CN105980869B - The processor of electronic equipment - Google Patents
The processor of electronic equipment Download PDFInfo
- Publication number
- CN105980869B CN105980869B CN201380081371.0A CN201380081371A CN105980869B CN 105980869 B CN105980869 B CN 105980869B CN 201380081371 A CN201380081371 A CN 201380081371A CN 105980869 B CN105980869 B CN 105980869B
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- Prior art keywords
- converter
- electronic equipment
- transfer mechanism
- crimp head
- transfer
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
Abstract
Processor (10) has: pallet (16) can load multiple electronic equipments;Converter (12) can load multiple electronic equipments with corresponding with the configuration of multiple testing jacks (18) possessed by experimental rig baseline configuration;First transfer mechanism (20) transfers electronic equipment from pallet (16) to converter (12);Second transfer mechanism (22) transfers electronic equipment between converter (12) and testing jack (18), and electronic equipment is crimped on testing jack (18);Third transfer mechanism (24) transfers electronic equipment from converter (12) to pallet (16);And heating mechanism (112), it is set to converter (12), and the electronic equipment for being placed in converter (12) is heated.Converter (12) has the first support plate (88) supported to the electronic equipment come from pallet (16) transfer.First support plate (88) has multiple supporting parts (108) of the number than testing jack (18) mostly, can support multiple electronic equipments on the desired supporting part (108) in these supporting parts with baseline configuration.
Description
Technical field
The present invention relates to the processors of electronic equipment.
Background technique
Experimental rig as the electrical test for carrying out the electronic equipments such as IC equipment supplies and discharge electronic equipment
Device, it is known to various processors.Such as patent document 1 discloses following processors, which includes singly
Hold the multiple equipment handle part of electronic equipment;And according to each electronic equipments held of these equipment handle parts
Posture, the information of position and respectively corrective handle part position position correction component.
In previous processor, there is known the processors for having following device temperature regulating mechanisms, in order to use examination
Experiment device carrys out the test of the true use environment of implementation plan electronic equipment, and electronic equipment is being transferred from supply side storage unit
To during experimental rig, electronic equipment is heated or cooled to predetermined temperature by above equipment thermoregulation mechanism.Such as it is used as and adds
The device temperature regulating mechanism (hereinafter referred to as equipment heating mechanism) of heat, in the past generally using any in following two ways
Kind, a kind of mode is in the heater contacts side that transfer midway contacts electronic equipment directly or indirectly with heater and heats up
Formula, another way are the chamber modes entirely through high temperature chamber for making to transfer the equipment transfer mechanism of electronic equipment.
In the processor of equipment heating mechanism for having heater contacts mode, only it can need to heat electronic equipment
When high-temperature process (carry out) implement that electronic equipment join and contacted to heater in the transfer midway to experimental rig to add
The heating process of hot device stipulated time, and (when carrying out room temperature processing), can be omitted when not needing heating electronic equipment
It states such heating process and electronic equipment is transferred to experimental rig.That is, having the equipment heater of heater contacts mode
The processor of structure can selectively execute high-temperature process and room temperature processing using 1 processor.Previous this high temperature is normal
The dual-purpose processor of temperature has preheating unit, and the preheating unit is in the equipment transfer path from supply side storage unit to experimental rig
Halfway, there is heater as with the mutually independent equipment heating mechanism of equipment transfer mechanism, when carrying out high-temperature process, equipment
Transfer mechanism by before heating electronic equipment be packed into preheating unit and from preheating unit recycling heating after electronic equipment, then to
Experimental rig transfer.
Citation
Patent document
Patent document 1: International Publication No. 2008/114457
Summary of the invention
In the processor of equipment heating mechanism for having heater contacts mode, when carrying out high-temperature process, need
Equipment transfer midway is for being packed into preheating unit for electronic equipment or from the time of preheating unit recycling electronic equipment, and utilizes
Electronic equipment is heated to the time of predetermined temperature by preheating unit, circulation time of equipment processing than when carrying out room temperature processing when
Between the long above-mentioned time.Can be in the dual-purpose this processor of high temperature room temperature, it is expected that when shortening circulation when carrying out high-temperature process
Between, make its circulation time close to progress room temperature processing when.
One embodiment of the present invention is following processors, is had: the pallet of supply and discharge, can be loaded multiple
Electronic equipment;Converter, can be with baseline configuration corresponding with the configuration of multiple testing jacks possessed by experimental rig
To load multiple electronic equipments;First transfer mechanism of supply transfers electronic equipment from pallet to converter;Test
Second transfer mechanism transfers electronic equipment between converter and testing jack, and electronic equipment is crimped on testing jack;
The third transfer mechanism of discharge, from converter to tray conveying electronic equipment;And heating mechanism, it is set to converter,
And the electronic equipment for being placed in converter is heated.
Invention effect
According to the processor of a mode, due to for the converter by electronic equipment from tray conveying to testing jack
On have the heating mechanism heated to electronic equipment, therefore, transfer in equipment transfer midway relative to independently of equipment
The previous processor that the preheating unit of mechanism loaded/recycled electronic equipment is compared, and following when carrying out high-temperature process can be shortened
The ring time.
Detailed description of the invention
Fig. 1 is the integrally-built top view for schematically showing the processor of first embodiment.
Fig. 2 is the perspective view for schematically showing a part of processor of Fig. 1.
Fig. 3 is the perspective view for schematically showing converter possessed by the processor of Fig. 1.
Fig. 4 is the top view of the converter of Fig. 3.
Fig. 5 is the exploded perspective view for showing a part of converter of Fig. 3.
Fig. 6 is the cross-sectional view of the line VI-VI along Fig. 3.
Fig. 7 A is the perspective view for schematically showing the first transfer mechanism possessed by the processor of Fig. 1.
Fig. 7 B is the perspective view for schematically showing the first transfer mechanism possessed by the processor of Fig. 1.
Fig. 8 A is the top view for schematically showing the first transfer mechanism possessed by the processor of Fig. 1.
Fig. 8 B is the top view for schematically showing the first transfer mechanism possessed by the processor of Fig. 1.
Fig. 9 A is figure corresponding with Fig. 7 A and Fig. 8 A, is the figure for schematically showing the movement of the first transfer mechanism.
Fig. 9 B is figure corresponding with Fig. 7 B and Fig. 8 B, is the figure for schematically showing the movement of the first transfer mechanism.
Figure 10 is the perspective view for schematically showing the second transfer mechanism possessed by the processor of Fig. 1.
Figure 11 is the perspective view for schematically showing the second transfer mechanism possessed by the processor of Fig. 1.
Figure 12 A is the perspective view for schematically showing a part of the second transfer mechanism.
Figure 12 B is the perspective view for schematically showing a part of the second transfer mechanism.
Figure 12 C is the perspective view for schematically showing a part of the second transfer mechanism.
Figure 13 A is the figure for schematically showing the movement of the second transfer mechanism.
Figure 13 B is the figure for schematically showing the movement of the second transfer mechanism.
Figure 13 C is the figure for schematically showing the movement of the second transfer mechanism.
Figure 13 D is the figure for schematically showing the movement of the second transfer mechanism.
Figure 13 E is the figure for schematically showing the movement of the second transfer mechanism.
Figure 13 F is the figure for schematically showing the movement of the second transfer mechanism.
Figure 13 G is the figure for schematically showing the movement of the second transfer mechanism.
Figure 13 H is the figure for schematically showing the movement of the second transfer mechanism.
Figure 13 I is the figure for schematically showing the movement of the second transfer mechanism.
Figure 13 J is the figure for schematically showing the movement of the second transfer mechanism.
Figure 13 K is the figure for schematically showing the movement of the second transfer mechanism.
Figure 13 L is the figure for schematically showing the movement of the second transfer mechanism.
Figure 14 is the top view for schematically showing the processor of second embodiment.
Figure 15 is the perspective view for schematically showing converter possessed by the processor of Figure 14.
Figure 16 is the perspective view for schematically showing a part of processor of Figure 14.
Specific embodiment
Hereinafter, the embodiment that present invention will be described in detail with reference to the accompanying.Throughout the drawings, for corresponding structural element
Mark general reference marks.
Fig. 1 shows the overall structure of the processor 10 of first embodiment.Fig. 2 schematically shows one of processor 10
Point.Fig. 3~Fig. 6 is shown as the converter 12 of a structural element of processor 10.Processor 10 be to carry out IC equipment,
The device that the experimental rig of the electrical test of the electronic equipments such as LSI equipment supplies electronic equipment and electronic equipment is discharged.
