CN106141429A - The technique of waste material in a kind of ferrite product hole getting rid of laser - Google Patents

The technique of waste material in a kind of ferrite product hole getting rid of laser Download PDF

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Publication number
CN106141429A
CN106141429A CN201510210567.6A CN201510210567A CN106141429A CN 106141429 A CN106141429 A CN 106141429A CN 201510210567 A CN201510210567 A CN 201510210567A CN 106141429 A CN106141429 A CN 106141429A
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CN
China
Prior art keywords
ferrite
laser
waste
deielectric
cutting
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Granted
Application number
CN201510210567.6A
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Chinese (zh)
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CN106141429B (en
Inventor
邢海
易小雷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yuan Yuan Industrial (Shanghai) Co., Ltd.
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West Unitary Electronic Technology (shanghai) Co Ltd
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Application filed by West Unitary Electronic Technology (shanghai) Co Ltd filed Critical West Unitary Electronic Technology (shanghai) Co Ltd
Priority to CN201510210567.6A priority Critical patent/CN106141429B/en
Publication of CN106141429A publication Critical patent/CN106141429A/en
Application granted granted Critical
Publication of CN106141429B publication Critical patent/CN106141429B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece

Abstract

The present invention relates to the technique of waste material in a kind of ferrite product hole getting rid of laser, (1) utilizes cutting die to punch out the deielectric-coating requiring the internal via shape of processing and position to match with ferrite product to be processed;(2) remove ferrite product to be processed carries film;(3) deielectric-coating is fitted in the glue surface of ferrite product to be processed, then ferrite product is placed on operating board;(4) circuit utilizing laser cutting device design along deielectric-coating carries out cutting process to ferrite product;(5) utilize blanking units to reject waste material remaining in endoporus, complete the processing to ferrite product.Compared with prior art, the present invention can improve the outward appearance of institute's converted products, convenient removal waste material, will not produce residual.

