CN106109012B - 扼流电介质加载电极端偶极微波天线 - Google Patents
扼流电介质加载电极端偶极微波天线 Download PDFInfo
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Abstract
公开了一种微波天线组件。所述微波天线组件包括:馈线,其包括内导体、外导体和置于其间的内绝缘体;辐射部,其包括偶极天线,所述偶极天线具有近侧部和远侧部,其中所述近侧部包括所述内导体和所述内绝缘体的至少一部分并且所述远侧部包括导电构件;连接插座,其包括连接到所述馈线上的电缆连接器;流体进口端口;流体出口端口;电极端,其具有插入基部并且被连接到所述偶极天线的所述远侧端;以及套管,其连接到所述连接插座和所述电极端,从而环绕所述馈线和所述辐射部限定出腔体,所述腔体适于使电介质冷却液流体流通经过其中。
Description
本申请是申请号为200980103070.7、申请日为2009年1月22日、发明名称为“扼流电介质加载电极端偶极微波天线”的专利申请的分案申请。
交叉参考相关申请
本申请要求由Joseph D.Brannan于2008年1月23日提交的序列号为61/023,031,名称为“扼流电介质加载的电极端偶极微波天线”的美国临时申请的优先权利益,其通过引用被合并于此。
技术领域
本公开一般地涉及在组织切除过程中使用的微波涂药器。更特别地,本公开指向一种具有液体或固体加载的电极端偶极天线的微波涂药器。
背景技术
某些疾病的治疗需要破坏恶性组织生长(例如,肿瘤)。已知的是,肿瘤细胞在比对周围健康的细胞有害的温度稍低的高温下会改变性质。因此,已知的诸如高温疗法的治疗方法,加热肿瘤细胞至高于41℃的温度,同时保持附近的健康细胞在较低的温度以避免不可挽回的细胞损害。这种方法需要应用电磁辐射来加热组织并且包括组织的切除和凝固。特别地,微波能被用于凝固和/或切除组织以使癌细胞改变性质或杀死癌细胞。
微波能经由穿透组织以触及肿瘤的微波切除天线而被应用。有几种类型的微波天线,比如单极和偶极。在单极和偶极天线中,微波能从导体的轴垂直地辐射。单极天线包括单一的、伸长的微波导体。偶极天线可具有包括由电介质部分隔开的内导体和外导线的同轴结构。更特别地,偶极微波天线可具有沿着天线的纵轴延伸的长的、细的内导体并且被外导线围绕。在某些变型例中,外导体的一部分或多部分可选择性地去除以提供更加有效的能量的向外辐射。这种类型的微波天线结构被典型地称为“有漏波导”或“漏泄同轴”天线。
常规的微波天线具有窄的工作带宽和实现最佳工作效率的波长范围,因此,不能保持预定的在微波传送系统(例如发生器、电缆等)和围绕微波天线的组织之间的阻抗匹配。更特别地,当微波能被应用于组织时,直接围绕微波天线的组织的介电常数由于组织被加热(cooked)而减小。此减少引起正被应用于组织的微波能的波长增加超过天线的带宽。因此,在常规的微波天线的带宽和正被应用的微波能之间存在失配。从而,窄带微波天线可能失谐阻碍有效的能量传送和分散。
发明内容
根据本公开的一种方案,一种微波天线组件被公开。天线组件包括:不平衡偶极天线;短路扼流圈,其具有延伸经过导体层的电介质层;以及连接插座,其连接到用于使电介质冷却液流体流通经过天线组件的冷却液系统。
根据本公开的另一种方案,一种微波天线组件被公开。天线组件包括具有内导体、外导体和置于其间的内绝缘体的馈线。辐射部被包括,其具有不平衡偶极天线,不平衡偶极天线具有近侧部和比近侧部长的远侧部。近侧部包括内导体和内绝缘体的至少一部分,远侧部包括导电构件。天线组件还包括环绕馈线的至少一部分布置的扼流圈。扼流圈包括内电介质层和外传导层,其中外传导层被短接到馈线的外导体上,并且内电介质层延伸经过外传导层。组件进一步包括布置在馈线和辐射部上方的套管,套管环绕馈线和辐射部限定出腔体,腔体适于使电介质冷却液流通经过其中。
