CN106160695A - Piezoelectric vibration component, the method manufacturing piezoelectric vibration component and piezoelectric vibrator - Google Patents
Piezoelectric vibration component, the method manufacturing piezoelectric vibration component and piezoelectric vibrator Download PDFInfo
- Publication number
- CN106160695A CN106160695A CN201510138361.7A CN201510138361A CN106160695A CN 106160695 A CN106160695 A CN 106160695A CN 201510138361 A CN201510138361 A CN 201510138361A CN 106160695 A CN106160695 A CN 106160695A
- Authority
- CN
- China
- Prior art keywords
- protuberance
- electrode
- vibration component
- piezoelectric vibration
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention provides a kind of piezoelectric vibration component, the method manufacturing piezoelectric vibration component and piezoelectric vibrator, described piezoelectric vibration component includes: vibration substrate, there is protuberance, on a surface of each thickness direction along described vibration substrate being arranged on described vibration substrate in described protuberance and another surface；Vibrating electrode, is arranged on described protuberance, and wherein, at least one side surface of described protuberance includes four crystrallographic planes.
Description
This application claims and within 16th, be submitted to the of Korean Intellectual Property Office in JIUYUE in 2014
No. 10-2014-0122946 and within 29th, be submitted to the of Korean Intellectual Property Office in JIUYUE in 2014
The priority of 10-2014-0129987 korean patent application and rights and interests, this application disclosure is by drawing
With being contained in this.
Technical field
It relates to a kind of piezoelectric vibration component, the method manufacturing this piezoelectric vibration component and piezoelectric vibration
Device.
Background technology
Piezoelectric vibrator is to be vibrated by piezoelectric vibration component and produces the setting of vibration with characteristic frequency
Standby, wherein, piezoelectric vibration component is due in the piezoelectric vibration component when applying voltage to piezoelectric vibration component
Occur piezoelectricity and vibrate.
Owing to piezoelectric vibrator has stable frequency of vibration, therefore at the multiple cores providing reference level signal
Such device has been employed in heart assembly and in the oscillating circuit of computer or communicator.
Included by crystal formation piezoelectric vibration component: vibration substrate, use crystal as base material；
Electrode, is arranged on vibration substrate, wherein, vibration substrate can physical characteristic as required and have each
Plant shape.
When the piezoelectric vibration component being in thickness-shear vibration model be formed so that vibration substrate thickness from
When the central part of vibration substrate is gradually reduced towards the end vibrating substrate, the damping of vibration displacement in end
Amount increases, thus can improve vibrational energy and be trapped in the effect of central part of piezoelectric vibration component and can improve frequency
Rate characteristic (such as, CI value, Q-value etc.).Vibrational energy can be realized and fall into effect (vibration energy trapping
The example of the shape of piezoelectric vibration component effect) includes that the curved surface of convex is formed as first type surface
Convex, space between smooth and thick central part and the edge of end are formed as the domatic of inclined surface
The platform shape etc. that smooth and thick and around central part the part of shape, central part is thin.
At the thickness of the flat central part of thickness and the thickness in slim cincture portion in netted piezoelectric vibration component
In the case of quickly changing, may reduce and can fall into effect and electrode connectivity may be reduced.Therefore,
It is required to solve the piezoelectric vibration component of these problems.
[prior art literature]
(patent documentation 1) 2010-109526 Japanese Patent Laid-Open
Summary of the invention
A kind of method that the one side of the disclosure can provide piezoelectric vibration component, manufacture this piezoelectric vibration component
And piezoelectric vibrator.
According to the one side of the disclosure, a kind of piezoelectric vibration component includes: vibration substrate, has protuberance,
One surface of each through-thickness being arranged on described vibration substrate in described protuberance and another table
On face；Vibrating electrode, wherein, at least one side surface of described protuberance includes four crystrallographic planes,
It is thus possible to sunken effect is excellent and improves electrode connectivity.
According to another aspect of the present disclosure, it is provided that a kind of method manufacturing piezoelectric vibration component, described method
Including: on wafer, form corrosion-resisting pattern；Wafer is etched, for the first time to form protuberance；Right
The wafer second time having removed corrosion-resisting pattern is etched；Form vibrating electrode over the projections；To wafer
Third time is etched, and to allow one or more side surface of described protuberance to include, four crystal are put down
Face, thus improve and can fall into effect and electrode connectivity.
