CN106159545A - Attachment means and include the electronic installation of attachment means - Google Patents
Attachment means and include the electronic installation of attachment means Download PDFInfo
- Publication number
- CN106159545A CN106159545A CN201610308515.7A CN201610308515A CN106159545A CN 106159545 A CN106159545 A CN 106159545A CN 201610308515 A CN201610308515 A CN 201610308515A CN 106159545 A CN106159545 A CN 106159545A
- Authority
- CN
- China
- Prior art keywords
- attachment means
- shell
- sealing member
- circuit board
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5202—Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5216—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5219—Sealing means between coupling parts, e.g. interfacial seal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/58—Contacts spaced along longitudinal axis of engagement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/44—Means for preventing access to live contacts
- H01R13/443—Dummy plugs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/04—Connectors or connections adapted for particular applications for network, e.g. LAN connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/06—Connectors or connections adapted for particular applications for computer periphery
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/16—Connectors or connections adapted for particular applications for telephony
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Signal Processing (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention provides a kind of attachment means and include the electronic installation of this attachment means.This attachment means includes: shell, is introduced in first and be formed as second contacted with first therein including plug；Connecting hole, extends to the inside of shell from the first face；Opening, extends to second with the most partially exposed connecting hole from the first face；And sealing member, it is arranged on the outer surface of shell with around the region forming opening.When on the mould component being arranged on electronic installation, sealing member can form dust-proof and waterproof construction between the inner peripheral surface of mould component and the outer surface of shell.
Description
Technical field
The disclosure generally relates to electronic installation, more particularly, to the company of the connection provided with another device
Connection device, manufacture the method for this attachment means and include the electronic installation of this attachment means.
Background technology
Typically, electronic installation relate to according to program perform specific function device, such as electronic scheduler,
Portable multimedia transcriber, mobile communication terminal, flat board PC, image/sound device, desktop/
PC on knee or Vehicular navigation system and household electrical appliance.Such as, such electronic installation can export
The information being stored therein is as sound or image.Along with the integrated level of such electronic installation increases, and
And the radio communication of high-speed high capacity has caught on, recent various functions have been provided at single shifting
In mobile communication terminal.Such as, in addition to communication function, multiple functions such as amusement function (is such as played
Function), multimedia function (such as music/video representational role), for the communication of mobile banking etc. and peace
Global function, progress control function and electronic purse function, be also integrated in single electronic device.
The most popular use is integrated with various function and such as networks and be miniaturized the electricity being convenient for carrying
Sub-device, as mentioned above.Such as, user's carrying electronic devices and use this electronic installation.As above institute
State the electronic installation carried by user and can be exposed to various external environment condition.Such as, the operation of electronic installation
Environment can change according to every diurnal variation of weather or the external activity of user, and electronic installation can expose
The pollution that Yu Youshui or foreign body cause.
Summary of the invention
The disclosure is devoted to solve at least the above and shortcoming and provide at advantage as described below.
Although the different aspect of the disclosure provides one that electronic installation can be protected from polluting and as above
The change of described operating environment still allows for the structure that electronic installation is operated, and provides the one can be real
The now manufacture method of this structure.
The different aspect of the disclosure provides a kind of attachment means, this attachment means be prevented from water or foreign body from
The outside inside penetrating into electronic installation, and a kind of method manufacturing this attachment means is provided and includes this
The electronic installation of attachment means.
The different aspect of the disclosure provides a kind of can being miniaturized to provide dust-proof and water-proof function simultaneously
Attachment means, and a kind of method manufacturing this attachment means is provided and includes the electronics of this attachment means
Device.
Different aspect according to the disclosure, it is provided that a kind of attachment means, this attachment means includes: shell,
Including plug be introduced in therein first be formed as contacting with first second；Connecting hole,
The inside of shell is extended to from the first face；Opening, extends to second with at least at second from the first face
Upper part ground exposes connecting hole；And sealing member, it is arranged on the outer surface of shell with around forming opening
Region.
Accompanying drawing explanation
By following detailed description of the accompanying drawings, the above-mentioned and other aspects, features and advantages of the disclosure
Will be apparent from, in accompanying drawing:
Fig. 1 is the perspective view illustrating the attachment means according to embodiment of the present disclosure；
Fig. 2 is to be shown under the state that the attachment means according to embodiment of the present disclosure is decomposed partly
The perspective view of attachment means；
Fig. 3 is the perspective view illustrating the attachment means according to embodiment of the present disclosure, wherein attachment means
A part watched from other direction；
Fig. 4 is the perspective view illustrating the attachment means according to embodiment of the present disclosure, wherein attachment means
Watched from other direction；
Fig. 5 is the perspective view illustrating the attachment means according to embodiment of the present disclosure；
Fig. 6 is the plane graph illustrating the attachment means according to embodiment of the present disclosure；
Fig. 7 is the upward view illustrating the attachment means according to embodiment of the present disclosure；
Fig. 8 is to be shown under the state that the attachment means according to embodiment of the present disclosure is decomposed partly
The perspective view of attachment means；
Fig. 9 is the perspective view illustrating the attachment means according to embodiment of the present disclosure；
Figure 10 is the plane graph illustrating the attachment means according to embodiment of the present disclosure；
Figure 11 is the upward view illustrating the attachment means according to embodiment of the present disclosure；
Figure 12 is to be shown in the state that the attachment means according to embodiment of the present disclosure is decomposed partly
The perspective view of lower connecting device；
Figure 13 is the perspective view illustrating the attachment means according to embodiment of the present disclosure；
Figure 14 is the plane graph illustrating the attachment means according to embodiment of the present disclosure；
Figure 15 is the upward view illustrating the attachment means according to embodiment of the present disclosure；
Figure 16 is the rearview illustrating the attachment means according to embodiment of the present disclosure；
Figure 17 to 20 illustrates the manufacture work of a part for the attachment means according to embodiment of the present disclosure
Skill；
Figure 21 to 23 illustrates the formation work of the sealing member of the attachment means according to embodiment of the present disclosure
Skill；
Figure 24 is that a part for the shell being shown in the attachment means according to embodiment of the present disclosure is cut
The sectional view of the state lower connecting device fallen；
Figure 25 is the perspective illustrating the electronic installation including attachment means according to embodiment of the present disclosure
Figure；
Figure 26 is the saturating of a part for the mould component illustrating the electronic installation according to embodiment of the present disclosure
View；
Figure 27 illustrates according to embodiment of the present disclosure, is arranged on electronic installation in attachment means
The perspective view of the state lower connecting device on mould component；
Figure 28 illustrates according to embodiment of the present disclosure, the shape in plug is inserted into attachment means
The sectional view of plug under state；
Figure 29 illustrates according to embodiment of the present disclosure, the shape in plug is inserted into attachment means
The front view of plug under state；And
Figure 30 is flow chart, it is shown that according to the method for the manufacture attachment means of embodiment of the present disclosure.
