CN106182478A - A kind of cutting technique of single gold silicon silicon body - Google Patents
A kind of cutting technique of single gold silicon silicon body Download PDFInfo
- Publication number
- CN106182478A CN106182478A CN201610714956.7A CN201610714956A CN106182478A CN 106182478 A CN106182478 A CN 106182478A CN 201610714956 A CN201610714956 A CN 201610714956A CN 106182478 A CN106182478 A CN 106182478A
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- Prior art keywords
- rod
- cutting
- silicon
- wiping
- charge bar
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The cutting technique of a kind of single gold silicon silicon body, relates to silicon materials processing technique field, passes through: takes rod, feeding platform, unloading rod, cleaning cleaning, winding displacement, replacing mortar, cutting pre-treatment, cut and cut post processing and complete.The invention have the benefit that present invention process flow process is simple, accurate errorless, by the way of integration relatively, carry out cutting process, ensure the Lubricity after silicon rod cutting, security performance, reduce the waste of material that cutting error causes, effect is notable, it is simple to promotes and uses.
Description
Technical field
The present invention relates to silicon materials processing technique field, be specifically related to the cutting technique of a kind of single gold silicon silicon body.
Background technology
Silicon materials, are important semi-conducting materials, chemical elemental symbol Si, and the silicon that electronics industry uses should have high-purity
Degree and the excellent performance such as electrical and mechanical, silicon is the semi-conducting material that yield is maximum, most widely used, its yield and consumption mark
Will a national electronics industry level, monocrystal silicon application in solar cells, and high-purity monocrystal silicon is important half
Conductor material.In today that photovoltaic technology and microminiature semiconductor inverter technology develop rapidly, silicon single crystal is utilized to be produced
Solaode directly can be converted into luminous energy solar energy, it is achieved that the beginning of green energy resource revolution of marching toward.
Silicon chip is a kind of physical form that silicon materials exist, and in normal application, silicon chip, is the weight making integrated circuit
Want material, by silicon chip is carried out the means such as photoetching, ion implanting, various semiconductor device can be made.Make with silicon chip
Chip has surprising operational capability, and the development of science and technology constantly promotes the development of quasiconductor, automatization and computer etc.
Technology develops, and makes the cost of this high-tech product of silicon chip have dropped down to the cheapest degree, but silicon chip is adding man-hour, different
Process node all can make silicon chip processing flaw occurs.
Silicon chip is typically all and carries out section by corresponding silicon heavy stone used as an anchor and form, due to when cutting, in each processing step, all
Certain technical problem can be there is, therefore, it is necessary to carry out the technical plan of entirety, it is ensured that each step fine rationally, but
Presently, the technique of similar this kind of one.
Summary of the invention:
The technical problem to be solved is to provide a kind of simple to operate, cutting precision, the obvious Dan Jin of effect
The cutting technique of silicon silicon body.
The technical problem to be solved realizes by the following technical solutions:
The cutting technique of a kind of single gold silicon silicon body, it is characterised in that comprise the following steps:
1) take rod: be directly entered take rod indoor carry out choosing silicon rod, silicon rod must assure that N/D, without obvious cut, and
And when removing rod, need to ensure mutually not rub between collision, and rod and rod；
2) feeding platform: the above-mentioned charge bar handled well is carried out wiping, during wiping, uses dry cloth to coordinate ethanol to carry out wiping material
Rod, and material platform is also carried out corresponding wiping, then by charge bar gently be fixed on material platform after alignment, screw is put into spiral shell
Silk is tightened behind hole；
3) unloading rod: under using, truck is by the above-mentioned charge bar Whole blanking being fixed on material platform, when carrying out blanking, it is necessary to
Guarantee is handled with care, it is to avoid collision；
4) cleaning is cleaned: after using clear water that charge bar is carried out a preliminary flushing, remove wherein, the relic left over, broken glue,
So re-use alcohol rinse once, after then re-using clear water flushing 1-2h:
5) winding displacement: check master rolls on whether have dead slot, carries out dead slot and repairs, got rid of by wire jumper by winding displacement glue；
6) changing mortar: cleaned out by mortar in mortar jar in machine, then injected wherein by mortar, injection rate is
180-220kg；
7) cutting pre-treatment: workpiece clamp, filter tool, fixture, pulley and material platform are checked, then in start heat engine 5-
After 10min, check whether stable working；
8) cutting: open machine and carry out actual cutting, during cutting, it is ensured that machine hygiene, variable interval uses cleaning wiping cloth to it
Surface carries out wiping, when wiping, it is to avoid touch machine button by mistake, cuts the later stage, uses pocket lamp to take care of rod side, detects whether
Penetrating；After having cut, carry out material lift；
9) cutting post processing: the charge bar after above-mentioned cutting is carried off, then separates, after removing photoresist, purged and packed.
