CN106170835B - 印刷电子用铜糊剂组合物 - Google Patents

印刷电子用铜糊剂组合物 Download PDF

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Publication number
CN106170835B
CN106170835B CN201380056055.8A CN201380056055A CN106170835B CN 106170835 B CN106170835 B CN 106170835B CN 201380056055 A CN201380056055 A CN 201380056055A CN 106170835 B CN106170835 B CN 106170835B
Authority
CN
China
Prior art keywords
copper
paste composition
mentioned
printed electronic
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201380056055.8A
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English (en)
Chinese (zh)
Other versions
CN106170835A (zh
Inventor
金圣培
李昇爀
林峻焕
韩住炅
刘炫硕
金永模
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongjin Semichem Co Ltd
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Priority claimed from PCT/KR2013/009664 external-priority patent/WO2014069866A1/ko
Publication of CN106170835A publication Critical patent/CN106170835A/zh
Application granted granted Critical
Publication of CN106170835B publication Critical patent/CN106170835B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C09D201/005—Dendritic macromolecules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN201380056055.8A 2012-10-31 2013-10-29 印刷电子用铜糊剂组合物 Expired - Fee Related CN106170835B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR10-2012-0121743 2012-10-31
KR20120121743 2012-10-31
KR10-2013-0128938 2013-10-29
KR1020130128938A KR102109427B1 (ko) 2012-10-31 2013-10-29 인쇄전자용 구리 페이스트 조성물
PCT/KR2013/009664 WO2014069866A1 (ko) 2012-10-31 2013-10-29 인쇄전자용 구리 페이스트 조성물

Publications (2)

Publication Number Publication Date
CN106170835A CN106170835A (zh) 2016-11-30
CN106170835B true CN106170835B (zh) 2018-12-04

Family

ID=50887514

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380056055.8A Expired - Fee Related CN106170835B (zh) 2012-10-31 2013-10-29 印刷电子用铜糊剂组合物

Country Status (3)

Country Link
JP (1) JP6487846B2 (ja)
KR (1) KR102109427B1 (ja)
CN (1) CN106170835B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150134728A (ko) * 2014-05-22 2015-12-02 주식회사 동진쎄미켐 전도성 조성물
KR101631923B1 (ko) 2015-10-27 2016-06-20 국방과학연구소 전도성 잉크와 대기압 플라즈마 젯을 이용한 다양한 패턴의 유연 플라즈마 전극 제작 방법
KR102454430B1 (ko) * 2015-12-14 2022-10-17 주식회사 동진쎄미켐 전주도금방식을 이용하는 금속배선 형성방법 및 이에 사용되는 메탈 페이스트 조성물
WO2019058727A1 (ja) * 2017-09-20 2019-03-28 矢崎総業株式会社 導電性組成物及びそれを用いた配線板
JP7156831B2 (ja) * 2017-09-20 2022-10-19 矢崎総業株式会社 導電性組成物及びそれを用いた配線板
CN113284646B (zh) * 2021-03-31 2023-03-31 浙江中科玖源新材料有限公司 一种柔性透明导电膜及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200812729A (en) * 2006-07-28 2008-03-16 Furukawa Electric Co Ltd Fine particle dispersion and method for producing fine particle dispersion
CN100488339C (zh) * 2003-05-16 2009-05-13 播磨化成株式会社 形成微细铜颗粒烧结产物类的微细形状导电体的方法
CN101618462A (zh) * 2008-07-03 2010-01-06 东进世美肯株式会社 金属纳米颗粒的制造方法
CN102388421A (zh) * 2009-04-01 2012-03-21 株式会社东进世美肯 可低温烧成的用于形成电极或配线的糊剂组合物
CN102470438A (zh) * 2009-08-05 2012-05-23 日立化成工业株式会社 Cu-Al 合金粉末、采用该合金粉末的合金糊膏以及电子部件
CN102651249A (zh) * 2011-02-25 2012-08-29 三星电机株式会社 铜纳米膏、形成其的方法、和利用其形成电极的方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2102026B (en) * 1981-06-05 1985-07-10 Matsushita Electric Ind Co Ltd Conductive pastes
WO2006080247A1 (ja) * 2005-01-25 2006-08-03 Fujikura Kasei Co., Ltd. 導電性ペースト
US20090029065A1 (en) * 2005-06-25 2009-01-29 Nobuto Terada Conductive circuit manufacturing method
FI20085229L (fi) * 2008-03-18 2009-09-19 Keskuslaboratorio Uudet materiaalit ja menetelmät
JP2010118449A (ja) * 2008-11-12 2010-05-27 Toray Ind Inc 導電膜の製造方法
KR101774069B1 (ko) * 2010-01-08 2017-09-01 도요보 가부시키가이샤 도전성 페이스트 및 금속 박막

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100488339C (zh) * 2003-05-16 2009-05-13 播磨化成株式会社 形成微细铜颗粒烧结产物类的微细形状导电体的方法
TW200812729A (en) * 2006-07-28 2008-03-16 Furukawa Electric Co Ltd Fine particle dispersion and method for producing fine particle dispersion
CN101618462A (zh) * 2008-07-03 2010-01-06 东进世美肯株式会社 金属纳米颗粒的制造方法
CN102388421A (zh) * 2009-04-01 2012-03-21 株式会社东进世美肯 可低温烧成的用于形成电极或配线的糊剂组合物
CN102470438A (zh) * 2009-08-05 2012-05-23 日立化成工业株式会社 Cu-Al 合金粉末、采用该合金粉末的合金糊膏以及电子部件
CN102651249A (zh) * 2011-02-25 2012-08-29 三星电机株式会社 铜纳米膏、形成其的方法、和利用其形成电极的方法

Also Published As

Publication number Publication date
KR102109427B1 (ko) 2020-05-28
CN106170835A (zh) 2016-11-30
KR20140056045A (ko) 2014-05-09
JP2016502752A (ja) 2016-01-28
JP6487846B2 (ja) 2019-03-20

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