CN106160695B - Piezoelectric vibration component, the method and piezoelectric vibrator for manufacturing piezoelectric vibration component - Google Patents
Piezoelectric vibration component, the method and piezoelectric vibrator for manufacturing piezoelectric vibration component Download PDFInfo
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- CN106160695B CN106160695B CN201510138361.7A CN201510138361A CN106160695B CN 106160695 B CN106160695 B CN 106160695B CN 201510138361 A CN201510138361 A CN 201510138361A CN 106160695 B CN106160695 B CN 106160695B
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Abstract
The present invention provides the methods and piezoelectric vibrator of a kind of piezoelectric vibration component, manufacture piezoelectric vibration component, the piezoelectric vibration component includes: vibration substrate, with protruding portion, each of described protruding portion is arranged on a surface and another surface for the thickness direction along the vibration substrate for the vibration substrate；Vibrating electrode is arranged on the protruding portion, wherein at least one side surface of the protruding portion includes four crystrallographic planes.
Description
This application claims be submitted on September 16th, 2014 No. 10-2014-0122946 of Korean Intellectual Property Office and
The priority of the 10-2014-0129987 South Korea patent application of Korean Intellectual Property Office is submitted within 29th in September in 2014
And equity, this application disclosure are contained in this by reference.
Technical field
This disclosure relates to a kind of piezoelectric vibration component, manufacture the method and piezoelectric vibrator of the piezoelectric vibration component.
Background technique
Piezoelectric vibrator is to vibrate the equipment for generating the vibration with specific frequency by piezoelectric vibration component, wherein
Piezoelectric vibration component due to when applying voltage to piezoelectric vibration component in piezoelectric vibration component the phenomenon of piezoelectricity that occurs and vibrate.
Since piezoelectric vibrator has stable vibration frequency, in the multiple cores component that reference level signal is provided
And such device is used in the oscillating circuit of computer or communication device.
Include: vibration substrate by the piezoelectric vibration component of Crystallization, uses crystal as base material；Electrode, setting
Vibration substrate on, wherein vibration substrate can be as needed physical characteristic and have various shape.
When in thickness-shear vibration model piezoelectric vibration component be formed so that vibration substrate thickness from vibration base
When the end of the central portion of plate towards vibration substrate is gradually reduced, the amount of resistant of vibration displacement increases in end, so as to improve
Vibrational energy is trapped in the effect of the central portion of piezoelectric vibration component and can improve frequency characteristic (for example, CI value, Q value etc.).It can be real
Existing vibrational energy falls into the example packet of the shape of the piezoelectric vibration component of effect (vibration energy trapping effect)
The curved surface for including convex is formed as space shape between the convex of main surface, flat and thick central portion and end edge
As the slope surface shape of inclined surface, the platform shape that central portion is flat and thick and around central portion part is thin etc..
Quickly change in netted piezoelectric vibration component in the thickness of thick flat central portion and the slim thickness around portion
In the case where change, may reduce can fall into effect and may reduce electrode connectivity.Therefore, it has been required to solve these to ask
The piezoelectric vibration component of topic.
[existing technical literature]
(patent document 1) 2010-109526 Japanese Patent Laid-Open
Summary of the invention
The method and piezoelectricity vibration that the one side of the disclosure can provide a kind of piezoelectric vibration component, manufacture the piezoelectric vibration component
Dynamic device.
According to the one side of the disclosure, a kind of piezoelectric vibration component includes: vibration substrate, has protruding portion, the protrusion
Each of portion is arranged on a surface and another surface for the through-thickness of the vibration substrate；Vibrating electrode, wherein
At least one side surface of the protruding portion include four crystrallographic planes, so as to fall into effect it is excellent and improve electrode connection
Property.
According to another aspect of the present disclosure, a kind of method for manufacturing piezoelectric vibration component is provided, which comprises in crystalline substance
On piece forms corrosion-resisting pattern；Chip is etched for the first time, to form protruding portion；To the chip second for having removed corrosion-resisting pattern
It is secondary to be etched；Vibrating electrode is formed over the projections；Chip third time is etched, to allow one of the protruding portion
Or more side surface include four crystrallographic planes, so as to improve effect and electrode connectivity can be fallen into.
