CN106119774A - 一种铝芯导线表面镀硅工艺 - Google Patents
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Abstract
一种铝芯导线表面镀硅工艺,包括表面预处理,清洗、烘干,溅射氮化铝层缓冲层,在缓冲层上蒸镀硅薄层,在纯氮气氛的退火炉中进行退火步骤。通过在铝芯导线表面先溅射一层缓冲层再蒸镀一层硅薄层,使得铝芯导线与硅薄层具有很好的兼容性,克服了金属铝与硅的晶格失配等缺陷,硅薄层使得铝芯导线外表面不易氧化,在与铜线导线连接时不会产生电化腐蚀、发热量小,同时突破了传统输电导线的结构设计,在铝芯导线外表面覆盖一层半导体层再用绝缘层包裹,输电时产生的电能损失更少,即使绝缘外层有破损也不会发生漏电或者引发触电事故,本发明的工艺方法具有工艺路线简单,成本低廉,适宜于大批量生产等优点。
Description
技术领域
本发明涉及铝芯导线制备技术领域,具体涉及一种铝芯导线表面镀硅工艺。
背景技术
铝芯导线与铜芯导线相比具有以下优点:
(1)铝芯导线价格便宜:铜杆是铝杆价格的3.5倍、铜的比重又是铝的3.3倍,所以铝芯导线比铜芯导线便宜很多,适合于低资工程或临时用电。
(2)铝芯导线质轻:铝芯导线的重量是铜芯线的40%,施工运输成本低。
尽管铝导芯线价格便宜,但是铝芯导线易氧化,在空气中与氧反应很快生成一种氧化膜,铜铝连接时会产生电化腐蚀,接头易发热,这限制了铝芯导线的应用。同时铝芯导线与绝缘外套直接接触这种传统结构设计,使得输送电能时在接触截面上产生较大的电损,如果绝缘外套破损,容易发生漏电事故。
发明内容
本发明为解决上述问题,提供一种在铝芯导线表面镀硅工艺,使得铝芯导线抗氧化,在与铜线连接时不产生电化腐蚀,具有很好的稳定性。
本发明所要解决的技术问题采用以下的技术方案来实现:
一种铝芯导线表面镀硅工艺,包括以下步骤:
1)、表面预处理:将铝芯导线置于浸泡液中浸泡10-15min。
2)、清洗、烘干:对铝芯导线表面进行清洗并作烘干处理,烘干温度100-150℃,烘干时间20-30min;
3)、溅射:使用铝源与氮源通过真空溅射方法向铝芯导线表面溅射一层厚度在5-8um的氮化铝层作为缓冲层;
4)、蒸镀:将铝芯导线匀速穿过真空镀膜管,设定蒸镀温度为420-450℃,压力250-300Torr,同时向真空镀膜管内通入硅源和氢气,氢气将硅从硅源中还原为单晶硅并蒸镀在铝芯导线表面,通过控制蒸镀时间使得镀层厚度在10-15um;
5)、退火:在纯氮气氛的石英管式退火炉中进行退火处理,控制氮气流量在30-50L/min,所用氮气纯度在99.99%以上,退火时间25-30min,直至铝芯导线出炉温度在30-40℃范围内。
所述步骤1)中的浸泡液由以下重量份的原料组成:
水100-120份,氯化钠10-15份,氯化钾8-12份,草酸3-5份,苹果汁2-4份,柠檬酸3-6份,高锰酸钾0.5-1.2份,甲酸0.8-2.0份,花生酸0.5-0.7份,蜂花粉0.1-0.4份,月桂酸0.3-0.5份,孢子粉0.2-0.4份,三七粉0.1-0.3份,麻黄碱0.3-0.4份,绿原酸0.1-0.2份,咖啡酸0.3-0.6份。
通过将铝芯导线在浸泡液中浸泡,清除铝芯导线表面的锈渍和各种污秽,同时在表面形成一极细空隙,使得后续溅射在铝芯导线表面的氮化铝层更加稳定致密。
所述步骤2)中清洗用水为反渗透水,使用反射透水能够去除铝芯导线表面氧化层和附着的各种金属离子、杂质。
所述步骤3)中铝源与氮源分别为三甲基铝和氨气。
