CN105990271A - 具有非水平管芯垫及相应引线框的ic封装 - Google Patents

具有非水平管芯垫及相应引线框的ic封装 Download PDF

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CN105990271A
CN105990271A CN201510139788.9A CN201510139788A CN105990271A CN 105990271 A CN105990271 A CN 105990271A CN 201510139788 A CN201510139788 A CN 201510139788A CN 105990271 A CN105990271 A CN 105990271A
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encapsulation
tube core
die pad
encapsulates
silk thread
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CN105990271B (zh
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葛友
赖明光
王志杰
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NXP USA Inc
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Freescale Semiconductor Inc
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Priority to US14/850,966 priority patent/US9379035B1/en
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Abstract

本发明涉及具有非水平管芯垫及相应引线框的IC封装。多构件集成电路(IC)封装具有基础构件(例如，插入器)限定IC封装的基底，多个管芯垫从基底延伸出去且成为IC封装的侧壁，一个或多个IC管芯，每个均安装在管芯之一的内表面上，并且键合丝线将IC管芯电连接到另一个IC封装组件上，例如插入器或另一个管芯上。通过安装管芯至非水平侧壁上，IC封装可提供相比于含有管芯堆叠的传统3D IC封装更有效的散热性能。

Description

具有非水平管芯垫及相应引线框的IC封装
技术领域
本发明涉及集成电路封装，并且，更具体地，涉及具有不只一个集成电路管芯的IC封装。
背景技术
传统三维(3D)集成电路插入器更多安装在管芯堆叠的下方和/或堆叠内部的管芯之间。这类传统3D IC封装的一个问题是无法有效散除位于堆叠内部的管芯产生的热量(例如，堆叠内除了最下层和最上层管芯外的其他管芯)。因此，具有良好散热性能的3D IC封装将是有利的。
附图说明
本发明的其他实施例通过下文的详细描述、附属权利要求书和附图将变得更加明显，附图中同样的附图标记代表相似的或相同的元件。
图1是根据本发明的一个实施例的IC封装的透视图；
图2是根据本发明的一个实施例的二维引线框阵列的平面图，其在一个阵列引线框内含有十个引线框，其中十个引线框可用来组装十个不同的图1的IC封装实例；
图3是安装在黏胶带相应部分上的图2十个引线框中一个的平面图；
图4是经过(i)插入器已安装到对应于引线框的中间开孔的黏胶带的一部分上，和(ii)四个管芯已被安装在引线框的四个管芯垫上之后的图3中引线框的平面图；
图5是键合丝线连接在管芯和插入器间之后的图4的部分组件的平面图；
图6是绝缘键合丝线的侧面剖视图，其用作图1与图5中连接插入器到管芯之一上的丝线中的一个；
图7是图6中插入器的一部分的侧面剖视图，显示出硅通孔(TSV)电连接管芯垫(键合丝线连接至其上)至位于插入器的底面上的焊球；
图8是两个绝缘纳米管的侧面剖视图，其用作图1与图5中连接插入器到管芯之一上的丝线中的两个；
图9是图8中插入器的一部分的侧面剖视图，显示出两个TSV电连接晶片级凸块(纳米管连接至其上)至位于插入器底面上的两个焊球；
图10是在四个管芯垫被旋转以相对于于引线框阵列的平面垂直之后的图5中的部分组件的平面图；
图11是在凝胶分散于由插入器与由管芯垫形成的四个垂直侧壁所限定的空腔中之后的图10中部分组件的平面图；
图12是透视图，示出可选择的、矩形的、金属的盖放置在图11的组件上；以及
图13是倒置的图12中金属盖的透视图。
具体实施方式
此处公开了本发明的详细说明实施例。然而，此处公开的具体结构性和功能性细节仅代表性地用于说明本发明的示例实施例。本发明可以很多替代形式实施且不应被理解为局限于仅在此处陈述的实施例。此外，此处所用的术语仅出于描述特定实施例的目的，并且不会成为本发明示例实施例的限制。