According to another aspect of the present disclosure, a kind of piezoelectric vibrator includes: piezoelectric vibration component, wherein,
One or more side surface of protuberance includes four crystrallographic planes；Upper casing and lower casing, described piezoelectricity shakes
Dynamic component is contained in described upper casing and described lower casing；Connect electrode, be connected to described piezoelectric vibration component
Electrode portion；Outer electrode.
Accompanying drawing explanation
By the detailed description carried out below in conjunction with the accompanying drawings, the above and other aspect of the disclosure, feature and
Advantage will be more clearly understood, wherein:
Fig. 1 is the perspective view of the piezoelectric vibration component of the exemplary embodiment according to the disclosure；
Fig. 2 is the sectional view of the piezoelectric vibration component of A-A ' the line intercepting along Fig. 1；
Fig. 3 is the district being provided with connecting electrode of the piezoelectric vibration component of B-B ' the line intercepting along Fig. 1
The sectional view in territory；
Fig. 4 is the method illustrating the piezoelectric vibration component manufacturing the another exemplary embodiment according to the disclosure
Flow chart；
Fig. 5 to Fig. 8 is to illustrate the piezoelectric vibration in the certain operations in the operation manufacturing piezoelectric vibration component
The sectional view of component；
Fig. 9 is the decomposition diagram of the piezoelectric vibrator of the exemplary embodiment according to the disclosure；
Figure 10 is the sectional view of the piezoelectric vibrator of C-C ' the line intercepting along Fig. 9.
Detailed description of the invention
The exemplary embodiment of the disclosure is described in detail now with reference to accompanying drawing.
But, the disclosure can illustrate with multiple different form and should not be construed as limited to explain
It is set forth in this specific embodiment.More precisely, these embodiments are provided so that the disclosure will be thoroughly
With complete, and the scope of the present disclosure is fully conveyed to those skilled in the art.
In the accompanying drawings, for the sake of clarity, the shape and size of element, and identical label can be exaggerated
To be used for all the time indicating same or analogous element.
Piezoelectric vibration component
Hereinafter, the piezoelectric vibration component of the exemplary embodiment according to the disclosure will be described.
Fig. 1 is the perspective view of the piezoelectric vibration component 100 of the exemplary embodiment according to the disclosure.
Fig. 2 is the sectional view of the piezoelectric vibration component 100 of A-A ' the line intercepting along Fig. 1.
See figures.1.and.2, can wrap according to the piezoelectric vibration component 100 of the exemplary embodiment of the disclosure
Include vibration substrate 110 and the electrode portion 120 being arranged on vibration substrate.
In the accompanying drawing of this specification, the thickness direction of DR1 direction finger pressure electric oscillation component 100, DR2
Direction refers to be perpendicular to a direction in DR1 direction, and DR3 direction refers to be perpendicular to DR1 direction and DR2 side
To direction.
Vibration substrate 110 comprises the steps that vibration section 112, has the thickness of relative thick；Cincture portion 111, tool
Having the thickness thinner than the thickness of vibration section, wherein, vibration section 112 can include and the edge than cincture portion 111
The region that one surface (that is, upper surface) of thickness direction and another surface (that is, lower surface) protrude
Corresponding protuberance 112a and 112b.
Such as, protuberance comprises the steps that the first protuberance 112a, than the through-thickness in cincture portion 111
One surface is protruded；Second protuberance 112b, more convex than another surface of the through-thickness in cincture portion 111
Go out.
The vibration substrate 110 being included in piezoelectric vibration component 100 can comprise crystal, as its material,
Wherein, crystal is used as mechanical type vibration machine.
According to the exemplary embodiment of the disclosure, crystal can be quartz.
Electrode portion 120 comprises the steps that vibrating electrode 121a and 121b, and the edge being arranged on vibration section 112 is thick
On one surface (that is, upper surface) in degree direction and another surface (that is, lower surface)；Termination electrode 123a
And 123b, it is arranged on a surface and at least in another surface of the through-thickness in cincture portion 111
On individual；Connect electrode 122a and 122b, vibrating electrode and termination electrode are connected to each other.
First vibrating electrode 121a may be provided on a surface of the through-thickness of vibration section 112 and leads to
Cross the first connection electrode 122a to be connected to the first termination electrode 123a, the second vibrating electrode 121b and may be provided at
On another surface relative with vibration section 112 surface of vibration section 112 and by the second connection electricity
Pole 122b is connected to the second termination electrode 123b.