As shown in figure 1 shown in top view, processor 10 includes: multiple pallets 16 of supply and discharge, can be distinguished
Load multiple electronic equipments 14 (Fig. 6);Converter 12, can with multiple surveys possessed by experimental rig (not shown)
The corresponding baseline configuration of configuration for trying socket 18 loads multiple electronic equipments 14;First transfer mechanism 20 of supply, from
Pallet 16 transfers electronic equipment 14 to converter 12;Second transfer mechanism 22 (dotted line shows operating space) of test,
Electronic equipment 14 is transferred between converter 12 and testing jack 18, and electronic equipment 14 is crimped on testing jack 18;Discharge is used
Third transfer mechanism 24, from converter 12 to pallet 16 transfer electronic equipment 14;Base station 26 carries pallet 16, conversion
Device 12, the first transfer mechanism 20, the second transfer mechanism 22 and third transfer mechanism 24.
Base station 26 usually horizontally configures in the floor of setting processor 10, and experimental rig is in the lower section of base station 26
The mode Chong Die with the predetermined region of base station 26 is arranged in floor.Being equipped in the predetermined region of base station 26 can be from base station 26
Upper direction base station below experimental rig disengaging opening portion 28.In experimental rig, (implemented in diagram with defined configuration
Configured in mode for 2 × 8 ranks shape) it is equipped with the testing jack 18 of number corresponding with the ability of experimental rig, the survey
Examination socket 18 is for supporting the electronic equipment 14 as subjects and connecting it with hookup.These 18 quilts of testing jack
The inside for the opening portion 28 configured in the predetermined region for being set to base station 26.In the shown embodiment, with substantially rectangular wheel
Region of the center of wide base station 26 nearby (for by close in figure) is equipped with opening portion 28.
It is on base station 26, move in/remove along the region constitution equipment for the lateral margin (in figure for lower edge) for leaving opening portion 28
Region 30 out, the equipment move-in/move-out region 30 become the interface with the production line (not shown) of electronic equipment 14.Separately
Outside, on base station 26, surround opening portion 28 region constitution equipment transfer region 32, the equipment transfer region 32, will be from life
The electronic equipment 14 that producing line is moved in front of the test in equipment move-in/move-out region 30 is transferred to the testing jack 18 of experimental rig, and
Electronic equipment 14 after test is transferred to equipment move-in/move-out region 30 from testing jack 18.It should be noted that opening portion
28 and the layout in each region 30,32 be not limited to schematic structure.
Be equipped in equipment move-in/move-out region 30: loading unit 34 moves in multiple electricity before having loaded test from production line
The pallet 16 of sub- equipment 14;Empty pallet rest area 36, being stored in equipment transfer region 32 becomes empty pallet 16;Moving section
38, the pallet 16 of the electronic equipment 14 after having loaded test is moved out to production line.Loading unit 34, empty pallet rest area 36 and
Moving section 38 is sequentially arranged along a lateral margin of base station 26 (being lower edge in figure) according to this.It is equipped with: accumulating in loading unit 34
Device (ス タ ッ カ) 40, it is interim to load the multiple pallets 16 for successively being moved in equipment move-in/move-out region 30;Band 42 is loaded,
These pallets 16 are conveyed to equipment transfer region 32 one by one from stockpile device 40.It is equipped in empty pallet rest area 36: slow
Band 44 is rushed, is conveyed empty pallet 16 is become in equipment transfer region 32 one by one to equipment move-in/move-out region 30;
Stockpile device 46 temporarily loads these multiple pallets 16.It is equipped in moving section 38: unloading carrier band 48, after test will have been loaded
The pallet 16 of electronic equipment 14 is conveyed to equipment move-in/move-out region 30 one by one;Stockpile device 50, it is interim before moving out
Load these pallets 16.
Be equipped in equipment transfer region 32: supply position 52 makes to utilize loading band 42 from loading unit in the supply position 52
34 stockpile device 40 conveys the pallet 16 come one by one to be stopped, and is carried out the first transfer mechanism 20 from the pallet 16 and is taken out test
The movement of preceding multiple electronic equipments 14;Tray storage position 54 will become in the tray storage position 54 in supply position 52
Empty pallet 16 is put to the shifting of buffer strip 44 one by one, becomes product of the buffer strip 44 by the pallet 16 to empty pallet rest area 36
The starting point that storage 46 conveys;Drain position 56, in the drain position 56, by supply position 52 become empty pallet 16 or from
Pallet 16 that the stockpile device 46 of empty pallet rest area 36 conveys again to tray storage position 54 is one by one to stopped
It unloads 48 shifting of carrier band to put, carries out the movement that third transfer mechanism 24 places multiple electronic equipments 14 after test to the pallet 16, and
And becomes and unload the starting point that carrier band 48 conveys the pallet 16 to the stockpile device 50 of moving section 38.
Processor 10 have empty pallet move laying mechanism 58, the empty pallet move laying mechanism 58 be used for by empty pallet 16 from supply position
52 are set to put to tray storage position 54 or the shifting of drain position 56 one by one, or for by empty pallet 16 from tray storage
It is put one by one to the shifting of drain position 56 position 54.Empty pallet move laying mechanism 58 include: moveable arm 60, loading unit 34,
It is moved back and forth in the orientation (being arrow α direction in figure) of empty pallet rest area 36 and moving section 38;Handle part is (in figure
It is not shown), empty pallet 16 can releasedly be held by absorption, gripping etc. in the front end of moveable arm 60.
The processor 101 of illustrated embodiment includes that 34, three empty pallet rest areas 36 of a loading unit and three remove
Portion 38 out.Loading unit 34, empty pallet rest area 36 and the respective number of moving section 38 are set according to required by processor 10
It is suitably selected for processing capacity.It especially, can be according to the purposes of such as electronic equipment 14 by having multiple moving sections 38
These moving sections 38 are distinguished, move out the pallet 16 for having loaded the electronic equipment 14 of different purposes from each moving section 38.At this
In the case of, such as can be configured to, according to the result of the electrical test of experimental rig functionally to from testing jack 18 to
The electronic equipment 14 that converter 12 is transferred is classified, and the electronic equipment 14 that third transfer mechanism 24 has classified these suitably divides
It is corresponding with the moving section 38 that gives different purposes and in the standby pallet 16 of drain position 56 and be discharged, each unload carrier band
These pallets 16 are conveyed to corresponding stockpile device 50 by 48.Furthermore, it is contemplated that have due to test result or other reasons and
It is not transported to the electronic equipment 14 of moving section 38, third transfer mechanism 24 this electronics can be transferred into from converter 12 and set
The arbitrary place on the base station 26 different from moving section 38 is arranged in the rest area 62 of standby 14 pallet 16.
First transfer mechanism 20 can equipment transfer it is in region 32, along base station 26 and equipment move-in/move-out area
The region of other different lateral margins (being left border in Fig. 1) of domain 30, (is X1 axis and Y1 in Fig. 1 according to horizontal orthogonal 2 axis
Axis) position command of coordinate system moved.Specifically, the first transfer mechanism 20 includes: Y1 axis feed arrangement 64, propped up
It holds in the top of base station 26;X1 axis feed arrangement 66, by Y1 axis feed arrangement 64 bearing for can to horizontal Y1 axis direction into
Row feed motion;Transfer head 68, by X1 axis feed arrangement 66 bearing for can to horizontal X 1 axis direction orthogonal with Y1 axis into
Row feed motion.Transfer head 68, which has, to be taken out multiple electronic equipments 14 from pallet 16 and is placed on multiple of converter 12
Hold portion 70.Each handle part 70 is configured to, including at least its front end part transfer head 68 on to X/Y plane (horizontal plane)
The orthogonal axis (not shown) direction Z1 carries out the lifting action of predetermined distance.Each handle part 70 its front end by absorption,
Gripping etc. can hold an electronic equipment 14 with discharging.
First transfer mechanism 20 transfers head 68 in base under the driving of Y1 axis feed arrangement 64 and X1 axis feed arrangement 66
The top of platform 26 is horizontally moved freely in X/Y plane, and passes through multiple handle parts 70 relative to transfer head 68 in lead
Histogram carries out lifting action upwards, multiple electronic equipments 14 can be taken out together from the pallet 16 for being located at supply position 52, and will
These electronic equipments 14 are placed in the desired position of standby converter 12 near supply position 52 together.It needs
Bright, pallet 16 can support multiple electronic equipments 14 with the configuration arranged on the direction parallel with X1 axis and Y1 axis.
To orthogonal 2 axis (the X1 axis that the position of each electronic equipment 14 on pallet 16 can be acted by the first transfer mechanism 20
And Y1 axis) coordinate value of coordinate system indicates.First transfer mechanism 20 is stated as detailed below.