According to another aspect of the present disclosure, a kind of piezoelectric vibrator includes: piezoelectric vibration component, wherein the one of protruding portion
A or more side surface includes four crystrallographic planes；Upper casing and lower casing, the piezoelectric vibration component be contained in the upper casing and
In the lower casing；Connection electrode is connected to the electrode portion of the piezoelectric vibration component；External electrode.
Detailed description of the invention
By the detailed description carried out below in conjunction with the accompanying drawings, above and other aspect, the features and advantages of the disclosure will
It is more clearly understood, in which:
Fig. 1 is the perspective view of piezoelectric vibration component according to the exemplary embodiment of the disclosure；
Fig. 2 is the sectional view of the piezoelectric vibration component intercepted along the A-A ' line of Fig. 1；
Fig. 3 is the section in the region for being provided with connection electrode of the piezoelectric vibration component intercepted along the B-B ' line of Fig. 1
Figure；
Fig. 4 is to show manufacture according to the process of the method for the piezoelectric vibration component of the another exemplary embodiment of the disclosure
Figure；
Fig. 5 to Fig. 8 is cutting for the piezoelectric vibration component in some operations shown in the operation of manufacture piezoelectric vibration component
Face figure；
Fig. 9 is the decomposition perspective view of piezoelectric vibrator according to the exemplary embodiment of the disclosure；
Figure 10 is the sectional view of the piezoelectric vibrator intercepted along the C-C ' line of Fig. 9.
Specific embodiment
Describe the exemplary embodiment of the disclosure in detail now with reference to attached drawing.
However, the disclosure can be illustrated with many different forms and should not be construed as limited to be set forth in this
Specific embodiment.More precisely, these embodiments are provided so that this disclosure will be thorough and complete, and by the disclosure
Range is fully conveyed to those skilled in the art.
In the accompanying drawings, for the sake of clarity, the shape and size of element can be exaggerated, and identical label will be used for always
Indicate the same or similar element.
Piezoelectric vibration component
Hereinafter, piezoelectric vibration component according to the exemplary embodiment of the disclosure will be described.
Fig. 1 is the perspective view of piezoelectric vibration component 100 according to the exemplary embodiment of the disclosure.
Fig. 2 is the sectional view of the piezoelectric vibration component 100 intercepted along the A-A ' line of Fig. 1.
Referring to Figures 1 and 2, piezoelectric vibration component 100 according to the exemplary embodiment of the disclosure may include vibration substrate
110 and be arranged in vibration substrate on electrode portion 120.
In the attached drawing of this specification, the thickness direction of the direction DR1 finger pressure electric oscillation component 100, the direction DR2 refer to perpendicular to
One direction in the direction DR1, the direction DR3 refers to the direction perpendicular to the direction DR1 and the direction DR2.
Vibrate substrate 110 can include: vibration section 112 has relatively thick thickness；Around portion 111, have than vibration section
The thin thickness of thickness, wherein vibration section 112 may include a surface with the through-thickness than circular portion 111 (that is, upper table
Face) and another surface (that is, lower surface) protrusion the corresponding protruding portion 112a and 112b in region.
For example, protruding portion can include: the first protruding portion 112a, a surface than the through-thickness in circular portion 111 are convex
Out；Second protruding portion 112b, than another surface protrusion of the through-thickness in circular portion 111.
It may include crystal including the vibration substrate 110 in piezoelectric vibration component 100, as its material, wherein crystal is used
Make mechanical vibration machine.
According to an exemplary embodiment of the present disclosure, crystal can be quartz.
Electrode portion 120 can include: one of the through-thickness of vibration section 112 is arranged in vibrating electrode 121a and 121b
On surface (that is, upper surface) and another surface (that is, lower surface)；Termination electrode 123a and 123b are arranged in around portion 111 along thickness
On at least one of one surface and another surface in degree direction；Connection electrode 122a and 122b, by vibrating electrode and end electricity
Pole is connected to each other.