如此处所用，单数形式“一个”(“a”)、“一个”(“an”)和“这个”(“the”)意为同样包含复数形式，除非上下文另作明确说明。应进一步理解，词语“包含”(“comprises”)、“包含”(“comprising”)、“包括”(“includes”)和/或“包括”(“including”)明确了所陈述的特性、步骤或部件的存在，但并不排除一个或多个特性、步骤或部件的存在或附加。还应注意的是在一些替代实施中，标明的功能/行为可以与图中标明的相反顺序发生。例如，接连示出的两个图实际上可大体同时执行或有时可能以相反的顺序执行，取决于相关的功能/行为。
在一个实施例中，多构件IC封装包括(i)限定了IC封装基底的基础构件；(ii)从基底延伸且形成IC封装的侧壁的多个管芯垫；(iii)一个或多个IC管芯，每个均安装在管芯之一的内表面上；以及(iv)多个丝线，每个丝线将相应的IC管芯连接到另一个IC封装的构件。
图1是根据本发明的一个实施例的IC封装100的透视图。IC封装100具有由其基底上的插入器(interposer)102和四个金属(例如铜)侧壁104限定的三维直线形状。尽管图1并未示出且如下文参考图12和13进一步描述，IC封装100可包括形成IC封装100的顶部的可选金属盖。安装在每个侧壁104内表面上的是IC管芯106，其具有提供电连接至插入器102的丝线108。由此，侧壁104起接收安装后的管芯106的管芯垫的作用。IC封装100之内的部分或全部内部空间填充有凝胶110(或其他适合的封装材料)，其密封丝线108且将侧壁104保持在位。
由于每个管芯106都安装在IC封装100的其自己的金属侧壁104上，所以每一个侧壁104都用作热宿(heat sink)以帮助从IC封装100散除安装的管芯106产生的热量。尽管图1未示出，热宿可连接到每个侧壁104上以进一步加强IC封装100上的热量散除。相比于安装成传统垂直堆叠的具有四个类似管芯的相应的传统3D IC封装，通过这种方式，IC封装100可提供更有效的散热性能。
图2到13表示用于组装图1的IC封装100的一种可能的技术的不同阶段。
图2是根据本发明的一个实施例的示例的、二维的、金属(例如铜)引线框阵列200的平面图，其在一个阵列引线框204内含有十个引线框202，其中该十个引线框202可用来组装十个图1的IC封装的不同的实例。引线框阵列200安装在黏胶带206上，黏胶带206为十个引线框202的不同结构元件提供力学支持。
图3是安装在黏胶带206的相应部分上的图2的十个引线框202中的一个的平面图。如图3所示，引线框202具有围绕着一个矩形(在此例中为正方形)中央开口304的四个矩形的金属管芯垫302，中央开口304暴露出黏胶带206的相应部分。引线框202还具有四个对角线系棒306，每一个都枢轴地一端连接至两个相邻管芯垫302的角而另一端连接至阵列引线框204以在管芯垫302和余下的引线框阵列200之间提供力学支撑，直到可施加黏胶带206(例如在制造(例如冲压)引线框阵列200的时间和其随后安装至黏胶带206上之间)为止。
如图3中标记308所示，黏胶带206沿四个管芯垫302的周边被刻划或切割。在一个实施中，黏胶带206在引线框阵列200安装到黏胶带206上之前被刻划。如下文进一步描述的，这个刻划使管芯垫302在组装工艺期间能够旋转出引线框阵列200的平面。
图4是经过(i)插入器102已安装到黏胶带206的对应于引线框202的中间开口304的部分上，和(ii)四个管芯106例如通过传统贴装机械(pick-and-place machinery)和适当的热导环氧树脂(未示出)，已经被安装至四个管芯垫302上之后的图3引线框202的平面图；
图5是丝线108连接在每一个管芯106和插入器102之间之后的图4的部分组件的平面图。取决于特定的实施方式，丝线108可包含绝缘键合丝线、绝缘带丝线、绝缘(例如碳)纳米管，和/或其他适合的电连接器。
图6是绝缘键合丝线600的侧面剖视图，其用作图1和图5中连接插入器102到管芯106之一上的丝线108中的一个。键合丝线600具有柔性导电(例如金属)芯602，其由柔性的绝缘的外护套604所包围。如图6所示，键合丝线600的一端丝线键合到插入器102的管芯垫606上，而另一端丝线键合到管芯106上相应的管芯垫606上。
图7是图6中插入器102的一部分的侧面剖视图，显示出硅通孔(TSV)702电连接管芯垫606(键合丝线600被丝线键合至其上)至位于插入器102的底面上的焊球704，当IC封装100使用键合丝线诸如键合丝线600组装时，该底面也是图1的IC封装100的底面。
图8是两个绝缘纳米管800的侧面剖视图，其用作图1和图5中连接插入器102到管芯106之一的丝线108中的两个。每个纳米管800都是一个柔性空心管，具有导电内表面802和绝缘外表面804。如图8所示，每个纳米管800一端连接到插入器102上的晶片级凸块806而另一端连接到管芯106上相应的晶片级凸块806。在以适当高温下的键合期间，纳米管的直径充分地增加以使纳米管800的端部能够插入于相应的晶片级凸块806上。随着温度降低，纳米管的直径也将减小，从而使纳米管800的端部固定到晶片级凸块806上。
