CN106057783B - A kind of Zapping circuit - Google Patents
A kind of Zapping circuit Download PDFInfo
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- CN106057783B CN106057783B CN201610363579.7A CN201610363579A CN106057783B CN 106057783 B CN106057783 B CN 106057783B CN 201610363579 A CN201610363579 A CN 201610363579A CN 106057783 B CN106057783 B CN 106057783B
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- Semiconductor Integrated Circuits (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
The invention discloses a kind of Zapping circuits, comprising: fusing module is installed on the integrated, for making Zapping circuit fuse by trimming electric current；Control module trims data for receiving and identifying, and trims electric current to fusing module output according to data are trimmed；Execution module is connect with control module and fusing module respectively, the connection for closing or opening fusing module and integrated circuit；Monitoring modular is trimmed, is trimmed in advance for monitoring the blown state of fusing module, and for fusing module.The advantages and beneficial effects of the present invention are: realizing that result simply has higher flexibility and reliability, while also there is higher fusing controllability, is conducive to the realization accurately to fuse with quick fuse；By enabling staff to obtain optimal trim as a result, greatly improving the yields of product using mode is trimmed in advance；The interference that random signal generates Zapping circuit is also avoided simultaneously, reduces power consumption.
Description
Technical field
The present invention relates to electronic field, in particular to a kind of Zapping circuit.
Background technique
As the requirement to integrated circuit high performance index is higher and higher, it is increasingly bright that integrated circuit faces high-precision requirement
Aobvious, the technology of trimming is to realize the necessary means of high-precision integrated circuit；Wherein, electronics Zapping circuit be it is existing trim in technology,
Common trims means；
(e-fuse) circuit however existing electronics fuses realizes that structure is complex, and technology is single, and fusing effect is paid no attention to
Think, cannot accurately control fusing effect；When not needing fusing, the power consumption that circuit generates is big, influences the property of entire chip
Energy.And in fusing process, blowout current is easy crosstalk, causes chip fuse function abnormal.
Summary of the invention
To solve the above-mentioned problems, the present invention provides a kind of Zapping circuit.The technical program, which passes through, utilizes control data control
The whole process of fusing is made, realizes that result simply has higher flexibility and reliability, while also having higher fusing can
Control property；
By being conducive to the realization accurately to fuse with quick fuse using monitoring module monitors blown state is trimmed.
By enabling staff to obtain optimal trim as a result, greatly improving product using mode is trimmed in advance
Yields；
By utilizing enable signal end, the random signal interference that integrated circuit or Zapping circuit generate is avoided；
By the power consumption for reducing entire integrated circuit or Zapping circuit using control metal-oxide-semiconductor.
One of present invention Zapping circuit, for trimming integrated circuit, comprising:
Fuse module, is mounted on the integrated circuit, for making the Zapping circuit fuse by trimming electric current；
Control module trims data for receiving and identifying, and trims data according to described and export to the fusing module
Trim electric current；
Execution module is connect with the control module and the fusing module respectively, for fusing described in closing or opening
The connection of module and integrated circuit；
Monitoring modular is trimmed, for monitoring the blown state of the fusing module, and is carried out in advance for the fusing module
It trims.
In above scheme, the monitoring modular that trims includes:
Input terminal is connect with the control module, for receiving control data；
It monitors and trims unit in advance, connect with the fusing module, to read the status data of the fusing module, and it is right
The status data is judged；It the monitoring and trims unit in advance and is also connect with the input terminal to receive the control number
According to, and result is trimmed according to the control data operation and is exported；
Control the default end of data, respectively with the monitoring and trim unit in advance and connect, described monitor and repair in advance for controlling
Adjust opening or closing for unit；
Output end trims unit and connect with the monitoring and in advance, for receiving the control data, and by the control number
According to output.
In above scheme, the control module has enable signal end, for controlling unlatching or the pass of the control module
It closes.
In above scheme, the control module controls opening or closing for the execution module, closes the execution module
Close or disconnect the connection of the fusing module and integrated circuit；The execution module includes control metal-oxide-semiconductor, the control metal-oxide-semiconductor
Grid connect with the control module, it is described control metal-oxide-semiconductor source electrode connect with the fusing module, the control metal-oxide-semiconductor
Drain electrode connect with the integrated circuit.
In above scheme, the Zapping circuit further includes control register, the control register and the status monitoring
Unit with store it is described fusing module status data.
The advantages and beneficial effects of the present invention are: the present invention provides a kind of Zapping circuit, realize that result simply has more
High flexibility and reliability, while also there is higher fusing controllability, be conducive to the realization accurately to fuse with quick fuse；
By enabling staff to obtain optimal trim as a result, greatly improving the yields of product using mode is trimmed in advance；
The interference that random signal generates Zapping circuit is also avoided simultaneously；Reduce the power consumption of entire integrated circuit or Zapping circuit.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of Zapping circuit of the present invention；
Fig. 2 is the structural schematic diagram that monitoring modular is trimmed in a kind of Zapping circuit of the present invention.