Detailed description of the invention
Below, the different embodiments of the disclosure will be described with reference to the drawings.It will be appreciated, however, that do not have
Have and the disclosure is limited to concrete form disclosed herein, but, the disclosure should be construed to cover these public affairs
Different changes, equivalent and/or the replacement of the embodiment opened.When describing accompanying drawing, similar accompanying drawing mark
Note may be used for indicating similar element.
In the disclosure, statement " A or B ", " at least one in A and/or B " or " A and/or
One or more in B " likely combining of the project listed can be included.Such as, statement " A
Or B ", " at least one of A and B " or " at least one of A or B " relate to all situations below:
(1) include at least one A, (2) include at least one B or (3) include at least one A and at least one
B both.
In the different embodiments of the disclosure use statement " first ", " second ", " described first " or
" described second " can modify different elements, unrelated with order and/or importance, and is not intended to corresponding
Element.Such as, first user device and the second user's set relate to different user's sets, although it
Both of which be user's set.Such as, the first element can be referred to as the second element, similarly, second
Element can be referred to as the first element, without deviating from the scope of the present disclosure.
It will be appreciated that when an element (such as, the first element) is referred to as (operatively or communicatedly)
" being connected to " or during " being connected to " another element (such as, the second element), this element can be direct
It is connected or coupled to another element, or any other element (such as, third element) can be plugged on
Between them.On the contrary, it is referred to as " being directly connected to " or " straight when an element (such as, the first element)
Connect connection " to another element (the second element) time, do not have element (such as, third element) to be plugged on
Between them.
According to circumstances, the statement used in the disclosure " be configured to " can with such as " be suitable for ", " tool
Have ... ability ", " being designed to ", " being suitable to ", " making ... " or " can " be interchangeably used.
Under hardware case, term " is configured to " not necessarily mean that the implication of " being specifically designed as ".Replace
Ground, in some cases, " be configured to ... device " statement can represent this device and other
Device or parts together " can ".Such as, " be suitable to (or being configured to) and perform the process of A, B and C
Device " can refer to be only used for perform the application specific processor (such as, embedding processor) of corresponding operating or can
Corresponding operating is performed to store one or more software program in the storage device by execution
General processor (such as, central processing unit (CPU) or application processor (AP)).
In the disclosure, term is used for describing particular implementation, and is not intended to the disclosure.As made at this
With, singulative is intended to also include plural form, unless content explicitly indicates that the other meaning.Saying
In bright book, it will be appreciated that term " include " or " having " represent feature, number, step, operation,
Structural detail, the existence of components or groups thereof, and get rid of one or more other features, number the most in advance
Mesh, step, operation, structural detail, the existence of components or groups thereof or the probability of interpolation.
Unless differently defined at this, all terms used herein, including technical term or scientific terminology,
There is the identical meanings understood with the skilled person belonging to the application.Such as those are in general words
It is identical that term defined in allusion quotation is to be interpreted as having the context connotation with in correlative technology field
Implication, has idealization or the most formal meaning by being not construed as, unless on the clear and definite boundary of a piece of land of the disclosure
Fixed.In some cases, even if the term limited in the disclosure is also understood not to get rid of the disclosure
Embodiment.
In the disclosure, electronic installation can be any device, and electronic installation can be referred to as terminal, just
Take terminal, mobile terminal, communication terminal, portable mobile terminal, portable mobile terminal, display device etc..
Electronic installation can be smart mobile phone, portable phone, game machine, TV, display unit, use
In the head-up display unit of automobile, notebook computer, laptop computer, tablet personal computer (PC),
Portable media player (PMP), personal digital assistant (PDA) etc..Electronic installation can be implemented as
There is radio communication function and it is the portable mobile terminal of little (pocket) size.Additionally, electronic installation can
To be flexible apparatus or flexible display apparatus.
Electronic installation can communicate with external electronic such as server etc., or by filling with external electrical
Put and work in coordination and perform operation.Such as, the figure that electronic installation will can be shot by photographing unit by network
Picture and/or the positional information detected by sensor unit are sent to server.Network can be mobile or honeycomb
Formula communication network, LAN (LAN), WLAN (WLAN), wide area network (WAN), the Internet,
Small-scale LAN network (SAN) etc., but it is not limited to this.
When describing the detailed description of the invention of the disclosure, the attachment means of different embodiments will be by accompanying drawing mark
Note such as " 100 ", " 100a ", " 100b " and " 100c " represent, thus by attachment means district each other
Separately.But, in certain embodiment, even if attachment means is only represented by reference " 100 ",
It can also refer to all attachment means of each embodiment being described below.Such as, with reference to Figure 25
To 27 detailed descriptions made, attachment means can only be represented by reference " 100 ", and it is permissible
Refer to the different embodiments of the attachment means being described below.
According to the different aspect of the disclosure, including the electronic installation of above-mentioned attachment means can provide dust-proof and
Water-proof function because attachment means is accommodated in the inside of mould component and sealing member be formed at shell and
Sealing structure between mould component.When sealing member is by inserting injection molding (insert injection molding)
When being molded, sealing member can be attached to the outer surface of shell simultaneously.Sealing member can separate system with shell
Make and shell can be attached to via such as binding agent or adhesive tape.
According to the different aspect of the disclosure, attachment means can form dust-proof and waterproof construction, because attachment
The sealing member of outer surface to shell is in close contact with the inner peripheral surface of the mould component of electronic installation.In reality
During existing such attachment means, the size (such as thickness) of shell is reduced to be accommodated in attachment means
In the part of connecting elements (such as plug) by being formed at least one face of attachment means
Outward opening exposes and seal arrangement is in parameatal such degree.Therefore, it can promote to connect
The miniaturization of device.Due to the attachment means miniaturization being accommodated in the mould component of electronic installation, so
Apparent design freedom at the mould component of electronic installation can improve.Such as, attachment means can
The aesthetic feeling of the appearance contributing to electronic installation realizes dust and water protection structure simultaneously.
Fig. 1 is the perspective view illustrating the attachment means 100 according to embodiment of the present disclosure.Fig. 2 is to show
Go out the state lower connecting device decomposed partly in the attachment means 100 according to embodiment of the present disclosure
The perspective view of 100.Fig. 3 is the perspective view illustrating the attachment means 100 according to embodiment of the present disclosure,
Wherein a part for attachment means is watched from other direction.Fig. 4 is to illustrate the embodiment party according to the disclosure
The perspective view of the attachment means 100 of formula, wherein attachment means is watched from other direction.
With reference to Fig. 1 and 2, attachment means 100 includes shell 101 and is arranged on the outer weekly form of shell 101
Sealing member 121 on face, external connection device (being such as arranged on the plug of the end of cable) is held
Receive and be connected in parallel to this shell 101.
