coolant flows,
A cooling member, wherein a heat transfer coefficient of an inner wall surface of the cooling member changes in a flow direction of a refrigerant. The cooling member has an inner wall surface of an internal flow path in which at least two or more flat plates are arranged to face each other, and has a plurality of projections formed on a surface of the flat plate in contact with the flow path. Forming a plurality of flow passage reduction portions in which the width of the road is reduced,
The cooling member according to claim 1, wherein the width of the flow path of the flow path reducing portion changes in a flow direction of the refrigerant. The cooling member has an inner wall surface of an internal flow path in which at least two or more flat plates are arranged to face each other, and has a plurality of projections formed on a surface of the flat plate in contact with the flow path. Forming a plurality of flow passage reduction portions in which the width of the road is reduced,
The cooling member according to claim 1, wherein the width of the flow path of the flow path reducing portion is configured such that the width of the downstream side of the refrigerant is smaller than the width of the upstream side. The cooling member has a tubular inner wall surface that forms an internal flow path, has a plurality of protrusions formed on the inner wall surface, and has a plurality of flow path reducing portions in which the diameter of the flow path is reduced by the protrusions. Constitute
The cooling member according to claim 1, wherein the diameter of the flow path of the flow path reducing portion changes in the flow direction of the refrigerant. The cooling member has a tubular inner wall surface that forms an internal flow path, has a plurality of protrusions formed on the inner wall surface, and has a plurality of flow path reducing portions in which the diameter of the flow path is reduced by the protrusions. Constitute
The cooling member according to claim 1, wherein a diameter of the flow path of the flow path reducing portion is configured such that a diameter of the refrigerant on the downstream side is smaller than a diameter of the refrigerant on the upstream side. The cooling member has a plurality of protrusions on an inner wall surface forming an internal flow path,
The cooling member according to claim 1, wherein a pitch between adjacent protrusions in the flow direction of the refrigerant changes in a flow direction of the refrigerant. The cooling member has a plurality of protrusions on an inner wall surface forming an internal flow path,
2. The cooling member according to claim 1, wherein the pitch at which the protrusions are arranged is such that a pitch on the downstream side of the refrigerant is smaller than a pitch on the upstream side. The cooling member has a plurality of cooling pipes connected to each other, and an O-ring that seals a connection portion of the cooling pipes and protrudes into an internal flow path of the cooling pipes,
2. The cooling member according to claim 1, wherein the amount of crushing of the O-ring changes in a flow direction of the refrigerant. The cooling member has a plurality of wire fins protruding in the internal flow path,
The cooling member according to claim 1, wherein the wire fins have pitches of adjacent fins changed in a flow direction of the coolant. One or more electronic units mounted with a plurality of electronic components,
A cooling member according to any one of claims 1 to 9,
The electronic device, wherein the electronic unit is in contact with a wall surface of the cooling member outside the internal flow path.

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