CN106612589A - Method for manufacturing inner-layer copper foil target box of ultra-thin flexible combined board - Google Patents
Method for manufacturing inner-layer copper foil target box of ultra-thin flexible combined board Download PDFInfo
- Publication number
- CN106612589A CN106612589A CN201611151920.9A CN201611151920A CN106612589A CN 106612589 A CN106612589 A CN 106612589A CN 201611151920 A CN201611151920 A CN 201611151920A CN 106612589 A CN106612589 A CN 106612589A
- Authority
- CN
- China
- Prior art keywords
- flexible
- layer
- copper foil
- foil target
- target frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
Abstract
The invention discloses a method for manufacturing the inner-layer copper foil target box of an ultra-thin flexible combined board. The method comprises the following steps: 1) adhering an inner-layer flexible double-sided board and an inner-layer flexible single-sided board through an adhesive layer; 2) paving a flexible protective layer on the outside of the inner-layer flexible single-sided board; 3) punching holes at fixed points on the flexible protective layer; and 4) forming through holes at punching positions by using drilling equipment. According to the method for manufacturing the inner-layer copper foil target box of the ultra-thin flexible combined board disclosed by the invention, quick formation of corresponding through holes in the inner-layer flexible double-sided board and the inner-layer flexible single-sided board can be carried out quickly, and the inner-layer flexible double-sided board or the inner-layer flexible single-sided board cannot be damaged, so that the production quality of the product is guaranteed while the production efficiency of the product is guaranteed.
Description
Technical field
The present invention relates to electronic product technology of preparing, the technology of preparing of particularly flexible board, specifically, it shows one
Plant ultrathin flexible and combine inner cord Copper Foil target frame manufacture method.
Background technology
As electronic product is towards becoming more meticulous development, the thickness of the flexible board of electronic product also more and more thinner, accordingly,
The thickness of the Copper Foil that flexible board inside uses also more and more thinner；
In carrying out flexible board preparation process, need to carry out the making of internal layer Copper Foil target frame, internal layer Copper Foil target at this stage
Frame manufacture method is:By producing scoring ring on the internal layer flexible double-sided plate being made up of Copper Foil, while in being made up of Copper Foil
Target frame is produced on the flexible single-sided plate of internal layer, internal layer flexible double-sided plate and the flexible single-sided plate of internal layer are combined into rear profit using pure glue-line
The making of correspondence through hole is carried out with broken target drone correspondence scoring ring and target frame.
Internal layer Copper Foil target frame production method at this stage, it is loaded down with trivial details to do industry, low production efficiency, while broken target drone to carry out correspondence logical
Hole easily weighs the flexible single-sided plate of internal layer wounded when making, and causes product qualified rate low.
Therefore, it is necessary to provide a kind of ultrathin flexible with reference to inner cord Copper Foil target frame manufacture method to solve the above problems.
The content of the invention
It is an object of the invention to provide a kind of ultrathin flexible combines inner cord Copper Foil target frame manufacture method, it can quickly be carried out
The quick Fabrication of the corresponding through hole of internal layer flexible double-sided plate and the flexible single-sided plate of internal layer, and will not be to internal layer flexible single-sided plate or interior
Layer flexible double-sided plate causes to damage, it is ensured that production efficiency ensures production quality simultaneously.
The present invention is achieved through the following technical solutions above-mentioned purpose：
A kind of ultrathin flexible combines inner cord Copper Foil target frame manufacture method, comprises the steps：
1) by adhesive layer bonding inner layers flexible double-sided plate and the flexible single-sided plate of internal layer；
2) one layer of flexible protective layer is laid in the flexible single-sided plate outer layer of internal layer；
3) by the fixed point punching position on flexible protective layer；
4) through hole carried out at punching position using rig is made.
Further, step 3) before need to carry out cutting to reach corresponding size.
Further, the flexible protective layer is drawn by high temperature resistant wheat and is constituted.
Further, the adhesive layer is made up of pure glue-line.
Further, punch is that fixed point passes through computer fixed-point implementation.
Further, rig adopts numerical control machining center.
Wherein：
1) by arrange flexible protective layer, carry out through hole make when, rig will not contact the flexible single-sided plate of internal layer or
Internal layer flexible double-sided plate, will not cause to damage, it is ensured that product quality to the flexible single-sided plate of internal layer or internal layer flexible double-sided plate；
2) through hole carried out using rig at punching position behind fixed point punching position on flexible protective layer is made, through hole system
Make efficiency high and then ensure the production efficiency of product.
Compared with prior art, ultrathin flexible of the invention combines inner cord Copper Foil target frame manufacture method, and it can quickly enter
The quick Fabrication of the corresponding through hole of row internal layer flexible double-sided plate and the flexible single-sided plate of internal layer, and will not to the flexible single-sided plate of internal layer or
Internal layer flexible double-sided plate causes to damage, it is ensured that production efficiency ensures production quality simultaneously.
Description of the drawings
Fig. 1 is one of structural representation of embodiments of the invention；
Fig. 2 is the two of the structural representation of embodiments of the invention；
Numeral is represented in figure：
1 internal layer flexible double-sided plate；
The flexible single-sided plate of 2 internal layers；
3 flexible protective layers, 31 punching positions；
4 adhesive layers.