根据本公开的另外的方案,一种微波天线组件被公开。天线组件包括:馈线,其具有内导体、外导体和置于其间的内绝缘体;以及辐射部,其包括不平衡偶极天线,不平衡偶极天线具有近侧部和有不同长度的远侧部。近侧部包括内导体和内绝缘体的至少一部分,并且远侧部包括导电构件。天线组件还包括环绕馈线的至少一部分布置的扼流圈。扼流圈包括内电介质层和外传导层,其中外传导层被短接到馈线的外导体上,并且内电介质层延伸经过外传导层。天线组件进一步包括:冷却套,其布置在馈线上方且环绕馈线限定近侧腔体,腔体适于使电介质冷却液流体流通经过其中;以及固体电介质加载,其具有限定在其中的中央腔体且适于安装在辐射部附近,固体电介质加载从冷却套延伸出。
附图说明
当结合附图时,根据下面的详细描述本公开的以上和其它方案、特征、以及优点将变得更加明显,其中:
图1是根据本公开的一个实施例的微波切除系统的示意图;
图2是根据本公开的微波天线组件的立体横截面图;
图3是图2的微波天线组件的一部分的放大横截面;
图4是图2的微波天线组件的一部分的放大横截面;
图5是图2的微波天线组件的馈线的远侧部的侧视图;
图6是根据本公开的一个实施例的平衡偶极天线的示意图;
图7是根据本公开的一个实施例的不平衡偶极天线的示意图;
图8是图2的微波天线组件的不平衡偶极天线的侧视图;
图9是图2的微波天线组件的远侧端的放大横截面;
图10是图2的微波天线组件的辐射部的侧视图;
图11是图2的微波天线组件的电极端和套管的侧视图;
图12是图2的微波天线组件的馈线的近侧端的侧视图;
图13是图2的微波天线组件的连接插座和近侧端的横截面图;
图14是图2的微波天线组件的流入管的示意视图;
图15是根据本公开的一个实施例的微波天线组件的侧视图;
图16和17是图15的微波天线的立体横截面图;以及
图18是图15的微波天线的横截面放大立体图。
具体实施方式
下面在这里将参考附图对本公开的特定实施例进行描述。在下面的描述中,对众所周知的功能或结构不进行详细描述以避免使本公开被不必要的细节所遮掩。
图1示出微波切除系统10,其包括经由柔性同轴电缆16连接到微波发生器14上的微波天线组件12。发生器14被配置为以从大约500MHz至大约5000MHz的工作频率来提供微波能。
天线组件12通常包括辐射部18,其可以由馈线20(或轴)连接到电缆16上。更特别地,天线组件12通过连接插座(hub)22连接到电缆16上。连接插座22还包括以流体连接的方式与套管38连接的流体出口端口30和流体进口端口32。套管38包住辐射部18和馈线20以允许来自端口30和32的冷却液流体被提供并且环绕天线组件12而流动。而且端口30和32连接到供给泵34上,供给泵34又连接到供给箱36上。供给箱36存储冷却液流体并且使流体保持在预定的温度。在一个实施例中,供给箱36可包括冷却液单元,其冷却从天线组件12返回的液体。在另一个实施例中,冷却液流体可以是气体和/或流体和气体的混合物。
组件12还包括具有锥形端24的电极端(tip)48,在一个实施例中锥形端24终止于尖头端26处以允许在辐射部18的远侧端处以最小的阻力插入组织。在那些辐射部18被插入预先存在的开口的情况下,电极端48可以是圆的或平的。
图2示出具有不平衡偶极天线40的天线组件12的辐射部18。偶极天线40被连接到将天线组件12电连接到发生器14上的馈线20上。如图3至4所示,馈线20包括由内绝缘体52围绕的内导体50(例如金属线),内绝缘体52然后被外导体56(例如,圆筒状的导电套管)围绕。内导体和外导体可由铜、金、不锈钢或其它具有相似的电导率值的导电金属构成。该金属可镀有其它材料,如其它导电材料,以提高它们的特性,例如提高导电率或减小能量损失等。在一个实施例中,馈线20可由具有0.047”外径的额定用于50欧姆的金属线的同轴半刚性电缆或同轴柔性电缆形成。
