CN106147649B - A kind of corrugated board low temperature adhesion glue and application thereof - Google Patents
A kind of corrugated board low temperature adhesion glue and application thereof Download PDFInfo
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- CN106147649B CN106147649B CN201610504986.5A CN201610504986A CN106147649B CN 106147649 B CN106147649 B CN 106147649B CN 201610504986 A CN201610504986 A CN 201610504986A CN 106147649 B CN106147649 B CN 106147649B
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- low temperature
- corrugated board
- temperature adhesion
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- adhesion glue
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J103/00—Adhesives based on starch, amylose or amylopectin or on their derivatives or degradation products
- C09J103/02—Starch; Degradation products thereof, e.g. dextrin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
- C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C09J131/04—Homopolymers or copolymers of vinyl acetate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of corrugated board low temperature adhesion glue, it is formulated by glutinous rice flour, wheaten starch, VAE resin emulsions, sodium hydroxide, borax, water, oxidant and other additives, wherein the weight ratio of the glutinous rice flour, wheaten starch and VAE resin emulsions is (5 15):(4‑17)：(10‑20).In addition, the invention also discloses the methods for preparing the corrugated board low temperature adhesion glue.Glue temperature in use prepared by the present invention is low, does not need to high-temperature heating curing, it can be achieved that low temperature adhesion；Adhesive strength is high, and glue consumption is few, and effect is reliable；Water resistance is high, excellent combination property；Adhesive strength is stablized, and high yield rate reduces production cost；Energy consumption is reduced, reduces entreprise cost.
Description
Technical field
The invention belongs to technical field of adhesive, and in particular to a kind of corrugated board low temperature adhesion glue and application thereof.
Background technology
Corrugated case due to have many advantages, such as it is light, secured, convenient for handling transport, at low cost, pollution-free and extensive use
In the transportation and packing such as household electrical appliance, precise electronic electronic product, food and medicine.The quality of corrugated case is mainly by corrugated board
Quality determine that and the factors such as the quality of corrugated board and raw material, temperature, the adhesive in its production process are related.
At present, China master bond for corrugated board to be used is using starch as the amylum adhesive of raw material, although forming sediment
Powder adhesive has many advantages, such as that source is wide, resourceful, nontoxic and pollution-free, at low cost, but it is influenced by temperature, constituent
Very big, performance is unstable, and drying temperature is excessively high in use, it is impossible to meet the needs of high-speed production, it is heavy easily to generate
Form sediment, bond properties is not high, poor permeability, when have false viscous, blistering, degumming phenomenon, loss is big, so as to cause productivity is low, production
The problems such as of high cost, unstable product quality.Therefore, many researchers are constantly modified traditional starch adhesive, with
Obtain the bond for corrugated board of excellent combination property.
103421446 A of CN disclose a kind of corrugated board adhesive glue, include the raw material of following parts by weight：Water：400-
600 parts, cornstarch：80-120 parts, polyvinyl alcohol：4-6 parts, borax：0.8-1.2 parts, sodium hydroxide solution：8-12 parts.It should
Corrugated board adhesive glue low in raw material price, it is simple for process, easy to operate, technological requirement temperature is low, bonding intensity is high, but should
The data in relation to bonding intensity are not announced in patent application.
104099037 A of CN disclose a kind of FSC bond for corrugated board preparation method, include the following steps：
(1) prepared by carrier paste purpose；(2) preparation of main gel；(3) it mixes.The preparation method need more raw material, it is of high cost,
Preparation time is long, needs more manpower and materials.
Therefore, it is necessary to develop, a kind of adhesive strength is high, bond for corrugated board at low cost and excellent combination property.
Invention content
In order to solve the problems in the prior art, the present invention provides a kind of corrugated board low temperature adhesion glue.It is with glutinous rice
Powder, wheaten starch and VAE resin emulsions are primary raw material, and adhesive strength is high, improves quality of corrugated, and at low cost
Honest and clean, excellent combination property can promote and apply rapidly.
Therefore, the purpose of the present invention is to provide a kind of corrugated board low temperature adhesion glue, prepared by following raw material and
Into：Glutinous rice flour, wheaten starch, VAE resin emulsions, sodium hydroxide, borax, water, oxidant and other additives,
The weight ratio of wherein described glutinous rice flour, wheaten starch and VAE resin emulsions is (5-15):(4-17)：(10-20).