First termination electrode 123a can extend to cincture portion from the through-thickness in cincture portion 111 a surface
A side surface and extend to another surface of through-thickness in cincture portion, the second termination electrode 123b can
Another surface of through-thickness from cincture portion 111 extends to a side surface in cincture portion and extends to
One surface of the through-thickness in cincture portion.But, the disclosure is not limited to this.
According to the exemplary embodiment of the disclosure, when watching in the plane, than cincture portion 111 along thick
The one of the through-thickness of protuberance 112a and 112b that one surface in degree direction and another surface are protruded
Individual surface STa and STb can generally have rectangular shape, although due to the corner of surface STa and STb
Etching cause surface STa and STb not have a complete rectangular shape, but protuberance described below
Surface STa and STb refer to highlight than a surface of through-thickness and another surface in cincture portion 111
The surface of through-thickness of protuberance.
In an exemplary embodiment of the disclosure, the side surface 1a of protuberance, 1b, 2a, 2b, 3a, 3b,
4a and 4b refers to the through-thickness by every side of surface STa and STb of protuberance and cincture portion 111
The surface that one surface and another surface are connected to each other, one or more side surface of protuberance can include
Four crystrallographic planes.
Each side surface of protuberance 112a and 112b can have a shape of inclination, protuberance 112a and
The top of 112b can have the width of the narrow width of the bottom than protuberance 112a and 112b.
According to the exemplary embodiment of the disclosure, the first protuberance 112a can include four side surface 1a,
2a, 3a and 4a, the second protuberance 112b can include four side surfaces 1b, 2b, 3b and 4b, and first dashes forward
One or more side surface going out portion and the second protuberance can have four crystrallographic planes.
First side surface 1a and 1b of protuberance can be with the 3rd side surface along DR2 direction of protuberance
3a with 3b is relative, the second side surface 2a and 2b of protuberance can with protuberance along the of DR3 direction
Four side surface 4a with 4b are relative.
Such as, as in figure 2 it is shown, Fig. 2 is the cross section of the piezoelectric vibration component of A-A ' the line intercepting along Fig. 1
Figure, the first side surface 1a of the first protuberance 112a can include four crystrallographic planes f1, f2, f3 and f4,
The 3rd side surface 3a of the first protuberance 112a can include four crystrallographic planes f5, f6, f7 and f8.
Additionally, as in figure 2 it is shown, Fig. 2 is the cross section of the piezoelectric vibration component of A-A ' the line intercepting along Fig. 1
Figure, the first side surface 1b of the second protuberance 112b can include four crystrallographic planes f13, f14, f15 and
F16, the 3rd side surface 3b of the second protuberance 112b can include four crystrallographic planes f9, f10, f11 and
f12。
The of the first side surface 1a being connected to the first protuberance 112a of the surface STa of the first protuberance
Side can with the surface STa of the first protuberance be connected to the first protuberance 112a along DR2 direction
3rd side of the 3rd side surface 3a is relative.Additionally, the surface STb of the second protuberance be connected to second dash forward
Go out portion 112b the first side surface 1b the first side can with the surface STb of the second protuberance be connected to
The 3rd side along the 3rd side surface 3b in DR2 direction of two protuberance 112b is relative.
Additionally, although it is not shown, the second side of the first protuberance and the 4th side and the second protuberance
The second side and the 4th side can include four crystrallographic planes respectively.
According to the exemplary embodiment of the disclosure, the first protuberance 112a and the one of the second protuberance 112b
Individual or more side surfaces can include the mineral crystal plane of quartz crystal and have and mineral crystal plane
The crystrallographic plane at the angle of inclination that angle of inclination is different.
Such as, the first side surface 1a and the 3rd side surface 3a and second of the first protuberance 112a are prominent
The first side surface 1b of portion 112b and the 3rd side surface 3b can include quartz crystal mineral crystal plane and
There is the crystrallographic plane at different angle of inclination, the angle of inclination of mineral crystal plane from quartz crystal.
As depicted in figs. 1 and 2, the first protuberance 112a and each side surface of the second protuberance 112b
Can have four crystrallographic planes, to relax due to the thickness difference shape between vibration section 112 and cincture portion 111
The step become, thus improve and fall into effect for the energy produced by the frequency of piezoelectric effect, and then reduce
Energy loss.