图9是图8的插入器102的一部分的侧面剖视图，显示出两个TSV 902电连接晶片级凸块806(纳米管800连接至其上)至位于插入器102底面上的两个焊球904，当IC封装100使用纳米管诸如纳米管800组装时，该底面也是图1的IC封装100的底面。
尽管丝线108(例如图6的键合丝线600和图8的纳米管800)在图7与9中被描述为通过垂直TSV 702和902电连接至插入器102的焊球704和904，在插入器102的其他实施方式中，这些电连接器中的部分或全部可用插入器102内为IC封装100提供扇出功能的金属迹线(未示出)来制得。此外，某些金属迹线(未示出)可在两个不同的丝线108之间提供电连接以实现芯片到芯片的电连接，而不是图7与9的基于TSV的芯片到焊球的电连接。
图10是在四个管芯垫302被旋转90度(例如在四个系棒306的枢轴连接处弯曲)以相对于引线框阵列200的平面垂直之后的图5中部分组件的平面图。在一个实施例中，特殊工具(未示出)被用来在保持插入器102在原位的同时，旋转管芯垫302和它们安装的管芯106及刻划的对应部分、附着的黏胶带206(例如使用真空工具)。如图10所示，四个现为垂直安装的管芯106借助互连的绝缘丝线108的柔性来获得其电连接至插入器102。在一个实施中，四个管芯垫302的旋转导致至四个系棒306的八个物理连接断裂，从而使管芯垫302从引线框阵列200的剩余结构上释放出来。要注意的是，四个管芯垫302被旋转以形成图1的IC封装100的四个垂直侧壁104。
图11是在凝胶110分布于由插入器102与由旋转的管芯垫302形成的四个垂直侧壁104所限定的空腔中之后的图10中部分组件的平面图，如前文所述，可为任意适合的封装材料的凝胶110密封了丝线108且保持旋转的管芯垫302到位。
图12是透视图，示出可选择的、矩形的、金属的盖1200正放置在图11的组件上。图13是图12中金属盖1200的倒置的透视图。如图13所示，金属盖1200具有限定金属盖1200内部体积1204的矩形外缘1202，和在其远端具有锚结构1208的柱1206。外缘1202被设计为使得每个旋转管芯垫302的上边缘1210配合盖1200的内部体积1204之内，外缘1202悬挂在每个上边缘1210的外表面之上。
在凝胶110被完全固化前，金属盖1200被放置在图11的组件之上使得柱1206延伸进凝胶110内而锚结构1208没入凝胶110之内。在凝胶110固化后，锚结构1208和柱1206将在IC封装100的顶部将盖1200永久固定到位。
不管是否使用金属盖1200，在凝胶110例如通过烘烤和/或照射充分固化后，得到的组件可经受紫外线(UV)辐射以弱化黏胶带206的粘合剂从而能够从插入器102底部和四个管芯垫302的外表面移除黏胶带206的部分，从而形成完成的IC封装100。
尽管本发明在图1的IC封装100的背景下进行描述，本发明并不局限于此。一般而言且尽管图中未示出，本发明的IC封装：
●可以有或没有盖；
●可以具有带有或不带有柱和锚结构的盖；
●可以有或没有安装于IC封装的一个或多个外表面(包括对应于侧壁和盖的外表面)上的再多一个热宿；
●只要IC封装具有至少一个IC管芯，零个、一个或更多个管芯可以被安装成在每个旋转管芯垫上的零个、一个或更多个并排的堆叠，每个堆叠具有一个或多个管芯；
●具有形成IC封装的三个或更多个侧壁的三个或更多个旋转管芯垫；
●具有相对于IC封装的基底垂直或非垂直的侧壁；
●具有在管芯和插入器之间和/或在两个管芯之间形成电连接的丝线；
●可以具有插入器，其通过TSV和焊球提供到外部世界的电连接和/或提供管芯到管芯的连接以使IC封装内不同管芯之间能够电连接在一起；以及
●可以具有插入器或另一个管芯或包装构件形成IC封装的基底。
引线框是金属引线和可能其他元件(例如功率棒、管芯叶板，也称作管芯焊垫或管芯旗(die flag))，其用在半导体封装中以装配一个或多个集成电路(IC)管芯到单一封装半导体器件中。在装配到半导体器件上之前，引线框可具有能保持那些元件到位的支撑结构(例如矩形金属框和系棒)。在组装工艺期间，支撑结构可被移除。如此处所用的，词语“引线框”可用来指称组装前或组装后的元件的集合，而不考虑那些支撑结构的存在或不存在。
除非另作明确说明，每个数值和范围都应被解释为近似的，如同词语“大约”或“近似”位于数值或范围之前。
需要进一步明白的是，本领域技术人员可对为说明本发明的实施例而描述和解释的细节、材料和部件布置进行不同的变化，而不背离由随附的权利要求书所囊括的本发明的实施例。
在此包含任何权利要求的说明书中，词语“每一个”可被用来指多个此前列举元件或步骤的一个或多个具体特性。当与开放式词语“包括”一起使用时，词语“每一个”的引述并不排除附加的、未列明的元件或步骤。因此，可以理解的是，装置可具有附加的、未列明的元件，且方法可具有附件的、未列明的步骤，其中附件的、未列明的元件或步骤并不具有所述一个或多个具体特性。
此处涉及的“一个实施例”或“实施例”指的是结合实施例描述的一个特定特性、结构或特征可被包含于本发明的至少一个实施例中。在具体说明中不同地方的词语“在一个实施例中”的表象并不一定全部指的是同一个实施例，也不一定是单独的或与其他实施例互斥的替代实施例。同样的情形适用于词语“实施方式”。