偶极天线40包括通过在馈电点46处的电介质隔离件相互连接的近侧部42和远侧部44。远侧部44和近侧部42具有不同的、不相等的长度使得偶极天线40为不平衡的。在一个实施例中,如图7所示,远侧部44可以比近侧部42长。近侧部42由内导体50和内绝缘体52形成,内导体50和内绝缘体52延伸到外导体56的外侧,如图4所最佳示出。在一个实施例中,其中馈线20由同轴电缆形成,外导体56和内绝缘体52可被切掉以露出内导体50,如图5所示。
远侧部44包括可由诸如金属(例如铜、不锈钢、锡以及其各种合金)的任何类型的导电材料形成的导电构件45。远侧部44可具有实心结构并且可由实芯线(例如10AWG)形成。在另一个实施例中,远侧部44可由同轴电缆的外导线的中空套筒或另外的圆筒状导体形成。圆筒状导体之后可填充焊料以使圆筒变成实心轴。更特别地,焊料可被加热至足够的温度以使在圆筒状导体内的焊料液化(例如500°F)从而制造出实心轴。
在另一个实施例中,近侧部42也可由实芯线或填充有焊料的圆筒状导体形成。近侧部42此后被连接到内导体50上,如图4所示。这可通过将近侧部42焊接到内导体50的远侧端实现,例如通过熔化近侧部42的焊料并且将内导体50插入其中。
在一些实施例中,不平衡偶极天线40在切除期间提供更好的阻抗匹配。切除期间组织性质的变化使微波切除天线的实部阻抗匹配变得复杂。在切除的整个过程中,由于合成的(resulting)动态电流和电压关系,偶极上的给定位置的实际阻抗发生改变。图6示出使用包括等长度的两部分的半波偶极天线在匹配实部阻抗中的困难,在偶极的中心处电压减到最小并且电流达到最大。然而,实部阻抗在近侧部42和远侧部44的端部减到最小和达到最大。与此相反,本公开的不平衡偶极天线40使得馈电点实部阻抗和电缆16之间的阻抗差在整个切除期间的积分最小化。如图7所示,不平衡半波偶极通过使近侧部42和远侧部44之间的空隙远离偶极天线40的中心而布置,来提供初始阻抗对实部阻抗的更好匹配。在一个实施例中,远侧部40的长度大约为40mm以最小化组件12的回波损耗。
图8示出连接到近侧部42上的远侧部44。远侧部44可被焊接到近侧部42的内导体50上以在其间建立机电接触。在一个实施例中,其中远侧部44由填充有焊料材料的中空圆筒状导体形成,通过液化远侧部44的焊料且将内导体50的远侧端插入其中,远侧部44可连接到近侧部42上。内导体50的远端部的一部分被插入远侧部44使得偶极馈电空隙(feedgap)“G”在馈电点46处保持在近侧部42和远侧部44之间。空隙“G”可为从大约1mm至大约3mm。天线的偶极馈电空隙是同轴场模式在传输到自由空间时遇到的第一个结构。因而空隙在回波损耗或者系统对天线的阻抗匹配中具有重要的作用。在一个实施例中,空隙“G”随后被填充电介质材料以在馈电点46处形成电介质隔离件。在另一个实施例中,内绝缘体52被延伸到馈电点46内。电介质材料可以是诸如由德国威明顿的杜邦公司销售的的聚四氟乙烯(PTFE)。在另一个实施例中,如图4所示,空隙“G”可通过电介质密封敷层而被涂敷,这将在下文更详细地论述。
如图2和9所示,远侧部44被连接到电极端48上,电极端48可由多种适于穿透组织的耐热材料形成,比如金属(例如不锈钢)和各种热塑性材料,比如聚醚酰亚胺,聚酰胺热塑性树脂,其一个示例为由美国康涅狄格州费尔菲德市通用电气公司销售的电极端48可以由各种杆状材料(stock rod)加工以获得需要的形状。电极端48可使用诸如环氧密封件49的各种粘合剂而被连接到远侧部44上。如果电极端48为金属,电极端48可被焊接到远侧部44上。
图11示出电极端48的各种形状和样式,即不锈钢电极端48a和电介质电极端48b。电极端48a和48b两者都包括具有比电极端48a和49的直径小的外径的插入基部51,以允许更容易地插入套管38。这种结构还在电极端48和套管38之间提供更好的密封,这将在下文更详细地论述。