Description

The technique of waste material in a kind of ferrite product hole getting rid of laser
Technical field
The present invention relates to electronic devices and components manufacture field, especially relate to a kind of ferrite getting rid of laser The technique of waste material in holes of products.
Background technology
Along with the diversified trend in market, the diversification that the product material of production and production technology the most also become, Because of the diversification of product material, cause processing space needs according to different materials. design and define different processing Technique.Often there is the bad waste discharge of waste material thus causes asking of bad order in laser ferrite product now Topic.
Chinese patent CN 103537810A discloses the laser drilling of ferrite substrate.At present, band is negative The grounding technology carrying ferrite device the most seriously restricts its large-scale production, and prior art has the most scarce Point, it is impossible to meet future development demand.Laser boring grounding technology has clear superiority, but due to ferrite The hard crisp characteristic of material, uses conventional laser punching micro-crack easily occur or rupture suddenly, and following ferrite The Main Trends of The Development of device be miniaturization, chip type, in high precision, high stable, high reliability.Therefore, Significant by improving the grounding technology of laser boring solution bringing onto load ferrite device.But, should Patent does not the most solve the problem that waste material is got rid of.
Summary of the invention
Defect that the purpose of the present invention is contemplated to overcome above-mentioned prior art to exist and provide a kind of improvement to produce The technique of waste material in the ferrite product hole getting rid of laser of product outward appearance.
The purpose of the present invention can be achieved through the following technical solutions:
The technique of waste material in a kind of ferrite product hole getting rid of laser, employing following steps:
(1) utilize cutting die punch out with ferrite product to be processed require processing internal via shape and position The deielectric-coating matched;
(2) remove ferrite product to be processed carries film;
(3) deielectric-coating is fitted in the glue surface of ferrite product to be processed, then ferrite product is put Put on operating board;
(4) ferrite product is cut by the circuit utilizing laser cutting device design along deielectric-coating Process;
(5) utilize blanking units to reject waste material remaining in endoporus, complete the processing to ferrite product.
Described deielectric-coating be material be the mould release membrance of PET.
Described deielectric-coating is fitted in the surface of ferrite product to be processed through roller bearing.
When utilizing laser cutting device to carry out cutting process, controlling laser power is the 28-34% of peak power, The speed of cutting is 275-372mm/s.
The peak power of described laser cutting device is 50W.
When utilizing blanking units to reject residual waste in endoporus, die-cut pressure is 0.2-0.4MPa, the die-cut time For 2-4s.
Compared with prior art, the present invention can effectively solve ferrite material product after laser In round, the bad order easily caused of waste material, has the advantage that
The hole profile PET mould release membrance of the die-cut size that matches with product. main purpose is to be given up at holes of products position Material film first cuts away. reduce the laser time when radium-shine. outward appearance is had greatly improved.
Glue surface film is changed into die-cut good PET mould release membrance. main purpose is between glue and the film reducing material Viscosity. good waste discharge arranging radium-shine rear waste material when. the bad order caused when reducing in waste discharge.
Radium-shine identical outer shaped position need to go to arrange radium-shine parameter with different figure layers, uses different figure layers to join The radium-shine identical profile of number. radium-shine rear product edge will not have the bad orders such as burr.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in detail.
Embodiment 1
The technique of waste material in a kind of ferrite product hole getting rid of laser, employing following steps:
(1) utilize cutting die punch out with ferrite product to be processed require processing internal via shape and position The deielectric-coating matched, in the present embodiment, the deielectric-coating of use be material be the mould release membrance of PET;
(2) remove ferrite product to be processed carries film;
(3) deielectric-coating is fitted in the surface of ferrite product to be processed, then by ferrite through roller bearing Product is placed on operating board;
(4) utilize the circuit of laser cutting device that peak power the is 50W design along deielectric-coating to ferrum Oxysome product carries out cutting process, technological parameter such as following table when utilizing laser cutting device to carry out cutting process Shown in:
(5) utilizing blanking units to reject waste material remaining in endoporus, die-cut pressure is 0.3MPa, time die-cut Between be 3s, complete the processing to ferrite product.
Embodiment 2
The technique of waste material in a kind of ferrite product hole getting rid of laser, employing following steps:
(1) utilize cutting die punch out with ferrite product to be processed require processing internal via shape and position The mould release membrance of the PET matched;
(2) remove ferrite product to be processed carries film;
(3) deielectric-coating is fitted in the glue surface of ferrite product to be processed, then by ferrite through roller bearing Product is placed on operating board;
(4) ferrite product is cut by the circuit utilizing laser cutting device design along deielectric-coating Processing, laser power is peak power 50W, when utilizing laser cutting device to carry out cutting process, controls laser Power is the 28% of peak power, and the speed of cutting is 275mm/s;
(5) utilizing blanking units to reject waste material remaining in endoporus, die-cut pressure is 0.2MPa, time die-cut Between be 2s, complete the processing to ferrite product.
Embodiment 3
The technique of waste material in a kind of ferrite product hole getting rid of laser, employing following steps:
(1) utilize cutting die punch out with ferrite product to be processed require processing internal via shape and position The mould release membrance of the PET matched;
(2) remove ferrite product to be processed carries film;
(3) deielectric-coating is fitted in the glue surface of ferrite product to be processed, then by ferrite through roller bearing Product is placed on operating board;
(4) ferrite product is cut by the circuit utilizing laser cutting device design along deielectric-coating Processing, laser power is peak power 50W, when utilizing laser cutting device to carry out cutting process, controls laser Power is the 34% of peak power, and the speed of cutting is 372mm/s;
(5) utilizing blanking units to reject waste material remaining in endoporus, die-cut pressure is 0.4MPa, time die-cut Between be 4s, complete the processing to ferrite product.

Claims (6)

1. the technique of waste material in the ferrite product hole getting rid of laser, it is characterised in that use Following steps:
(1) utilize cutting die punch out with ferrite product to be processed require processing internal via shape and position The deielectric-coating matched;
(2) remove ferrite product to be processed carries film;
(3) deielectric-coating is fitted in the surface of ferrite product to be processed, then ferrite product is put Put on operating board;
(4) ferrite product is cut by the circuit utilizing laser cutting device design along deielectric-coating Process;
(5) utilize blanking units to reject waste material remaining in endoporus, complete the processing to ferrite product.
The work of waste material in a kind of ferrite product hole getting rid of laser the most according to claim 1 Skill, it is characterised in that described deielectric-coating be material be the mould release membrance of PET.
The work of waste material in a kind of ferrite product hole getting rid of laser the most according to claim 1 Skill, it is characterised in that described deielectric-coating is fitted in the glue surface of ferrite product to be processed through roller bearing.
The work of waste material in a kind of ferrite product hole getting rid of laser the most according to claim 1 Skill, it is characterised in that when utilizing laser cutting device to carry out cutting process, control laser power is maximum work The 28-34% of rate, the speed of cutting is 275-372mm/s.
The work of waste material in a kind of ferrite product hole getting rid of laser the most according to claim 4 Skill, it is characterised in that the peak power of described laser cutting device is 50W.
The work of waste material in a kind of ferrite product hole getting rid of laser the most according to claim 1 Skill, it is characterised in that when utilizing blanking units to reject residual waste in endoporus, die-cut pressure is 0.2-0.4MPa, The die-cut time is 2-4s.
CN201510210567.6A 2015-04-28 2015-04-28 It is a kind of exclude laser ferrite product hole in waste material technique Expired - Fee Related CN106141429B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510210567.6A CN106141429B (en) 2015-04-28 2015-04-28 It is a kind of exclude laser ferrite product hole in waste material technique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510210567.6A CN106141429B (en) 2015-04-28 2015-04-28 It is a kind of exclude laser ferrite product hole in waste material technique

