CN106024769A - 一种半导体照明装置 - Google Patents

一种半导体照明装置 Download PDF

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CN106024769A
CN106024769A CN201610560250.XA CN201610560250A CN106024769A CN 106024769 A CN106024769 A CN 106024769A CN 201610560250 A CN201610560250 A CN 201610560250A CN 106024769 A CN106024769 A CN 106024769A
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CN106024769B (zh
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王培培
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Nantong Rui Bo Electrical Appliance Co., Ltd.
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王培培
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Priority to CN201811006532.0A priority patent/CN109524391A/zh
Priority to CN201811006558.5A priority patent/CN109473423B/zh
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Abstract

本发明涉及一种半导体照明装置，其具有第一玻璃挡板和第二玻璃挡板，第一玻璃挡板的表面设有两个导电凸柱，第二玻璃挡板具有向外凸出的深凹槽，所述深凹槽填充一半的透明导电材料，构成导电部分和不导电部分；导电凸柱和深凹槽的导电部分电连接至水平导电板上，并通过水平板下方的两个连接板引出端子，并且在两个连接板的外侧具有弹性装置，所述第一和第二挡板间用以设置LED灯串结构。

Description

一种半导体照明装置
技术领域
本发明涉及固态照明材料领域，具体涉及一种半导体照明装置。
背景技术
LED是一种固态的半导体器件，它可以直接把电能转化为光能。与传统的白炽灯、荧光灯相比，白光LED具有耗电小、发光效率高、使用寿命长、节能环保等优点，因此其不仅可以在日常照明领域得到广泛的应用，而且可以进入显示设备领域。
目前的半导体照明装置主要使用的是COB（chip on board）封装结构，这种封装多是将多个LED芯片固定于基板上，通过打线进行串并联，再进行树脂的整体密封。该种封装结构，一旦出现封装体中一个LED芯片的损坏，不能更换，且一系列的串联形式，会导致整个封装体的失效，不能工作。
发明内容
基于解决上述封装中的问题，本发明提供了一种半导体照明装置，其具有第一玻璃挡板和第二玻璃挡板，第一玻璃挡板的表面设有两个导电凸柱，第二玻璃挡板具有向外凸出的深凹槽，所述深凹槽填充一半的透明导电材料，构成导电部分和不导电部分；所述第一和第二玻璃挡板分别垂直固定于两个水平导电板上，导电凸柱和深凹槽的导电部分电连接至所述水平导电板上，并通过水平板下方的两个连接板引出端子，并且在两个连接板的外侧具有弹性装置，用以调整所述第一和第二挡板间的距离，所述第一和第二挡板间用以设置LED灯串结构。
其中，所述LED灯串结构包括多个LED封装体，所述的LED结构体包括：
荧光玻璃板；
固定在所述荧光玻璃板两相对面上的第一和第二LED芯片，所述第一LED芯片具有第一和第二电极，所述第二LED芯片具有第三和第四LED电极；
包覆所述第一和第二LED芯片、所述荧光玻璃板的荧光胶，所述荧光胶包覆形状为长方体或正方体；
位于所述第一、第二、第三和第四电极上并暴露所述第一、第二、第三和第四电极的连接孔；
位于所述第一和第二LED芯片朝向面的浅沟槽，所述浅沟槽与连接孔分别相连通；
位于所述第一和第二LED芯片的第一侧面外侧的深沟槽，所述深沟槽与所述浅沟槽相连通，并且所述浅沟槽和深沟槽形成于所述荧光胶表面；
以及透明导电材料，包括填充所述连接孔和浅沟槽的第一部分、部分填充所述深沟槽的第二部分以及在与深沟槽相对的第二侧面上凸出的第三部分，其具有包含第二部分和第一部分以连接第一和第三电极的第一导电路径，以及包含第三部分和第一部分以连接第二和第四电极的第二导电路径；
凸出的所述第三部分与未填充透明导电材料的深沟槽的凹入部分形状相匹配。
在本发明中，所述第一导电路径呈C型，所述第二路径呈现倒C型。
在本发明中，所述透明导电材料为氧化锡铟、掺铝氧化锌、掺氟氧化锡等氧化物或透明金属材料。
在本发明中，所述荧光胶包含荧光粉或者荧光晶体。
在本发明中，所述封装结构通过透明导电材料的所述第二部分和第三部分施加电压，以使得所述第一和第二LED芯片并联。
在本发明中，所述弹性装置为绝缘性装置，例如可以是橡胶等。
在本发明中，弹性装置通过两个夹板分别向内给予压力。
本发明可实现多个LED芯片串并联的灯串，易于更换，且方法简单。
附图说明
图1为本发明的LED封装结构的剖面图；
图2为本发明的LED封装结构的三维图；
图3为本发明的LED封装结构的俯视图；
图4为本发明的LED封装结构的右视图；
图5为本发明的LED灯串结构的示意图；
图6为本发明的半导体照明装置的支撑体结构图。
具体实施方式
参见图1-4，本发明的LED封装结构为360度发光结构，荧光玻璃板1为刚性透明基板，并含有相应的荧光颗粒物，两个LED芯片2分别位于荧光玻璃板1的上侧和下侧，两个芯片分别具有两个引出电极9，利用荧光胶3包覆所述两个LED芯片2、所述荧光玻璃板1，并通过切割打磨等工序形成正方体形状或长方体形状，在四个电极9的对应位置具有四个连接孔4，该四个连接孔4均填充满透明导电材料，在两个LED芯片2所面对的荧光胶表面上具有四个相对较浅的浅沟槽5，浅沟槽5中也填满透明导电材料，并且与所述连接孔4电连接，位于所述两个LED芯片2的第一侧面外侧的具有深沟槽8，所述深沟槽8与所述浅沟槽5相连通，并且所述浅沟槽8和深沟槽5形成于所述荧光胶3表面。
所述透明导电材料为氧化锡铟、掺铝氧化锌、掺氟氧化锡等氧化物或透明金属材料，包括填充所述连接孔4和浅沟槽5的第一部分、部分填充所述深沟槽8的第二部分7以及在与深沟槽8相对的第二侧面上凸出的第三部分6，其具有包含第二部分7和第一部分以连接上侧芯片的左侧电极和下侧芯片的左侧电极的第一导电路径，以及包含第三部分和第一部分以连接上侧芯片的右侧电极和下侧芯片的右侧电极的第二导电路径；并且，凸出的所述第三部分6与未填充透明导电材料的深沟槽8的凹入部分形状相匹配，优选的，深沟槽8的深度是所述第三部分6的高度的两倍，而未填充透明导电材料的深沟槽8的凹入部分得深度等于第三部分的高度，这样就可以在形成灯串时，两者相互嵌入，达到电互联的目的。
所述第一导电路径呈C型，所述第二路径呈现倒C型；所述荧光胶包含荧光粉或者荧光晶体；所述封装结构通过透明导电材料的所述第二部分和第三部分施加电压，以使得所述第一和第二LED芯片并联。
图5示出了本发明LED灯串结构，其包括多个如上述的LED封装结构，多个LED封装结构通过前一个LED封装结构的凸出的所述第三部分嵌入所述未填充透明导电材料的深沟槽的凹入部分而形成先并联再串联的灯串，所述任意两个LED封装结构之间可以设有透明硅胶以作为粘合层，该灯串的数量可以是1×2，也可以是2×2，甚至是更多。
图6是本发明的半导体照明装置的结构图。其中左半部的玻璃挡板10的表面设有两个导电凸柱18，其对应于图5中左侧深沟槽的凹入部分，并与深沟槽中的透明导电材料电连接，右半部的玻璃挡板10具有向外凸出的深凹槽，所述深凹槽填充一半的透明导电材料，构成导电部分15，和不导电部分16，所述导电材料和上面图5中的一致；所述玻璃挡板10固定于水平板11上，水平板为导电材料，导电凸柱18和深凹槽的导电部分15电连接至所述水平板11上，并通过水平板下方的连接板12引出端子，并且在两个连接板的外侧具有弹性装置13，所述弹性装置13为绝缘性装置，例如可以是橡胶等，弹性装置通过两个夹板14分别向内给予压力。所述照明装置可以通过调整所述弹性装置13而设置合适的两个玻璃挡板10的距离以达到放置不同数量的LED芯片的灯串。
最后应说明的是：显然，上述实施例仅仅是为清楚地说明本发明所作的举例，而并非对实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引申出的显而易见的变化或变动仍处于本发明的保护范围之中。