Third transfer mechanism 24 has and can transfer in region 32, moving with configured with first along base station 26 in equipment
The region for sending the lateral margin (in Fig. 1 for right border) of the lateral margin opposite side of mechanism 20 (in Fig. 1 is according to horizontal orthogonal 2 axis
X3 axis and Y3 axis) position command of coordinate system carries out mobile structure.Specifically, third transfer mechanism 24 includes: Y3 axis
Feed arrangement 72 is supported in the top of base station 26;X3 axis feed arrangement 74, being by the bearing of Y3 axis feed arrangement 72 can
Feed motion is carried out to horizontal Y3 axis direction;Head 76 is transferred, by the bearing of X3 axis feed arrangement 74 for can be to orthogonal with Y3 axis
3 axis direction of horizontal X carry out feed motion.Y3 axis is parallel with Y1 axis, and X3 axis is parallel with X1 axis.Transfer head 76 has from converter
12 take out multiple electronic equipments 14 and are placed on multiple handle parts 78 of pallet 16.Each handle part 78 is configured to, and at least wraps
It is advised on transfer head 76 to the Z3 axis (not shown) direction orthogonal with X/Y plane (horizontal plane) part for including its front end
The lifting action of set a distance.Each handle part 78 can hold an electronic equipment by absorption, gripping etc. in its front end with discharging
14。
Under the driving of Y3 axis feed arrangement 72 and X3 axis feed arrangement 74, head 76 is transferred in the top of base station 26 in XY
It is horizontally moved freely in plane, and multiple handle parts 78 carry out lifting relative to transfer head 76 in the vertical direction and move
Make, accordingly, third transfer mechanism 24 can take out together multiple electronic equipments from the converter 12 being located near drain position 56
14, and these electronic equipments 14 are placed in the pallet 16 standby in drain position 56 together.It should be noted that 16 energy of pallet
It is enough that multiple electronic equipments 14 are supported with the configuration arranged on the direction parallel with X3 axis and Y3 axis.To on pallet 16
Orthogonal 2 axis (X3 axis and Y3 axis) coordinate system that the position of each electronic equipment 14 can be acted by third transfer mechanism 24
Coordinate value indicate.Third transfer mechanism 24 is stated as detailed below.
Fig. 2 schematically shows a part of processor 10, includes converter 12, testing jack 18 and the second drag-over unit
Part including structure 22.As shown, the second transfer mechanism 22 has in equipment transfer region 32, base station 26 opening portion
28 top can refer to according to the position of horizontal 1 axis and 2 vertical axis (being Y2 axis, Z2a axis and Z2b axis in Fig. 2)
Order carries out mobile structure.Specifically, the second transfer mechanism 22 includes: Y2 axis feed arrangement 80, supported by base station 26;The
One crimp head 82 carries out feed motion to horizontal Y2 axis direction under the driving of Y2 axis feed arrangement 80, and feeds in Z2a axis
Feed motion is carried out to the vertical Z2a axis direction orthogonal with Y2 axis under the driving of device (not shown);Second crimp head 84,
Its under the driving of Y2 axis feed arrangement 80 to horizontal Y2 axis direction carry out feed motion, and Z2b axis feed arrangement (in figure not
Show) driving under to the vertical Z2b axis direction orthogonal with Y2 axis carry out feed motion.Y2 axis is parallel with Y1 axis and Y3 axis.
Z2a axis and Z2b axis are parallel to each other, and parallel with Z1 axis and Z3 axis.
First and second crimp head 82,84 is respectively in the upper direction Y2 of base station 26 under the driving of Y2 axis feed arrangement 80
Axis direction is horizontally moved, and under the driving of Z2a axis feed arrangement or Z2b axis feed arrangement relative to converter 12 or
Testing jack 18 carries out lifting action, and accordingly, the second transfer mechanism 22 can be set from the electronics that converter 12 takes out regulation number
Standby 14, the electronic equipment 14 of taking-up is loaded into testing jack 18 and with the crimping of defined pressing force, and by the electronics after crimping
Equipment 14 recycles from testing jack 18 and sends converter 12 back to.Second transfer mechanism 22 is stated as detailed below.
As shown in Figure 1, processor 10 has to the first transfer mechanism 20, the second transfer mechanism 22 and third transfer mechanism
The operation control part 86 that 24 above-mentioned movement is controlled.Operation control part 86, which can also control, to be loaded band 42, buffer strip 44, unloads
Carrier band 48 and empty pallet move the movement of laying mechanism 58.Operation control part 86 can also have operating surface used in operator
Plate, display.What the equipment processing under the control of operation control part 86 acted states as detailed below.
As shown in Figure 1, processor 10 has the testing jack 18 across experimental rig and configures the of side opposite each other
One converter 12A and the second converter 12B.First converter 12A configures in equipment transfer region 32, base station in Fig. 1
The downside of 26 opening portion 28, the second converter 12B configure in equipment transfer region 32, base station 26 opening in Fig. 1
The upside in portion 28.First converter 12A and the second converter 12B has the structure being substantially identical to each other, the first converter 12A
Converter 12 is collectively referred to as sometimes in the present specification with the second converter 12B.
First converter 12A and the second converter 12B have respectively to from pallet 16 transfer come electronic equipment 14 into
First support plate 88 of the supply side of row bearing and the discharge that the electronic equipment 14 come from the transfer of testing jack 18 is supported
Second support plate 90 of side.Each converter 12 can be in first position (such as the position for configuring the first converter 12A in Fig. 1)
It is moved between the second position (such as configuring the second position converter 12B in Fig. 1), first position is the first transfer mechanism 20
It can enable that electronic equipment 14 is placed in the first support plate 88 and the second transfer mechanism 22 makes electronic equipment 14 be placed in second
The position of support plate 90, the second position are that the second transfer mechanism 22 can take out electronic equipment 14 and the from the first support plate 88
Three transfer mechanisms 24 can take out the position of electronic equipment 14 from the second support plate 90.
Fig. 3~Fig. 6 schematically shows the structure of the first converter 12A.In addition to the first support plate 88 and the second support plate 90
Relative configuration (referring to Fig.1) it is different except, the second converter 12B has and the first converter 12A substantially the same structure.
Hereinafter, referring to Fig.1 and Fig. 3~Fig. 6, the first converter 12A and the second converter 12B are collectively referred to as converter 12, to
The structure of one converter 12A and the second converter 12B are illustrated.
Converter 12 has the substrate 92 with profile generally L-shaped, in the predetermined bits of the upper surface 92a of substrate 92
Set, the second support plate 90 of the first support plate 88 of substantially rectangular profile and the substantially rectangular profile smaller than the first support plate 88 with
Configuration adjacent to each other is fixed.To which in this embodiment, the first support plate 88 and the second support plate 90 pass through substrate 92
And it is integrated by interconnected.
Converter 12 has and can carry out along the surface 26a of base station 26 according to the position command of horizontal 1 axis (X2 axis)
Mobile structure.Specifically, substrate 92 and the X2 axis for moving back and forth converter 12 between the first position and the second position
Feed arrangement 94 links.X2 axis feed arrangement 94 includes: transmission belt 98, is continuously erected at a pair of of the belt wheel 96 being separated from each other
Between;The power source 100 of motor etc. is supported and connect with the belt wheel of a side 96 by base station 26;A pair of of line parallel to each other
Property guide rail 102, is linearly extended along the upper surface 26a of base station 26.Transmission belt 98 is linked in which can transmit power
Substrate 92, substrate 92 are mounted on a pair of of linear guides 102.For converter 12, the first support plate 88 and second
Board 90 is integrally formed along with the positive and negative rotation of the output shaft of power source 100, a pair of of linear guides 102 guidance it
Under, converter 12 is back and forth moved in the X2 axis direction parallel with X1 axis and X3 axis between the first position and the second position
It is dynamic.
In said structure, belt wheel 96 and transmission belt 98 be can replace and using other power such as sprocket wheel and chain
Transmission mechanism.Alternatively, it is also possible to which at least one party of the first support plate 88 and the second support plate 90 is removably installed in base
Plate 92 (shows the structure that support plate 88,90 is formed to suitably to be replaced with other support plates to be able to carry out in Fig. 6
The bolt 104 and positioning pin 106 of replacement).Alternatively, it is also possible to which the first support plate 88 and the second support plate 90 are respectively arranged in
On substrate independent of each other, and these substrates are driven by the way that X2 axis feed arrangement 94 is synchronous.
