CN106105403A - 表面涂层 - Google Patents

表面涂层 Download PDF

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Publication number
CN106105403A
CN106105403A CN201480074578.XA CN201480074578A CN106105403A CN 106105403 A CN106105403 A CN 106105403A CN 201480074578 A CN201480074578 A CN 201480074578A CN 106105403 A CN106105403 A CN 106105403A
Authority
CN
China
Prior art keywords
chamber
monomer
electrode layer
coating
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480074578.XA
Other languages
English (en)
Chinese (zh)
Inventor
F.莱盖因
E.罗格
P.马腾斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUROPE PLASMA NV
Original Assignee
EUROPE PLASMA NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUROPE PLASMA NV filed Critical EUROPE PLASMA NV
Publication of CN106105403A publication Critical patent/CN106105403A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/52—Polymerisation initiated by wave energy or particle radiation by electric discharge, e.g. voltolisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/16—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/62—Plasma-deposition of organic layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
  • Chemical Vapour Deposition (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Plasma Technology (AREA)
CN201480074578.XA 2013-12-10 2014-12-10 表面涂层 Pending CN106105403A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1321792.2A GB2521137A (en) 2013-12-10 2013-12-10 Surface Coatings
GB1321792.2 2013-12-10
PCT/EP2014/077233 WO2015086682A1 (en) 2013-12-10 2014-12-10 Surface coatings

Publications (1)

Publication Number Publication Date
CN106105403A true CN106105403A (zh) 2016-11-09

Family

ID=50000466

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480074578.XA Pending CN106105403A (zh) 2013-12-10 2014-12-10 表面涂层

Country Status (11)

Country Link
US (1) US20160324011A1 (enExample)
EP (1) EP3081058A1 (enExample)
JP (1) JP2017509137A (enExample)
KR (1) KR20160097326A (enExample)
CN (1) CN106105403A (enExample)
AU (1) AU2014363543A1 (enExample)
BE (1) BE1021398B1 (enExample)
CA (1) CA2933390A1 (enExample)
GB (1) GB2521137A (enExample)
IL (1) IL246178A0 (enExample)
WO (1) WO2015086682A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108080228A (zh) * 2017-10-26 2018-05-29 中国船舶重工集团公司第七二五研究所 一种线路板防水防腐涂层及其制备方法
CN109686672A (zh) * 2017-10-18 2019-04-26 上海稷以科技有限公司 在物体表面形成保护层的方法及表面形成有保护层的产品

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201601221D0 (en) * 2016-01-22 2016-03-09 Semblant Ltd Coated electrical assembly
CN106216192A (zh) * 2016-08-30 2016-12-14 无锡荣坚五金工具有限公司 一种管状大容积等离子体聚合涂层装置
JP2018204054A (ja) * 2017-05-31 2018-12-27 住友金属鉱山株式会社 金属部材の製造方法、プリント基板の製造方法、金属部材及びプリント基板
DE102017119233A1 (de) * 2017-08-23 2019-02-28 Dr. O. K. Wack Chemie Gmbh Verfahren zum Überprüfen der Geschlossenheit einer auf eine elektronische Baugruppe aufgebrachten Schutzbeschichtung
EP3680029B1 (en) * 2019-01-09 2023-06-07 Europlasma nv A plasma polymerisation method for coating a substrate with a polymer
CN114535029A (zh) * 2022-02-24 2022-05-27 深圳市技高美纳米科技有限公司 纳米防水薄膜制备方法和制备系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020016408A1 (en) * 2000-06-29 2002-02-07 Michihiro Sugo Polyimide silicone resin, its solution composition, and polyimide silicone resin film
CN102821873A (zh) * 2010-01-22 2012-12-12 欧洲等离子公司 通过低压等离子体工艺施加保形纳米涂层的方法
US20130033825A1 (en) * 2010-02-23 2013-02-07 Semblant Limited Plasma-Polymerized Polymer Coating
WO2013034920A2 (en) * 2011-09-07 2013-03-14 Europlasma Nv Surface coatings

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA884511B (en) * 1987-07-15 1989-03-29 Boc Group Inc Method of plasma enhanced silicon oxide deposition
US4981713A (en) * 1990-02-14 1991-01-01 E. I. Du Pont De Nemours And Company Low temperature plasma technology for corrosion protection of steel
DE9206834U1 (de) * 1992-02-21 1993-06-17 Robert Bosch Gmbh, 70469 Stuttgart Anschlußteil
US7673970B2 (en) * 2004-06-30 2010-03-09 Lexmark International, Inc. Flexible circuit corrosion protection
GB2510213A (en) * 2012-08-13 2014-07-30 Europlasma Nv Forming a protective polymer coating on a component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020016408A1 (en) * 2000-06-29 2002-02-07 Michihiro Sugo Polyimide silicone resin, its solution composition, and polyimide silicone resin film
CN102821873A (zh) * 2010-01-22 2012-12-12 欧洲等离子公司 通过低压等离子体工艺施加保形纳米涂层的方法
US20130033825A1 (en) * 2010-02-23 2013-02-07 Semblant Limited Plasma-Polymerized Polymer Coating
WO2013034920A2 (en) * 2011-09-07 2013-03-14 Europlasma Nv Surface coatings

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
K. SCHMIDT-SZALOWSKI: "thin films deposition from hexamethyldisiloxane and hexamethyldisilazane under dielectric-barrier discharge (DBD) conditions", 《PLASMAS AND POLYMERS》 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109686672A (zh) * 2017-10-18 2019-04-26 上海稷以科技有限公司 在物体表面形成保护层的方法及表面形成有保护层的产品
CN108080228A (zh) * 2017-10-26 2018-05-29 中国船舶重工集团公司第七二五研究所 一种线路板防水防腐涂层及其制备方法

Also Published As

Publication number Publication date
AU2014363543A1 (en) 2016-07-07
CA2933390A1 (en) 2015-06-18
US20160324011A1 (en) 2016-11-03
IL246178A0 (en) 2016-07-31
WO2015086682A1 (en) 2015-06-18
BE1021398B1 (nl) 2015-11-16
GB2521137A (en) 2015-06-17
EP3081058A1 (en) 2016-10-19
KR20160097326A (ko) 2016-08-17
JP2017509137A (ja) 2017-03-30
GB201321792D0 (en) 2014-01-22

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Application publication date: 20161109