Specific embodiment
Embodiment：
The present embodiment shows that a kind of ultrathin flexible combines inner cord Copper Foil target frame manufacture method：
Comprise the steps：
1) by the bonding inner layers flexible double-sided plate 1 of adhesive layer 4 and the flexible single-sided plate 2 of internal layer；
2) one layer of flexible protective layer 3 is laid in the flexible single-sided outer layer of plate 2 of internal layer；
3) by the fixed point punching position 31 on flexible protective layer 3；
4) through hole carried out at punching position 31 using rig is made.
Step 3) before need to carry out cutting to reach corresponding size.
Flexible protective layer 3 is drawn by high temperature resistant wheat and is constituted.
Adhesive layer 4 is made up of pure glue-line.
Punch is that fixed point passes through computer fixed-point implementation.
Rig adopts numerical control machining center.
Wherein：
1) by arranging flexible protective layer 3, when carrying out through hole making, rig will not contact the flexible single-sided plate 2 of internal layer
Or internal layer flexible double-sided plate 1, the flexible single-sided plate 2 of internal layer or internal layer flexible double-sided plate 1 will not be caused to damage, it is ensured that product matter
Amount；
2) through hole carried out using rig at punching position behind fixed point punching position on flexible protective layer 3 is made, through hole
The high production efficiency for further ensureing product of make efficiency.
Compared with prior art, the ultrathin flexible of the present embodiment combines inner cord Copper Foil target frame manufacture method, and it can be quick
The quick Fabrication of the corresponding through hole of internal layer flexible double-sided plate 2 and the flexible single-sided plate 1 of internal layer is carried out, and will not be flexible single-sided to internal layer
Plate 2 or the plate of internal layer flexible double-sided plate 1 cause to damage, it is ensured that production efficiency ensures production quality simultaneously.
Above-described is only some embodiments of the present invention.For the person of ordinary skill of the art, not
On the premise of departing from the invention design, some deformations and improvement can also be made, these belong to the protection model of the present invention
Enclose.
Claims (6)
1. a kind of ultrathin flexible combines inner cord Copper Foil target frame manufacture method, it is characterised in that：
Comprise the steps：
1) by adhesive layer bonding inner layers flexible double-sided plate and the flexible single-sided plate of internal layer；
2) one layer of flexible protective layer is laid in the flexible single-sided plate outer layer of internal layer；
3) by the fixed point punching position on flexible protective layer；
4) through hole carried out at punching position using rig is made.
2. a kind of ultrathin flexible according to claim 1 combines inner cord Copper Foil target frame manufacture method, it is characterised in that：Step
It is rapid 3) before need to carry out cutting to reach corresponding size.
3. a kind of ultrathin flexible according to claim 1 combines inner cord Copper Foil target frame manufacture method, it is characterised in that：Institute
State flexible protective layer to be made up of the drawing of high temperature resistant wheat.
4. a kind of ultrathin flexible according to claim 1-3 any one combines inner cord Copper Foil target frame manufacture method, its
It is characterised by：The adhesive layer is made up of pure glue-line.
5. a kind of ultrathin flexible according to claim 4 combines inner cord Copper Foil target frame manufacture method, it is characterised in that：Beat
Hole passes through computer fixed-point implementation for fixed point.
6. a kind of ultrathin flexible according to claim 1 combines inner cord Copper Foil target frame manufacture method, it is characterised in that：Bore
Hole equipment adopts numerical control machining center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611151920.9A CN106612589A (en) | 2016-12-14 | 2016-12-14 | Method for manufacturing inner-layer copper foil target box of ultra-thin flexible combined board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611151920.9A CN106612589A (en) | 2016-12-14 | 2016-12-14 | Method for manufacturing inner-layer copper foil target box of ultra-thin flexible combined board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106612589A true CN106612589A (en) | 2017-05-03 |
Family
ID=58636418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611151920.9A Pending CN106612589A (en) | 2016-12-14 | 2016-12-14 | Method for manufacturing inner-layer copper foil target box of ultra-thin flexible combined board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106612589A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110933846A (en) * | 2019-11-29 | 2020-03-27 | 盐城维信电子有限公司 | Manufacturing method for back-to-back process of coiled material flexible circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101155476A (en) * | 2006-09-28 | 2008-04-02 | 比亚迪股份有限公司 | Preparation method for flexible circuit board |
| US20140318832A1 (en) * | 2011-11-18 | 2014-10-30 | Zhuhai Founder Tech. Hi-Density Electronic Co., Ltd. | Fabrication method of a rigid-flexible circuit board and rigid-flexible printed circuit board |
| CN105307403A (en) * | 2015-12-02 | 2016-02-03 | 深圳市深联电路有限公司 | Method for preventing damage of high frequency circuit board aperture solder mask |
-
2016
- 2016-12-14 CN CN201611151920.9A patent/CN106612589A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101155476A (en) * | 2006-09-28 | 2008-04-02 | 比亚迪股份有限公司 | Preparation method for flexible circuit board |
| US20140318832A1 (en) * | 2011-11-18 | 2014-10-30 | Zhuhai Founder Tech. Hi-Density Electronic Co., Ltd. | Fabrication method of a rigid-flexible circuit board and rigid-flexible printed circuit board |
| CN105307403A (en) * | 2015-12-02 | 2016-02-03 | 深圳市深联电路有限公司 | Method for preventing damage of high frequency circuit board aperture solder mask |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110933846A (en) * | 2019-11-29 | 2020-03-27 | 盐城维信电子有限公司 | Manufacturing method for back-to-back process of coiled material flexible circuit board |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170503 |