In figure: 1, the module 2 that fuses, execution module 4, trims monitoring modular at control module 3
21, enable signal end 31, control metal-oxide-semiconductor 41, input terminal
42, monitor and trim in advance unit 43, the default end of control data 44, output end
Specific embodiment
With reference to the accompanying drawings and examples, further description of the specific embodiments of the present invention.Following embodiment is only
For clearly illustrating technical solution of the present invention, and not intended to limit the protection scope of the present invention.
As depicted in figs. 1 and 2, the present invention is a kind of Zapping circuit, for trimming integrated circuit (not shown), is wrapped
It includes:
Fuse module 1, installs on the integrated, for making Zapping circuit fuse by trimming electric current；
Control module 2 trims data for receiving and identifying, and trims electricity to the fusing output of module 1 according to data are trimmed
Stream；
Execution module 3 is connect with control module 2 and fusing module 1 respectively, for closing or opening fusing module 1 and collection
At the connection of circuit；
Monitoring modular 4 is trimmed, is trimmed sight in advance for monitoring the blown state of fusing module 1, and for fusing module 1
It surveys.
Further, trimming monitoring modular 4 includes:
Input terminal 41 is connect with the control module 2, for receiving control data；
It monitors and trims unit 42 in advance, connect with the fusing module 1, to read the status data of the fusing module 1,
And the status data is judged；The monitoring and unit 42 is trimmed in advance also connect with the input terminal 41 with described in receiving
Control data, and according to the control data operation, and realize virtually trim result after export；
Control the default end 43 of data, respectively with the monitoring and trim unit 42 in advance and connect, for control it is described monitor and
Opening or closing for unit 42 is trimmed in advance；
Output end 44 trims unit 42 and connect with the monitoring and in advance, for receiving the control data, and by the control
Data processed are exported to IC interior module.
Preferably, control module 2 has enable signal end 21, for controlling opening or closing for control module 2；Enabled letter
Number end 21 no signal when, all control data all will not work, and avoid interference of the random signal to Zapping circuit.
Preferably, control module 2 controls opening or closing for execution module 3, makes 3 closing or opening of execution module fusing mould
The connection of block 1 and integrated circuit, and then realize integrated circuit between the module 1 that fuses big Zapping circuit passes through or disconnects；
Execution module 3 include control metal-oxide-semiconductor 31, control metal-oxide-semiconductor 31 grid connect with control module 2, control metal-oxide-semiconductor 31 drain electrode and
The module 1 that fuses connects, and the earth signal of the source electrode and integrated circuit that control metal-oxide-semiconductor 31 connects；
Wherein, when the module 1 that fuses is needed in blown state, control metal-oxide-semiconductor 31 connects fusing module 1, when fusing mould
When block 1 is needed in non-blown state, control metal-oxide-semiconductor 31 is in an off state.Fusing module 1 only just has electricity in blown state
Stream flows through, and reduces the power consumption of entire integrated circuit or Zapping circuit.
Preferably, Zapping circuit further includes control register (not shown), control register and state reading unit
To store the status data of fusing module 1.
The working principle of above-mentioned technical proposal is:
By the corresponding overriding function of test integrated circuit whether meet demand, staff judges whether to need pair
Fusing module 1 carries out data and trims；If desired trim can start it is pre- trim mode test trim result whether meet demand, and really
It is fixed it is optimal trim scheme after starting trim mode；Certainly the mode of trimming can also be directly initiated.
1) mode is trimmed
Staff trims mode by operation control module 2 and enable signal end 21, with start Zapping circuit, makes to control
Control data are opened and received to molding block 2, and is started to work according to control data；Meanwhile control module 2 controls execution module 3
Control metal-oxide-semiconductor 31 connect, make to fuse module 1 and ic power are connected, and then make big to trim electric current by reaching molten
Disconnected movement, while the reduction of biasing branch also having been blocked accidentally to trim probability；
The default end 43 of control data for trimming monitoring modular 4 is set as low level, and the status data for the module 1 that fuses is through monitoring
And the direct feedthrough of unit 42 is trimmed in advance to output end 44, and be output to control register processing through output end 44.