Shell 101 can include the connecting hole 113 extended from first 111a.It addition, shell 101 can
To include the opening 115 extending to second 111b from first 111a, this second 111b and first
Face 111a contacts.Opening 115 may be coupled to the connecting hole 113 in first 111a, it is possible to
Expose connecting hole 113 in outside until at least the second 111b.Connecting hole is inserted at external connection device
Under state in 113, a part for the outer surface of external connection device can be by opening 115 by cruelly
Dew, or can stretch out from the outer surface (such as second 111b) of shell 101.Such as, connecting hole
113 can have a structure, and this structure allows a part for the external connection device inserted through opening 115
Externally protrude the external connection device accommodating simultaneously and fixing this insertion.
Shell 101 including opening 115 as above can aid in the miniaturization of attachment means 100.
Such as, corresponding in the described part of second 111b, thickness can be in the inner circumferential of connecting hole 113
Reduce between the outer surface of surface and shell 101, and opening 115 can be formed.Outside wherein
Shell 101 is compared completely around the peripheral structure of external connection device, and attachment means 100 is (outside such as
Shell 101) thickness or highly can be by reducing outside the inner peripheral surface of connecting hole 115 and shell 101
Thickness between perimeter surface and reduce.The structure of above-mentioned attachment means will be more fully described with reference to Figure 29.
Sealing member 121 is arranged on the outer surface of shell 101, it is possible to by elastomeric material (such as rubber
Glue, silicon, polyurethane etc.) make.Fig. 2 is shown in the shape that sealing member 121 is separately manufactured with shell 101
The sealing member 121 of the form being mounted to shell 101 it is under state.But, sealing member 121 can be
By being attached and be fixed to the outer weekly form of shell 101 while such as inserting injection molding technique molding
Face.Sealing member 121 can have closed loop shape, it is possible to is arranged on the outer surface of shell 101 to enclose
Around the region forming opening 115 wherein.
The outer surface of shell 101 can stand at least along the passage that sealing member 121 is arranged and fixes
Surface processes (such as corrosion treatmentCorrosion Science), to strengthen adhesive force and the bed knife of sealing member 121.Such as,
It is formed on and is attached the surface roughness on the surface of sealing member 121 by increase, to increase shell
Contact area between 101 and sealing member 121, can improve adhesive force and bed knife.Fixed swage 117
Can be formed on the outer surface of shell 101 to provide the sky forming or being attached sealing member 121 wherein
Between.Fixed swage 117 can stride across first 111a and second 111b and be formed, it is possible to is formed and encloses
Loop curve around the region forming opening 115 wherein.By forming fixed swage mentioned above
117, it is possible to increase the adhesive force of sealing member 121 and bed knife.It addition, by processing all via surface
As denuded the bottom or the surface roughness of medial wall increasing fixed swage 117, it is possible to outside improving further
Adhesive force between shell 101 and sealing member 121 and bed knife.
With reference to Fig. 3 and 4, attachment means 100 can include multiple connection terminal.Connect each of terminal
First end 135a can stretch out to be electrically connected to be inserted into connecting hole 113 from the inner peripheral surface of connecting hole 113
In external connection device.The each second end 135b connecting terminal can reach outside shell 101.
Second end 135b can be arranged on the 3rd 111c of shell 101.Such as, the 3rd 111c is permissible
It is to contact with first 111a or second 111b or contrary face.Present embodiment provides wherein the
Three 111c be arranged as contrary with second 111b while the example that contacts with first 111a.3rd
Face 111c may be positioned such that while contacting with second 111b in the face of first 111a, maybe can determine
Position is to contact with first 111a and each of second 111b.The face that second end 135b is disposed thereon
It is considered that the position that the shape of such as shell 101 and attachment means 100 are disposed in electronic installation
It is appropriately designed with structure.
Circuit board 131 can be arranged on the 3rd 111c of shell 101.Sidewall 125a can be along
The peripheral edge of the 3rd 111c is formed on the 3rd 111c.Sidewall 125a can be at the 3rd 111c
The upper space forming receiving circuit board 131.Circuit board 131 can be by hard circuit board or flexible print circuit
Plate is formed, and second circuit board 133 can be from circuit board 131 a lateral edges or opposite side edge across side
Outside wall 125a extends to reach shell 101.Second circuit board 133 can provide for connecting electricity
Road plate 131 is to the means (means) of other circuit devcies of electronic installation, it is possible to be flexible print circuit
Plate.On sidewall 125a, wiring depression can be by removing a part of sidewall 125a to provide a space
And formed, second circuit board 133 strides across this space and is arranged.
When circuit board 131 is arranged on the 3rd 111c, each second end 135b connecting terminal can
To be positioned on circuit board 131.Circuit board 131 can be disposed in shell 101 via surface mounting technology
The 3rd 111c on.In surface mounting technology, each second end 135b can be soldered to circuit
Appropriate location on plate 131.
When arranging circuit board 131, the second sealing member 123a can be arranged in the 3rd 111c
On.Second sealing member 123a can stop that water or foreign body are formed via during arranging connection terminal
The infiltration of passage (route) (such as, from the passage of the first end 135a to second end 135b).Seal
Part 123a can be made up of the elastomeric material identical with sealing member 121.Second sealing member 123a can be by
The curing resin layer obtained by coating and solidify resin such as epoxy resin is formed, maybe can be by attachment
One single sheet and realize.Circuit board 131 self can also stop by arranging that connection terminal is formed logical
Road.Present embodiment exemplifies the structure that the second sealing member 123a is formed by curing resin layer.
As described below, sealing member 121 can stop that water or foreign body can penetrate into attachment means by it
The passage in gap between 100 and the mould component of electronic installation.Such as, at external connection device along it
From the outside passage arriving connecting hole 113 of the mould component of electronic installation, sealing member 121 can be at electricity
Dust-proof and waterproof knot is formed between inner peripheral surface and the outer surface of shell 101 of the mould component of sub-device
Structure.Water or foreign body can also be penetrated into by connecting hole 113.Second sealing member 123a can stop water or
Foreign body is disposed in the inside that passage therein penetrates into electronic installation along connecting terminal.
Fig. 5 is the perspective view illustrating the attachment means according to embodiment of the present disclosure.Fig. 6 is to illustrate root
Plane graph according to the attachment means of embodiment of the present disclosure.Fig. 7 is to illustrate the embodiment party according to the disclosure
The upward view of the attachment means of formula.Fig. 8 is to be shown in the attachment means quilt according to embodiment of the present disclosure
The perspective view of the state lower connecting device decomposed partly.
According to another embodiment of the disclosure, attachment means 100a can arrange sealing member 123b's
Configuration aspects is different from the attachment means in first embodiment.When describing attachment means 100a, logical
Cross the attachment means 100 at first embodiment to may be appreciated parts and can be indicated by the same numbers
Or this reference can be omitted.Alternatively, it is also possible to description is omitted.