参考图2和3,天线组件12还包括扼流圈60。扼流圈60环绕馈线20布置并且包括内电介质层62和外传导层64。在一个实施例中,扼流圈60为在近侧定位的四分之一波长短路扼流圈。通过使用环绕由电介质层隔开的馈线20的外导体56的外传导层64,扼流圈60实施为四分之一波长短路。扼流圈60通过焊接或其它方法在扼流圈60的近侧端被短接到馈线20的外导体56上。在一个实施例中,电介质层32由诸如四氟乙烯、全氟丙烯等的含氟聚合物形成,并且具有0.005英寸的厚度。外传导层34可由诸如高导电金属(例如铜)的所谓的“理想导体”材料形成。
在实施例中,扼流圈60可以是四分之一波长短路扼流圈、半波长开路扼流圈、以及反相四分之一波长短路扼流圈或空隙消除扼流圈。扼流圈60限制从发生器14到组件12的辐射部20的微波能,从而限制沿着馈线20的微波能沉积区域长度。扼流圈28提供高阻抗给沿着传导馈线20的外侧向下传导的微波能,从而限制对天线末端的能量沉积。
置于天线组件12上的近侧部42的高阻抗点的短路四分之一波扼流圈使天线电流局限在组件12的辐射段18,由于几乎球形的功率耗散区域从而减小了长度并且最大化了切除的横截面直径。
电介质层62的电介质朝向组件12的远侧端延伸经过扼流圈导体层64,如图10所示。在一个实施例中,电介质层62可以延伸过扼流圈导体层64大约6mm。这种延伸的电介质通过将电容置于偶极的近侧部42和扼流圈导体层64的外表面之间来改进扼流圈60的性能,从而阻止电流跨接到扼流圈导体层64上。由电介质形成的电容对微波电流是高阻抗势垒,以便完全避免扼流圈结构,否则微波电流会从近侧部42跨接到扼流圈60靠近其入口的外表面。作为代替,这些电流通过电容被引入四分之一波扼流圈60,从而提高它的有效性。
如上面所论述的,由于组织脱水而导致的波长增加使得在近侧部42上的高阻抗点沿着组件12向近侧移动。有效的扼流圈必须在这个可变的点处呈现高阻抗。延伸的电介质有效地作为可变位置扼流圈,覆盖这个点所变动的范围,在近侧部42的高阻抗点保持在延伸的电介质边界内时维持扼流圈的有效性。电介质层62可以延伸到扼流圈传导层64和馈电点46之间的任意长度处。
在一个实施例中,电介质层62可以通过应用诸如5/64”厚的PTFE热缩塑料包的电介质收缩材料于外导体56上形成。一旦热缩塑料包材料环绕外导体56布置,材料被加热使得材料被熔化并且围绕外导体56设置。加热可以通过热风鼓风机来完成,热风鼓风机能够提供大约750°F的热风流。可应用PTFE热缩塑料包的多个层并且连续地加热以形成期望厚度的电介质层62。在一个实施例中,应用了PTFE热缩塑料包的三个或更多层。
如图3和10所示,导体层64可通过应用导电的金属箔(例如铜)的一个或更多层于电介质层62上而形成。箔可延伸经过电介质层62的近侧端,如图12所示。箔使用各种类型的粘合剂(例如紫外线活性胶、环氧树脂等)可接附到电介质层62上。在一个实施例中,延伸经过电介质层62的箔的近侧端通过所谓的“绕接”技术可接附到馈线20上以便提供可靠的电连接至箔和馈线20,如图12所示。金属线在箔开始向下经过电介质层62而逐渐变细的位置处卷绕在铜箔上。金属线被缠绕后,沿着缠绕的整个长度将金属线自身相焊接以便固定金属线并且防止金属线解绕。在另一个实施例中,其它方法可被用来将箔固定到馈线20上,例如,中空圆筒可环绕着颈缩经过电介质层62的过量箔而放置。在进一步的实施例中,箔可基本上与电介质层62等长以避免需要将箔的近侧端固定到馈线20上。
组件12还包括连接插座22,如图13中所更详细示出。连接插座22包括电缆连接器79和流体端口30和32。连接插座22可包括三分支鲁尔型连接器72,具有被用来容纳电缆连接器70的中指74和分别容纳流体出口端口30和流体进口端口32的左指76和右指78。连接插座22还包括布置在中指74的远侧端的基部81。