First vibrating electrode 121a may be provided on a surface of the through-thickness of vibration section 112 and connect by first
Receiving electrode 122a is connected to the first termination electrode 123a, the second vibrating electrode 121b may be provided at vibration section 112 with vibration section 112
The opposite another surface in a surface on and the second termination electrode 123b is connected to by the second connection electrode 122b.
First termination electrode 123a can be extended to from a surface of the through-thickness around portion 111 around a side in portion
Surface and another surface for extending to the through-thickness around portion, the second termination electrode 123b can be from circular portions 111 along thickness
Another surface in direction extends to a side surface around portion and extends to a surface of the through-thickness around portion.So
And the present disclosure is not limited thereto.
According to an exemplary embodiment of the present disclosure, when watching in the plane, than the one of the through-thickness in circular portion 111
One surface STa and STb of the through-thickness of the protruding portion 112a and 112b of a surface and another surface protrusion can be generally
With rectangular shape, although since the etching in the corner of surface STa and STb causes surface STa and STb not to have complete rectangle
Shape, but the surface STa and STb of protruding portion described below refer to the through-thickness than circular portion 111 a surface and
One surface of the through-thickness of another surface protruding portion outstanding.
In an exemplary embodiment of the disclosure, side surface 1a, 1b, 2a, 2b, 3a, 3b, 4a and 4b of protruding portion, which will refer to, to dash forward
A surface and another surface for the through-thickness of every side of the surface STa and STb in portion and circular portion 111 is connected to each other out
Surface, one or more side surfaces of protruding portion may include four crystrallographic planes.
Each side surface of protruding portion 112a and 112b can have inclined shape, and the top of protruding portion 112a and 112b can
With the narrow width of the width than protruding portion 112a and the lower part of 112b.
According to an exemplary embodiment of the present disclosure, the first protruding portion 112a may include four side surfaces 1a, 2a, 3a and 4a,
Second protruding portion 112b may include four side surfaces 1b, 2b, 3b and 4b, the first protruding portion and the second protruding portion it is one or more
A side surface can have there are four crystrallographic plane.
First side surface 1a and 1b of protruding portion can be opposite with the third side surface 3a and 3b along the direction DR2 of protruding portion,
Second side surface 2a and 2b of protruding portion can be opposite with the 4th the side surface 4a and 4b along the direction DR3 of protruding portion.
For example, first is prominent as shown in Fig. 2, Fig. 2 is the sectional view of the piezoelectric vibration component intercepted along the A-A ' line of Fig. 1
The first side surface 1a of portion 112a may include four crystrallographic planes f1, f2, f3 and f4, the third side surface of the first protruding portion 112a
3a may include four crystrallographic planes f5, f6, f7 and f8.
In addition, second is prominent as shown in Fig. 2, Fig. 2 is the sectional view of the piezoelectric vibration component intercepted along the A-A ' line of Fig. 1
The first side surface 1b of portion 112b may include four crystrallographic planes f13, f14, f15 and f16, the third side of the second protruding portion 112b
Surface 3b may include four crystrallographic planes f9, f10, f11 and f12.
It the first side of the first side surface 1a for being connected to the first protruding portion 112a of the surface STa of first protruding portion can be with
The third side of the third side surface 3a along the direction DR2 for being connected to the first protruding portion 112a of the surface STa of one protruding portion is opposite.
In addition, the first side of the first side surface 1b for being connected to the second protruding portion 112b of the surface STb of the second protruding portion can be with second
The third side of the third side surface 3b along the direction DR2 for being connected to the second protruding portion 112b of the surface STb of protruding portion is opposite.
In addition, although it is not shown, second side of second side of the first protruding portion and the 4th side and the second protruding portion
Four crystrallographic planes can be respectively included with the 4th side.