The invention have the benefit that present invention process flow process is simple, accurate errorless, enter by the way of integration relatively
Row cutting process, it is ensured that the Lubricity after silicon rod cutting, security performance, reduces the waste of material that cutting error causes, effect
Fruit is notable, it is simple to promotes and uses.
Detailed description of the invention
For the technological means making the present invention realize, creation characteristic, reach purpose and be easy to understand with effect, below knot
Close specific embodiment, the present invention is expanded on further.
Embodiment 1
The cutting technique of a kind of single gold silicon silicon body, comprises the following steps:
1) take rod: be directly entered take rod indoor carry out choosing silicon rod, silicon rod must assure that N/D, without obvious cut, and
And when removing rod, need to ensure mutually not rub between collision, and rod and rod；
2) feeding platform: the above-mentioned charge bar handled well is carried out wiping, during wiping, uses dry cloth to coordinate ethanol to carry out wiping material
Rod, and material platform is also carried out corresponding wiping, then by charge bar gently be fixed on material platform after alignment, screw is put into spiral shell
Silk is tightened behind hole；
3) unloading rod: under using, truck is by the above-mentioned charge bar Whole blanking being fixed on material platform, when carrying out blanking, it is necessary to
Guarantee is handled with care, it is to avoid collision；
4) cleaning is cleaned: after using clear water that charge bar is carried out a preliminary flushing, remove wherein, the relic left over, broken glue,
So re-use alcohol rinse once, after then re-using clear water flushing 2h:
5) winding displacement: check master rolls on whether have dead slot, carries out dead slot and repairs, got rid of by wire jumper by winding displacement glue；
6) changing mortar: cleaned out by mortar in mortar jar in machine, then injected wherein by mortar, injection rate is
220kg；
7) cutting pre-treatment: workpiece clamp, filter tool, fixture, pulley and material platform are checked, then in start heat engine
After 10min, check whether stable working；
8) cutting: open machine and carry out actual cutting, during cutting, it is ensured that machine hygiene, variable interval uses cleaning wiping cloth to it
Surface carries out wiping, when wiping, it is to avoid touch machine button by mistake, cuts the later stage, uses pocket lamp to take care of rod side, detects whether
Penetrating；After having cut, carry out material lift；
9) cutting post processing: the charge bar after above-mentioned cutting is carried off, then separates, after removing photoresist, purged and packed.
Embodiment 2
The cutting technique of a kind of single gold silicon silicon body, it is characterised in that comprise the following steps:
1) take rod: be directly entered take rod indoor carry out choosing silicon rod, silicon rod must assure that N/D, without obvious cut, and
And when removing rod, need to ensure mutually not rub between collision, and rod and rod；
2) feeding platform: the above-mentioned charge bar handled well is carried out wiping, during wiping, uses dry cloth to coordinate ethanol to carry out wiping material
Rod, and material platform is also carried out corresponding wiping, then by charge bar gently be fixed on material platform after alignment, screw is put into spiral shell
Silk is tightened behind hole；
3) unloading rod: under using, truck is by the above-mentioned charge bar Whole blanking being fixed on material platform, when carrying out blanking, it is necessary to
Guarantee is handled with care, it is to avoid collision；
4) cleaning is cleaned: after using clear water that charge bar is carried out a preliminary flushing, remove wherein, the relic left over, broken glue,
So re-use alcohol rinse once, after then re-using clear water flushing 1h:
5) winding displacement: check master rolls on whether have dead slot, carries out dead slot and repairs, got rid of by wire jumper by winding displacement glue；
6) changing mortar: cleaned out by mortar in mortar jar in machine, then injected wherein by mortar, injection rate is
180kg；
7) cutting pre-treatment: workpiece clamp, filter tool, fixture, pulley and material platform are checked, then in start heat engine 5min
After, check whether stable working；
8) cutting: open machine and carry out actual cutting, during cutting, it is ensured that machine hygiene, variable interval uses cleaning wiping cloth to it
Surface carries out wiping, when wiping, it is to avoid touch machine button by mistake, cuts the later stage, uses pocket lamp to take care of rod side, detects whether
Penetrating；After having cut, carry out material lift；
9) cutting post processing: the charge bar after above-mentioned cutting is carried off, then separates, after removing photoresist, purged and packed.
The ultimate principle of the present invention and principal character and advantages of the present invention have more than been shown and described.The technology of the industry
Personnel, it should be appreciated that the present invention is not restricted to the described embodiments, simply illustrating this described in above-described embodiment and description
The principle of invention, without departing from the spirit and scope of the present invention, the present invention also has various changes and modifications, and these become
Change and improvement both falls within scope of the claimed invention.Claimed scope by appending claims and
Equivalent defines.
Claims (1)
1. the cutting technique of a single gold silicon silicon body, it is characterised in that comprise the following steps:
1) take rod: be directly entered take rod indoor carry out choosing silicon rod, silicon rod must assure that N/D, without obvious cut, and removes
During rod, need to ensure mutually not rub between collision, and rod and rod；
2) feeding platform: the above-mentioned charge bar handled well is carried out wiping, during wiping, uses dry cloth to coordinate ethanol to carry out wiping charge bar,
And material platform is also carried out corresponding wiping, then by charge bar gently be fixed on material platform after alignment, screw is put into screw
Tighten behind hole；
3) unloading rod: under using, truck is by the above-mentioned charge bar Whole blanking being fixed on material platform, when carrying out blanking, it is necessary to assure
Handle with care, it is to avoid collision；
4) cleaning is cleaned: after using clear water that charge bar is carried out a preliminary flushing, remove wherein, the relic left over, broken glue, the most again
Use alcohol rinse once, after then re-using clear water flushing 1-2h:
5) winding displacement: check master rolls on whether have dead slot, carries out dead slot and repairs, got rid of by wire jumper by winding displacement glue；
6) changing mortar: cleaned out by mortar in mortar jar in machine, then injected wherein by mortar, injection rate is 180-
220kg；
7) cutting pre-treatment: workpiece clamp, filter tool, fixture, pulley and material platform are checked, then in start heat engine 5-10min
After, check whether stable working；
8) cutting: open machine and carry out actual cutting, during cutting, it is ensured that machine hygiene, variable interval uses cleaning wiping cloth to its surface
Carry out wiping, when wiping, it is to avoid touch machine button by mistake, cut the later stage, use pocket lamp to take care of rod side, detect whether to lead to
Thoroughly；After having cut, carry out material lift；
9) cutting post processing: the charge bar after above-mentioned cutting is carried off, then separates, after removing photoresist, purged and packed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610714956.7A CN106182478A (en) | 2016-08-24 | 2016-08-24 | A kind of cutting technique of single gold silicon silicon body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610714956.7A CN106182478A (en) | 2016-08-24 | 2016-08-24 | A kind of cutting technique of single gold silicon silicon body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106182478A true CN106182478A (en) | 2016-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610714956.7A Pending CN106182478A (en) | 2016-08-24 | 2016-08-24 | A kind of cutting technique of single gold silicon silicon body |
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| Country | Link |
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| CN (1) | CN106182478A (en) |
Citations (13)
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|---|---|---|---|---|
| CN101474830A (en) * | 2008-12-11 | 2009-07-08 | 江苏海尚新能源材料有限公司 | Technological process for slicing solar energy grade six-cun monocrystalline silicon wafer |
| CN101664970A (en) * | 2009-09-03 | 2010-03-10 | 无锡尚品太阳能电力科技有限公司 | Monocrystal silicon-rod butting technique |
| CN102059749A (en) * | 2010-12-13 | 2011-05-18 | 天津市环欧半导体材料技术有限公司 | Process for cutting silicon wafer by using steel wire with diameter of 0.1mm |
| CN102285010A (en) * | 2011-08-08 | 2011-12-21 | 江西金葵能源科技有限公司 | Solar-grade silicon chip cut by using diamond wires and cutting method |
| CN102756433A (en) * | 2011-04-29 | 2012-10-31 | 苏州协鑫光伏科技有限公司 | Method for rescuing broken wire during silicon wafer linear cutting |
| CN102825670A (en) * | 2012-09-17 | 2012-12-19 | 金坛正信光伏电子有限公司 | Method for slicing solar silicon rod |
| CN103331828A (en) * | 2013-05-31 | 2013-10-02 | 阳光硅谷电子科技有限公司 | Cutting technique of oversized-diameter silicon rod |
| CN103341919A (en) * | 2013-07-29 | 2013-10-09 | 山东大海新能源发展有限公司 | Pretreatment process capable of increasing slicing rate of polycrystalline silicon rod |
| CN103372922A (en) * | 2013-07-30 | 2013-10-30 | 衡水英利新能源有限公司 | Method of cutting ingot by wire-cutting mesh |
| CN103934909A (en) * | 2014-03-19 | 2014-07-23 | 阳光硅谷电子科技有限公司 | Process adopting extra-fine steel wire to cut silicon rod |
| CN103991140A (en) * | 2014-04-28 | 2014-08-20 | 阳光硅谷电子科技有限公司 | Diamond wire-electrode cutting technology for silicon rod |
| CN104195643A (en) * | 2014-09-04 | 2014-12-10 | 无锡尚品太阳能电力科技有限公司 | Silicon rod sticking improving process |
| CN105382949A (en) * | 2015-10-30 | 2016-03-09 | 江苏耀阳电子有限公司 | Slicing operation technology of polycrystalline silicon chips |
-
2016
- 2016-08-24 CN CN201610714956.7A patent/CN106182478A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101474830A (en) * | 2008-12-11 | 2009-07-08 | 江苏海尚新能源材料有限公司 | Technological process for slicing solar energy grade six-cun monocrystalline silicon wafer |
| CN101664970A (en) * | 2009-09-03 | 2010-03-10 | 无锡尚品太阳能电力科技有限公司 | Monocrystal silicon-rod butting technique |
| CN102059749A (en) * | 2010-12-13 | 2011-05-18 | 天津市环欧半导体材料技术有限公司 | Process for cutting silicon wafer by using steel wire with diameter of 0.1mm |
| CN102756433A (en) * | 2011-04-29 | 2012-10-31 | 苏州协鑫光伏科技有限公司 | Method for rescuing broken wire during silicon wafer linear cutting |
| CN102285010A (en) * | 2011-08-08 | 2011-12-21 | 江西金葵能源科技有限公司 | Solar-grade silicon chip cut by using diamond wires and cutting method |
| CN102825670A (en) * | 2012-09-17 | 2012-12-19 | 金坛正信光伏电子有限公司 | Method for slicing solar silicon rod |
| CN103331828A (en) * | 2013-05-31 | 2013-10-02 | 阳光硅谷电子科技有限公司 | Cutting technique of oversized-diameter silicon rod |
| CN103341919A (en) * | 2013-07-29 | 2013-10-09 | 山东大海新能源发展有限公司 | Pretreatment process capable of increasing slicing rate of polycrystalline silicon rod |
| CN103372922A (en) * | 2013-07-30 | 2013-10-30 | 衡水英利新能源有限公司 | Method of cutting ingot by wire-cutting mesh |
| CN103934909A (en) * | 2014-03-19 | 2014-07-23 | 阳光硅谷电子科技有限公司 | Process adopting extra-fine steel wire to cut silicon rod |
| CN103991140A (en) * | 2014-04-28 | 2014-08-20 | 阳光硅谷电子科技有限公司 | Diamond wire-electrode cutting technology for silicon rod |
| CN104195643A (en) * | 2014-09-04 | 2014-12-10 | 无锡尚品太阳能电力科技有限公司 | Silicon rod sticking improving process |
| CN105382949A (en) * | 2015-10-30 | 2016-03-09 | 江苏耀阳电子有限公司 | Slicing operation technology of polycrystalline silicon chips |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161207 |