组件12还包括如图1、13和14所示的有源冷却液系统。更特别地,组件12包括包住馈线20的套管38、从电极端48至基部81的辐射部18。冷却液由泵34供给并且在辐射部18、馈线20和套管38之间的空间中流通。由于辐射部18和馈线20与冷却液直接接触,因此组件12的这些部件应当被密封以防止任何流体在其中渗漏。这可通过应用任何类型的使用常规的注射成型和螺旋挤压技术的热熔加工的聚合体来实现。在一个实施例中,氟化乙丙烯(FEP)热缩塑料包的套筒可被应用于整个组件12上,即馈线20和辐射部18,如图1所示。FEP套筒然后被加热以密封馈线20和辐射部18。所得的FEP密封件防止任何冷却液流体渗入组件12。FEP套筒可在应用外传导层64之前或之后被应用。另外,FEP还可被应用在内导体50和内绝缘体52延伸经过外导体56的位置处,从而产生真空53,如图4所示。
套管38可以是任何类型的刚性管,如由聚酰亚胺和其它类型的聚合体制作的导管。套管38可通过以下方式被组装:首先将电极端48固定到套管38的远侧端,然后将组合的套管和电极端的组件插入到组件12上。套管38还被固定到连接插座22的基部81和电极端48上,使得套管38与连接插座22流体连接并且在基部81和电极端48之间限定出腔体89。
流入管86可以包括一个或更多个流入管86a和86b。流入管86a和86b可以是具有足够的外径以安装在馈线20和套管38之间的腔体89(图4和9)的内部的任何类型的柔性管。流入管86a和86b被插入经过流体出口端口30。更特别地,流入管86a差不多被插到远侧部44的远侧端并且流入管86b被插到接近于馈电点46,如图14所示。流入管86a和86b然后被固定到辐射部18上(例如使用环氧树脂、胶水等)。流入管86a和86b被定位在这种结构中以便提供经过套管38的最佳冷却液流。来自流入管86a的流体流被喷射入电极端48并且沿近侧方向折回。来自流入管86b的流体流沿着辐射部18提供冷却液。在工作期间,泵34经过流入管86a和86b供给流体到组件12,从而使冷却液流通经过包括连接插座22的组件12的整个长度。然后流体通过流体出口端口32从中指74和左指76被抽回。
上述的冷却液系统提供经过天线组件12的整个长度的电介质冷却液流体(例如盐水、去离子水等)的流通。电介质冷却液流体带走了由组件12产生的热量。另外,电介质冷却液流体充当用于组件12的缓冲并且避免组件12的近场电介质性质因组织电介质性质的变化而改变。当在切除期间应用微波能时,环绕辐射部18的组织的脱水导致组织复介质常数下降了很多倍(例如大约10)。介电常数(er`)下降增加了组织中微波能的波长,这显著影响了无缓冲的微波天线组件的阻抗,从而使天线组件与系统阻抗失配(例如电缆16和发生器14的阻抗)。波长的增加还导致功率耗散区域,该区域沿着组件12的长度比横截面直径长很多。组织电导率(er``)的减小还影响组件12的阻抗的实部。根据本公开的流体电介质缓冲还缓和了传送能量的波长的增加和近场电导率的下降,从而减少组件12的阻抗的改变,不管组织状态而允许更多一致的天线对系统的阻抗匹配和球形功率耗散区域。
波长变化的缓冲还允许更有效的扼流网络。扼流圈必须被置于近侧部42的端部上的在弱电流点处或高阻抗点处。在扼流的湿电极端中具有波长缓冲的条件下,偶极辐射段上的半波长电流图形被维持,使得高阻抗点的位置较少变化因而允许更有效的扼流圈网络。共同地,电缆冷却和电介质缓冲允许有目标的和有效的能量传送到组织以使几乎球形的切除区域和快速的切除时间成为可能。盐水或去离子水能与组件12一起使用。
图15-18示出微波天线组件112的另一个实施例,其具有辐射部118和将组件112连接到电缆16上的馈线120。更特别地,天线组件112通过连接插座122连接到电缆16上,连接插座122包括流体出口端口130和流体进口端口132。