First support plate 88 has multiple supporting parts 108 of one electronic equipment 14 of each bearing respectively.These supporting parts 108
All have identical size and chamfered shape, the direction parallel with the moving direction of converter 12 (X2 axis) and with conversion
The moving direction (X2 axis) of device 12 is arranged at equal intervals respectively on orthogonal direction.To the position of each supporting part 108
(or position of converter 12) can with orthogonal 2 axis (X1 axis and Y1 axis) coordinate system that the first transfer mechanism 20 is acted,
Horizontal 1 axis (X2 axis) that horizontal 1 axis (Y2 axis), the converter 12 that second transfer mechanism 22 is acted are acted, with
And the respective coordinate value of orthogonal 2 axis (X3 axis and Y3 axis) coordinate system that third transfer mechanism 24 is acted indicates.
The number of supporting part 108 is more than the number of testing jack 18 possessed by experimental rig.In addition, supporting part 108
Horizontal spacing P1 and longitudinal pitch P2 is respectively than between the horizontal spacing and longitudinal direction of testing jack 18 possessed by experimental rig
Away from small.Here, " spacing " refers to the mutual shortest distance in the corresponding position in mutual alignment of adjacent supporting part 108.First
Support plate 88 (can be matched in the shown embodiment for 2 × 8 ranks shape with the configuration of the testing jack 18 with experimental rig
Set) corresponding baseline configuration, multiple electronic equipments 14 are supported on the desired supporting part 108 in multiple supporting parts 108.
Here, " baseline configuration " is to include supporting part 108 corresponding with the relative position of testing jack 18, number and spacing
Term including relative position, number and spacing.It should be noted that in the shown embodiment, horizontal spacing P1 and vertical
It is mutually the same to spacing P2, but horizontal spacing P1 and longitudinal pitch P2 can also be different from each other.
Second support plate 90 has multiple supporting parts 110 of one electronic equipment 14 of each bearing respectively.These supporting parts 110
All have identical size and chamfered shape, the direction parallel with the moving direction of converter 12 (X2 axis) and with conversion
The moving direction (X2 axis) of device 12 is arranged at equal intervals respectively on orthogonal direction.To the position of each supporting part 110
(or position of converter 12) can with orthogonal 2 axis (X1 axis and Y1 axis) coordinate system that the first transfer mechanism 20 is acted,
Horizontal 1 axis (X2 axis) that horizontal 1 axis (Y2 axis), the converter 12 that second transfer mechanism 22 is acted are acted, with
And the respective coordinate value of orthogonal 2 axis (X3 axis and Y3 axis) coordinate system that third transfer mechanism 24 is acted indicates.
The number of supporting part 110 is equal with the number of testing jack 18 possessed by experimental rig.In addition, supporting part 110
Horizontal spacing P3 and longitudinal pitch P4 respectively with the horizontal spacing of testing jack 18 and longitudinal direction possessed by experimental rig
Spacing is equal.Here, " spacing " refers to the mutual shortest distance in the corresponding position in mutual alignment of adjacent supporting part 110.
Second support plate 90 can be opposite with the configuration (configuring in figure for 2 × 8 ranks shape) of the testing jack 18 with experimental rig
Multiple electronic equipments 14 are supported on multiple supporting parts 110 by the baseline configuration answered.Here, " baseline configuration " is to include and test
Including the relative position of socket 18, the relative position of number and the corresponding supporting part 110 of spacing, number and spacing
Term.It should be noted that in the shown embodiment, horizontal spacing P3 and longitudinal pitch P4 are mutually the same, but horizontal spacing
P3 and longitudinal pitch P4 can also be different from each other.In addition, in the shown embodiment, P3 is 2 times of P1, P4 is 2 times of P2, but
P3 and P4 can also be 3 or more the integral multiple of P1 and P2 respectively.
In a processor 10, the configuration of multiple electronic equipments 14 and multiple tests of experimental rig placed by the pallet 16
When the configuration of socket 18 is different, the efficiency of the practice that directly transfer electronic equipment 14 has test from pallet 16 to testing jack 18 is disliked
The anxiety of change.Converter 12 plays the following functions: by the way that the configuration of the electronic equipment 14 on pallet 16 to be converted into and testing jack
The 18 corresponding baseline configuration of configuration is supported and is improved the efficiency of the practice of test.Especially, when the test of experimental rig
When the number of socket 18 is more (such as 8 or more), if converter 12 is near testing jack 18 with baseline configuration branch
Multiple electronic equipments 14 are held, then can simplify the driving that electronic equipment 14 is crimped on to the second transfer mechanism 22 of testing jack 18
Mode can make 22 high speed motion of the second transfer mechanism.In addition, by utilizing the first transfer mechanism 20, the second transfer mechanism 22
And third transfer mechanism 24 is shared implementation electronic equipment 14 and is being converted from pallet 16 to the transfer of converter 12, electronic equipment 14
The transfer of transfer and electronic equipment 14 from converter 12 to pallet 16 between device 12 and testing jack 18, can make these
The superposition of transfer mechanism 20,22,24 ground movement, the implementation that can make the whole high speed of equipment processing and further increase test are imitated
Rate.
Operation control part 86 can be dynamic with the first transfer mechanism 20, the second transfer mechanism 22 and third transfer mechanism 24
Converter 12 (the first converter 12A and the second converter 12B) is controlled in first position and second with making control associated
Reciprocating movement between setting.What the equipment processing under the control of operation control part 86 acted states as detailed below.
As shown in Fig. 3, Fig. 5 and Fig. 6, processor 10 has set on converter 12 (the first converter 12A and second turn
Parallel operation 12B) and the heating mechanism 112 of heater contacts mode that the electronic equipment 14 for being placed in converter 12 is heated.
Heating mechanism 112 heats the first support plate 88 of converter 12, and does not heat substantially to the second support plate 90.Scheming
Show in embodiment, heating mechanism 112 has the heater (example for the plate shape being clamped between the first support plate 88 and substrate 92
Such as it is known as rubber heater) 114.Heater 114 passes through uniform to all multiple supporting parts 108 possessed by the first support plate 88
Ground is heated, and can be heated the electronic equipment 14 for being supported on any supporting part 108 indirectly and is allowed to warm to predetermined temperature.
Heating mechanism 112 is connect with the heater circuit (Fig. 5) with power supply 116 and switch portion 117.Pass through on-off switch
Portion 117 allows hand over the work and stopping of heating mechanism 112.Switch portion 117 can by the manual working of operator come into
Row on-off can also make 117 auto switching of switch portion by operation control part 86.Processor 10 by having switch portion 117,
It can selectively implement that electronic equipment 14 is heated to the high-temperature process of predetermined temperature before the test and thermionic device is not added
14 room temperature processing.
The temperature sensor 118 that the temperature that processor 10 is also equipped with the object heated to heating mechanism 112 is perceived
Controlled with the temperature that is perceived according to temperature sensor 118 heating mechanism 112 plus thermally operated temperature control part 119.?
In illustrated embodiment, temperature sensor 118 perceives the multiple supporting parts 108 for the first support plate 88 that heater 114 is heated
Respective temperature.Real-time temperature data of the temperature control part 119 referring to the supporting part 108 obtained from temperature sensor 118
The switching circuit 114a for belonging to heater 114 is paid to control, the temperature of supporting part 108 is adjusted to preset target temperature
Degree.It should be noted that temperature sensor 118 is also configured to the temperature for the electronic equipment 14 that perception supporting part 108 supports,
Or the temperature of the substrate 92 of the first support plate 88 is fixed in perception.
Heating mechanism 112 is not limited to the heater 114 of plate shape, can be uniformly heated up all multiple supporting parts 108
As premise, it can have various heaters.Alternatively, built-in among each supporting part 108 electricity can also be directly heated
The heater of sub- equipment 14.In addition, influenced brought by the heat of heating mechanism 112 to eliminate, it can also be in 12 He of converter
Thermal insulation board 120 (Fig. 6) is set between base station 26.
Hereinafter, referring to Fig.1~Fig. 6 illustrates that the equipment processing based on processor 10 acts.
Illustrate high-temperature process first.In this case, being converted as preparation work for the first converter 12A and second
Device 12B connects the switch portion 117 of heater circuit (Fig. 5) and heating mechanism 112 is made to work, and heats the first support plate 88.In addition,
First converter 12A and the second converter 12B both sides are configured to first position by operation control part 86.
The pallet 16 of multiple electronic equipments 14 before test will be loaded with specified configuration from the production line of electronic equipment 14
Move in loading unit 34.The pallet 16 is by the loading band 42 that is acted under the control of operation control part 86, by from stockpile device
40 send to supply position 52.Operation control part 86 controls Y1 axis feed arrangement 64 and X1 axis feed arrangement 66, by the first transfer
The transfer head 68 of mechanism 20 is positioned at the position (X1-Y1 coordinate) of the vertical top of the pallet 16 stopped in supply position 52.It connects
Get off, operation control part 86 makes multiple handle parts 70 carry out lifting action on transfer head 68, these handle parts 70 is made to hold position
It is taken out in multiple electronic equipments 14 on the pallet 16 of supply position 52 and by it from pallet 16.