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CN106141429A true CN106141429A (en) 2016-11-23
CN106141429B CN106141429B (en) 2019-01-01

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202496171U (en) * 2012-01-10 2012-10-17 3M创新有限公司 Drilled sintered ferrite sheet, antenna isolation body and antenna module
CN103200807A (en) * 2012-01-10 2013-07-10 3M创新有限公司 Drilling sintering ferrite sheet, antenna isolation body and antenna module
CN103374309A (en) * 2012-04-23 2013-10-30 日东电工株式会社 Surface protection film
CN203265915U (en) * 2013-04-19 2013-11-06 上海景奕电子科技有限公司 Laser die-cutting jig for electronic product ferrite material die-cutting piece
CN203316915U (en) * 2013-04-19 2013-12-04 上海景奕电子科技有限公司 Novel ferrite laser cutting device
CN103515698A (en) * 2012-06-28 2014-01-15 比亚迪股份有限公司 NFC (Near Field Communication) antenna and electronic equipment
CN103862517A (en) * 2012-12-10 2014-06-18 大连圣锋胶粘制品有限公司 Double-faced adhesive film product die-cutting hole waste discharge process
CN203875959U (en) * 2014-05-27 2014-10-15 东莞劲胜精密组件股份有限公司 Punching die
CN104107984A (en) * 2013-04-19 2014-10-22 上海景奕电子科技有限公司 Laser die-cutting jig for ferrite materials
CN104107983A (en) * 2013-04-19 2014-10-22 上海景奕电子科技有限公司 Novel laser cutting method for ferrite

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202496171U (en) * 2012-01-10 2012-10-17 3M创新有限公司 Drilled sintered ferrite sheet, antenna isolation body and antenna module
CN103200807A (en) * 2012-01-10 2013-07-10 3M创新有限公司 Drilling sintering ferrite sheet, antenna isolation body and antenna module
CN103374309A (en) * 2012-04-23 2013-10-30 日东电工株式会社 Surface protection film
CN103515698A (en) * 2012-06-28 2014-01-15 比亚迪股份有限公司 NFC (Near Field Communication) antenna and electronic equipment
CN103862517A (en) * 2012-12-10 2014-06-18 大连圣锋胶粘制品有限公司 Double-faced adhesive film product die-cutting hole waste discharge process
CN203265915U (en) * 2013-04-19 2013-11-06 上海景奕电子科技有限公司 Laser die-cutting jig for electronic product ferrite material die-cutting piece
CN203316915U (en) * 2013-04-19 2013-12-04 上海景奕电子科技有限公司 Novel ferrite laser cutting device
CN104107984A (en) * 2013-04-19 2014-10-22 上海景奕电子科技有限公司 Laser die-cutting jig for ferrite materials
CN104107983A (en) * 2013-04-19 2014-10-22 上海景奕电子科技有限公司 Novel laser cutting method for ferrite
CN203875959U (en) * 2014-05-27 2014-10-15 东莞劲胜精密组件股份有限公司 Punching die

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Effective date of registration: 20180205

Address after: 201108 No. 103, room 2059, Shanghai City Road, Minhang District, Shanghai

Applicant after: Yuan Yuan Industrial (Shanghai) Co., Ltd.

Address before: Room A201-17 No. 99, building 16, A new town of Pudong New Area Nanhui Lake West Road 201306 in Shanghai City

Applicant before: West unitary Electronic Technology (Shanghai) Co., Ltd.

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