Claims (14)

1.一种多构件集成电路(IC)封装，包括：
限定IC封装的基底的基础构件；
多个管芯垫，从所述基底延伸并形成所述IC封装的侧壁；
一个或多个IC管芯，每一个都安装在所述管芯垫中的一个的内表面上；以及
多个丝线，每个丝线将相应的IC管芯连接到所述IC封装的另一个构件。
2.根据权利要求1的IC封装，其中：
所述基础构件是插入器；以及
至少一个丝线将相应的IC管芯连接到所述插入器。
3.根据权利要求2的IC封装，其中所述插入器的底面具有至少一个焊球，所述焊球通过所述插入器内的硅通孔电连接到所述至少一个丝线。
4.根据权利要求1的IC封装，含有形成所述IC封装的四个侧壁的四个垂直管芯垫，其中由所述基础构件和所述四个垂直管芯垫限定的空间至少部分填充有密封所述丝线的密封物。
5.根据权利要求1的IC封装，其中所述丝线包含连接到所述基础构件上的键合垫的绝缘键合丝线以及相对应的IC管芯。
6.根据权利要求1的IC封装，其中所述丝线包含连接到所述基础构件上的晶片级凸块的绝缘纳米管以及相对应的IC管芯。
7.根据权利要求1的IC封装，进一步包括覆盖所述丝线的密封物。
8.根据权利要求7的IC封装，进一步包括形成所述IC封装的顶侧的盖。
9.根据权利要求8的IC封装，其中所述盖具有延伸进所述密封物内的中央柱体。
10.一种用于IC封装的引线框，所述引线框包括多个管芯垫，包围中央开口且在枢轴连接处枢轴地连接，使得每个管芯垫都能接收IC管芯且相对于中央开口关于枢轴连接旋转以限定具有安装的IC管芯的所述IC封装的侧壁。
11.根据权利要求10的引线框，其中所述引线框安装在黏胶带上，使得位于所述中央开孔的所述黏胶带能接收要通过一个或多个丝线被电连接至至少一个安装的IC管芯的插入器。
12.根据权利要求10的引线框，包含四个管芯垫，位于矩形中央开口的四侧上且枢轴地连接，使得每个管芯垫都能接收相应的IC管芯且旋转至相对于所述中央开口为垂直取向以限定具有安装的IC管芯的所述IC封装的垂直侧壁，其中四个垂直管芯垫限定矩形IC封装的四个所述垂直侧壁。
13.根据权利要求12的引线框，进一步包含四个对角线系棒，在八个枢轴连接处支撑四个所述管芯垫，其中所述四个对角线系棒将所述引线框连接至引线框阵列中的一个或多个相邻的引线框。
14.根据权利要求13的引线框，其中所述枢轴连接被配置为当所述管芯垫旋转至所述垂直取向时断裂。
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