Fig. 3 is the district being provided with connecting electrode of the piezoelectric vibration component of B-B ' the line intercepting along Fig. 1
The sectional view in territory.
The connection electrode 122a that vibrating electrode 121a and 121b and termination electrode 123a and 123b is connected to each other
May be provided on one or more side surface of protuberance 112a and 112b with 122b.
Such as, first connects electrode 122a may be provided on the first side surface 1a of the first protuberance 112a,
As it is shown on figure 3, although it is not shown, the second connection electrode 122b may be provided at the second protuberance 112b
The 3rd side surface 3b on.
According to the exemplary embodiment of the disclosure, due to be provided with the protuberance 112a connecting electrode and
The side surface of 112b has four crystal for relaxing the step between vibration section 112 and cincture portion 111
Plane, therefore can reduce the fast of the angle of inclination due to the crystrallographic plane being included in the side surface of protuberance
The generation connecting the electrode open fault that electrode disconnects that speed changes and causes.
According to the exemplary embodiment of the disclosure, the side surface of protuberance 112a and 112b includes four crystalline substances
Body plane, thus vibrate substrate and can have situation about being convexly formed by mechanical polishing method with vibration section
Under the similar shape of shape of vibration substrate.Such as, as shown in Figures 2 and 3, according to these public affairs
In the vibration substrate of the exemplary embodiment opened, although vibration section and cincture portion have and be formed at therebetween
Step, but due to thickness difference, that step is formed as is multistage.Therefore, vibration substrate has and it
The similar shape of shape of the vibration substrate that first type surface is convexly formed by mechanical polishing, it is thus possible to fall into
It is excellent that effect falls into effect than the energy of the vibration substrate with platform shape according to prior art.
Fig. 4 is the method illustrating the piezoelectric vibration component manufacturing the another exemplary embodiment according to the disclosure
Flow chart；Fig. 5 to Fig. 8 is to illustrate the pressure in the certain operations in the operation manufacturing piezoelectric vibration component
The sectional view of electric oscillation component.
Fig. 5 to Fig. 8 is to illustrate the piezoelectric vibration structure intercepted with the A-A ' line along Fig. 1 in different operations
The sectional view in the region that the cross section of part is corresponding.
With reference to Fig. 4, manufacture and comprise the steps that system according to the method for the piezoelectric vibration component of this exemplary embodiment
Standby wafer (S1)；Corrosion-resisting pattern is formed on another surface on a surface of the through-thickness of wafer
(S2)；Wafer is etched, for the first time to form protuberance (S3)；Remove corrosion-resisting pattern (S4)；
Wafer second time is etched (S5)；Wafer is formed vibrating electrode (S6)；To wafer third time
It is etched (S7).
In the step preparing wafer (S1), the list corresponding with the size of a vibration substrate can be used
Individual wafer, although not shown, but can use be formed with corresponding with the size of a vibration substrate
The wafer assemblies of multiple wafers.
Can be by rectangle or round-shaped coarse quartz be processed then by described coarse quartz
Cut into predetermined thickness and form wafer.But, wafer is not limited to have rectangle or round-shaped, and can
There is variously-shaped (such as, polygonal shape).Additionally, can be to rectangle or round-shaped finished
Wafer carries out processing of surface polishing, to reduce the thickness of wafer.
Although wafer can be used to form multiple piezoelectric vibration component, but will describe in an illustrative manner below
Form the situation of single piezoelectric vibration component, to contribute to the understanding of the disclosure.
As it is shown in figure 5, may be formed at the edge thickness of wafer 310 for forming the corrosion-resisting pattern 320 of protuberance
On one surface in degree direction and another surface (S2).Corrosion-resisting pattern 320 can shape based on protuberance and
Size and be suitably disposed on wafer.
It follows that as shown in Figure 6, the wafer 310 of corrosion-resisting pattern 320 can be provided with on which for the first time
It is etched, forms protuberance (S3) with a surface of the through-thickness at wafer on another surface,
One surface of the through-thickness of protuberance has rectangular shape.
Can be by the chemistry erosion that the wafer 310 being formed with corrosion-resisting pattern 320 on it is immersed in etchant
Carving method and wafer 310 is etched.
One or more side surface of protuberance can have a natural crystalline by current etch process
Body plane.
