JP2000340722A - Radiating fin structure of high-efficiency thermal conductivity heat sink - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve even temperature distribution on a number of regions and to provide a variety of designs, by disposing a number of radiating fins formed by successively bending thin aluminum pieces and cut in a direction opposite to each other at regular intervals of array, while an inserting part remains uncut at the lower ends of the fins on the base of a heat sink for radiating heat caused by an electronic component and so on. SOLUTION: A radiating fin 20, which is mounted on a base 10 of a heat sink 100, is formed by cutting a thin aluminum plate at regular intervals, while only a base inserting part 21a and so on remain uncut at the upper and lower ends of the fin, so that a large number of pieces 21 are made. These pieces are successively bent in a direction opposite to each other to form a number of radiating fins 20. Namely, cutting is made at regular intervals of the fin while only the base inserting part 21a remains uncut at the upper and the lower ends, so that a number of pieces 21 are made. Therefore, it is also possible to mount the radiating fins 20, which have a number of uneven embossing parts at regular intervals at the upper ends with a complex arrangement on the base 10, while the base inserting part 21a is left uncut at the lower end of the fin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-dissipating fin structure of a high-efficiency heat-conducting hit sink for absorbing heat generated from various electronic components and devices, which have been increasing in capacity and miniaturization, and dissipating the heat to the outside.

In recent years, the amount of heat generated from transistors and the like has increased dramatically due to the increase in output and performance of electronic devices. However, how to effectively dissipate such heat has become an important issue. became.

[0003] In fact, for normal operation of electronic equipment, it is necessary to maintain the built-in electronic components within a certain temperature range. This is because the characteristics of electronic components are sensitive to temperature, Extremely high or low temperatures will have a huge impact on product reliability, such as affecting components and adversely affecting longevity, and not being able to exert their own characteristics. Experts say that the temperature of electronic components is 25
From ℃ to 125 ℃, the failure rate increases almost 10 times,
It is expected that parts with abrupt temperature changes will have a service life about six times shorter than parts that operate at constant temperature conditions.

[0004]

2. Description of the Related Art However, hit-sinks (heat radiators, heat sinks) based on solid heat conduction, such as existing aluminum die-cast and extruded products, are naturally hit to increase the heat-dissipating effect when the output exceeds a certain level. Since the required dimensions of the sink become large and bulky,
It was not practical because it could not properly cope with the trends of large capacity, high output, high performance, and miniaturization of electronic components.

[0005]

SUMMARY OF THE INVENTION The present invention has been devised in consideration of various problems arising from the existing hit sink as described above, and has been improved by improving the structure of the heat radiation fins constituting the hit sink. In addition to equalizing the temperature distribution in the area, it is possible to transport a large amount of heat, and it is possible to design a variety of hit sinks by enabling shapes that are impossible with existing extrusion and die casting. It is an object of the present invention to provide a high-performance hit sink so that it can effectively cope with the trends of large capacity, high output, high performance, and miniaturization of electronic components.

[0006]

As shown in FIGS. 1 and 2 of the accompanying drawings, the present invention for attaining the above-mentioned object is intended to reduce the heat generated from various electronic components and elements, which are in the trend of large-capacity miniaturization. Hit sink 10 to absorb and radiate outside
0, the base 1 of the hit sync 100
The heat radiation fins 20 mounted on the base plate 0 are made of a thin aluminum plate, leaving only the base insertion portion 21a on the lower side,
After making a large number of individual pieces 21 by cutting at a constant width, a number of heat radiation fins 20 are formed by sequentially bending these in opposite directions, and these are formed on the base 10 at a constant arrangement interval. Wear it.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

According to the present invention, as shown in FIGS. 3 and 4 of the accompanying drawings, the heat radiation fins 20 mounted on the base 10 of the hit sink 100 are formed on both upper and lower sides by using a thin aluminum plate. Some base insertion portions 21a, 21b
After leaving a plurality of fins 20 by making incisions at regular intervals to form a large number of individual pieces 21, these are sequentially bent in opposite directions to form a number of radiating fins 20. One of the base insertion portions 21a and 21b may be attached to the base 10 at a fixed arrangement interval. However, the upper base insertion portion 21b has a separate upper cover body (not shown). Can also be used in combination.

As shown in FIG. 5 and FIG. 6 of the accompanying drawings, the heat radiation fins 20 mounted on the base 10 of the hit sink 100 are formed by using a thin aluminum plate with a base insertion portion on the lower side. A large number of radiating fins 20 are formed by forming a large number of concavo-convex embossing portions 25 in various shapes such as circles or squares at regular intervals on the upper side while leaving only 21a. It can also be attached to.