所述步骤4)中铝芯导线在匀速穿过真空镀膜管时,同时以20-30RPM绕中心轴线旋转,使得表面镀层更加均匀。
所述步骤4)中使用的硅源为硅烷或二氯二氢硅。
本发明的有益效果为:通过在铝芯导线表面先溅射一层缓冲层再蒸镀一层硅薄层,使得铝芯导线与硅薄层具有很好的兼容性,克服了金属铝与硅的晶格失配等缺陷,硅薄层使得铝芯导线外表面不易氧化,在与铜线导线连接时不会产生电化腐蚀、发热量小,同时突破了传统输电导线的结构设计,在铝芯导线外表面覆盖一层半导体层再用绝缘层包裹,输电时产生的电能损失更少,即使绝缘外层有破损也不会发生漏电或者引发触电事故,本发明的工艺方法具有工艺路线简单,成本低廉,适宜于大批量生产等优点。
具体实施方式:
为了使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解,下面结合实施例,进一步阐述本发明。
实施例1
1)、表面预处理:将铝芯导线置于浸泡液中浸泡10min。
2)、清洗、烘干:对铝芯导线表面进行清洗并作烘干处理,烘干温度100℃,烘干时间20min;
3)、溅射:使用铝源与氮源通过真空溅射方法向铝芯导线表面溅射一层厚度在5um的氮化铝层作为缓冲层;
4)、蒸镀:将铝芯导线匀速穿过真空镀膜管,设定蒸镀温度为420℃,压力250Torr,同时向真空镀膜管内通入硅源和氢气,氢气将硅从硅源中还原为单晶硅并蒸镀在铝芯导线表面,通过控制蒸镀时间使得镀层厚度在10um;
5)、退火:在纯氮气氛的石英管式退火炉中进行退火处理,控制氮气流量在30-50L/min,所用氮气纯度在99.99%以上,退火时间25-30min,直至铝芯导线出炉温度在30-40℃范围内。
实施例2
1)、表面预处理:将铝芯导线置于浸泡液中浸泡13min。
2)、清洗、烘干:对铝芯导线表面进行清洗并作烘干处理,烘干温度130℃,烘干时间25min;
3)、溅射:使用铝源与氮源通过真空溅射方法向铝芯导线表面溅射一层厚度在7um的氮化铝层作为缓冲层;
4)、蒸镀:将铝芯导线匀速穿过真空镀膜管,设定蒸镀温度为430℃,压力275Torr,同时向真空镀膜管内通入硅源和氢气,氢气将硅从硅源中还原为单晶硅并蒸镀在铝芯导线表面,通过控制蒸镀时间使得镀层厚度在13um;
5)、退火:在纯氮气氛的石英管式退火炉中进行退火处理,控制氮气流量在30-50L/min,所用氮气纯度在99.99%以上,退火时间25-30min,直至铝芯导线出炉温度在30-40℃范围内。
实施例3
1)、表面预处理:将铝芯导线置于浸泡液中浸泡15min。
2)、清洗、烘干:对铝芯导线表面进行清洗并作烘干处理,烘干温度150℃,烘干时间30min;
3)、溅射:使用铝源与氮源通过真空溅射方法向铝芯导线表面溅射一层厚度在8um的氮化铝层作为缓冲层;
4)、蒸镀:将铝芯导线匀速穿过真空镀膜管,设定蒸镀温度为450℃,压力300Torr,同时向真空镀膜管内通入硅源和氢气,氢气将硅从硅源中还原为单晶硅并蒸镀在铝芯导线表面,通过控制蒸镀时间使得镀层厚度在15um;
5)、退火:在纯氮气氛的石英管式退火炉中进行退火处理,控制氮气流量在30-50L/min,所用氮气纯度在99.99%以上,退火时间25-30min,直至铝芯导线出炉温度在30-40℃范围内。
所述步骤1)中的浸泡液由以下重量份的原料组成:
水100-120份,氯化钠10-15份,氯化钾8-12份,草酸3-5份,苹果汁2-4份,柠檬酸3-6份,高锰酸钾0.5-1.2份,甲酸0.8-2.0份,花生酸0.5-0.7份,蜂花粉0.1-0.4份,月桂酸0.3-0.5份,孢子粉0.2-0.4份,三七粉0.1-0.3份,麻黄碱0.3-0.4份,绿原酸0.1-0.2份,咖啡酸0.3-0.6份。
通过将铝芯导线在浸泡液中浸泡,清除铝芯导线表面的锈渍和各种污秽,同时在表面形成一极细空隙,使得后续溅射在铝芯导线表面的氮化铝层更加稳定致密。
所述步骤2)中清洗用水为反渗透水,使用反射透水能够去除铝芯导线表面氧化层和附着的各种金属离子、杂质。
所述步骤3)中铝源与氮源分别为三甲基铝和氨气。
所述步骤4)中铝芯导线在匀速穿过真空镀膜管时,同时以20-30RPM绕中心轴线旋转,使得表面镀层更加均匀。
所述步骤4)中使用的硅源为硅烷或二氯二氢硅。
以上显示和描述了本发明的基本原理、主要特征和本发明的优点。本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施例和说明书中描述的仅为本发明的优选例,并不用来限制本发明,在不脱离本发明精神和范围的前提下,本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。
Claims (8)
1.一种铝芯导线表面镀硅工艺,其特征在于,包括以下步骤:
1)、表面预处理:将铝芯导线置于浸泡液中浸泡10-15min。
2)、清洗、烘干:对铝芯导线表面进行清洗并作烘干处理,烘干温度100-150℃,烘干时间20-30min;
3)、溅射:使用铝源与氮源通过真空溅射方法向铝芯导线表面溅射一层厚度在5-8um的氮化铝层作为缓冲层;
4)、蒸镀:将铝芯导线匀速穿过真空镀膜管,设定蒸镀温度为420-450℃,压力250-300Torr,同时向真空镀膜管内通入硅源和氢气,氢气将硅从硅源中还原为单晶硅并蒸镀在铝芯导线表面,通过控制蒸镀时间使得镀层厚度在10-15um;
5)、退火:在纯氮气氛的石英管式退火炉中进行退火处理,控制氮气流量在30-50L/min,所用氮气纯度在99.99%以上,退火时间25-30min,直至铝芯导线出炉温度在30-40℃范围内。
2.如权利要求1所述的一种铝芯导线表面镀硅工艺,其特征在于,所述步骤1)中的浸泡液由以下重量份的原料组成:
水100-120份,氯化钠10-15份,氯化钾8-12份,草酸3-5份,苹果汁2-4份,柠檬酸3-6份,高锰酸钾0.5-1.2份,甲酸0.8-2.0份,花生酸0.5-0.7份,蜂花粉0.1-0.4份,月桂酸0.3-0.5份,孢子粉0.2-0.4份,三七粉0.1-0.3份,麻黄碱0.3-0.4份,绿原酸0.1-0.2份,咖啡酸0.3-0.6份。
3.如权利要求1所述的一种铝芯导线表面镀硅工艺,其特征在于:所述步骤2)中清洗用水为反渗透水。
4.如权利要求1所述的一种铝芯导线表面镀硅工艺,其特征在于:所述步骤3)中氮化铝层厚度为5-8um。
5.如权利要求1所述的一种铝芯导线表面镀硅工艺,其特征在于:所述步骤3)中铝源与氮源分别为三甲基铝和氨气。
6.如权利要求1所述的一种铝芯导线表面镀硅工艺,其特征在于:所述硅薄层厚度为10-15um。
7.如权利要求1所述的一种铝芯导线表面镀硅工艺,其特征在于:所述步骤4)中铝芯导线在匀速穿过真空镀膜管时,同时以20-30RPM绕中心轴线旋转。
8.如权利要求1所述的一种铝芯导线表面镀硅工艺,其特征在于:所述步骤4)中使用的硅源为硅烷或二氯二氢硅。
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