For configuring the converter 12 (such as first converter 12A) in either first position, the first transfer mechanism
20 Y1 axis feed arrangement 64 and X1 axis feed arrangement 66 is acted under the control of operation control part 86, will transfer head 68
It is positioned at the position (X1-Y1 that the vertical top in the desired supporting part 108 of the first support plate 88 configures each handle part 70
Coordinate) at.Next, operation control part 86 makes multiple handle parts 70 carry out lifting action on transfer head 68, by each holding
The electronic equipment 14 that portion 70 is held is placed on the desired supporting part 108 of the first support plate 88.
Operation control part 86 executes the above-mentioned equipment transfer movement based on the first transfer mechanism 20 repeatedly, by electronic equipment
14 are transferred to configuration in the first converter 12A of first position and second from the multiple pallets 16 for successively being moved in loading unit 34
On all supporting parts 108 of converter 12B.As a result, all supporting parts 108 of each converter 12 include multiple groups with test
The corresponding baseline configuration of configuration of the testing jack 18 of device supports the desired supporting part 108 of multiple electronic equipments 14
Group.During the transfer movement, multiple electronic equipments 14 are continued with the sequence for being placed on supporting part 108 with the required time
Receive the heat effect of heating mechanism 112, to successively be warming up to predetermined temperature.
Operation control part 86 is to the 12 (example of converter for formerly finishing the transfer of electronic equipment 14 to all supporting parts 108
If the X2 axis feed arrangement 94 of the first converter 12A) is controlled, make the converter (the first converter 12A) from first position
It is moved to the second position.For configuring the first converter 12A in the second position, the Y2 axis feed arrangement of the second transfer mechanism 22
80 and Z2a axis feed arrangement is acted under the control of operation control part 86, and the first crimp head 82 is from the first converter 12A
The desired supporting part 108 of the first support plate 88 heating for passing through the required time is taken out according to the sequence that begins to warm up
Multiple electronic equipments 14 of the baseline configuration of predetermined temperature are warming up to, the electronic equipment 14 of taking-up is forced home in corresponding position
In the testing jack 18 set, and crimped with defined pressing force.In this state, experimental rig sets the electronics to have heated up
Standby 14 implement electrical test.
During electronic equipment 14 of the experimental rig to the first crimp head 82 implements test, operation control part 86 controls respectively
X2 axis feed arrangement 94 makes the first converter 12A be moved to first position from the second position, and makes the second converter 12B from
One position is moved to the second position.For configuring the second converter 12B in the second position, the Y2 axis of the second transfer mechanism 22 into
It is acted under the control of operation control part 86 to device 80 and Z2b axis feed arrangement, the second crimp head 84 is from second turn
The desired supporting part 108 of the first support plate 88 of parallel operation 12B takes out according to the sequence begun to warm up through the required time
Heating and be warming up to multiple electronic equipments 14 of the baseline configuration of predetermined temperature.
At the end of the electrical test that the electronic equipment 14 that is crimped for the first crimp head 82 carries out, for configuration the
First converter 12A of one position, the Y2 axis feed arrangement 80 and Z2a axis feed arrangement of the second transfer mechanism 22 are controlled in movement
It is acted under the control in portion 86 processed, the first crimp head 82 lifts from testing jack 18 and multiple electronic equipments after recovery test
14, and return to multiple supporting parts 110 of the second support plate 90 of the first converter 12A with keeping baseline configuration.Meanwhile second moves
The Y2 axis feed arrangement 80 and Z2b axis feed arrangement for sending mechanism 22 are acted under the control of operation control part 86, and second
Crimp head 84 is by the electricity for the baseline configuration taken out from the desired supporting part 108 of the first support plate 88 of the second converter 12B
Sub- equipment 14 is crimped on the testing jack 18 positioned at corresponding position with defined pressing force.In this state, experimental rig pair
The electronic equipment 14 to have heated up implements electrical test.
Above-mentioned movement is repeated by first and second converter 12A, 12B and the second transfer mechanism 22, to passing through
All electronic equipments 14 that first transfer mechanism 20 is transplanted on converter 12 implement electrical test.It should be noted that by
One and second the transfer movement of electronic equipment 14 that carries out of converter 12A, 12B and the second transfer mechanism 22 it is further in detail
Feelings are seen below.
During electronic equipment 14 of the experimental rig to the second crimp head 84 implements test, operation control part 86 controls each X2
Axis feed arrangement 94, so that the second converter 12B be made to be moved to first position from the second position, and make the first converter 12A from
First position is moved to the second position.For configuring the first converter 12A in the second position, the Y3 axis of third transfer mechanism 24
Feed arrangement 72 and X3 axis feed arrangement 74 are acted under the control of operation control part 86, and transfer head 76 is positioned at
The vertical top of multiple supporting parts 110 of second support plate 90 configures the position (X3-Y3 coordinate) of each handle part 78.Next,
Operation control part 86 makes multiple handle parts 78 carry out lifting action on transfer head 76, holds these handle parts 78 at second
Electronic equipment 14 after the test supported on the desired supporting part 110 of board 90, and it is above-mentioned from the first converter 12A taking-up
Electronic equipment 14.
During this period, laying mechanism 58 is moved from supply position 52 or tray storage position 54 to drain position by empty pallet
The pallet 16 of 56 shifting emptying is simultaneously standby.Operation control part 86 controls Y3 axis feed arrangement 72 and X3 axis feed arrangement 74, by the
The transfer head 76 of three transfer mechanisms 24 is positioned at position (the X3-Y3 seat of the vertical top in the standby pallet 16 of drain position 56
Mark).Next, operation control part 86 makes multiple handle parts 78 carry out lifting action on transfer head 76, by each handle part 78
The electronic equipment 14 of holding is placed on the pallet 16 of drain position 56.The pallet of electronic equipment 14 after having loaded test
16 unload carrier band 48 by what is acted under the control of operation control part 86, are sent to stockpile device 50 from supply position 56, and
It moves out from moving section 38 to production line.
When processor 10 implements room temperature processing, as preparation work, for the first converter 12A and the second converter
12B turns off the switch portion 117 of heater circuit (Fig. 5) and stops heating mechanism 112.Later equipment processing movement with it is above-mentioned
High-temperature process in equipment processing movement it is substantially the same.In the case where room temperature processing, without the concern for electronic equipment 14
Required heating time select transfer destination supporting part 108 place or determine transfer sequence (do not need yet using
All supporting parts 108).On the other hand, room temperature processing in, even if with the shifting in the high-temperature process for considering heating time
It send same order to transfer electronic equipment 14 to all supporting parts 108, substantive shadow will not be caused to circulation time
It rings.To which the equipment processing movement in room temperature processing and the equipment processing movement in high-temperature process are substantially the same.
In the processor 10 for having above structure, due in order to 14 efficiency of electronic equipment is moved from pallet 16 well
It is sent to testing jack 18 and has adding for the heater contacts mode heated to electronic equipment 14 in the converter 12 of equipment
Therefore heat engine structure 112 transfers midway relative to the preheating unit filling independently of equipment transfer mechanism/recycling electricity in equipment
The previous processor of sub- equipment is compared, and circulation time when carrying out high-temperature process can be shortened.Especially, if being formed as logical
It crosses Operation switch portion 117 and switches the work of heating mechanism 112 and the structure stopped, then processor 10 can selectively be implemented
High-temperature process and room temperature handle both sides.Also, since equipment processing movement is substantially the same in high-temperature process and room temperature processing,
Therefore, can make carry out high-temperature process when circulation time close to carry out room temperature processing when circulation time.
In addition, the first support plate 88 of converter 12 has number than test in the processor 10 with above structure
Multiple supporting parts 108 of testing jack more than 18 possessed by device, and can be supported multiple electronic equipments 14 with baseline configuration
Desired supporting part 108 in these supporting parts 108, therefore, in order to which electronic equipment 14 is placed in the first support plate 88
All supporting parts 108 on and need time to a certain degree, as a result, it can be ensured that heating mechanism 112 is by each electricity
Sub- equipment 14 is heated to the time required for predetermined temperature.Electronic equipment 14 is placed in all supporting parts with regulation sequence
The circulation time of 108 high-temperature process and the room temperature that electronic equipment 14 is independently loaded with the place of supporting part 108, transfer sequence
The circulation time of processing is substantially the same.That is, no matter electronic equipment 14 is loaded according to the characteristic structural of the first support plate 88
In multiple supporting parts 108 sequence how, circulation time when carrying out high-temperature process can be made normal close to carrying out
Circulation time when temperature processing.