Claims (8)

1.一种半导体照明装置，其具有第一玻璃挡板和第二玻璃挡板，第一玻璃挡板的表面设有两个导电凸柱，第二玻璃挡板具有向外凸出的深凹槽，所述深凹槽填充一半的透明导电材料，构成导电部分和不导电部分；所述第一和第二玻璃挡板分别垂直固定于两个水平导电板上，导电凸柱和深凹槽的导电部分电连接至所述水平导电板上，并通过水平板下方的两个连接板引出端子，并且在两个连接板的外侧具有弹性装置，用以调整所述第一和第二挡板间的距离，所述第一和第二挡板间用以设置LED灯串结构。
2.根据权利要求1所述的半导体照明装置，所述LED灯串结构包括多个LED封装体，所述的LED结构体包括：
荧光玻璃板；
固定在所述荧光玻璃板两相对面上的第一和第二LED芯片，所述第一LED芯片具有第一和第二电极，所述第二LED芯片具有第三和第四LED电极；
包覆所述第一和第二LED芯片、所述荧光玻璃板的荧光胶，所述荧光胶包覆形状为长方体或正方体；
位于所述第一、第二、第三和第四电极上并暴露所述第一、第二、第三和第四电极的连接孔；
位于所述第一和第二LED芯片朝向面的浅沟槽，所述浅沟槽与连接孔分别相连通；
位于所述第一和第二LED芯片的第一侧面外侧的深沟槽，所述深沟槽与所述浅沟槽相连通，并且所述浅沟槽和深沟槽形成于所述荧光胶表面；
以及透明导电材料，包括填充所述连接孔和浅沟槽的第一部分、部分填充所述深沟槽的第二部分以及在与深沟槽相对的第二侧面上凸出的第三部分，其具有包含第二部分和第一部分以连接第一和第三电极的第一导电路径，以及包含第三部分和第一部分以连接第二和第四电极的第二导电路径；
其特征在于：凸出的所述第三部分与未填充透明导电材料的深沟槽的凹入部分形状相匹配。
3.根据权利要求2所述的半导体照明装置，其特征在于：第一导电路径呈C型。
4.根据权利要求2所述的半导体照明装置，其特征在于：所述透明导电材料为氧化锡铟、掺铝氧化锌、掺氟氧化锡等氧化物或透明金属材料。
5.根据权利要求2所述的半导体照明装置，其特征在于：所述荧光胶包含荧光粉或者荧光晶体。
6.根据权利要求2所述的半导体照明装置，其特征在于：所述封装结构通过透明导电材料的所述第二部分和第三部分施加电压，以使得所述第一和第二LED芯片并联。
7.根据权利要求1所述的半导体照明装置，其特征在于：所述弹性装置为绝缘性装置，例如可以是橡胶等。
8.根据权利要求1所述的半导体照明装置，其特征在于：弹性装置通过两个夹板分别向内给予压力。
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