With reference to Fig. 5 to 8, attachment means 100a can include the 3rd 111c being attached to shell 101
The second sealing member 123b, circuit board 131 is plugged on therebetween.Sealing member 123b can be by by synthesizing
Synthetic resin film that resin or elastomeric material (such as rubber, silicon, polyurethane etc.) are made or flat type
Flashing realize.Second sealing member 123b can be attached to circuit board 131, or can be via adhesive
127a such as binding agent or adhesive tape are attached to the 3rd 111c.Second sealing member 123b can be attached at by
Sidewall 125a around space in.In another embodiment of the disclosure, " the second sealing member is described
It is attached to the 3rd face " wherein adhesive 127a can be related to the second sealing member 123b is attached to sidewall
The structure of the upper end of 125a.Although present embodiments provide for frame shape, but adhesive 127a can
There is the flat board with the second sealing member 123b same form or form membrane.Part quilt as sidewall 125a
Removing to second circuit board 133 when connecting up, the 3rd sealing member 123c may be arranged to be formed dust-proof
And waterproof construction closes the space for connecting up to second circuit board 133 simultaneously.Arranging the 3rd sealing member
During 123c, the adhesive of such as binding agent or adhesive tape can be provided in the 3rd sealing member 123c and second electricity
Between road plate 133 or between the 3rd sealing member 123c and sidewall 125a.
In the above-described embodiment, the second sealing member 123a and 123b can be arranged in by sidewall 125a
In the space formed.Such as, the second sealing member 123a and 123b can be formed or be arranged as having from
Three 111c rise with the sidewall 125a height same or below sidewall 125a.As the second sealing member 123a
With 123b be arranged in circuit board 131 be disposed in space therein time, dust-proof and waterproof construction is permissible
Formed and do not increase the thickness of attachment means 100 (such as shell 101).
Fig. 9 is the perspective view illustrating the attachment means according to embodiment of the present disclosure.Figure 10 is to illustrate
The plane graph of the attachment means according to embodiment of the present disclosure.Figure 11 is to illustrate the reality according to the disclosure
Execute the upward view of the attachment means of mode.Figure 12 is to be shown in the connection according to embodiment of the present disclosure
The perspective view of the state lower connecting device that device is decomposed partly.
Attachment means 100b can stop that by using circuit board 131 water or foreign body are along connecting terminal cloth
Put the infiltration of passage wherein.When describing attachment means 100b according to present embodiment, pass through
Attachment means 100 at first embodiment may be appreciated parts with 100a can be by identical accompanying drawing
Labelling represents, or this reference can be omitted.It addition, its detailed description can also be omitted.
With reference to Fig. 9 and 12, when the 3rd 111c arranges circuit board 131, adhesive 123d (example
Such as water blocking tape) can be plugged between circuit board 131 and the 3rd 111c.Adhesive 123d can have
It is attached at least peripheral edge in a face of circuit board 131 and is further attached at the 3rd 111c
Bottom on the frame shape at edge.For more firmly attachment circuits plate 131 to the 3rd 111c,
Adhesive 123d may further include enhancing part 123e.Such as, except the second end 135b connecting terminal
Arriving outside the passage of circuit board 131, whole of circuit board 131 can be attached by adhesive 123d
Receive the 3rd 111c.
Shell 101 can include wiring the depression 125b, adhesive 123d being formed in sidewall 125a
Can be positioned partially in wiring depression 125b and arrive wiring depression with attachment fixing second circuit board 133
125b.Circuit board 131 can include the hole being formed to correspond to connect the second end 135b of terminal.Should
Hole can be closed by solder in surface mounting technology.Such as, by using adhesive (the most waterproof
Band) circuit board 131 is attached to the 3rd 111c by 123d, it is possible to stop and connect terminal shape by arranging
The water become or foreign body penetrate into passage.
Second sealing member 123a (the most above-mentioned curing resin layer) can be arranged in circuit board 131 and the 3rd
Between the 111c of face.It addition, the second end 135b connecting terminal can be formed at contrary with first 111a
Face on, or be formed on the face contacted with first 111a and second 111b both of which.According to this
Disclosed embodiment, shell 101 can have hexahedral shape, the outer surface of its housing 101
Some is known respectively as " the first face ", " the second face " and " the 3rd face ".But, this is only used for
Describing, the disclosure is not limited to this.Such as, a part for the outer surface of shell 101 can be formed as curved
Curved surface, forms the position of opening 115 and arranges that the position of the second end 135b connecting terminal can root
Change according to the shape of shell 101.
Figure 13 is the perspective view illustrating the attachment means according to embodiment of the present disclosure.Figure 14 is to illustrate
The plane graph of the attachment means according to embodiment of the present disclosure.Figure 15 is to illustrate the reality according to the disclosure
Execute the upward view of the attachment means of mode.Figure 16 is to illustrate the connection dress according to embodiment of the present disclosure
The rearview put.
With reference to figures 13 to 16, connect terminal the second end 135b can be arranged in shell 101 with first
On the 3rd contrary for face 111a 111c.3rd 111c can orientate second with shell 101 as
111b contact is the most contrary with first 111a.
Shell 101 can include being formed as extending from second 111b being simultaneously connected at first 111a
In the opening 115 of connecting hole 113, the sealing member 121 of closed loop shape can be formed at shell 101
On outer surface or be attached to the outer surface of shell 101 to be centered around the district wherein forming opening 115
Territory.Circuit board 131 is arranged on the 3rd 111c and makes each second end 135b may be coupled to circuit
Plate 131.As it has been described above, the second end 135b can be connected by welding to circuit board 131.Figure 19's
Second sealing member (curing resin layer) 123f can be arranged in the 3rd between 111c and circuit board 131.
Second sealing member 123f can by before mounting circuit boards 131 on the 3rd 111c coated with resins
(such as epoxy resin) then solidifies this resin and is formed.Second sealing member 123f can be by such as
Water blocking tape realizes.
Below, a part for the manufacturing process of attachment means 100c will be described with reference to Figure 17 to 20.
Figure 17 to 20 illustrates the manufacture work of a part for the attachment means according to embodiment of the present disclosure
Skill.
With reference to Figure 17 to 20, connecting terminal 135 can be assembled to shell 101 from the 3rd 111c.Outward
Shell 101 can be manufactured by injection molding, and sealing member 121 can be formed at the outer surface of shell 101
(such as, first 111a and second 111b) goes up or is attached to the outer surface of shell 101.Example
As, sealing member 121 can be by the resin that then will melt in the shell 101 of molding is arranged in mould
It is poured in mould the outer surface being molded into shell 101.Alternatively, separately fabricated sealing member 121
Shell 101 can be attached to by using binding agent or adhesive tape.
Connect terminal 135 external connection being connected to attachment means 100c to be filled according to being arranged in
The number of the holding wire in putting and be mounted to shell 101.As it has been described above, connect the first of terminal 135
End 135a can protrude through the inside of connecting hole 113, and the second end 135b can protrude through shell 101 (example
Such as the 3rd face) outside.
Sidewall can be formed on the peripheral edge of the 3rd 111c.3rd 111c is enclosed by sidewall
Around space in, the second sealing member 123f (flashing of such as elastomeric material) or can be with shape can be arranged
Become curing resin layer, as mentioned above.As a result, water or foreign body are disposed in wherein by connecting terminal 135
The infiltration of passage be blocked.