Generally, in the case of forming wafer by chemical etching, only it is being provided with the state of corrosion-resisting pattern
Lower just can be etched for the first time, to form protuberance.In this case, as shown in Figure 6, vibration
Step between portion and cincture portion is not mild, and is probably steep.
In the case of step between vibration section and cincture portion is not mild, can fall into efficiency may be low, and
The probability that will appear from open fault in the electrodes may be increased.
But, according to the exemplary embodiment of the disclosure, against corrosion remove on etched wafer 310
After pattern (S4), wafer 310 second time being formed without single corrosion-resisting pattern state can be lost
Carve (S5).Therefore, as it is shown in fig. 7, each side surface of protuberance 112a and 112b can have two
Or more crystrallographic plane, to relax the step between vibration section 112 and cincture portion 111.
Additionally, according to the exemplary embodiment of the disclosure, be formed in the electrode portion including vibrating electrode
After on the wafer that second etch is crossed (S6), the wafer third time that can be formed with electrode portion on which is lost
Carve, to allow one or more side surface of protuberance 112a and 112b to include four crystrallographic planes.
Such as, each in four side surfaces of protuberance 112a and 112b includes four crystrallographic planes.
By the method identical with the method etched first of wafer wafer second time can be etched and the
It is etched for three times.Such as, by wafer is immersed in etchant, wafer second time can be etched
It is etched with third time.
According to the exemplary embodiment of the disclosure, the method for manufacture piezoelectric vibration component may additionally include to be passed through
Electrode portion is formed, as shown in Figure 8 on the vibration substrate 110 wafer being etched again and formed.
Electrode portion can include vibrating electrode, termination electrode and connection electrode and can by be formed on prominent
Print electrocondution slurry on the vibration substrate in portion and formed.
Electrode portion can have the vibrating electrode on a surface of the through-thickness being formed at protuberance
121a and 121b.
Detailed description and piezoelectric vibration component 100 due to electrode portion and the shape of every side of protuberance
Above description repeats, and will omit descriptions thereof the most below.
Piezoelectric vibrator
It follows that the piezoelectric vibrator that the another exemplary embodiment according to the disclosure will be described.
Fig. 9 is the decomposition diagram of the piezoelectric vibrator 200 of the exemplary embodiment according to the disclosure；Figure
10 is the sectional view of the piezoelectric vibrator 200 of C-C ' the line intercepting along Fig. 9.
With reference to Fig. 9 and Figure 10, comprise the steps that according to the piezoelectric vibrator 200 of the exemplary embodiment of the disclosure
Have vibration substrate 110 and the piezoelectric vibration component 100 in electrode portion 120, lower casing 210, upper casing 220,
Connect electrode 211a and 211b and outer electrode 212a and 212b.
The piezoelectric vibration component being included in the piezoelectric vibrator 200 of the exemplary embodiment according to the disclosure
100 can be in above-mentioned piezoelectric vibration component 100.Therefore, for piezoelectric vibration component 100
Describe and will be replaced by the description that provides referring to figs. 1 through Fig. 3, will omit piezoelectric vibration component 100
Describe in detail, to avoid repeated description.
Lower casing 210 and upper casing 220 can be bonded to each other, to form the shell being formed with inner space,
Piezoelectric vibration component 100 be may be provided at and is bonded to each other in the inner space formed by upper casing and lower casing.
Piezoelectric vibration component 100 may be provided in lower casing 210 and upper casing 220, thus prevents external drive.
Connect electrode and can include that the first connection electrode 211a and second being arranged to be separated from each other connects electricity
Pole 211b, outer electrode can include that the first outer electrode 212a and second being arranged to be separated from each other is outside
Electrode 212b.
First connection electrode 211a and the second connection electrode 211b may be provided at the upper of the inside of lower casing 210
On surface and be connected respectively to the first termination electrode 123a and second termination electrode of piezoelectric vibration component 100
123b。
First outer electrode 212a and the second outer electrode 212b may be provided under the outside of lower casing 210
On surface and be connected respectively to the first connection electrode 211a and second connect electrode 211b.First outer electrode
212a and the second outer electrode 212b and first connects electrode 211a and second connection electrode 211b can be passed through
It is connected to each other via the electrode 213a penetrating lower casing 210, but is not limited to this.
