CN106141429B - It is a kind of exclude laser ferrite product hole in waste material technique - Google Patents
It is a kind of exclude laser ferrite product hole in waste material technique Download PDFInfo
- Publication number
- CN106141429B CN106141429B CN201510210567.6A CN201510210567A CN106141429B CN 106141429 B CN106141429 B CN 106141429B CN 201510210567 A CN201510210567 A CN 201510210567A CN 106141429 B CN106141429 B CN 106141429B
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- CN
- China
- Prior art keywords
- ferrite product
- laser
- waste material
- ferrite
- deielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Magnetic Ceramics (AREA)
Abstract
The present invention relates to a kind of technique of waste material in ferrite product hole for excluding laser, (1) is punched into the deielectric-coating to match with the internal via shape of ferrite product requirement to be processed processing and position using cutting die；(2) the included film of ferrite product to be processed is removed；(3) deielectric-coating is fitted in the glue surface of ferrite product to be processed, then ferrite product is placed on station；(4) route of the design using laser cutting device on deielectric-coating carries out cutting process to ferrite product；(5) waste material remaining in inner hole is rejected using blanking units, completes the processing to ferrite product.Compared with prior art, the present invention can improve the appearance of institute's converted products, facilitate removal waste material, will not generate residual.
Description
Technical field
The present invention relates to electronic component manufacture fields, more particularly, to a kind of ferrite product hole for excluding laser
The technique of interior waste material.
Background technique
With the diversified trend in market, the diversification that the product material and production technology of production equally also become, because of product
The diversification of material causes processing space to need to design and define different processing technologys according to different material.Present laser radium
Penetrate the problem of ferrite product the bad waste discharge of waste material occurs often to cause bad order.
Chinese patent CN 103537810A discloses the laser drilling of ferrite substrate.Currently, bringing onto load ferrite
The grounding technology of device seriously restricts its large-scale production, and the prior art has distinct disadvantage, is not able to satisfy future development
Demand.Laser boring grounding technology has a clear superiority, but due to the hard crisp characteristic of Ferrite Material, is punched using conventional laser
Easily there is micro-crack or suddenly fracture, and the Main Trends of The Development of the following ferrite device be miniaturization, chip type, high-precision,
High stable, high reliability.Therefore, there is important meaning by improving the grounding technology that laser boring solves bringing onto load ferrite device
Justice.But the patent is still without solving the problems, such as that waste material excludes.
Summary of the invention
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide a kind of improvement product appearances
Exclusion laser ferrite product hole in waste material technique.
The purpose of the present invention can be achieved through the following technical solutions:
It is a kind of exclude laser ferrite product hole in waste material technique, using following steps:
(1) it is punched into using cutting die and to be matched with the internal via shape of ferrite product requirement processing to be processed and position
Deielectric-coating；
(2) the included film of ferrite product to be processed is removed；
(3) deielectric-coating is fitted in the glue surface of ferrite product to be processed, ferrite product is then placed on operation
On platform；
(4) route of the design using laser cutting device on deielectric-coating carries out cutting process to ferrite product；
(5) waste material remaining in inner hole is rejected using blanking units, completes the processing to ferrite product.
The deielectric-coating is the release film that material is PET.
The deielectric-coating is fitted in the surface of ferrite product to be processed through roller bearing.
When carrying out cutting process using laser cutting device, control laser power is the 28-34% of maximum power, cutting
Speed is 275-372mm/s.
The maximum power of the laser cutting device is 50W.
When rejecting residual waste in inner hole using blanking units, punching pressure is 0.2-0.4MPa, and the punching time is 2-4s.
Compared with prior art, the present invention can be effectively solved ferrite material product after laser in round
The bad order of waste material be easy to causeing, has the advantage that
Punching with product match size hole shape PET release film main purpose be by holes of products position waste film elder generation
Time of reduction laser when radium-shine is cut away to be greatly improved to appearance.
It is that the sticky reduced between the glue and film of material exists that glue surface film is changed into the PET release film main purpose being punched
It arranges good waste discharge when radium-shine rear waste material and reduces bad order caused by waste discharge.
Radium-shine identical outer shaped position need to be gone that radium-shine parameter is arranged with different figure layers, radium-shine using different figure layer parameters
Product edge will not have the bad orders such as flash after identical shape is radium-shine.