Under the state arranging or defining the second sealing member 123f wherein, circuit board 131 can be installed
To hide the second sealing member 123f on the 3rd 111c.The the second end 135b connecting terminal 135 is permissible
Prominent to be connected to circuit board 131 from the second sealing member 123f.Adhesive can be arranged in circuit board 131
And to replace the second sealing member 123f between the 3rd 111c.Such as, by using water blocking tape by circuit
Plate 131 is attached to the 3rd 111c, and circuit board 131 self can form dust-proof and waterproof construction.
Figure 21 to 23 illustrates the formation work of the sealing member of the attachment means according to embodiment of the present disclosure
Skill.Figure 24 is that a part for the shell being shown in the attachment means according to embodiment of the present disclosure is cut
The sectional view of this attachment means under the state fallen.
Figure 21 to 23 is shown through inserting injection molding and forms the technique of sealing member 121, and Figure 24 illustrates
Sealing member 121 forms or is arranged on the state on the outer surface of shell 101.
With reference to figures 21 to 23, be injection molded in by insertion formed on the outer surface of shell 101 close
During sealing 121, shell 101 may be by the cast of the resin of the fusing for forming sealing member 121
Pressure and deform.When manufacturing attachment means 100, by being connected to shell 101 at dummy plug 104
State under perform insert injection molding, be possible to prevent the deformation of shell 101.
According to the shape of external connection device, the shape of connecting hole 113 can also be deformed into and be suitable for outside
The shape of attachment means.Can by the external connection device (such as plug) being coupled to attachment means 100
Having circular cross-section, a part for external connection device can have different diameters.Connecting hole 113 can have
There is the first bore portion 113a extended from first 111a and from the extension of the end of the first bore portion 113a
Second bore portion 113b.First bore portion 113a can extend the length of opening 115 from first 111a,
Second bore portion 113b can have the diameter that the diameter than the first bore portion 113a is little.
Inserting in injection molding technique, it is assumed that be applied to be formed in this place the part of sealing member 121
The pouring pressure of the resin of fusing is uniform, more likely causes shell 100 in the part of relative thin
Deformation.Such as, the part between second 111b and the inner peripheral surface of connecting hole 113 can be formed
For thinner than other parts.In inserting injection molding technique, the part of relative thin can be by the tree of fusing
The pouring pressure of fat and deform.But, by inserting dummy plug 104, the intensity of the part of relative thin
Can be strengthened by dummy plug 104 in inserting injection molding technique.Therefore, it is possible to prevent shell 101
Deformed by the pouring pressure of fusing resin in inserting injection molding technique.
It addition, in inserting injection molding technique, the resin of the fusing for forming sealing member 121 is permissible
Flow into (such as, the inside of connecting hole 113) in off-design part.This can cause in shell 101
Defect.But, by inserting dummy plug 104 in the technique forming sealing member 121 to connecting hole
In 113, it is possible to prevent the resin of fusing from flowing in connecting hole 113.
As it has been described above, sealing member 121 can be attached to shell via adhesive such as binding agent or adhesive tape
101 rather than by insert injection molding formed.
With reference to Figure 24, a part for sealing member 121 is accommodated on the outer surface being formed at shell 101
Fixed swage 117 in, another part can from the outer surface of shell 101 highlight.Close in order to strengthen
Adhesive force between sealing 121 and shell 101 and bed knife, a part for the outer surface of shell 101
(such as, the bottom of fixed swage 117 or inwall) can have high surface roughness by corrosion treatmentCorrosion Science.
In the part of the outer surface being projected into shell 101 at sealing member 121, it is wide that sealing member 121 can have it
The shape that degree is gradually reduced on the direction of the outer surface away from shell 101.
Figure 25 is illustrate the electronic installation 10 including attachment means according to embodiment of the present disclosure saturating
View.
With reference to Figure 25, electronic installation 10 includes mould component 11, and this mould component 11 has display device 12
Front mounted thereto.Display device 12 may be arranged to export picture (screen) to mould component 11
Front be embedded in mould component 11 simultaneously.Touch pad can be merged in display device 12 can with realization
To replace the dummy keyboard of the keyboard of mechanically operable.Power key or volume key can be implemented as grasping by machinery
Make key and can be arranged on side or the front of mould component.
In mould component 11, different circuit arrangements can be received to control electronic installation.It is contained in
Circuit arrangement in mould component can include one or more processor (such as application processor (AP)),
Communication module, subscriber identification module, memorizer, sensor assembly, input equipment, display are (such as
Display device 12), interface, audio-frequency module, camera model, power management module, battery, indicator
And motor.
Keyboard 13 and/or reception unit 15 are separately positioned on display device 12 below and above, to allow
The input/output of information, such as illuminance transducer or proximity transducer can be arranged in display device 12 weeks
Enclose.
It is internal that above-mentioned attachment means 100 is installed in mould component 11, is connected to inserting of attachment means 100
Hand-hole 17 can be formed in mould component 11.Insert hole 17 and can be formed at the side (example of mould component 11
Such as upper surface) on, and permission external connection device can be provided (such as, to be connected to the plug of earphone
Or it is connected to the plug of data cable) it is introduced in the passage in the connecting hole 113 of attachment means 100.
Figure 26 is the saturating of a part for the mould component illustrating the electronic installation according to embodiment of the present disclosure
View.Figure 27 is to illustrate to be arranged on an electronics according to embodiment of the present disclosure in attachment means 100
The perspective view of the state lower connecting device 100 on the mould component of device.
With reference to Figure 26 and 27, it is internal that main circuit board 19 can be arranged on mould component 11.At mould component 11
In, it is contemplated that the shape of inner space and the layout of circuit arrangement are in addition to main circuit board 19, permissible
Arrange auxiliary circuit board further.According to embodiment of the present disclosure, it is arranged on master in attachment means 100
Under state on circuit board 19, attachment means 100 is arranged in mould component 11.But, the disclosure is not
Being limited to this, attachment means 100 may be mounted on mould component 11 or on single auxiliary circuit board.
Some or all in foregoing circuit device can be suitably arranged on main circuit board 19, attachment means
100 can be electrically connected to main circuit board 19 by second circuit board 133.
When attachment means 100 is arranged in mould component 11, connecting hole 113 can be directed at insertion hole 17.
Structure that Figure 28 and 29 is shown respectively in wherein attachment means 100 is installed in mould component 11 and its
Peripheral attachment means (such as plug) is connected to the state of attachment means 100.
Figure 28 is to be shown in plug to be inserted into according under the state of the attachment means of embodiment of the present disclosure
The sectional view of plug.Figure 29 is to be shown in plug to be inserted into the connection dress according to embodiment of the present disclosure
The front view of plug under the state putting 100.