According to an exemplary embodiment of the present disclosure, the first protruding portion 112a's and the second protruding portion 112b is one or more
Side surface may include the mineral crystal plane of quartz crystal and with the inclination angle different from the tilt angle of mineral crystal plane
The crystrallographic plane of degree.
For example, the first protruding portion 112a the first side surface 1a and third side surface 3a and the second protruding portion 112b
One side surface 1b and third side surface 3b may include the mineral crystal plane of quartz crystal and with the natural crystalline with quartz crystal
The crystrallographic plane of the different tilt angle of the tilt angle of body plane.
As depicted in figs. 1 and 2, each side surface of the first protruding portion 112a and the second protruding portion 112b can have that there are four brilliant
Body plane, to mitigate the step that the thickness difference due to vibration section 112 and between portion 111 is formed, so as to improve for logical
The sunken effect of energy that the frequency of piezoelectric effect generates is crossed, and then reduces energy loss.
Fig. 3 is the section in the region for being provided with connection electrode of the piezoelectric vibration component intercepted along the B-B ' line of Fig. 1
Figure.
It can by vibrating electrode 121a and 121b and termination electrode 123a and 123b the connection electrode 122a and 122b being connected to each other
It is arranged on one or more side surfaces of protruding portion 112a and 112b.
For example, the first connection electrode 122a may be provided on the first side surface 1a of the first protruding portion 112a, such as Fig. 3 institute
Show, although it is not shown, the second connection electrode 122b may be provided on the third side surface 3b of the second protruding portion 112b.
According to an exemplary embodiment of the present disclosure, due to being provided with the side of the protruding portion 112a and 112b of connection electrode
Surface has four crystrallographic planes for mitigating vibration section 112 and the step between portion 111, therefore can reduce due to packet
The electrode that connection electrode disconnects caused by including the quick change of the tilt angle of the crystrallographic plane in the side surface of protruding portion
The generation of open-circuit fault.
According to an exemplary embodiment of the present disclosure, the side surface of protruding portion 112a and 112b includes four crystrallographic planes, from
And vibrate the shape phase for the vibration substrate that substrate can have in the case where being convexly formed with vibration section by mechanical polishing method
Similar shape.For example, as shown in Figures 2 and 3, in vibration substrate according to the exemplary embodiment of the disclosure, although vibration
Dynamic portion and there is the step formed between around portion, but since to be formed as step multistage for thickness difference.Therefore,
Vibration substrate has the similar shape of the vibration shape of substrate being convexly formed with its main surface by mechanical polishing, thus
It is excellent than the sunken effect of energy of the vibration substrate according to prior art with platform shape that energy falls into effect.
Fig. 4 is to show manufacture according to the process of the method for the piezoelectric vibration component of the another exemplary embodiment of the disclosure
Figure；Fig. 5 to Fig. 8 is the sectional view of the piezoelectric vibration component in some operations shown in the operation of manufacture piezoelectric vibration component.
Fig. 5 to Fig. 8 is the section phase with the piezoelectric vibration component of A-A ' the line interception along Fig. 1 shown in different operations
The sectional view in corresponding region.
Referring to Fig. 4, the method for manufacturing piezoelectric vibration component according to the present exemplary embodiment can include: prepare chip
(S1)；Corrosion-resisting pattern (S2) is formed on a surface and another surface for the through-thickness of chip；To chip for the first time into
Row etching, to form protruding portion (S3)；It removes corrosion-resisting pattern (S4)；Chip is etched for the second time (S5)；The shape on chip
At vibrating electrode (S6)；(S7) is etched to chip third time.
In the step of preparing chip (S1), single wafer corresponding with the size of a vibration substrate can be used, though
It is so not shown, but the wafer assemblies for being formed with multiple chips corresponding with the size of a vibration substrate can be used.
By the coarse quartz to rectangle or circular shape can process and then be cut into the coarse quartz
Predetermined thickness and form chip.However, chip is not limited to rectangle or circular shape, and there can be various shape (for example, more
Side shape shape).In addition, processing of surface polishing can be carried out to the finished chip of rectangle or circular shape, to reduce chip
Thickness.