图16和17示出天线组件112的辐射部118,其具有不平衡偶极天线140,其中套管38由金属管(例如冷却套200)和固体电介质加载(loading)190代替。偶极天线140连接到馈线120上,馈线120将天线组件112电连接到发生器14上。如图18所示,与馈线20相似,馈线120包括由内绝缘体152围绕的内导体150(例如金属线),内绝缘体152又被外导体156(例如圆筒状导电套管)围绕。
偶极天线140包括通过在馈电点146处的电介质隔离件相互连接的近侧部142和远侧部144。远侧部144包括导电构件145。远侧部144和近侧分142具有不同的、不相等的长度使得偶极天线140为不平衡的。近侧部142由内导体150和内绝缘体152形成,内导体150和内绝缘体152延伸到外导体156的外侧。在一个实施例中,其中馈线120由同轴电缆形成,外导体156和内绝缘体152可被切掉以露出内导体150,如图18所示。
远侧部144可由诸如金属(例如铜、不锈钢、锡以及其各种合金)的任何类型的导电材料形成。部144可具有实心结构并且可由实芯线(例如10AWG)或填充有与组件12的部44相似的焊料的圆筒状导体形成。近侧部144其后被连接到内导体150上。
参考图16-18,天线组件112还包括扼流圈160。扼流圈160环绕馈线120布置并且包括内电介质层162和外导体层164。在一个实施例中,扼流圈160为近侧定位的四分之一波短路扼流圈,其通过焊接或其它方法在扼流圈160的近侧端被短接到馈线120的外导体156上。电介质层162的电介质朝向组件112的远侧端延伸经过扼流圈导体层164。
组件112还包括连接插座122,如图15所示。连接插座122包括电缆连接器179和流体出口130和流体进口端口132。连接插座122可包括三分支鲁尔型连接器172,具有被用来容纳电缆连接器179的中指174和分别容纳流体出口端口130和流体进口端口132的左指176和右指178。电缆连接器179在馈线120的近侧端处被连接到内导体152和外导体156上,内导体152和外导体156延伸到外导体156的外侧。连接插座122还包括布置在中指174的远侧端的基部181。在一个实施例中,组件112包括一个或更多个流入管186,其通过右指178被供给。
组件112包括布置在偶极天线140上方的固体电介质加载190,以替代组件112的液体电介质材料。固体电介质加载190从扼流圈导体层164的端点延伸。更特别地,组件112包括在扼流圈导体层164的远侧端上方的液封192。在一个实施例中,加载190可通过胶水和其它方法连接到密封件192上。
加载190可为具有限定在其中的中央腔体198且适于插在天线140上的圆筒状。加载190还可具有带有尖头电极196的锥形端194,从而避免需要电极端48。加载190还可在腔体198内连接到天线140的远侧端(例如在其远侧部144处)。腔体198可具有根据其横截面形状适于安装在天线140上的大致的圆筒形状。另外,腔体198包括近侧部197和远侧部199,其中近侧部197具有比远侧部199大的内径,以容纳扼流圈电介质层162。扼流圈层162可延伸到扼流圈传导层164和馈电点146之间的任意长度处。为容纳延伸的扼流圈层162,近侧部197的深度相应地改变。
加载190具有大致等于馈线120的厚度的外径和大致等于偶极天线140的直径的内径。由于加载190布置在偶极天线140上并且没有冷却液流体将与之接触,因此天线140可不覆盖电介质热缩塑料包来密封它的部件。
在一个实施例中,加载190的电介质材料可具有从大约2.5和150的介电常数并且可由陶瓷材料制成,例如氧化铝陶瓷或塑料材料,例如聚酰胺塑料(例如从特拉华(州)威明顿的杜邦公司可得到的)。加载190在辐射部118和组织之间充当电介质缓冲,使得虽然组织的电特性在切除期间发生变化,但天线组件112在整个切除过程中仍保持半波谐振和与能量传送系统(例如发生器14、电缆16等)的阻抗匹配。