Specific embodiment
The present invention is described in detail combined with specific embodiments below.
Embodiment 1
It is a kind of exclude laser ferrite product hole in waste material technique, using following steps:
(1) it is punched into using cutting die and to be matched with the internal via shape of ferrite product requirement processing to be processed and position
Deielectric-coating, in the present embodiment, the deielectric-coating used are the release film that material is PET；
(2) the included film of ferrite product to be processed is removed；
(3) deielectric-coating is fitted in the surface of ferrite product to be processed through roller bearing, then places ferrite product
On station；
(4) route of the design using the laser cutting device that maximum power is 50W on deielectric-coating is to ferrite product
Cutting process is carried out, technological parameter when carrying out cutting process using laser cutting device is as shown in the table:
(5) waste material remaining in inner hole is rejected using blanking units, punching pressure is 0.3MPa, and the punching time is 3s, complete
The processing of pairs of ferrite product.
Embodiment 2
It is a kind of exclude laser ferrite product hole in waste material technique, using following steps:
(1) it is punched into using cutting die and to be matched with the internal via shape of ferrite product requirement processing to be processed and position
The release film of PET；
(2) the included film of ferrite product to be processed is removed；
(3) deielectric-coating is fitted in the glue surface of ferrite product to be processed through roller bearing, then places ferrite product
On station；
(4) route of the design using laser cutting device on deielectric-coating carries out cutting process to ferrite product, swashs
Optical power is maximum power 50W, and when carrying out cutting process using laser cutting device, control laser power is maximum power
28%, the speed of cutting is 275mm/s；
(5) waste material remaining in inner hole is rejected using blanking units, punching pressure is 0.2MPa, and the punching time is 2s, complete
The processing of pairs of ferrite product.
Embodiment 3
It is a kind of exclude laser ferrite product hole in waste material technique, using following steps:
(1) it is punched into using cutting die and to be matched with the internal via shape of ferrite product requirement processing to be processed and position
The release film of PET；
(2) the included film of ferrite product to be processed is removed；
(3) deielectric-coating is fitted in the glue surface of ferrite product to be processed through roller bearing, then places ferrite product
On station；
(4) route of the design using laser cutting device on deielectric-coating carries out cutting process to ferrite product, swashs
Optical power is maximum power 50W, and when carrying out cutting process using laser cutting device, control laser power is maximum power
34%, the speed of cutting is 372mm/s；
(5) waste material remaining in inner hole is rejected using blanking units, punching pressure is 0.4MPa, and the punching time is 4s, complete
The processing of pairs of ferrite product.
Claims (2)
1. the technique of waste material in a kind of ferrite product hole for excluding laser, which is characterized in that use following steps:
(1) medium to match with the internal via shape of ferrite product requirement to be processed processing and position is punched into using cutting die
Film；
(2) the included film of ferrite product to be processed is removed；
(3) deielectric-coating is fitted in the glue surface of ferrite product to be processed through roller bearing, ferrite product is then placed on behaviour
Make on platform；
(4) route of the design using laser cutting device on deielectric-coating carries out cutting process to ferrite product, and laser is cut
The maximum power for cutting device is 50W, and control laser power is the 28-34% of maximum power, and the speed of cutting is 275-372mm/s；
(5) waste material remaining in inner hole is rejected using blanking units, punching pressure is 0.2-0.4MPa, and the punching time is 2-4s,
Complete the processing to ferrite product.