Although chip can be used to form multiple piezoelectric vibration components, will describe to be formed below in an illustrative manner single
The case where piezoelectric vibration component, to facilitate the understanding of the disclosure.
As shown in figure 5, the corrosion-resisting pattern 320 for being used to form protruding portion may be formed at the one of the through-thickness of chip 310
On a surface and another surface (S2).Corrosion-resisting pattern 320 can the shape and size based on protruding portion and be suitably disposed at chip
On.
Next, as shown in fig. 6, can be etched to 310 first time of chip for being provided with corrosion-resisting pattern 320, with
Protruding portion (S3) is formed on a surface and another surface for the through-thickness of chip, the one of the through-thickness of protruding portion
A surface has rectangular shape.
It can be and the chip 310 for being formed with corrosion-resisting pattern 320 thereon be immersed in the method for chemially etching in etchant
Chip 310 is etched.
One or more side surfaces of protruding portion can have a mineral crystal plane by current etch process.
It, only just can the in the state of being provided with corrosion-resisting pattern in general, in the case where forming chip by chemical etching
It is once etched, to form protruding portion.In this case, as shown in fig. 6, vibration section and the step injustice between portion
It is slow, and may be steep.
In the case where vibration section and the not gentle step between portion, can fall into efficiency may be low, and may increase
To occur a possibility that open-circuit fault in the electrodes greatly.
However, according to an exemplary embodiment of the present disclosure, after removing the corrosion-resisting pattern on etched chip 310
(S4), (S5) can be etched to second of chip 310 for being formed without individual corrosion-resisting pattern state.Therefore, such as Fig. 7 institute
Show, each side surface of protruding portion 112a and 112b there can be two or more crystrallographic planes, to mitigate vibration section 112 and ring
Step between portion 111.
In addition, according to an exemplary embodiment of the present disclosure, being formed in second of etching in the electrode portion including vibrating electrode
After on the chip crossed (S6), the chip third time for being formed with electrode portion thereon can be etched, to allow protruding portion 112a
One or more side surfaces with 112b include four crystrallographic planes.
For example, each of four side surfaces of protruding portion 112a and 112b may include four crystrallographic planes.
Chip can be etched for the second time by method identical with the method for chip etched for the first time and third time into
Row etching.For example, can be etched for the second time by the way that chip to be immersed in etchant to chip and be etched for the third time.
According to an exemplary embodiment of the present disclosure, manufacture piezoelectric vibration component method may additionally include by chip again
Secondary be etched and form electrode portion on the vibration substrate 110 that is formed, as shown in Figure 8.
Electrode portion may include vibrating electrode, termination electrode and connection electrode and can be by being formed on the vibration of protruding portion
Electrocondution slurry is printed on substrate and is formed.
Electrode portion can have vibrating electrode 121a and 121b on a surface of the through-thickness for being formed in protruding portion.
Due to the detailed description of shape and retouching for the upper surface of piezoelectric vibration component 100 of electrode portion and every side of protruding portion
Repetition is stated, therefore descriptions thereof will be omitted below.
Piezoelectric vibrator
Next, by description according to the piezoelectric vibrator of the another exemplary embodiment of the disclosure.
Fig. 9 is the decomposition perspective view of piezoelectric vibrator 200 according to the exemplary embodiment of the disclosure；Figure 10 is along Fig. 9
C-C ' line interception piezoelectric vibrator 200 sectional view.
Referring to Fig. 9 and Figure 10, piezoelectric vibrator 200 according to the exemplary embodiment of the disclosure can include: have vibration
Substrate 110 and the piezoelectric vibration component 100 of electrode portion 120, lower casing 210, upper casing 220, connection electrode 211a and 211b and outer
Portion electrode 212a and 212b.
It can be with including the piezoelectric vibration component 100 in piezoelectric vibrator 200 according to the exemplary embodiment of the disclosure
It is one in above-mentioned piezoelectric vibration component 100.It therefore, will be by referring to figs. 1 to Fig. 3 for the description of piezoelectric vibration component 100
The description of offer replaces, and the detailed description to piezoelectric vibration component 100 will be omitted, to avoid repeated description.