2) mode is trimmed in advance
The default end 43 of control data for trimming monitoring modular 4 is set as low level, and at this moment monitoring and the pre- unit 42 that trims lead to
It crosses input terminal 41 and receives control data, and result is trimmed according to control data operation；It monitors and knot will be trimmed by trimming unit 42 in advance
Fruit is sent to output end 44 by state reading unit to control the internal module of integrated circuit, and staff can tie according to trimming
Fruit, judge it is possible trim state whether meet demand, and enter trim mode before check it is various it is possible trim as a result,
It determines and optimal trims scheme；Meanwhile solution formulation control data are trimmed according to optimal, then operate control module 2 and make to fuse
Circuit entrance trims mode and is trimmed.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (4)
1. a kind of Zapping circuit, for trimming integrated circuit characterized by comprising
Fuse module, is mounted on the integrated circuit, for making the Zapping circuit fuse by trimming electric current；
Control module trims data for receiving and identifying, and according to it is described trim data to the fusing module output trim
Electric current；
Execution module is connect, for the module that fuses described in closing or opening respectively with the control module and the fusing module
With the connection of integrated circuit；
Monitoring modular is trimmed, for monitoring the blown state of the fusing module, and is trimmed in advance for the fusing module；
The monitoring modular that trims includes:
Input terminal is connect with the control module, for receiving control data；
It monitors and trims unit in advance, connect with the fusing module, to read the status data of the fusing module, and to described
Status data is judged；It the monitoring and trims unit in advance and is also connect with the input terminal to receive the control data, and
Result is trimmed according to the control data operation and is exported；
Control the default end of data, respectively with the monitoring and trim unit in advance and connect, described monitor and trim in advance list for controlling
Member opens or closes；
Output end trims unit and connect with the monitoring and in advance, for receiving the control data, and the control data are defeated
Out.
2. a kind of Zapping circuit according to claim 1, which is characterized in that the control module has enable signal end,
For controlling opening or closing for the control module.
3. a kind of Zapping circuit according to claim 1, which is characterized in that the control module controls the execution module
Open or close, make described in the execution module closing or opening fuse module and integrated circuit connection；The execution mould
Block includes control metal-oxide-semiconductor, and the grid of the control metal-oxide-semiconductor is connect with the control module, the source electrode of the control metal-oxide-semiconductor and institute
Fusing module connection is stated, the drain electrode of the control metal-oxide-semiconductor is connect with the integrated circuit.
4. a kind of Zapping circuit according to claim 1, which is characterized in that the Zapping circuit further includes control deposit
Device, the control register store the status data of the fusing module with the Condition Monitoring Unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610363579.7A CN106057783B (en) | 2016-05-27 | 2016-05-27 | A kind of Zapping circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610363579.7A CN106057783B (en) | 2016-05-27 | 2016-05-27 | A kind of Zapping circuit |
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| Publication Number | Publication Date |
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| CN106057783A CN106057783A (en) | 2016-10-26 |
| CN106057783B true CN106057783B (en) | 2019-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610363579.7A Active CN106057783B (en) | 2016-05-27 | 2016-05-27 | A kind of Zapping circuit |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107994894B (en) * | 2017-11-23 | 2022-01-28 | 成都华微电子科技股份有限公司 | Polysilicon fuse pre-trimming circuit |
| CN112630628B (en) * | 2021-03-08 | 2021-05-18 | 上海伟测半导体科技股份有限公司 | Fuse device and method for polysilicon process fuse |
| CN115567050B (en) * | 2022-08-30 | 2023-10-24 | 贵州振华风光半导体股份有限公司 | Fuse trimming circuit |
| CN115857605B (en) * | 2023-03-03 | 2023-05-23 | 无锡市晶源微电子股份有限公司 | Fuse trimming circuit |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205692827U (en) * | 2016-05-27 | 2016-11-16 | 上海路虹电子科技有限公司 | A kind of Zapping circuit |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI251900B (en) * | 2005-02-15 | 2006-03-21 | Neotec Semiconductor Ltd | Trimming fuse with latch circuit |
| JP2009152325A (en) * | 2007-12-19 | 2009-07-09 | Sharp Corp | Semiconductor apparatus |
| US8058921B2 (en) * | 2009-05-08 | 2011-11-15 | O2Micro, Inc. | Fuse circuits |
| CN101740566B (en) * | 2009-12-21 | 2011-11-02 | 西安电子科技大学 | Current fusing-based polycrystalline fuse circuit |
| CN203675091U (en) * | 2012-11-15 | 2014-06-25 | 东莞赛微微电子有限公司 | Fuse wire trimming circuit |
| CN105445648B (en) * | 2015-12-18 | 2020-04-03 | 浙江大华技术股份有限公司 | Test trimming circuit and integrated circuit |
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2016
- 2016-05-27 CN CN201610363579.7A patent/CN106057783B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205692827U (en) * | 2016-05-27 | 2016-11-16 | 上海路虹电子科技有限公司 | A kind of Zapping circuit |
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| CN106057783A (en) | 2016-10-26 |
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Effective date of registration: 20220819 Address after: Room 607, 6th Floor, Building 1, No. 560 Shengxia Road, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai, 201210 Patentee after: Shanghai zanxin Electronic Technology Co.,Ltd. Address before: Room 601-07 and 601-08, Building A, Building 1, No. 3000 Longdong Avenue, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai, 200131 Patentee before: SHANGHAI LUHONG ELECTRONIC TECHNOLOGY Co.,Ltd. |
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