The first support plate 88 is determined by the time required for each electronic equipment 14 is heated to predetermined temperature
The number of possessed supporting part 108, can be avoided the deficiency of heating time.For example, by the number of setting supporting part 108,
So that the electronic equipment 14 being finally placed on the first support plate 88 of converter 12 from being started to warm up in supporting part 108 to
Elapsed time H1 is heated to advising with by electronic equipment 14 until taking out to transfer to testing jack 18 from supporting part 108
Determine that time H2 required for temperature is roughly the same, so as to all electronic equipments 14 on the first support plate 88 ensure to
Heating time H2 required for few.Converter 12 is from first after having loaded electronic equipment 14 on all supporting parts 108
Set extremely short to the second position mobile time, therefore, time H1 is substantially to carry out on testing jack 18 to electronic equipment 14
N and 2 converter of number (number for the electronic equipment 14 tested together) of the time t of test, testing jack 18
Following functions of the total 2N of 12 supporting part 108.
H1=2N/n × t
Here, if H1=H2,
2N=H2/t × n.
For example, as H2=70sec, t=3.2sec, n=16 (Fig. 1), the supporting part 108 of 2 converters 12
Total 2N is
2N=70/3.2 × 16=350.
To as long as the first support plate 88 of a converter 12 has 175 supporting parts 108, it will be able to first
Heating time 70sec required for all electronic equipments 14 on board 88 ensure at least.
Fig. 7 A~Fig. 9 B schematically shows the first transfer mechanism 20 of the processor 10 based on illustrated embodiment.Third is moved
Send mechanism 24 (Fig. 1) that there is the structure substantially the same with the first transfer mechanism 20.Hereinafter, referring to Fig. 4 and Fig. 7 A~Fig. 9 B
Illustrate the structure of first and third transfer mechanism 20,24, and remarks additionally and transferred by the equipment that the second transfer mechanism 22 carries out
Movement.
First transfer mechanism 20, which has, to be arranged in transfer head 68 (Fig. 1) to direction parallel with X1 axis and Y1 axis respectively
And it is configured to 16 handle parts 70 of 4 × 4 ranks shapes.Each handle part 70 has in front end can be to one by vacuum suction
The adsorption section 122 that electronic equipment 14 (Fig. 6) is releasedly held.It should be noted that the holding construction of handle part 70 is not
It is defined in vacuum suction, it can also be using magnetic-adsorption or the gripping etc. carried out with finger element.
First transfer mechanism 20 is acted as previously mentioned under the control of operation control part 86 (Fig. 1), can will be from
16 electronic equipments 14 taken out positioned at the pallet 16 (Fig. 1) of supply position 52 (Fig. 1) are (lateral with the spacing with baseline configuration
P3, longitudinal P 4) corresponding spacing is placed into from the multiple of the first support plate 88 of the converter 12 (Fig. 1) for being located at first position
On the supporting part 108 selected in supporting part 108.For example, in the first converter 12A shown in Fig. 4, by being transferred twice
First 68 are placed into electronic equipment 14 movement on supporting part 108, can be placed into be arranged in by electronic equipment 14 and are spaced in length and breadth
On 16 supporting part 108a (hacures expression) of one 2 × 8 ranks shape.
Operation control part 86 (Fig. 1) executes the above-mentioned equipment transfer movement carried out by the first transfer mechanism 20 repeatedly, makes
Electronic equipment 14 more than the number of baseline configuration is placed on multiple supporting parts 108 of converter 12.For example, shown in Fig. 4
The first converter 12A in, can adjacent in the longitudinal direction with the group for the supporting part 108a that placed electronic equipment 14 before and
Placement electronics on the 16 supporting part 108b (hacures expression) for 2 × 8 ranks shape for being spaced one in length and breadth is equally arranged in set
Standby 14.In this state, the electronic equipment 14 amounted on 32 supporting parts 108a, 108b is placed on to match including two groups in benchmark
The group for 16 electronic equipments 14 set.The transfer repeatedly that operation control part 86 controls the first transfer mechanism 20 as described above is dynamic
Make, thus, it is possible to be sequentially placed electronic equipment 14 on all supporting parts 108 of first support plate 88 of converter 12.
In the case where carrying out high-temperature process, the electronic equipment 14 of converter 12 is shifted into according to being placed to supporting part
108 sequence and by heating mechanism 112 (Fig. 3) heat.Therefore, operation control part 86 controls the second transfer mechanism as previously mentioned
The transfer movement of 22 (Fig. 2), thus with sequence substantially corresponding with the sequence being placed on supporting part 108 by the electricity of baseline configuration
Sub- equipment 14 is transferred to testing jack 18 (Fig. 1) from desired supporting part 108.For example, the first converter shown in Fig. 4
In 12A, be placed on amount to 32 supporting parts 108a, 108b on electronic equipment 14 in, in figure since upper the first row and
The electronic equipment 14 placed on total 16 supporting parts 108a, 108b of second row is placed in a manner of baseline configuration.Therefore,
Second transfer mechanism 22 first with by figure since upper on the first row and the total of the second row 16 supporting parts 108a, 108b
The electronic equipment 14 of placement is acted to the mode that testing jack 18 is transferred.When the electrical test of these electronic equipments 14 terminates
And when returning to the supporting part 110 of the second support plate 90 as earlier mentioned, next, the second transfer mechanism 22 in figure from above will open
What the electronic equipment 14 placed on beginning the third line and total 16 supporting parts 108a, 108b of fourth line was transferred to testing jack 18
Mode is acted.
The testing jack 18 of experimental rig is being configured to longitudinal direction 2, laterally 2 by embodiment as shown in Figure 1mA (m
Integer for 1 or more) ranks shape structure (m=3 in Fig. 1) in, multiple handle parts possessed by the first transfer mechanism 20
70 can be configured to longitudinal 2 on transfer head 68nA, transverse direction 2nThe ranks shape of a (integer that n is 1 or more, m >=n) is (in Fig. 1
N=2).According to this structure, it can reduce by the first transfer mechanism 20 and pass through above-mentioned transfer movement repeatedly to converter 12
Supporting part 108 when transferring electronic equipment 14, the number of occurrence of transfer movement.It should be noted that the first transfer mechanism 20
Also it can have to cope with and configure the number of the experimental rig of odd number testing jack 18 at least one party in length and breadth and match
The handle part 70 set.
First transfer mechanism 20 can have displacement mechanism 124, and displacement mechanism 124 is so that the multiple electricity taken out from pallet 16
The spacing of sub- equipment 14 mode corresponding with the spacing of baseline configuration makes multiple 70 relative displacements of handle part, so as to cope with
It is placed in the spacing of multiple electronic equipments 14 of pallet 16 occasion different from spacing (the lateral P3, longitudinal P 4) of baseline configuration.
Displacement mechanism 124 is to make other all handle parts on the basis of a handle part 70 (for handle part 70a in Fig. 7 A~Fig. 9 B)
70 are displaced in transfer head 68 (Fig. 1) to the direction β parallel with X1 axis and Y1 axis respectively and the direction γ.
Displacement mechanism 124 has multiple link mechanisms 126, and multiple link mechanism 126 can make to remove a handle part 70a
Other all handle parts 70 in addition are carried out in the way of direct proportion relative to a handle part 70a by mutual distance
Displacement.In the shown embodiment, 4 handle parts 70 to arrange on the direction β provide the link mechanism 126 in a direction β,
It is equipped on the direction β and amounts to 4 link mechanisms 126.Similarly, 4 handle parts 70 to arrange on the direction γ provide one
The link mechanism 126 in the direction γ is equipped on the direction γ and amounts to 4 link mechanisms 126.It according to this structure, can be by 16 handles
Hold portion 70 on transfer head 68 bearing can to move so that in 16 handle parts 70, one shown in such as Fig. 7 A~Fig. 8 B
A handle part 70a is fixedly supported at the position as benchmark on transfer head 68, and makes other all handle parts 70
It is displaced in such a way that the spacing of adjacent handle part 70 is impartial.As a result, the spacing of handle part 70 can be made from Fig. 8 A
Minimum spacing (lateral P5, longitudinal P 6) increase to the expansion spacing (lateral P5 ', longitudinal P 6 ') of Fig. 8 B.Further, it is possible to will figure
The expansion spacing of 8B is configured to equal with the spacing of baseline configuration (lateral P3, longitudinal P 4).