Lower casing 210 and upper casing 220 can be bonded to each other, to form a shell for being formed with inner space, piezoelectric vibration
Component 100 may be provided to be bonded to each other in the inner space to be formed by upper casing and lower casing.
Piezoelectric vibration component 100 may be provided in lower casing 210 and upper casing 220, to prevent external drive.
Connection electrode may include being arranged to the first connection electrode 211a separated from each other and the second connection electrode 211b, outside
Portion's electrode may include being arranged to the first external electrode 212a separated from each other and the second external electrode 212b.
On the upper surface for the inside that first connection electrode 211a and the second connection electrode 211b may be provided at lower casing 210 and divide
It is not connected to the first termination electrode 123a and the second termination electrode 123b of piezoelectric vibration component 100.
On the lower surface for the outside that first external electrode 212a and the second external electrode 212b may be provided at lower casing 210 and divide
It is not connected to the first connection electrode 211a and the second connection electrode 211b.First external electrode 212a and the second external electrode 212b
It can connect each other and via the electrode 213a for penetrating lower casing 210 with the first connection electrode 211a and the second connection electrode 211b
It connects, but not limited to this.
First external electrode 212a and the second external electrode 212b can be used as the input electrode and output of piezoelectric vibrator 200
Electrode.As described above, voltage can be applied to when applying voltage to the first external electrode 212a and the second external electrode 212b
The the first vibrating electrode 121a and the second vibrating electrode 121b of piezoelectric vibration component 100, so that piezoelectric vibration component 100 can shake
It is dynamic.
The the first termination electrode 123a and the second termination electrode 123b of piezoelectric vibration component 100 and the first connection electrode 211a and
Two connection electrode 211b can be connected to each other by solder flux or electrically-conducting adhesive.Solder flux or electrically-conducting adhesive can become setting and exist
The the first termination electrode 123a and the second termination electrode 123b of piezoelectric vibration component 100 connect electricity with the first connection electrode 211a and second
Interconnecting piece 230 between the 211b of pole, by the first termination electrode 123a and the second termination electrode 123b and the first connection electrode 211a and
Second connection electrode 211b is electrically connected to each other.
Interconnecting piece 230 may also include metal solder flux.The connection of first connection electrode 211a of piezoelectric vibration component 100 and second
Electrode 211b and the first termination electrode 123a and the second termination electrode 123b can be connected to each other as follows: in the first connection electrode
Metal solder flux is set on 211a and the second connection electrode 211b；First termination electrode 123a and the second termination electrode 123b is arranged in gold
Belong on solder flux；Then reflux technique is executed.
In addition, interconnecting piece 230 is it can be formed as follows: in the first connection electrode 211a and the second connection electrode 211b
Nickel (Ni), golden (Au), kovar alloy (kovar) etc. are set between the first termination electrode 123a and the second termination electrode 123b and tied
Arc welding or electron beam welding are executed in conjunction portion (for example, nickel (Ni), golden (Au), kovar alloy (kovar) etc.)；Or with high-temperature fusion
Golden (Au)-mercury (Hg) alloy, but not limited to this.
Optionally, interconnecting piece 230 may include the electrically-conducting adhesive that may include any one of resin or organic material.
Using electrically-conducting adhesive comprising resin or organic material, it is possible to increase piezoelectric vibration component 100 with connect electricity
Air-tightness between pole 211a and 211b, and the generation of crackle can be prevented.
Upper casing 220 and lower casing 210 may include identical material, for example, insulating resin etc., but not limited to this.
As described above, according to an exemplary embodiment of the present disclosure, it is possible to provide there is excellent energy to fall into effect and connected with electrode
Piezoelectric vibration component that property is improved, the method and piezoelectric vibrator for manufacturing the piezoelectric vibration component.