Preferably, the corrugated board low temperature adhesion glue is formulated by the raw material of following parts by weight：
50-150 parts of glutinous rice flour；40-170 parts of wheaten starch；100-200 parts of VAE resin emulsions；Sodium hydroxide 10-15 weights
Measure part；5-8 parts of borax；600-800 parts of water；10-30 parts of oxidant；Other additives 10-50 parts by weight.
Preferably, in corrugated board low temperature adhesion glue of the present invention, the viscosity of the VAE resin emulsions is 450-
800mPas, to obtain the high corrugated board low temperature adhesion glue of adhesive strength.
Preferably, in corrugated board low temperature adhesion glue of the present invention, it is 20- that the VAE resin emulsions, which are Ethylene mass,
35% VAE resin emulsions.
Preferably, in corrugated board low temperature adhesion glue of the present invention, the fineness of the glutinous rice flour is 80-100 mesh.
Preferably, in corrugated board low temperature adhesion glue of the present invention, the oxidant is conventional oxidant, preferably
Hydrogen oxide or sodium hypochlorite.
Preferably, in corrugated board low temperature adhesion glue of the present invention, other described additives for stabilizer, drier,
It is one or more in thickener, plasticizer, bleeding agent, antifoaming agent, so as to obtain the corrugated board low temperature of excellent combination property
Bond glue.
In addition, the present invention also provides a kind of method for preparing above-mentioned corrugated board low temperature adhesion glue, including following step
Suddenly：
(1) sodium hydroxide with water is mixed in proportion, and stirred evenly until sodium hydroxide is completely soluble in water, you can obtained
Obtain sodium hydroxide solution；
(2) it is molten that glutinous rice flour, wheaten starch, VAE resin emulsions are added in step (1) to the sodium hydroxide obtained in proportion
It in liquid, stirs evenly, then heats to 60-70 DEG C, constant temperature 2-3 hours obtains feed liquid；
(3) temperature of feed liquid that step (2) is obtained is down to 30-35 DEG C, then add in borax, oxidant and other add
Add agent, and stir 30-100 minutes, then discharging obtains corrugated board low temperature adhesion glue.
Corrugated board low temperature adhesion glue prepared by the present invention is applied to production and the bonding of corrugated board.
Compared with prior art, watt that the present invention is prepared using glutinous rice flour, wheaten starch and VAE resin emulsions as primary raw material
Corrugated paper board low temperature adhesion glue has following excellent effect：Temperature in use is low, does not need to high-temperature heating curing, it can be achieved that low temperature glues
It closes；Adhesive strength is high, and glue consumption is few, and effect is reliable；Water resistance is high, excellent combination property；Adhesive strength is stablized, high yield rate,
Reduce production cost；Energy consumption is reduced, reduces entreprise cost, and due to adding auxiliary material, therefore does not rise in use
It steeps, not gel.In addition, it is of the invention using glutinous rice flour, wheaten starch and VAE resin emulsions as primary raw material, by simple and practicable
Processing method and prepare the corrugated board low temperature adhesion glue, of low cost, raw material sources are wide, and technological process is simple, low
Temperature production, energy consumption is small, is easy to prepare on a large scale.
Specific embodiment
Under in order to make objects and advantages of the present invention more concise, the present invention will be explained with specific examples below
It is bright, but the present invention is only limitted to absolutely not these embodiments.Following embodiment is only more preferably embodiment, and be only used for explaining of the invention
State the present invention, it is impossible to be interpreted as limiting the scope of the present invention.It should be pointed out that it is all the present invention essence and principle it
Interior done all any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention.Therefore, it is of the invention
The protection domain of patent should be determined by the appended claims.
Prepare embodiment
Prepare embodiment 1
To equipped with blender, thermometer, reflux condensing tube reactor in add in 10kg sodium hydroxides and 600kg water,
Then it stirs evenly until sodium hydroxide is completely soluble in water.100kg glutinous rice flours, 100kg wheaten starches and 100kg are added in later
VAE resin emulsions, and stir evenly, 70 DEG C are then raised temperature to, and stir 2.5 hours at this temperature.Then temperature is reduced
To 35 DEG C, 8kg boraxs, 20kg antifoaming agent trioctyl phosphate and 15kg oxidizing agent sodium hypochlorites are added in later, and stir 70 minutes,
Then discharging obtains corrugated board low temperature adhesion glue.