Fig. 9 A and Fig. 9 B schematically show the structure of the link mechanism 126 in a direction β.In schematic structure, in β
It is in 4 handle parts 70 arranged on direction, in figure from left second handle part 70a of number on the basis of, other 3 handle parts 70
It is displaced to the direction β.Link mechanism 126 has: being fixed on the handle part 70 of left end in figure and can be relative to handle part 70a
The base component 128 mobile to the direction β;130a is rotatably linked to the handle part 70 of right end in figure and another at one end
One end 130b is rotatably linked to the first connecting rod component 130 of base component 128;132a rotatably links at one end
The second company of base component 128 is rotatably linked to from second handle part 70 of right number in Yu Tu and in other end 132b
Rod unit 132;And the driving portion 134 for keeping base component 128 mobile to the direction β.
First connecting rod component 130 and second connecting rod component 132 are respectively provided with to be configured in and fix relative to handle part 70a
Position at rotation center 130c and 132c.Between one end 130a and rotation center 130c of first connecting rod component 130
Distance (swinging the size of wrist) is 2 times of one end 132a and the distance between rotation center 132c of second connecting rod component 132.
(size of wrist is swung) in addition, the distance between other end 130b and rotation center 130c of first connecting rod component 130 and the
The distance between the other end 132b and rotation center 132c of two linkage components 132 are equal.In the rotation of second connecting rod component 132
Heart 132c is located at the middle of one end 132a and other end 132b.
In the state of the minimum spacing of Fig. 9 A, handle part 70a is configured in the base position 0 in the direction β, the holding of left end
Portion 70 is configured in position -1, and the handle part 70 of right end is configured in position+2, and second handle part 70 of right number is configured in place
Set+1.When driving portion 134 from the state by base component 128 to the direction-β moving distance 1 (Fig. 9 B) when, the handle part of left end
70 are moved to position -2 from position -1.With the movement of the base component 128, the other end 130b of first connecting rod component 130
And the other end 132b of second connecting rod component 132 is also to the direction-β moving distance 1.As a result, first connecting rod component 130
Other end 130b and with the other end 130b connection handle part 70 be moved to position+4, second connecting rod component from position+2
132 other end 132b and with the other end 132b connection handle part 70 be moved to position+2 from position+1.In this way, holding
Between portion 70a and other 3 handle parts 70 the distance between respectively become 2 times, thus the spacing of all handle parts 70 becomes minimum
Away from 2 times.
Driving portion 134, can be by adjusting the mobile carry out position control of base component 128 using stepping motor etc.
Save the variable quantity of the spacing of handle part 70.In addition, by using having suitably changed the number of linkage component, having swung the size ratio of wrist
Link mechanism, in all handle parts 70 of the first transfer mechanism 20, the handle part 70 of any position, any number can be made
Handle part 70 be displaced to the direction β or the direction γ.In this way, the first transfer mechanism 20, which is coped with, loads electricity with a variety of spacing
The various pallets 16 of sub- equipment 14, the various converters 12 with a variety of spacing with supporting part 108, thus, processor 10 can
To the processing of the various experimental rig efficiency of the practice for having testing jack 18 with various configurations good equipment.
Third transfer mechanism 24 (Fig. 1) has 16 handle parts 78,16 handle parts 78 and the first transfer mechanism 20
Handle part 70 similarly arranges on direction parallel with X3 axis and Y3 axis respectively in transfer head 76 (Fig. 1) and is configured to 4
× 4 ranks shape (Fig. 1).Third transfer mechanism 24 is acted as previously mentioned under the control of operation control part 86 (Fig. 1),
The benchmark taken out from all supporting parts 110 of the second support plate 90 of the converter 12 (Fig. 1) for being located at the second position can be matched
16 electronic equipments 14 (Fig. 6) set are in place on the pallet 16 (Fig. 1) of drain position 56 (Fig. 1).At this point, third supports
Mechanism 24, can be with 8 handle parts 78 first by arranging 2 column on the direction parallel with X3 axis for the second support plate 90
8 electronic equipments 14 are taken out, remaining 8 electronics is taken out by 8 handle parts 78 that others are arranged in 2 column immediately later and sets
Standby 14 mode is acted.
Embodiment as shown in Figure 1 is configured to longitudinal direction 2, laterally 2 in the testing jack 18 of experimental rigmA (m
Integer for 1 or more) ranks shape structure (m=3 in Fig. 1) in, multiple handle parts 78 possessed by third transfer mechanism 24
It may be configured to longitudinal 2 on transfer head 76nA, transverse direction 2nRanks shape (the n in Fig. 1 of a (integer that n is 1 or more, m >=n)
=2).According to this structure, third transfer mechanism 24 can be reduced to act by above-mentioned taking-up repeatedly from converter 12
Supporting part 110 take out electronic equipment 14 when, taking-up movement the number of occurrence.It should be noted that third transfer mechanism 24
Also it can have to cope with and configure the number and configuration of the experimental rig of odd number testing jack 18 at least one party in length and breadth
Handle part 78.
Third transfer mechanism 24 can have displacement mechanism, and the displacement mechanism is so that the electronics taken out from the second support plate 90
The mode that the spacing of equipment 14 changes since the spacing of baseline configuration makes multiple 78 relative displacements of handle part, so as to cope with
It is placed in the spacing of multiple electronic equipments 14 of pallet 16 occasion different from spacing (the lateral P3, longitudinal P 4) of baseline configuration.
The displacement mechanism of third transfer mechanism 24 has structure same as the displacement mechanism 124 of the first transfer mechanism 20, with a handle
On the basis of holding portion 78, the handle part 78 for keeping other all is on transfer head 76 to direction position parallel with X3 axis and Y3 axis respectively
It moves.The displacement mechanism of third transfer mechanism 24 is by having multiple companies identical with the link mechanism 126 of the first transfer mechanism 20
Linkage, the handle part 78 that other can be made all is relative to a handle part 78 in a manner of mutual distance direct proportion
It is displaced.The details of the displacement mechanism of third transfer mechanism 24 is omitted the description.
In this way, third transfer mechanism 24 is coped with the various pallets 16 of a variety of spacing mounting electronic equipment 14, with more
Kind spacing has the various converters 12 of supporting part 110.Processor 10 can have testing jack 18 to various configurations as a result,
The good equipment processing of various experimental rig efficiency of the practice.
Figure 10 shows the first crimp head 82 possessed by the second transfer mechanism 22.Second crimp head 84 (Fig. 2) has and the
Substantially the same structure of one crimp head 82.Hereinafter, illustrating the first and second crimp head 82,84 referring to Fig. 2 and Figure 10
Structure.
First crimp head 82 has on the head point 136 of its front end with corresponding with the baseline configuration of electronic equipment 14 (Fig. 6)
Configuration setting multiple handle parts 137.Each handle part 137 is connect with vacuum source not shown in the figure, can be inhaled by vacuum
It is attached releasedly to hold electronic equipment 14.In addition, being equipped in each handle part 137 for adsorbed electronic equipment 14 to be crimped on
The press section 138 of testing jack 18 (Fig. 1).Press section 138 can be mobile to Z2a axis direction relative to head points 136, can be with
Electronic equipment 14 is pressed on into testing jack 18 in the state that end face is adsorbed with electronic equipment 14.It should be noted that handle part
137 holding construction is not limited to vacuum suction, can also be using magnetic-adsorption or the gripping etc. carried out with finger element.Second
Crimp head 84 has multiple handle parts and press section in the same manner as the first crimp head 82.
First and second crimp head 82,84 can have the electronic equipment 14 for being held to each handle part 137 into
The heater 139 of row auxiliary heating.Heater 139 is identical as the heater 114 of heating mechanism 112, with include power supply 140, open
Heater circuit connection including pass portion 141, temperature sensor 142 and temperature control part 143.The function of heater 139 is to incite somebody to action
The temperature for the electronic equipment 14 that handle part 137 is held maintains predetermined temperature, so that the supporting part 108 in converter 12 is added
The electronic equipment 14 of heat will not cool down on handle part 137.
Figure 11~Figure 12 C shows the drive configuration of the second transfer mechanism 22.Hereinafter, referring to Fig. 2 and Figure 11~Figure 12 C into
One step explains the structure of the second transfer mechanism 22 in detail.