With reference to Figure 28 and 29, sealing member 121 can be in close contact by the inner peripheral surface with mould component 11
And form dust-proof and waterproof construction.Such as, by such as insert the water penetrated in hole 17 or foreign body can be through
Mould component 11 is penetrated into by the gap between the inner peripheral surface and the outer surface of shell 101 of mould component 11
Inside.Sealing member 121 can stop the infiltration lane of such water or foreign body.The one of sealing member 121
Part extends between first 111a and the mould component 11 formed around the region inserting hole 17
In gap, other parts of sealing member 121 extend to second 111b, are thus formed in second 111b
And the dust-proof and waterproof construction between the inner peripheral surface of mould component 11.Therefore, via at shell 101
Gap between the inner peripheral surface of outer surface and mould component 11 extends to mould component 11 from inserting hole 17
The passage of inside can be stopped by sealing member 121.
When water or foreign body can penetrate into the inside of connecting hole 113, by the second sealing member 123a, 123b,
Dust-proof and the waterproof construction that 123f or circuit board 131 self are formed can stop that water or foreign body are via connecting hole
113 passages passing its inside penetrating into mould component 11.Such as, by the second sealing member 123a, 123b,
Dust-proof and the waterproof construction that 123f or circuit board 131 self are formed can stop that water or foreign body are through connecting end
Son 135 is disposed in the infiltration of passage therein.
As a result, attachment means 100 is possible to prevent water or foreign body to penetrate into the mould component 11 of electronic installation 10
Inside the connection means of external device (ED) are provided simultaneously.
Plug 141 can have the Part I 141a corresponding to the first bore portion 113a and corresponding to second
The Part II 141b of bore portion 113b.Such as, Part I 141a can have ratio Part II 141b
The big diameter of diameter.When plug 141 is inserted in connecting hole 113, Part I 141a is permissible
It is positioned at the first bore portion 113a.Such as, a part of Part I 141a can pass through opening 115
It is exposed to outside shell 101.When plug 141 is inserted in connecting hole 113, Part II 141b
Can be inserted in shell 101 (such as, the second bore portion 113b of connecting hole 113) to be hidden.
But, the disclosure is not limited to this, and the exposure of plug 141 or concealed structure can be according to connecting holes 113
Shape or the development length of opening 115 and realize in every way.
Attachment means 100 can be exposed the opening 115 of Part I 141a subtracted by forming part
Its thickness little (or highly) and miniaturization.Part I 141a can be through opening 115 from shell 100
Outer surface (such as second 111b) partly highlight.But, the disclosure is not limited to this, and first
A part for part 141a can orientate the outer surface less than shell 101 as (such as, at opening 115
In).
Opening 115 can also be formed in the fourth face 111d contrary for 111b with second.Such as, cloth
It is set to can be formed in fourth face 111d with another opening of opening 115 symmetry, Part I 141a
Another part can from fourth face 111d highlight.Be there is by realization the shell of above-mentioned shape, connect
The thickness of device 100 can reduce further.When opening is respectively formed at second 111b and fourth face
Time in 111d, sealing member 121 can have from second 111b via first 111a to fourth face 111d
Closed loop shape.In Figure 29, the sealing member 121 being positioned on first 111a can have and is similar to " U "
The shape of shape.Utilize the structure that opening wherein is respectively formed in second 111b and fourth face 111d,
Sealing member 121 can be to extend to the periphery of connecting hole 113 being directed on first 111a
(circumference) shape realizes or real to extend to the shape of the edge alignment along first 111a
Existing.It addition, in structure in opening is respectively formed at second 111b and fourth face 111d, connect
Second end 135b of component 135 can be arranged on the face contrary for 111a with first.
By reducing the thickness of shell 101 and forming opening 115 as above, it is possible to reduce and connect dress
Put the thickness of 100.Attachment means 100 is arranged adjacent to the edge in mould component 11.Therefore, right
Design freedom in the appearance of mould component 11 can be according to the size (such as thickness) of attachment means 100
And change.Such as, along with the size of attachment means 100 increases, the receiving attachment means of mould component 11
The part of 100 can also increase, and there may be the difficulty realizing curved surface on mould component 11.
Dust-proof and waterproof construction can be implemented at the thickness reducing attachment means 100 simultaneously.Therefore, electronics dress
The reliability put can improve the design freedom simultaneously improved when realizing the appearance of electronic installation.
As it has been described above, according to embodiment of the present disclosure, a kind of attachment means includes: shell, including inserting
Head is introduced in first and be formed as second contacted with first therein；Connecting hole, from
One side extends to the inside of shell to accommodate plug；Opening, extends to second with at least from the first face
Second upper part ground exposes connecting hole；And sealing member, it is arranged on the outer surface of shell to be centered around
Wherein form the region of opening.
According to embodiment of the present disclosure, sealing member has closed loop shape.
According to embodiment of the present disclosure, plug includes Part I and has less than the diameter of Part I
The Part II of diameter, when plug inserts connecting hole, Part I be positioned on opening and
Part II inserts in connecting hole to be hidden.
According to embodiment of the present disclosure, a part for Part I reaches the periphery of shell through opening
Surface.
According to embodiment of the present disclosure, attachment means also includes connecting terminal, and each connection terminal includes
It is projected into the first end of the inner peripheral surface of connecting hole and is projected into the second end outside shell.
According to embodiment of the present disclosure, shell also includes contacting or contrary with first or second
3rd, the second end connecting terminal is arranged on the 3rd.
According to embodiment of the present disclosure, attachment means also includes that coupling is the circuit board in the face of the 3rd.
Each connection terminal is connected to circuit board.
According to embodiment of the present disclosure, attachment means also include couple in the face of the 3rd circuit board and
Being formed as the second sealing member in the face of the 3rd, circuit board is plugged between the 3rd and the second sealing member.
Each connection terminal is connected to circuit board.
According to embodiment of the present disclosure, the second sealing member includes the solidification resin being coated on the 3rd
Layer.
According to embodiment of the present disclosure, the second sealing member includes the flashing being attached to the 3rd.
According to embodiment of the present disclosure, attachment means also include couple in the face of the 3rd circuit board and
Attachment circuits plate to the 3rd is to form the water blocking tape of waterproof construction.Each connection terminal is connected to circuit
Plate.
According to embodiment of the present disclosure, attachment means also include couple in the face of the 3rd circuit board and
It is coated in the 3rd curing resin layer above and between the 3rd and circuit board.Each connection terminal connects
To the circuit board on curing resin layer.
According to embodiment of the present disclosure, with first the while that the 3rd face may be arranged to contrary with second
Contact, or contact with second the while of being arranged as contrary with first.
A kind of electronic installation according to embodiment of the present disclosure includes attachment means as above.
According to embodiment of the present disclosure, electronic installation also includes the mould component accommodating attachment means, seals
Part forms waterproof construction between shell and the inner peripheral surface of mould component.
According to embodiment of the present disclosure, electronic installation also includes the insertion hole being formed in mould component, and
And connecting hole alignment inserts hole.
