CN106024769B - 一种半导体照明装置 - Google Patents
一种半导体照明装置 Download PDFInfo
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- CN106024769B CN106024769B CN201610560250.XA CN201610560250A CN106024769B CN 106024769 B CN106024769 B CN 106024769B CN 201610560250 A CN201610560250 A CN 201610560250A CN 106024769 B CN106024769 B CN 106024769B
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- illumination device
- plate
- baffle plate
- semiconductor illumination
- led
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 238000005286 illumination Methods 0.000 title claims abstract description 16
- 239000011521 glass Substances 0.000 claims abstract description 29
- 239000004020 conductor Substances 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims description 12
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- 239000002305 electric material Substances 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 description 11
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0756—Stacked arrangements of devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (8)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610560250.XA CN106024769B (zh) | 2016-07-17 | 2016-07-17 | 一种半导体照明装置 |
CN201811005807.9A CN109442229B (zh) | 2016-07-17 | 2016-07-17 | 具有led灯串的半导体照明装置 |
CN201811006532.0A CN109524391A (zh) | 2016-07-17 | 2016-07-17 | 半导体照明装置 |
CN201811006558.5A CN109473423B (zh) | 2016-07-17 | 2016-07-17 | 一种具有led灯串的半导体照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610560250.XA CN106024769B (zh) | 2016-07-17 | 2016-07-17 | 一种半导体照明装置 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811006558.5A Division CN109473423B (zh) | 2016-07-17 | 2016-07-17 | 一种具有led灯串的半导体照明装置 |
CN201811005807.9A Division CN109442229B (zh) | 2016-07-17 | 2016-07-17 | 具有led灯串的半导体照明装置 |
CN201811006532.0A Division CN109524391A (zh) | 2016-07-17 | 2016-07-17 | 半导体照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106024769A CN106024769A (zh) | 2016-10-12 |
CN106024769B true CN106024769B (zh) | 2018-10-02 |
Family
ID=57119264
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811006558.5A Active CN109473423B (zh) | 2016-07-17 | 2016-07-17 | 一种具有led灯串的半导体照明装置 |
CN201610560250.XA Active CN106024769B (zh) | 2016-07-17 | 2016-07-17 | 一种半导体照明装置 |
CN201811006532.0A Withdrawn CN109524391A (zh) | 2016-07-17 | 2016-07-17 | 半导体照明装置 |
CN201811005807.9A Active CN109442229B (zh) | 2016-07-17 | 2016-07-17 | 具有led灯串的半导体照明装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811006558.5A Active CN109473423B (zh) | 2016-07-17 | 2016-07-17 | 一种具有led灯串的半导体照明装置 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811006532.0A Withdrawn CN109524391A (zh) | 2016-07-17 | 2016-07-17 | 半导体照明装置 |
CN201811005807.9A Active CN109442229B (zh) | 2016-07-17 | 2016-07-17 | 具有led灯串的半导体照明装置 |
Country Status (1)
Country | Link |
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CN (4) | CN109473423B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102130239A (zh) * | 2011-01-31 | 2011-07-20 | 郑榕彬 | 全方位采光的led封装方法及led封装件 |
CN103730454A (zh) * | 2013-12-13 | 2014-04-16 | 青岛威力电子科技有限公司 | 具有可调色温提高显色功能的发光二极管 |
CN104241512A (zh) * | 2013-06-11 | 2014-12-24 | 晶元光电股份有限公司 | 发光装置 |
CN104638091A (zh) * | 2014-12-18 | 2015-05-20 | 上海大学 | Led玻璃基板 |
CN105336734A (zh) * | 2015-10-19 | 2016-02-17 | 漳州立达信光电子科技有限公司 | Led垂直封装结构 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4507982B2 (ja) * | 2005-05-26 | 2010-07-21 | パナソニック電工株式会社 | 照明装置 |
GB2497702B (en) * | 2009-08-20 | 2014-02-12 | Graviton Lite Ltd | Mounting for light emitting diode |
WO2011118934A2 (en) * | 2010-03-23 | 2011-09-29 | Kang Kim | Light emitting diode device and lighting device using the same |
CN201983025U (zh) * | 2011-01-21 | 2011-09-21 | 陈上贵 | 一种led灯及其灯体连接结构 |
CN102679233A (zh) * | 2012-06-11 | 2012-09-19 | 海安县威仕重型机械有限公司 | 一种光源位置可调的led台灯 |
CN103915428A (zh) * | 2014-01-14 | 2014-07-09 | 四川品龙光电科技有限公司 | Led发光装置及封装方法 |
CN105280627B (zh) * | 2014-07-08 | 2018-01-16 | 简汝伊 | 光源模组及其封装方法、及运用该光源模组的照明装置 |
CN204118115U (zh) * | 2014-07-29 | 2015-01-21 | 中国科学院苏州纳米技术与纳米仿生研究所 | 新型透明基板led封装结构 |
-
2016
- 2016-07-17 CN CN201811006558.5A patent/CN109473423B/zh active Active
- 2016-07-17 CN CN201610560250.XA patent/CN106024769B/zh active Active
- 2016-07-17 CN CN201811006532.0A patent/CN109524391A/zh not_active Withdrawn
- 2016-07-17 CN CN201811005807.9A patent/CN109442229B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102130239A (zh) * | 2011-01-31 | 2011-07-20 | 郑榕彬 | 全方位采光的led封装方法及led封装件 |
CN104241512A (zh) * | 2013-06-11 | 2014-12-24 | 晶元光电股份有限公司 | 发光装置 |
CN103730454A (zh) * | 2013-12-13 | 2014-04-16 | 青岛威力电子科技有限公司 | 具有可调色温提高显色功能的发光二极管 |
CN104638091A (zh) * | 2014-12-18 | 2015-05-20 | 上海大学 | Led玻璃基板 |
CN105336734A (zh) * | 2015-10-19 | 2016-02-17 | 漳州立达信光电子科技有限公司 | Led垂直封装结构 |
Also Published As
Publication number | Publication date |
---|---|
CN109473423B (zh) | 2020-03-27 |
CN109442229B (zh) | 2020-07-14 |
CN109524391A (zh) | 2019-03-26 |
CN109442229A (zh) | 2019-03-08 |
CN106024769A (zh) | 2016-10-12 |
CN109473423A (zh) | 2019-03-15 |
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Effective date of registration: 20180828 Address after: 325600 Dong Jia village, Baishi Town, Yueqing, Zhejiang Applicant after: Guan Wei Address before: 226300 266 Century Avenue, Nantong hi tech Zone, Nantong, Jiangsu Applicant before: Wang Peipei |
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Effective date of registration: 20190619 Address after: 226000 Sunjiaqiao Village, Xingren Town, Tongzhou District, Nantong City, Jiangsu Province Patentee after: Nantong Rui Bo Electrical Appliance Co., Ltd. Address before: 325600 Dong Jia village, Baishi Town, Yueqing, Zhejiang Patentee before: Guan Wei |