First outer electrode 212a and the second outer electrode 212b can be used as the input of piezoelectric vibrator 200
Electrode and output electrode.As it has been described above, when to the first outer electrode 212a and the second outer electrode 212b
When applying voltage, voltage can be applied to the first vibrating electrode 121a and second of piezoelectric vibration component 100
Vibrating electrode 121b, thus piezoelectric vibration component 100 can vibrate.
The first termination electrode 123a and the second termination electrode 123b of piezoelectric vibration component 100 and first connect electricity
Pole 211a and second is connected electrode 211b and can be connected to each other by solder flux or electrically-conducting adhesive.Solder flux or
Electrically-conducting adhesive can become the first termination electrode 123a and the second end electricity being arranged on piezoelectric vibration component 100
Pole 123b and first connects electrode 211a and second and connects the connecting portion 230 between electrode 211b, to incite somebody to action
First termination electrode 123a and the second termination electrode 123b and first connects electrode 211a and second and connects electrode
211b is electrically connected to each other.
Connecting portion 230 may also include metal solder flux.First connection electrode 211a of piezoelectric vibration component 100
Can be as follows with the second connection electrode 211b and the first termination electrode 123a and the second termination electrode 123b
It is connected to each other: connect first and on electrode 211a and second connection electrode 211b, metal solder flux is set；Will
First termination electrode 123a and the second termination electrode 123b is arranged on metal solder flux；Then reflux technique is performed.
Additionally, connecting portion 230 can be formed in the following way: connect electrode 211a and second even first
Arrange between receiving electrode 211b and the first termination electrode 123a and the second termination electrode 123b nickel (Ni), gold (Au),
Kovar alloy (kovar) etc. and joint portion (such as, nickel (Ni), gold (Au), kovar alloy (kovar)
Deng) above perform arc welding or electron beam weldering；Or with high-temperature fusion gold (Au)-hydrargyrum (Hg) alloy, but
It is not limited to this.
Alternatively, connecting portion 230 can include the conduction that can comprise any one of resin or organic material
Binding agent.In the case of using the electrically-conducting adhesive comprising resin or organic material, it is possible to increase pressure
Electric oscillation component 100 and the air-tightness being connected between electrode 211a and 211b, and crackle can be prevented
Produce.
Upper casing 220 and lower casing 210 can comprise identical material, such as, insulating resin etc., but are not limited to
This.
As it has been described above, according to the exemplary embodiment of the disclosure, it is possible to provide have excellent energy fall into effect and
Electrode connectivity improved piezoelectric vibration component, the method manufacturing this piezoelectric vibration component and piezoelectricity shake
Dynamic device.
Although having been shown above and describe exemplary embodiment, but will for those skilled in the art
It is evident that in the case of without departing from the scope of the present invention being defined by the claims, it can be carried out
Amendment and modification.
Claims (15)
1. a piezoelectric vibration component, described piezoelectric vibration component includes:
Vibration substrate, has protuberance, each edge being arranged on described vibration substrate in described protuberance
On one surface of the thickness direction of described vibration substrate and another surface；
Vibrating electrode, is arranged on described protuberance,
Wherein, at least one side surface of described protuberance includes four crystrallographic planes.
2. piezoelectric vibration component as claimed in claim 1, wherein, two side surfaces of described protuberance
Include four crystrallographic planes respectively.
3. piezoelectric vibration component as claimed in claim 1, wherein, four side surfaces of described protuberance
Include four crystrallographic planes respectively.
4. piezoelectric vibration component as claimed in claim 1, wherein, the through-thickness of described protuberance
A surface there is rectangular shape.
5. piezoelectric vibration component as claimed in claim 1, wherein, described four crystrallographic planes relative to
One surface of the through-thickness of described protuberance has different angles of inclination.
6. piezoelectric vibration component as claimed in claim 1, wherein, described vibration substrate is formed by quartz.
7. a piezoelectric vibration component, described piezoelectric vibration component includes:
Vibration substrate, including vibration section and the cincture portion thinner than described vibration section；
Vibrating electrode, is arranged on a surface of the thickness direction along described vibration substrate of described vibration section
With on another surface,
Wherein, described vibration section includes protuberance, each edge than described cincture portion in described protuberance
One surface of thickness direction and another surface are protruded,
At least one side surface of described protuberance includes four crystrallographic planes.
8. piezoelectric vibration component as claimed in claim 7, described piezoelectric vibration component also includes:
Termination electrode, is arranged on a surface and another surface of the through-thickness in described cincture portion；
Connect electrode, described termination electrode and described vibrating electrode are connected to each other.