According to embodiment of the present disclosure, a part for sealing member is arranged around the interior weekly form at mould component
The part in the region inserting hole is formed on face.
Figure 30 is flow chart, it is shown that according to the method for the manufacture attachment means of embodiment of the present disclosure.
When describing manufacture method, it is referred to structure and its portion of the attachment means of above-mentioned embodiment
Part.
With reference to Figure 30, manufacture method S100 includes step S101 providing shell and arranges sealing member
Step S102.It addition, manufacture method (S100) also includes in step S103, S141b and S141c
In step S141a, S143b and S143c, structure is being connected while middle layout connecting elements and circuit board
Part is disposed in passage therein the multiple steps forming dust-proof and waterproof construction.
The operation of shell is provided to relate to the operation providing above-mentioned shell 101, shell 101 in step S101
Such as injection molding manufacture can be passed through.When providing shell 101, perform the cloth in step S102
Put the operation of sealing member.If desired, in the execution table on the outer surface of shell 101 of step S111
Face processes the operation of (below, being referred to as " etching operation ") and can be first carried out in advance.Such table
Face processes and relates to such as performing on the surface of shell 101 corrosion treatmentCorrosion Science, it is possible to increase surface roughness
To strengthen the adhesive force between shell 101 and sealing member 121 and bed knife.Outer weekly form at shell 101
On face, fixed swage 117 can be formed thus form sealing member 121 wherein, or thus is attached close
Sealing 121 to its on.In the operation that shell is provided in step S101 or in step S111
In etching operation, fixed swage 117 can be formed.
In the operation arranging sealing member in step s 102, sealing member 121 can be injected by insertion
Moulding technology is formed on the outer surface of shell 101.Separately fabricated sealing member 121 can be attached to
The outer surface of shell 101.When sealing member 121 is formed by inserting injection molding technique, illusory slotting
104 can be inserted in the connecting hole 113 of shell 101 in inserting injection molding technique, thus can
To prevent the deformation of shell 101.When sealing member 121 is attached to shell 101, it is possible to use adhesive,
Such as binding agent or adhesive tape.
The operation arranging connecting elements in step S103 relates to assembly connection component 135 to shell 101
Operation, wherein the first end 135a of connecting elements 135 can protrude through the connecting hole 113 of shell 101,
Second end 135b can protrude through outside shell 101.The operation arranging connecting elements in step S103
Perform after the operation arranging sealing member of step S102, but, the disclosure is not limited to this.Such as,
The operation arranging sealing member in step S102 can connect performing the layout in step S103 in advance
Perform after the operation of component.
Arranging after connecting elements 135, step S141b, S141c and S143a at shell 101
The operation of middle layout circuit board can be performed by such as surface mounting technology.In step S141b, S141c
Before or after the operation arranging circuit board of S143a, can perform in step S141a, S143b
The operation forming or arranging the second sealing member with S143c.Arrange circuit board and the operation of the second sealing member
Order suitably can be selected according to by the specification of the attachment means manufactured or the structure of shell 101
Select.The detailed description of the invention of the disclosure has had been described above an example, and wherein circuit board is by using
The adhesive 123d (such as water blocking tape) of Figure 12 is attached to shell and makes dust-proof and waterproof construction by electricity
Road plate self is formed.
When second sealing member 123d and 123f of Figure 19 was formed or arranged before circuit board 131,
After connecting elements 135 is arranged, curing resin layer can by step S141a at shell 101
The 3rd 111c on coated with resins (such as epoxy resin) solidify this resin formation.By being formed
The the second sealing member 123f formed by curing resin layer, by connecting elements 135 arrange formed water or
The infiltration lane of foreign body can be blocked.After curing resin layer is formed, circuit board 131 can be
Step S143a is disposed in shell 101, and it can be performed by surface mounting technology.Arranging electricity
In the operation of road plate 131, each second end 135b of connecting elements 135 may be coupled to circuit board 131.
When circuit board 131 includes the hole being formed as accommodating the second end 135b, this hole can be by such as welding
It is closed.In the operation arranging circuit board of step S143a, circuit board 131 can be by the most viscous
Mixture or adhesive tape are attached to shell 101.
As it has been described above, outside circuit board 131 is by using adhesive (such as water blocking tape) 123d to be attached to
During the 3rd 111c of shell 101, circuit board 131 self can form dust-proof and waterproof construction.Such as,
Before arranging circuit board 131, the operation forming curing resin layer in step S141a can be viscous by arranging
The operation of component 123d (such as water blocking tape) replaces.
According to the different embodiments of the disclosure, step S141b is arranged in shell circuit board in advance
Afterwards, step S143b and S143c can be attached or be formed the second sealing member.
In shell 101, arrange that the operation of circuit board 131 can be performed by surface mounting technology in advance.
By the operation arranging circuit board in step S143b, circuit board 131 is arranged in shell 101, with
Time connecting elements 135 the second end 135b can be coupled (e.g., welded) to circuit board 131.
When arranging circuit board 131, in the operation of attachment second sealing member of step S143b
Can be by using such as adhesive 127a to be attached the second sealing member 123b (such as, flat board or form membrane
Flashing) to shell 101.Second sealing member 123b may be arranged in the face of the 3rd 111c, electricity
Road plate 131 is plugged on therebetween.In the operation of attachment the second sealing member 123b, additional sealing member (example
As, above-mentioned 3rd sealing member 123c) can be further arranged in as required on the 3rd 111c.
After arranging circuit board, arrange that the operation of the second sealing member can be solidified by the formation of step S143c
The operation of resin bed substitutes.Such as, by arranging after circuit board 131 at the 3rd in shell 101
The upper coating of 111c and solidification resin such as epoxy resin, dust-proof and waterproof construction can be formed simultaneously the 3rd
Embedded circuit plate 131 on the 111c of face.
As it has been described above, a kind of method manufacturing attachment means includes: providing shell, this shell includes plug
Be introduced in first therein, be formed as contacting with first second, from the first face extends to
The inside of shell is to accommodate the connecting hole of plug and to extend to second with the most on the second surface from the first face
The opening of partially exposed connecting hole；With layout sealing member on the outer surface of shell to be centered around wherein
Form the region of opening.
According to embodiment of the present disclosure, arrange that sealing member is included under the state that shell is arranged in a mold
Operated by the insertion injection molding of molded seals in casting resin to mould, insert injection molding behaviour
Work can perform when dummy plug is inserted in connecting hole.
According to embodiment of the present disclosure, arrange that sealing member includes being attached sealing member to shell, this sealing member
Preparation is separated with shell.
According to embodiment of the present disclosure, sealing member has closed loop shape, and it is close that the method is additionally included in layout
Before sealing, the outer surface of shell is made to be corroded at least along the passage that sealing member in this place is attached.
According to embodiment of the present disclosure, the method also includes: arrange that connecting terminal makes to connect terminal
First end is projected into the inner peripheral surface of connecting hole and connects the second end of terminal and be projected into outside shell；With
Arranging circuit board, this circuit board is connected in the outside of shell and is connected to connect the second end of terminal.