2. the technique of waste material, feature exist in a kind of ferrite product hole for excluding laser according to claim 1
In the deielectric-coating is the release film that material is PET.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510210567.6A CN106141429B (en) | 2015-04-28 | 2015-04-28 | It is a kind of exclude laser ferrite product hole in waste material technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510210567.6A CN106141429B (en) | 2015-04-28 | 2015-04-28 | It is a kind of exclude laser ferrite product hole in waste material technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106141429A CN106141429A (en) | 2016-11-23 |
| CN106141429B true CN106141429B (en) | 2019-01-01 |
Family
ID=57347630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510210567.6A Expired - Fee Related CN106141429B (en) | 2015-04-28 | 2015-04-28 | It is a kind of exclude laser ferrite product hole in waste material technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106141429B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113635565A (en) * | 2021-08-06 | 2021-11-12 | 深圳市腾鑫精密电子芯材科技有限公司 | Processing technology of camera module optical component pasting material |
Citations (10)
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|---|---|---|---|---|
| CN202496171U (en) * | 2012-01-10 | 2012-10-17 | 3M创新有限公司 | Drilled sintered ferrite sheet, antenna isolation body and antenna module |
| CN103200807A (en) * | 2012-01-10 | 2013-07-10 | 3M创新有限公司 | Drilling sintering ferrite sheet, antenna isolation body and antenna module |
| CN103374309A (en) * | 2012-04-23 | 2013-10-30 | 日东电工株式会社 | Surface protection film |
| CN203265915U (en) * | 2013-04-19 | 2013-11-06 | 上海景奕电子科技有限公司 | Laser die-cutting jig for electronic product ferrite material die-cutting piece |
| CN203316915U (en) * | 2013-04-19 | 2013-12-04 | 上海景奕电子科技有限公司 | Novel ferrite laser cutting device |
| CN103515698A (en) * | 2012-06-28 | 2014-01-15 | 比亚迪股份有限公司 | NFC (Near Field Communication) antenna and electronic equipment |
| CN103862517A (en) * | 2012-12-10 | 2014-06-18 | 大连圣锋胶粘制品有限公司 | Double-faced adhesive film product die-cutting hole waste discharge process |
| CN203875959U (en) * | 2014-05-27 | 2014-10-15 | 东莞劲胜精密组件股份有限公司 | Punching die |
| CN104107983A (en) * | 2013-04-19 | 2014-10-22 | 上海景奕电子科技有限公司 | Novel laser cutting method for ferrite |
| CN104107984A (en) * | 2013-04-19 | 2014-10-22 | 上海景奕电子科技有限公司 | Laser die-cutting jig for ferrite materials |
-
2015
- 2015-04-28 CN CN201510210567.6A patent/CN106141429B/en not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202496171U (en) * | 2012-01-10 | 2012-10-17 | 3M创新有限公司 | Drilled sintered ferrite sheet, antenna isolation body and antenna module |
| CN103200807A (en) * | 2012-01-10 | 2013-07-10 | 3M创新有限公司 | Drilling sintering ferrite sheet, antenna isolation body and antenna module |
| CN103374309A (en) * | 2012-04-23 | 2013-10-30 | 日东电工株式会社 | Surface protection film |
| CN103515698A (en) * | 2012-06-28 | 2014-01-15 | 比亚迪股份有限公司 | NFC (Near Field Communication) antenna and electronic equipment |
| CN103862517A (en) * | 2012-12-10 | 2014-06-18 | 大连圣锋胶粘制品有限公司 | Double-faced adhesive film product die-cutting hole waste discharge process |
| CN203265915U (en) * | 2013-04-19 | 2013-11-06 | 上海景奕电子科技有限公司 | Laser die-cutting jig for electronic product ferrite material die-cutting piece |
| CN203316915U (en) * | 2013-04-19 | 2013-12-04 | 上海景奕电子科技有限公司 | Novel ferrite laser cutting device |
| CN104107983A (en) * | 2013-04-19 | 2014-10-22 | 上海景奕电子科技有限公司 | Novel laser cutting method for ferrite |
| CN104107984A (en) * | 2013-04-19 | 2014-10-22 | 上海景奕电子科技有限公司 | Laser die-cutting jig for ferrite materials |
| CN203875959U (en) * | 2014-05-27 | 2014-10-15 | 东莞劲胜精密组件股份有限公司 | Punching die |
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| Publication number | Publication date |
|---|---|
| CN106141429A (en) | 2016-11-23 |
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Effective date of registration: 20180205 Address after: 201108 No. 103, room 2059, Shanghai City Road, Minhang District, Shanghai Applicant after: Yuan Yuan Industrial (Shanghai) Co., Ltd. Address before: Room A201-17 No. 99, building 16, A new town of Pudong New Area Nanhui Lake West Road 201306 in Shanghai City Applicant before: West unitary Electronic Technology (Shanghai) Co., Ltd. |
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Granted publication date: 20190101 Termination date: 20200428 |