Although exemplary embodiments have been shown and described above, will be apparent for those skilled in the art
It is that, in the case where not departing from the scope of the present invention being defined by the claims, can modify to it and modification.
Claims (13)
1. a kind of piezoelectric vibration component, the piezoelectric vibration component include:
Vibrate substrate, have protruding portion, each of described protruding portion be arranged in it is described vibration substrate along the vibration substrate
Thickness direction a surface and another surface on；
Vibrating electrode is arranged on the protruding portion,
Wherein, at least one side surface of the protruding portion includes four crystrallographic planes,
Wherein, four crystrallographic planes have relative to the extension plane on a surface of the through-thickness of the protruding portion
Different tilt angles at an acute angle, and each crystrallographic plane in four crystrallographic planes and four crystrallographic planes
In at least one of other crystrallographic planes directly contact.
2. piezoelectric vibration component as described in claim 1, wherein two side surfaces of the protruding portion respectively include four crystalline substances
Body plane.
3. piezoelectric vibration component as described in claim 1, wherein four side surfaces of the protruding portion respectively include four crystalline substances
Body plane.
4. piezoelectric vibration component as described in claim 1, wherein a surface of the through-thickness of the protruding portion has
Rectangular shape.
5. piezoelectric vibration component as described in claim 1, wherein the vibration substrate is formed by quartz.
6. a kind of piezoelectric vibration component, the piezoelectric vibration component include:
Substrate is vibrated, including vibration section and the circular portion thinner than the vibration section；
The surface and another surface of the thickness direction along the vibration substrate of the vibration section is arranged in vibrating electrode
On,
Wherein, the vibration section includes protruding portion, one of each of described protruding portion than the through-thickness around portion
A surface and another surface protrusion,
At least one side surface of the protruding portion includes four crystrallographic planes,
Wherein, four crystrallographic planes have relative to the extension plane on a surface of the through-thickness of the protruding portion
Different tilt angles at an acute angle, and each crystrallographic plane in four crystrallographic planes and four crystrallographic planes
In at least one of other crystrallographic planes directly contact.
7. piezoelectric vibration component as claimed in claim 6, the piezoelectric vibration component further include:
Termination electrode is arranged on the surface and another surface of the through-thickness around portion；
The termination electrode and the vibrating electrode are connected to each other by connection electrode.
8. piezoelectric vibration component as claimed in claim 7, wherein at least the one of the protruding portion is arranged in the connection electrode
On a side surface.
9. piezoelectric vibration component as claimed in claim 6, wherein at least one described side surface of the protruding portion includes stone
The mineral crystal plane of English crystal and crystal with the tilt angle different from the tilt angle of the mineral crystal plane are flat
Face.
10. a kind of method for manufacturing piezoelectric vibration component, which comprises
Prepare chip；
Corrosion-resisting pattern is formed on a surface and another surface for the thickness direction along the chip of the chip；
The chip is etched for the first time, to form protruding portion, each of described protruding portion is formed in the chip
On one surface of through-thickness and another surface, a surface of the through-thickness of the protruding portion has rectangle shape
Shape；
The corrosion-resisting pattern is removed from the chip；
The chip for having removed the corrosion-resisting pattern is etched for the second time, to allow at least one side surface of the protruding portion
Including two or more crystrallographic planes；
Vibrating electrode is formed on a surface of the protruding portion and another surface；
The chip third time for being formed with the vibrating electrode thereon is etched, to allow at least one side of the protruding portion
Surface includes four crystrallographic planes；
Preparation vibration substrate,
Wherein, four crystrallographic planes have relative to the extension plane on a surface of the through-thickness of the protruding portion
Different tilt angles at an acute angle, and each crystrallographic plane in four crystrallographic planes and four crystrallographic planes
In at least one of other crystrallographic planes directly contact.
11. method as claimed in claim 10, wherein at least one described side surface of the protruding portion includes quartz crystal
Mineral crystal plane and crystrallographic plane with the tilt angle different from the tilt angle of the mineral crystal plane.