According to embodiment of the present disclosure, shell also includes contacting or contrary with first or second
3rd, the second end connecting terminal can be arranged on the 3rd.
According to embodiment of the present disclosure, before the method is additionally included in layout circuit board, on the 3rd
Form curing resin layer, or be disposed on 3rd thereon formation solidification resin at circuit board
Layer.
According to embodiment of the present disclosure, arrange that circuit board includes by using water blocking tape attachment circuits plate to arrive
3rd and form waterproof construction.
According to embodiment of the present disclosure, the method is additionally included in circuit board layout state on the 3rd
Lower attachment the second sealing member to the 3rd so that circuit board is plugged between the 3rd and this sealing member.
Although the disclosure be shown and described by reference to some embodiment of the disclosure, but this area
Ordinarily skilled artisan will understand that, without departing from the disclosure defined by claim and equivalent thereof
In the case of spirit and scope, may be made that the various changes in form and details.
Claims (15)
1. an attachment means, including:
Shell, including plug be introduced in therein first be formed as contacting with described first
Two；
Connecting hole, extends to the inside of described shell from described first face；
Opening, extend to from described first face described second with sudden and violent on the most described second upper part ground
Reveal described connecting hole；With
Sealing member, is arranged on the outer surface of described shell with around the region forming described opening.
2. attachment means as claimed in claim 1, wherein said sealing member has closed loop shape.
3. attachment means as claimed in claim 1, wherein said plug includes Part I and has
The Part II of the diameter less than the diameter of described Part I, and
Wherein, when described plug is inserted in described connecting hole, described Part I is positioned at described opening
On, described Part II is inserted in described connecting hole to be hidden.
4. attachment means as claimed in claim 3, a part for wherein said Part I passes through institute
State opening and be projected into the outer surface of described shell.
5. attachment means as claimed in claim 1, also includes:
Multiple connection terminals, each connection terminal includes being projected into the first of the inner peripheral surface of described connecting hole
Hold and be projected into the second end of the outside of described shell.
6. attachment means as claimed in claim 5, wherein said shell include with described first or
Described second contact or contrary 3rd, and
Described second end of wherein said connection terminal is arranged on described 3rd.
7. attachment means as claimed in claim 6, also includes:
Circuit board, is configured in the face of described 3rd, and the most each described connection terminal is connected to described electricity
Road plate.
8. attachment means as claimed in claim 6, also includes:
Circuit board, is configured in the face of described 3rd；With
Second sealing member, is configured in the face of described 3rd, and described circuit board is plugged on described second and seals
Between part and described 3rd, the most each described connection terminal is connected to described circuit board.
9. attachment means as claimed in claim 8, wherein said second sealing member includes being coated in institute
State the curing resin layer on the 3rd, be attached to the flashing of described 3rd and be configured to described in attachment
Circuit board to described 3rd with formed waterproof construction water blocking tape at least one.
10. attachment means as claimed in claim 6, also includes:
Circuit board, is configured in the face of described 3rd；With
Curing resin layer, is coated on described 3rd between described 3rd and described circuit board,
The most each described connection terminal is connected to described circuit board.
11. attachment means as claimed in claim 6, wherein said 3rd with described second contrary
Contact with described first simultaneously, or described 3rd with described first contrary while with described second
Face contacts.
12. 1 kinds of electronic installations, including the connection according to any one in claim 1 to 11
Device.
13. electronic installations as claimed in claim 12, also include:
Mould component, accommodates described attachment means,
Wherein said sealing member forms waterproof knot between the inner peripheral surface of described shell and described mould component
Structure.
14. electronic installations as claimed in claim 12, also include:
Insert hole, be formed in described mould component,
Wherein said connecting hole is directed at described insertion hole.
15. electronic installations as claimed in claim 14, a part for wherein said sealing member is centered around
The part in the region in described insertion hole is formed in the inner peripheral surface of described mould component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911363139.1A CN110957612B (en) | 2015-05-12 | 2016-05-11 | Connecting device and electronic device comprising same |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150066174A KR102344836B1 (en) | 2015-05-12 | 2015-05-12 | Connection device, manufacturing method of the same and electronic device including the same |
| KR10-2015-0066174 | 2015-05-12 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911363139.1A Division CN110957612B (en) | 2015-05-12 | 2016-05-11 | Connecting device and electronic device comprising same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106159545A true CN106159545A (en) | 2016-11-23 |
| CN106159545B CN106159545B (en) | 2021-03-30 |
Family
ID=55854616
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911363139.1A Active CN110957612B (en) | 2015-05-12 | 2016-05-11 | Connecting device and electronic device comprising same |
| CN201610308515.7A Active CN106159545B (en) | 2015-05-12 | 2016-05-11 | Connecting device and electronic device comprising same |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911363139.1A Active CN110957612B (en) | 2015-05-12 | 2016-05-11 | Connecting device and electronic device comprising same |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US9692170B2 (en) |
| EP (1) | EP3093928B1 (en) |
| KR (1) | KR102344836B1 (en) |
| CN (2) | CN110957612B (en) |
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| CN112566431A (en) * | 2019-09-26 | 2021-03-26 | 苹果公司 | Shell for electronic equipment and electronic equipment |
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| CN107799943B (en) * | 2016-09-07 | 2024-04-19 | 京东方科技集团股份有限公司 | Port |
| WO2018068534A1 (en) * | 2016-10-13 | 2018-04-19 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Mobile terminal, earphone socket and method for manufacturing earphone socket |
| EP3570391A1 (en) * | 2016-10-13 | 2019-11-20 | Guangdong OPPO Mobile Telecommunications Corp., Ltd. | Mobile terminal, earphone socket and method for manufacturing earphone socket |
| CN106711685B (en) * | 2016-12-24 | 2021-11-19 | 富士康(昆山)电脑接插件有限公司 | Protective cover and electric connector assembly |
| CN219535102U (en) * | 2019-09-02 | 2023-08-15 | 东莞市源创电子科技有限公司 | Data line |
| CN112618949A (en) * | 2019-10-08 | 2021-04-09 | 苏州景昱医疗器械有限公司 | Connector assembly for implantable medical device and method of making same |
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Also Published As
| Publication number | Publication date |
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| US20170256880A1 (en) | 2017-09-07 |
| EP3093928A1 (en) | 2016-11-16 |
| US20160336678A1 (en) | 2016-11-17 |
| EP3093928B1 (en) | 2018-06-06 |
| KR102344836B1 (en) | 2021-12-29 |
| US20190267751A1 (en) | 2019-08-29 |
| US10333245B2 (en) | 2019-06-25 |
| CN106159545B (en) | 2021-03-30 |
| US9692170B2 (en) | 2017-06-27 |
| US10700470B2 (en) | 2020-06-30 |
| CN110957612B (en) | 2022-12-13 |
| KR20160133272A (en) | 2016-11-22 |
| CN110957612A (en) | 2020-04-03 |
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