天线组件112还包括布置在基部181和密封件192之间的冷却套200。冷却套200可由不锈钢或其它适合的医用金属形成。冷却套200在扼流圈导体层164和冷却套200之间限定出近侧腔体201,电介质冷却液流体通过连接插座122被供给到近侧腔体201内。更特别地,与管86a和86b相似的一个或更多个流入管186可延伸到腔体201内以使电介质冷却液流体流通经过冷却套200。密封件192被布置在冷却套200和扼流圈导体层164的远侧端处的冷却套200和扼流圈导体层164之间。密封件192可由任何类型的适于将腔体201与加载190密封隔离的电介质(例如合成橡胶)和/或导电材料形成。
本公开的所述实施例意图为说明性的而非限制性的,并且没有意图描述本公开的每一个实施例。在不背离如下面的权利要求书中既以字面又以惯例认可的等同所阐述的本公开的精神或范围的情况下,能够进行各种改进和变型。
Claims (13)
1.一种微波天线组件,其包括:
馈线,其包括内导体、外导体和置于其间的内绝缘体;
辐射部,其包括不平衡偶极天线,所述不平衡偶极天线具有近侧部和比所述近侧部长的远侧部,其中所述近侧部包括所述内导体和所述内绝缘体的至少一部分并且所述远侧部包括导电构件;
连接插座,其包括连接到所述馈线上的电缆连接器;
流体进口端口;
流体出口端口;
电极端,其具有插入基部并且被连接到所述不平衡偶极天线的所述远侧端;以及
套管,其连接到所述连接插座和所述电极端,从而环绕所述馈线和所述辐射部限定出腔体,所述腔体适于使电介质冷却液流体流通经过其中,
所述微波天线组件进一步包括:环绕所述馈线的至少一部分布置的扼流圈,其中
所述扼流圈包括内电介质层和外传导层,并且
所述内电介质层向远侧延伸经过所述外传导层。
2.一种微波天线组件,其包括:
馈线,其包括内导体、外导体和置于其间的内绝缘体;
辐射部,其包括不平衡偶极天线,所述不平衡偶极天线具有近侧部和比所述近侧部长的远侧部,其中所述近侧部包括所述内导体和所述内绝缘体的至少一部分并且所述远侧部包括导电构件;
连接插座,其包括连接到所述馈线上的电缆连接器;
流体进口端口;
流体出口端口;
扼流圈,其环绕所述馈线的至少一部分布置;
密封件,其环绕所述扼流圈的所述外传导层的远侧端布置;以及
冷却套,其连接到所述连接插座和所述密封件上从而环绕所述馈线限定出近侧腔体,其中
所述扼流圈包括内电介质层和外传导层,并且
所述内电介质层向远侧延伸经过所述外传导层。
3.一种微波天线组件,其包括:
馈线,其包括内导体、外导体和置于其间的内绝缘体;
辐射部,其包括不平衡偶极天线,所述不平衡偶极天线具有近侧部和比所述近侧部长的远侧部,其中所述近侧部包括所述内导体和所述内绝缘体的至少一部分并且所述远侧部包括导电构件;
冷却套,其布置在所述馈线的上方且环绕所述馈线限定出腔体,所述腔体适于使电介质冷却液流体流通经过其中;以及
固体电介质加载,其具有限定在其中的中央腔体且适于安装在所述辐射部附近,所述固体电介质加载从所述冷却套延伸出,
所述微波天线组件进一步包括:环绕所述馈线的至少一部分布置的扼流圈,其中
所述扼流圈包括内电介质层和外传导层,并且
所述内电介质层向远侧延伸经过所述外传导层。
4.根据权利要求1所述的微波天线组件,其中所述外传导层被短接到所述馈线的所述外导体上。
5.根据权利要求1所述的微波天线组件,其中所述内电介质层选自四氟乙烯和全氟丙烯组成的集合。
6.根据权利要求1所述的微波天线组件,进一步包括:
至少一个流入管,其连接到所述流体进口端口并且布置在所述腔体内以向其供给电介质冷却液流体;以及
至少一个流出管,其连接到所述流体出口端口并且与所述腔体流体连接以从其抽回所述电介质冷却液流体。
7.根据权利要求2所述的微波天线组件,进一步包括:
固体电介质加载,其具有限定在其中的中央腔体且适于安装在所述辐射部附近,所述固体电介质加载被连接到所述密封件上。