Prepare embodiment 2
To equipped with blender, thermometer, reflux condensing tube reactor in add in 15kg sodium hydroxides and 700kg water,
Then it stirs evenly until sodium hydroxide is completely soluble in water.150kg glutinous rice flours, 70kg wheaten starches and 200kg are added in later
VAE resin emulsions, and stir evenly, 65 DEG C are then raised temperature to, and stir 2.5 hours at this temperature.Then temperature is reduced
To 35 DEG C, 8kg boraxs, 20kg oxidizing agent sodium hypochlorites, 20kg antifoaming agent trioctyl phosphate and 10kg plasticizer second are added in later
Acid esters, and stir 100 minutes, then discharging obtains corrugated board low temperature adhesion glue.
Comparative example 1
The preparation of carrier starch：To equipped with blender, thermometer, reflux condensing tube first reactor in add in
The sodium hydrate aqueous solution of 150kg water, 15kg cornstarch and 30L 40%, and be sufficiently mixed and stir evenly, then gradually rise
Temperature stirs 30 minutes to 68 DEG C at a temperature of 68 DEG C；
The preparation of main body starch：To equipped with blender, thermometer, reflux condensing tube second reactor in add in
350kg water, 85kg cornstarch, 5kg polyvinyl alcohol and 1kg boraxs, and be sufficiently mixed and stir evenly；
The preparation of amylum adhesive：Prepared carrier starch and main body starch are mixed and stirred for uniformly, you can obtain
Amylum adhesive.
Comparative example 2
To equipped with blender, thermometer, reflux condensing tube reactor in add in 10kg sodium hydroxides and 600kg water,
Then it stirs evenly until sodium hydroxide is completely soluble in water.150kg glutinous rice flours and 150kg wheaten starches are added in later, and are stirred
It mixes uniformly, then raises temperature to 70 DEG C, and stir 2.5 hours at this temperature.Then temperature is reduced to 35 DEG C, added in later
8kg boraxs, 20kg antifoaming agent trioctyl phosphate and 15kg oxidizing agent sodium hypochlorites, and stir 70 minutes, then discharging obtains
Adhesive.
Testing example
Adhesive prepared by the corrugated board low temperature adhesion glue for preparing embodiment 1-2 preparations and comparative example 1 and 2
It is glued applied to corrugated board, prepared corrugated paper is in addition to adhesive with drying condition difference, other conditions all same.
Adhesive prepared by corrugated board low temperature adhesion glue and comparative example 1 and 2 prepared by preparation embodiment 1-2
Test result is shown in the following table 1.Wherein, adhesive strength is detected by the method in GB/T6541-2011, and water resistance test is
Corrugated board is placed in 25 DEG C of water, separation time is the water resistance time.
Table 1 prepares the performance test results of embodiment 1-2 and the adhesive prepared by comparative example.
As can be known from the above table, since the present invention using glutinous rice flour, wheaten starch and VAE resin emulsions prepares corrugation as primary raw material
Cardboard low temperature adhesion glue, so as to fulfill prepared glue low temperature adhesion, and adhesive strength is high, water-tolerant, particularly makes
Glue prepared by standby embodiment 2, adhesive strength and water resistance are significantly better than comparative example.
According to the disclosure and teachings of the above specification, those skilled in the art in the invention can also be to above-mentioned embodiment party
Formula is changed and is changed.Therefore, the invention is not limited in specific embodiment disclosed and described above, to the one of invention
A little modifications and changes should also be as falling into the scope of the claims of the present invention.In addition, it although is used in this specification
Some specific terms, but these terms are merely for convenience of description, do not limit the present invention in any way.
Claims (4)
1. a kind of corrugated board low temperature adhesion glue, which is characterized in that the corrugated board low temperature adhesion glue is by following raw material
It is formulated：Glutinous rice flour, wheaten starch, VAE resin emulsions, sodium hydroxide, borax, water, oxidant and other additives,
The weight ratio of wherein described glutinous rice flour, wheaten starch and VAE resin emulsions is (5-15):(4-17)：(10-20)；It is described
Corrugated board low temperature adhesion glue preparation method, include the following steps：
(1) sodium hydroxide with water is mixed in proportion, and stirred evenly until sodium hydroxide is completely soluble in water, you can obtain hydrogen
Sodium hydroxide solution；
(2) glutinous rice flour, wheaten starch, VAE resin emulsions are added in the sodium hydroxide solution obtained to step (1) in proportion
In, it stirs evenly, then heats to 60-70 DEG C, constant temperature 2-3 hours obtains feed liquid；
(3) temperature of feed liquid that step (2) is obtained is down to 30-35 DEG C, then adds in borax, oxidant and other additions
Agent, and stir 30-100 minutes, then discharging obtains corrugated board low temperature adhesion glue.