9. piezoelectric vibration component as claimed in claim 8, wherein, described connection electrode is arranged on described
On at least one side surface of protuberance.
10. piezoelectric vibration component as claimed in claim 7, wherein, described protuberance described at least
One side surface includes the mineral crystal plane of quartz crystal and has and the inclination of described mineral crystal plane
The crystrallographic plane at the angle of inclination that angle is different.
11. 1 kinds of methods manufacturing piezoelectric vibration component, described method includes:
Prepare wafer；
The surface of the thickness direction along described wafer and another surface of described wafer are formed against corrosion
Pattern；
Described wafer is etched for the first time, each formation to form protuberance, in described protuberance
On the surface of through-thickness and another surface of described wafer, described protuberance along thickness side
To a surface there is rectangular shape；
Described corrosion-resisting pattern is removed from described wafer；
The wafer second time removing described corrosion-resisting pattern is etched, to allow described protuberance extremely
A few side surface includes two or more crystrallographic planes；
A surface of described protuberance and another surface are formed vibrating electrode；
The wafer third time being formed with described vibrating electrode on which is etched, to allow described protuberance
At least one side surface include four crystrallographic planes；
Preparation vibration substrate.
12. methods as claimed in claim 11, wherein, described four crystrallographic planes are prominent relative to described
One surface of the through-thickness going out portion has different angles of inclination.
13. methods as claimed in claim 11, wherein, at least one side table described of described protuberance
Face include the mineral crystal plane of quartz crystal with have different from the angle of inclination of described mineral crystal plane
The crystrallographic plane at angle of inclination.
14. 1 kinds of piezoelectric vibrators, described piezoelectric vibrator includes:
Piezoelectric vibration component, including: vibration substrate, including vibration section and the cincture thinner than described vibration section
Portion；Vibrating electrode, is arranged on a surface of the thickness direction along described vibration substrate of described vibration section
With on another surface, described vibration section includes protuberance, each than described cincture portion in described protuberance
A surface of through-thickness and another surface protrude, at least one side surface tool of described protuberance
There are four crystrallographic planes；
Upper casing and lower casing, described piezoelectric vibration component is contained in described upper casing and described lower casing；
Connect electrode, be arranged on the upper surface of described lower casing and be electrically connected to include described vibrating electrode
Electrode portion；
Outer electrode, is arranged on the lower surface of described lower casing and is electrically connected to described connection electrode.
15. piezoelectric vibrators as claimed in claim 14, described piezoelectric vibrator also includes being arranged on institute
State electrode portion and the described connecting portion being connected between electrode, so that described electrode portion is electrically connected to described connection
Electrode.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0122946 | 2014-09-16 | ||
| KR1020140122946A KR20160032600A (en) | 2014-09-16 | 2014-09-16 | Piezoelectric vibration piece, method of fabricating piezoelectric vibration piece, and piezoelectric device |
| KR10-2014-0129987 | 2014-09-29 | ||
| KR1020140129987A KR20160037459A (en) | 2014-09-29 | 2014-09-29 | Piezoelectric vibration piece, method of fabricating piezoelectric vibration piece, and piezoelectric device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106160695A true CN106160695A (en) | 2016-11-23 |
| CN106160695B CN106160695B (en) | 2019-07-26 |
Family
ID=57339081
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510138152.2A Expired - Fee Related CN106160694B (en) | 2014-09-16 | 2015-03-26 | Piezoelectric vibration component, the method and piezoelectric vibrator for manufacturing piezoelectric vibration component |