12. a kind of piezoelectric vibrator, the piezoelectric vibrator include:
Piezoelectric vibration component, comprising: vibration substrate, including vibration section and the circular portion thinner than the vibration section；Vibrating electrode, if
It sets on the surface and another surface of the thickness direction along the vibration substrate of the vibration section, the vibration section includes
Protruding portion, each of described protruding portion are protruded than a surface of the through-thickness around portion and another surface, institute
At least one side surface tool of protruding portion is stated there are four crystrallographic plane；
Upper casing and lower casing, the piezoelectric vibration component are contained in the upper casing and the lower casing；
Connection electrode is arranged on the upper surface of the lower casing and is electrically connected to the electrode portion including the vibrating electrode；
External electrode is arranged on the lower surface of the lower casing and is electrically connected to the connection electrode,
Wherein, four crystrallographic planes have relative to the extension plane on a surface of the through-thickness of the protruding portion
Different tilt angles at an acute angle, and each crystrallographic plane in four crystrallographic planes and four crystrallographic planes
In at least one of other crystrallographic planes directly contact.
13. piezoelectric vibrator as claimed in claim 12, the piezoelectric vibrator further includes being arranged in the electrode portion and institute
The interconnecting piece between connection electrode is stated, the electrode portion is electrically connected to the connection electrode.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0122946 | 2014-09-16 | ||
| KR1020140122946A KR20160032600A (en) | 2014-09-16 | 2014-09-16 | Piezoelectric vibration piece, method of fabricating piezoelectric vibration piece, and piezoelectric device |
| KR1020140129987A KR20160037459A (en) | 2014-09-29 | 2014-09-29 | Piezoelectric vibration piece, method of fabricating piezoelectric vibration piece, and piezoelectric device |
| KR10-2014-0129987 | 2014-09-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106160695A CN106160695A (en) | 2016-11-23 |
| CN106160695B true CN106160695B (en) | 2019-07-26 |
Family
ID=57339081
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510138152.2A Expired - Fee Related CN106160694B (en) | 2014-09-16 | 2015-03-26 | Piezoelectric vibration component, the method and piezoelectric vibrator for manufacturing piezoelectric vibration component |
| CN201510138361.7A Expired - Fee Related CN106160695B (en) | 2014-09-16 | 2015-03-26 | Piezoelectric vibration component, the method and piezoelectric vibrator for manufacturing piezoelectric vibration component |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1238245A (en) * | 1998-06-09 | 1999-12-15 | 松下电器产业株式会社 | Piezoelectric vibrator |
| US6362561B1 (en) * | 1999-03-18 | 2002-03-26 | Murata Manufacturing Co., Ltd | Piezoelectric vibration device and piezoelectric resonance component |
| JP2010109526A (en) * | 2008-10-29 | 2010-05-13 | Epson Toyocom Corp | Crystal vibration piece, and method of manufacturing the same |
| CN102957395A (en) * | 2011-08-17 | 2013-03-06 | 日本电波工业株式会社 | Mesa-type quartz-crystal vibrating piece and quartz crystal device |
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| JP5943186B2 (en) * | 2012-03-19 | 2016-06-29 | セイコーエプソン株式会社 | Vibrating piece, vibrator, electronic device, and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1238245A (en) * | 1998-06-09 | 1999-12-15 | 松下电器产业株式会社 | Piezoelectric vibrator |
| US6362561B1 (en) * | 1999-03-18 | 2002-03-26 | Murata Manufacturing Co., Ltd | Piezoelectric vibration device and piezoelectric resonance component |
| JP2010109526A (en) * | 2008-10-29 | 2010-05-13 | Epson Toyocom Corp | Crystal vibration piece, and method of manufacturing the same |
| CN102957395A (en) * | 2011-08-17 | 2013-03-06 | 日本电波工业株式会社 | Mesa-type quartz-crystal vibrating piece and quartz crystal device |
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| CN106160694B (en) | 2019-07-30 |
| CN106160694A (en) | 2016-11-23 |
| CN106160695A (en) | 2016-11-23 |
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