8.根据权利要求7所述的微波天线组件,其中所述固体电介质加载由具有从大约2.5至大约150的介电常数的电介质材料形成。
9.根据权利要求2所述的微波天线组件,进一步包括:
至少一个流入管,其被连接到所述流体进口端口并且布置在所述近侧腔体内以向其供给电介质冷却液流体;以及
至少一个流出管,其被连接到所述流体出口端口并且与所述近侧腔体流体连接以从其抽回所述电介质冷却液流体。
10.根据权利要求1所述的微波天线组件,其中所述套管是聚酰亚胺导管。
11.根据权利要求1所述的微波天线组件,其中所述电极端具有插入基部、锥形端以及尖头端。
12.根据权利要求3所述的微波天线组件,进一步包括连接插座,其包括连接到所述馈线上的电缆连接器、流体进口端口和流体出口端口,其中所述冷却套被连接到所述连接插座上并且环绕所述馈线。
13.根据权利要求3所述的微波天线组件,其中所述冷却套由医用金属形成。
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CN200980103070.7A CN101926046B (zh) | 2008-01-23 | 2009-01-22 | 扼流电介质加载的电极端偶极微波天线 |
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EP2736122B1 (en) | 2016-05-25 |
CN101926046A (zh) | 2010-12-22 |
US20150133908A1 (en) | 2015-05-14 |
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WO2009094422A1 (en) | 2009-07-30 |
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US8945111B2 (en) | 2015-02-03 |
CA2712776A1 (en) | 2009-07-30 |
AU2009206445A1 (en) | 2009-07-30 |
EP2736122A1 (en) | 2014-05-28 |
US10743934B2 (en) | 2020-08-18 |
US20120194409A1 (en) | 2012-08-02 |
EP2245702B8 (en) | 2014-06-11 |
CN106109012A (zh) | 2016-11-16 |
KR20110005234A (ko) | 2011-01-17 |
US9861439B2 (en) | 2018-01-09 |
CN101926046B (zh) | 2016-09-14 |
US10058384B2 (en) | 2018-08-28 |
CA2712776C (en) | 2016-06-21 |
AU2009206445B2 (en) | 2013-12-05 |
EP2245702A4 (en) | 2011-04-20 |
JP2011511538A (ja) | 2011-04-07 |
KR101521957B1 (ko) | 2015-05-20 |
US20200360087A1 (en) | 2020-11-19 |
EP2731196A1 (en) | 2014-05-14 |
EP2245702A1 (en) | 2010-11-03 |
US20190000548A1 (en) | 2019-01-03 |
EP2731196B1 (en) | 2016-03-30 |
EP3026756A1 (en) | 2016-06-01 |
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