2. corrugated board low temperature adhesion glue according to claim 1, which is characterized in that the corrugated board low temperature adhesion
Glue is formulated by the raw material of following parts by weight：
50-150 parts of glutinous rice flour；40-170 parts of wheaten starch；100-200 parts of VAE resin emulsions；Sodium hydroxide 10-15 parts by weight；
5-8 parts of borax；600-800 parts of water；10-30 parts of oxidant；Other additives 10-50 parts by weight.
3. corrugated board low temperature adhesion glue according to claim 1, which is characterized in that the fineness of the glutinous rice flour is
80-100 mesh.
4. corrugated board low temperature adhesion glue according to claim 1, which is characterized in that other described additives is stablize
It is one or more in agent, drier, thickener, plasticizer, antifoaming agent, bleeding agent.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610504986.5A CN106147649B (en) | 2016-06-28 | 2016-06-28 | A kind of corrugated board low temperature adhesion glue and application thereof |
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| CN201610504986.5A CN106147649B (en) | 2016-06-28 | 2016-06-28 | A kind of corrugated board low temperature adhesion glue and application thereof |
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| CN106147649B true CN106147649B (en) | 2018-06-22 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106753032A (en) * | 2016-11-29 | 2017-05-31 | 广西大学 | A kind of corrugated case adhesive of bonding strength high and preparation method thereof |
| CN109207095A (en) * | 2018-07-20 | 2019-01-15 | 蚌埠市奥特纸箱机械有限公司 | A kind of corrugated paper high viscosity adhesive |
| CN109334129A (en) * | 2018-10-23 | 2019-02-15 | 东莞市厚威包装科技股份有限公司 | A kind of corrugated paper bonded using low temperature corrugation paper-hanging |
| CN109486441B (en) * | 2018-10-24 | 2020-12-25 | 安徽金田彩印包装有限公司 | Low-temperature bonding glue for corrugated boards |
| CN109456707A (en) * | 2018-12-03 | 2019-03-12 | 太仓适度纸业包装有限公司 | A kind of adhesive for corrugated board bonding |
| CN110126360A (en) * | 2019-04-10 | 2019-08-16 | 四川港大工贸有限公司 | A kind of low-temperature production process of corrugated board |
| CN113150717A (en) * | 2021-04-09 | 2021-07-23 | 湖北银河彩印包装有限公司 | Preparation method of adhesive for corrugated board |
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|---|---|---|---|---|
| CN1727424A (en) * | 2004-07-30 | 2006-02-01 | 赵春发 | Biologic waterproof glue and usage |
| CN102234493A (en) * | 2010-04-21 | 2011-11-09 | 王钱生 | Plant composite adhesive for man-made board and preparation method thereof |
| CN103102836A (en) * | 2013-02-06 | 2013-05-15 | 福建省文松彩印有限公司 | Special glue for corrugated paper board production line and preparation method of special glue |
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- 2016-06-28 CN CN201610504986.5A patent/CN106147649B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1727424A (en) * | 2004-07-30 | 2006-02-01 | 赵春发 | Biologic waterproof glue and usage |
| CN102234493A (en) * | 2010-04-21 | 2011-11-09 | 王钱生 | Plant composite adhesive for man-made board and preparation method thereof |
| CN103102836A (en) * | 2013-02-06 | 2013-05-15 | 福建省文松彩印有限公司 | Special glue for corrugated paper board production line and preparation method of special glue |
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Denomination of invention: A low temperature adhesive for corrugated board and its application Effective date of registration: 20201016 Granted publication date: 20180622 Pledgee: Bank of China Limited Dongshan Branch of Guangzhou Pledgor: GUANGDONG BAOYA PAPER INDUSTRY Co.,Ltd. Registration number: Y2020440000324 |
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