Using the thin aluminum plate, a large number of individual pieces 21 are cut out at a fixed width, leaving only the base insertion portion 21a only on the lower side or on both the upper and lower sides.
After that, these are sequentially bent in the opposite directions to each other, leaving only the radiation fins 20 and only the base insertion portion 21a on the lower side, and forming a large number of uneven embossing portions 25 at regular intervals on the upper surface. The heat dissipating fins 20 formed as described above may be mounted on the base 10 in a shape of a composite arrangement.

Here, the radiation fins 20 and the like may be configured to be bent into an "S" shape.

When the hit sink 100 having the structure of the heat dissipating fins 20 of the present invention is used to dissipate the heat of various electronic components, FIG.
As shown in FIG. 5, heat convection occurs, and such heat convection is uniformly distributed from the lower side to the upper side of the radiating fins 20, so that the thermal convection has a uniform thermal resistance value from the lower side to the upper side of the radiating fins 20.

Therefore, since a large amount of heat can be transported, the cooling effect is improved, and various electronic components exhibit their own characteristics without difficulty.

[0014]

As described above, according to the present invention, the base of the hit sink can be variously combined with the improved radiating fins of various structures, so that the radiating fins connected to the base can be formed in many areas. Heat transfer capable of forming a temperature distribution is possible, and the heat transfer (heat dissipation) effect is large. It is possible to improve the quality and improve the reliability, and it is possible to make the shape impossible with the existing extrusion type or die casting, and it is possible to design hit sinks of various forms This is an epoch-making invention that can effectively respond to the trends of large capacity, high output, high performance, and miniaturization of electronic components.

[Brief description of the drawings]

FIG. 1 is a structural state diagram of the present invention, showing one embodiment of a radiation fin.

FIG. 2 is a configuration state diagram of the present invention, showing a state of assembly of a hit sink;

FIG. 3 is another configuration diagram of the present invention, showing another embodiment of the radiation fin.

FIG. 4 is another assembly state diagram of the present invention, showing an assembly state diagram of a hit sink;

FIG. 5 is a diagram showing still another configuration of the present invention, which is another embodiment of the radiation fin.

FIG. 6 is a diagram showing another configuration of the present invention, showing a state of assembling a hit sink;

FIG. 7 is a schematic diagram showing a state of thermal convection of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Base 20 Heat radiation fin 21 One piece 21a, 21b Base insertion part 25 Embossing part 100 Hit sink

Claims (4)

[Claims] 1. A hit sink structure for absorbing heat generated from various electronic components and elements of a large capacity and miniaturization trend and dissipating the heat to the outside, wherein a radiation fin mounted on a base of the hit sink is provided. Using a thin aluminum plate, leaving only the base insertion part on the lower side, making a large number of individual pieces by making a cut with a fixed width, and then bending these sequentially in the opposite direction The heat radiating fin structure of a high-efficiency heat-conducting hit sink characterized in that the heat radiating fins are arranged on the base at regular intervals. 2. The heat radiation fin mounted on the base of the hit sink is made of aluminum having a small thickness.
After leaving a part of the base insertion part on both lower sides and making a large number of individual pieces by cutting at regular intervals, these are sequentially bent in the opposite direction to form a number of heat radiation fins A heat-dissipating fin structure for a high-efficiency heat-conducting hit sink, wherein these are mounted on a base at regular intervals. 3. The heat sink fin mounted on the base of the hit sink is made of thin aluminum, leaving only the base insertion part on the lower side, and forming a large number of concavo-convex embossing parts at regular intervals on the upper side. A heat-dissipating fin structure for a high-efficiency heat-conducting hit sink, comprising a plurality of heat-dissipating fins formed on the base at regular intervals. 4. The heat sink fin mounted on the base of the hit sink is made of aluminum having a small thickness, and only a base insertion portion is left on only the lower side or on both upper and lower sides,
After making a large number of individual pieces by incising with a constant width, radiating fins that are sequentially bent in the opposite direction to each other, leaving only the base insertion part on the lower side, at regular intervals on the upper side 4. A heat-dissipating fin structure for a high-efficiency heat-conducting hit sink according to claim 1, wherein a heat-dissipating fin formed with a plurality of concavo-convex embossing portions is mounted on the base in a complex arrangement. .