| CN201510138361.7A Expired - Fee Related CN106160695B (en) | 2014-09-16 | 2015-03-26 | Piezoelectric vibration component, the method and piezoelectric vibrator for manufacturing piezoelectric vibration component |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510138152.2A Expired - Fee Related CN106160694B (en) | 2014-09-16 | 2015-03-26 | Piezoelectric vibration component, the method and piezoelectric vibrator for manufacturing piezoelectric vibration component |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN106160694B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI824438B (en) * | 2021-03-17 | 2023-12-01 | 日商大真空股份有限公司 | Crystal oscillator and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1238245A (en) * | 1998-06-09 | 1999-12-15 | 松下电器产业株式会社 | Piezoelectric vibrator |
| US6362561B1 (en) * | 1999-03-18 | 2002-03-26 | Murata Manufacturing Co., Ltd | Piezoelectric vibration device and piezoelectric resonance component |
| JP2010109526A (en) * | 2008-10-29 | 2010-05-13 | Epson Toyocom Corp | Crystal vibration piece, and method of manufacturing the same |
| CN102957395A (en) * | 2011-08-17 | 2013-03-06 | 日本电波工业株式会社 | Mesa-type quartz-crystal vibrating piece and quartz crystal device |
| CN103326690A (en) * | 2012-03-19 | 2013-09-25 | 精工爱普生株式会社 | Resonator element, resonator, electronic device and electronic apparatus |
-
2015
- 2015-03-26 CN CN201510138152.2A patent/CN106160694B/en not_active Expired - Fee Related
- 2015-03-26 CN CN201510138361.7A patent/CN106160695B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1238245A (en) * | 1998-06-09 | 1999-12-15 | 松下电器产业株式会社 | Piezoelectric vibrator |
| US6362561B1 (en) * | 1999-03-18 | 2002-03-26 | Murata Manufacturing Co., Ltd | Piezoelectric vibration device and piezoelectric resonance component |
| JP2010109526A (en) * | 2008-10-29 | 2010-05-13 | Epson Toyocom Corp | Crystal vibration piece, and method of manufacturing the same |
| CN102957395A (en) * | 2011-08-17 | 2013-03-06 | 日本电波工业株式会社 | Mesa-type quartz-crystal vibrating piece and quartz crystal device |
| CN103326690A (en) * | 2012-03-19 | 2013-09-25 | 精工爱普生株式会社 | Resonator element, resonator, electronic device and electronic apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI824438B (en) * | 2021-03-17 | 2023-12-01 | 日商大真空股份有限公司 | Crystal oscillator and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106160694B (en) | 2019-07-30 |
| CN106160694A (en) | 2016-11-23 |
| CN106160695B (en) | 2019-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6713314B2 (en) | Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator | |
| CN102362430A (en) | Package member assembly, method for manufacturing package member assembly, package member, and method for manufacturing piezoelectric vibration device using package member | |
| US20100072860A1 (en) | Piezoelectric microspeaker and method of fabricating the same | |
| JPWO2017090380A1 (en) | Resonant device and manufacturing method thereof | |
| JP2018504793A (en) | Quartz resonator having a circular wafer structure and manufacturing method thereof | |
| US20180139542A1 (en) | Piezoelectric speaker and method for forming the same | |
| US10516382B2 (en) | Piezoelectric vibration member, method of manufacturing the same, and piezoelectric vibrator | |
| KR101532115B1 (en) | Piezo vibrator and method for manufacturing the same | |
| JP2010081415A (en) | Piezoelectric device and method of manufacturing the same | |
| JP2008113238A (en) | Piezoelectric vibrator, and manufacturing method and electronic components of piezoelectric vibrator | |
| JP4352052B2 (en) | Microelectromechanical system (MEMS) device and system and method for producing the same | |
| CN104811881B (en) | Piezoelectric speaker and forming method thereof | |
| CN106160695A (en) | Piezoelectric vibration component, the method manufacturing piezoelectric vibration component and piezoelectric vibrator | |
| CN106505964B (en) | Piezoelectric oscillator and method for manufacturing the same | |
| JP5245064B2 (en) | ULTRASONIC VIBRATION ELEMENT, ITS MANUFACTURING METHOD, AND ULTRASONIC CLEANING DEVICE | |
| KR102556333B1 (en) | Surface acoustic wave wafer level package and manufacturing method of PCB therefor | |
| JP2009225219A (en) | Piezoelectric device and method for manufacturing the same | |
| JP2017528012A (en) | Piezoelectric quartz chip with single-sided convex structure | |
| JP2013081022A (en) | Crystal oscillator and manufacturing method of the same | |
| JP2017060054A (en) | Piezoelectric vibration piece and piezoelectric vibrator | |
| KR20160037459A (en) | Piezoelectric vibration piece, method of fabricating piezoelectric vibration piece, and piezoelectric device | |
| KR100518828B1 (en) | MEMS structure for metal interconnection and fabrication method thereof | |
| JP2011139532A (en) | Method of manufacturing crystal wafer | |
| JP6026841B2 (en) | Method for manufacturing piezoelectric wafer and acoustic wave device | |
| JP2007158458A (en) | Lame-mode quartz crystal resonator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190726 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |