CN106170835B - 印刷电子用铜糊剂组合物 - Google Patents
印刷电子用铜糊剂组合物 Download PDFInfo
- Publication number
- CN106170835B CN106170835B CN201380056055.8A CN201380056055A CN106170835B CN 106170835 B CN106170835 B CN 106170835B CN 201380056055 A CN201380056055 A CN 201380056055A CN 106170835 B CN106170835 B CN 106170835B
- Authority
- CN
- China
- Prior art keywords
- copper
- paste composition
- mentioned
- printed electronic
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
- C09D201/005—Dendritic macromolecules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Conductive Materials (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0121743 | 2012-10-31 | ||
KR20120121743 | 2012-10-31 | ||
KR10-2013-0128938 | 2013-10-29 | ||
KR1020130128938A KR102109427B1 (ko) | 2012-10-31 | 2013-10-29 | 인쇄전자용 구리 페이스트 조성물 |
PCT/KR2013/009664 WO2014069866A1 (ko) | 2012-10-31 | 2013-10-29 | 인쇄전자용 구리 페이스트 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106170835A CN106170835A (zh) | 2016-11-30 |
CN106170835B true CN106170835B (zh) | 2018-12-04 |
Family
ID=50887514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380056055.8A Expired - Fee Related CN106170835B (zh) | 2012-10-31 | 2013-10-29 | 印刷电子用铜糊剂组合物 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6487846B2 (ja) |
KR (1) | KR102109427B1 (ja) |
CN (1) | CN106170835B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150134728A (ko) * | 2014-05-22 | 2015-12-02 | 주식회사 동진쎄미켐 | 전도성 조성물 |
KR101631923B1 (ko) | 2015-10-27 | 2016-06-20 | 국방과학연구소 | 전도성 잉크와 대기압 플라즈마 젯을 이용한 다양한 패턴의 유연 플라즈마 전극 제작 방법 |
KR102454430B1 (ko) * | 2015-12-14 | 2022-10-17 | 주식회사 동진쎄미켐 | 전주도금방식을 이용하는 금속배선 형성방법 및 이에 사용되는 메탈 페이스트 조성물 |
WO2019058727A1 (ja) * | 2017-09-20 | 2019-03-28 | 矢崎総業株式会社 | 導電性組成物及びそれを用いた配線板 |
JP7156831B2 (ja) * | 2017-09-20 | 2022-10-19 | 矢崎総業株式会社 | 導電性組成物及びそれを用いた配線板 |
CN113284646B (zh) * | 2021-03-31 | 2023-03-31 | 浙江中科玖源新材料有限公司 | 一种柔性透明导电膜及其制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200812729A (en) * | 2006-07-28 | 2008-03-16 | Furukawa Electric Co Ltd | Fine particle dispersion and method for producing fine particle dispersion |
CN100488339C (zh) * | 2003-05-16 | 2009-05-13 | 播磨化成株式会社 | 形成微细铜颗粒烧结产物类的微细形状导电体的方法 |
CN101618462A (zh) * | 2008-07-03 | 2010-01-06 | 东进世美肯株式会社 | 金属纳米颗粒的制造方法 |
CN102388421A (zh) * | 2009-04-01 | 2012-03-21 | 株式会社东进世美肯 | 可低温烧成的用于形成电极或配线的糊剂组合物 |
CN102470438A (zh) * | 2009-08-05 | 2012-05-23 | 日立化成工业株式会社 | Cu-Al 合金粉末、采用该合金粉末的合金糊膏以及电子部件 |
CN102651249A (zh) * | 2011-02-25 | 2012-08-29 | 三星电机株式会社 | 铜纳米膏、形成其的方法、和利用其形成电极的方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2102026B (en) * | 1981-06-05 | 1985-07-10 | Matsushita Electric Ind Co Ltd | Conductive pastes |
WO2006080247A1 (ja) * | 2005-01-25 | 2006-08-03 | Fujikura Kasei Co., Ltd. | 導電性ペースト |
US20090029065A1 (en) * | 2005-06-25 | 2009-01-29 | Nobuto Terada | Conductive circuit manufacturing method |
FI20085229L (fi) * | 2008-03-18 | 2009-09-19 | Keskuslaboratorio | Uudet materiaalit ja menetelmät |
JP2010118449A (ja) * | 2008-11-12 | 2010-05-27 | Toray Ind Inc | 導電膜の製造方法 |
KR101774069B1 (ko) * | 2010-01-08 | 2017-09-01 | 도요보 가부시키가이샤 | 도전성 페이스트 및 금속 박막 |
-
2013
- 2013-10-29 KR KR1020130128938A patent/KR102109427B1/ko active IP Right Grant
- 2013-10-29 JP JP2015539508A patent/JP6487846B2/ja not_active Expired - Fee Related
- 2013-10-29 CN CN201380056055.8A patent/CN106170835B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100488339C (zh) * | 2003-05-16 | 2009-05-13 | 播磨化成株式会社 | 形成微细铜颗粒烧结产物类的微细形状导电体的方法 |
TW200812729A (en) * | 2006-07-28 | 2008-03-16 | Furukawa Electric Co Ltd | Fine particle dispersion and method for producing fine particle dispersion |
CN101618462A (zh) * | 2008-07-03 | 2010-01-06 | 东进世美肯株式会社 | 金属纳米颗粒的制造方法 |
CN102388421A (zh) * | 2009-04-01 | 2012-03-21 | 株式会社东进世美肯 | 可低温烧成的用于形成电极或配线的糊剂组合物 |
CN102470438A (zh) * | 2009-08-05 | 2012-05-23 | 日立化成工业株式会社 | Cu-Al 合金粉末、采用该合金粉末的合金糊膏以及电子部件 |
CN102651249A (zh) * | 2011-02-25 | 2012-08-29 | 三星电机株式会社 | 铜纳米膏、形成其的方法、和利用其形成电极的方法 |
Also Published As
Publication number | Publication date |
---|---|
KR102109427B1 (ko) | 2020-05-28 |
CN106170835A (zh) | 2016-11-30 |
KR20140056045A (ko) | 2014-05-09 |
JP2016502752A (ja) | 2016-01-28 |
JP6487846B2 (ja) | 2019-03-20 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181204 Termination date: 20201029 |
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CF01 | Termination of patent right due to non-payment of annual fee |