Second transfer mechanism 22 has: the first lifting driving portion (Z2a axis feed arrangement) 144 makes the first crimp head 82
Lifting action is carried out to Z2a axis direction relative to the first converter 12A and testing jack 18;Second lifting driving portion (Z2b axis
Feed arrangement) 145, carry out the second crimp head 84 to Z2b axis direction relative to the second converter 12B and testing jack 18
Lifting action;Horizontal drive portion (Y2 axis feed arrangement) 80, makes the first crimp head 82 in the top position of the first converter 12A
It is moved horizontally between the top position of testing jack 18, and makes the second crimp head 84 in the top position of the second converter 12B
It is moved horizontally between the top position of testing jack 18;And power transfering part 146, in a manner of it can release driving force
Driving force (figure is transmitted between horizontal drive portion (Y2 axis feed arrangement) 80 and the first crimp head 82 and the second crimp head 84
11)。
First lifting driving portion (Z2a axis feed arrangement) 144 has: by power such as the motor of base station 26 (Fig. 1) bearing
Source 148;The feed screw device 152 for being supported by base station 26 and being connect via transmission belt 150 etc. with power source 148;And with
The guiding parts 154 that the nut part (not shown) of feed screw device 152 integrally links.Feed screw device 152 by
Guiding parts 154 is moved back and forth in Z2a axis direction by the driving of power source 148.Guiding parts 154 have to Y2 axis
The track 156 that parallel direction extends.A pair of of the guide roller 158 engaged with track 156 is equipped in the first crimp head 82.First pressure
Connector 82 under the state (Figure 12 A) that a pair of of guide roller 158 engages with track 156, can by the driving of power source 148 and
It moves back and forth, and can be moved back and forth in Y2 axis direction along track 156 in Z2a axis direction.
Second lifting driving portion (Z2b axis feed arrangement) 145 has: by power such as the motor of base station 26 (Fig. 1) bearing
Source 160;The feed screw device 164 for being supported by base station 26 and being connect via transmission belt 162 etc. with power source 160;And with
The guiding parts 166 that the nut part (not shown) of feed screw device 164 integrally links.Feed screw device 164 by
Guiding parts 166 is moved back and forth in Z2b axis direction by the driving of power source 160.Guiding parts 166 have to Y2 axis
The track 168 that parallel direction extends.A pair of of the guide roller 170 engaged with track 168 is equipped in the second crimp head 84.Second pressure
Connector 84 under the state (Figure 12 A) that a pair of of guide roller 170 fastens with track 168, can by the driving of power source 160 and
It moves back and forth, and can be moved back and forth in Y2 axis direction along track 168 in Z2b axis direction.
Horizontal drive portion (Y2 axis feed arrangement) 80 has: by power sources 172 such as the motor of base station 26 (Fig. 1) bearing;
The feed screw device 174 being connect with power source 172;And the nut part (not shown) with feed screw device 174
The guiding parts 176 integrally linked.Feed screw device 174 makes guiding parts 176 in Y2 axis by the driving of power source 172
It is moved back and forth on direction.Guiding parts 176 has the track 178 extended to the direction parallel with Z2a axis and to parallel with Z2b axis
Direction extend track 180.A pair of of the guide roller 182 engaged with track 178 is equipped in the first crimp head 82.In the second crimping
First 84 are equipped with a pair of of the guide roller 184 engaged with track 180.First crimp head 82 engages in a pair of of guide roller 182 with track 178
State (Figure 12 B) under, can be moved back and forth in Y2 axis direction by the driving of power source 172, and can be along track 178
It is moved back and forth in Z2a axis direction.The state (Figure 12 B) that second crimp head 84 engages in a pair of of guide roller 184 with track 180
Under, it can be moved back and forth in Y2 axis direction by the driving of power source 172, and can be along track 180 in Z2b axis direction
It moves back and forth.
Power transfering part 146 includes: the track 178 and track 180 of guiding parts 176;A pair of first crimp head 82
Guide roller 182;And second crimp head 84 a pair of of guide roller 184 (Figure 12 B).The effect of power transfering part 146 is seen below.
Second transfer mechanism 22 is also equipped with positioning region 186, and the positioning region 186 is by the first crimp head 82 and the second crimp head
84 are alternately positioned at the specified position (Figure 11) of Y2 axis direction in the top of testing jack 18.Positioning region 186 include with to
The track 188 of the first crimp head 82 is arranged in the mode that the parallel direction of Z2a axis extends;To prolong to the direction parallel with Z2b axis
The track 190 of the second crimp head 84 is arranged in the mode stretched;It is fixed at the specified position of base station 26 (Fig. 1) and and track
A pair of of guide roller 192 of either 188 and track 190 engaging.First crimp head 82 is in track 188 and a pair of of guide roller
It under the state (Figure 12 C) of 192 engagings, can be moved back and forth in Z2a axis direction, and multiple handle parts 137 (Figure 10) are positioned
Relative to corresponding testing jack 18 and in Z2a axis direction at the position of precise arrangement.Second crimp head 84 is in track 190
It under the state (Figure 12 C) engaged with a pair of of guide roller 192, can be moved back and forth in Z2b axis direction, and by multiple handle parts
137 (Figure 10) are located in relative to corresponding testing jack 18 and in Z2b axis direction at the position of precise arrangement.In track
188,190 engage with a pair of of guide roller 192 in the state of, the first and second crimp head 82,84 cannot be moved to Y2 axis direction.
Next, 3A~Figure 13 L referring to Fig.1, illustrate the equipment transfer movement carried out by the second transfer mechanism 22 and should
The effect of power transfering part 146 (track 178, track 180, guide roller 182, guide roller 184) during equipment transfer movement.
Figure 13 A shows the electronic equipment 14 (Fig. 6) held to the handle part 137 by the second crimp head 84 via testing jack
18 carry out electrical tests, the test close to an end before state.In this state, the second crimp head 84 passes through guide roller 170
Engage with the track 168 of guiding parts 166 (Figure 11) and connects with second lifting driving portion (Z2b axis feed arrangement) 145 (Figure 11)
It connects, is detached from from the track 180 of guiding parts 176 from horizontal drive portion (Y2 axis feed arrangement) 80 (figure by guide roller 184
11) it separates, engages the predetermined bits for being positioned in Y2 axis direction with the guide roller 192 on base station 26 (Fig. 1) by track 190
It sets.In addition, the first crimp head 82 is taken out electronic equipment 14 from the first converter 12A and is configured near testing jack 18
Position of readiness.In this state, the first crimp head 82 is blocked by the track 156 of guide roller 158 and guiding parts 154 (Figure 11)
It closes and is connect with first lifting driving portion (Z2a axis feed arrangement) 144 (Figure 11), pass through guide roller 182 and guiding parts 176
Track 178 engages and connect with horizontal drive portion (Y2 axis feed arrangement) 80 (Figure 11).In addition, the first converter 12A and
Two converter 12B are placed in first position, and second support plate 90 and testing jack 18 of the two are configured adjacently.
When terminating electrical test in the state of Figure 13 A, the second lifting driving portion (Z2b axis feed arrangement) 145 (figure
11) it starts, under the engaging of guide roller 170 and track 168, the second crimp head 84 starts to mobile (figure above Z2b axis direction
13B).It is accompanied by this, the second crimp head 84 lifts the electronic equipment 14 (Fig. 6) that handle part 137 is held simultaneously from testing jack 18
Recycling.At this point, the beginning of roller 184 of the second crimp head 84 engages with track 180, the second crimp head 84 and horizontal drive portion (Y2 axis
Feed arrangement) 80 (Figure 11) connection.
When the second crimp head 84 is further to when movement above Z2b axis direction, track 190 is detached from from guide roller 192, so that
Second crimp head 84 can be mobile (Figure 13 C) to Y2 axis direction.It is being detached from substantially simultaneously with track 190 from guide roller 192, first
Driving portion (Z2a axis feed arrangement) 144 (Figure 11) are gone up and down to start, under the engaging of guide roller 158 and track 156, the first pressure
Connector 82 starts to movement below Z2a axis direction.At this point, the first and second crimp head 82,84 both sides and horizontal drive portion (Y2
Axis feed arrangement) 80 (Figure 11) connection.
When the second crimp head 84 rises to the position than the second converter 12A high and the first crimp head 82 drops to and the
When the position of two crimp heads, 84 roughly same height, horizontal drive portion (Y2 axis feed arrangement) 80 (Figure 11) start (Figure 13 D).It is logical
The starting for crossing horizontal drive portion 80, under the engaging of guide roller 182 and track 178, the first crimp head 82 starts to the axis side Y2
(left in figure) is mobile forwards, and synchronously therewith, under the engaging of guide roller 184 and track 180, the second crimp head 84 is opened
Begin mobile in front of Y2 axis direction (left in figure).
When the first crimp head 82 reaches the axis direction specified position Y2 of the top of testing jack 18, horizontal drive portion (Y2
Axis feed arrangement) 80 (Figure 11) stopping, on the other hand, first lifting driving portion (Z2a axis feed arrangement) 144 (Figure 11) continue work
Make, the first crimp head 82 is made to decline (Figure 13 E) to testing jack 18.During this period, the second crimp head 84 reaches the second converter
The Y2 axis direction specified position of the top of 12A and Z2b axis direction specified altitude, the second lifting driving portion (Z2b axis feeding dress
Set) 145 (Figure 11) stopping, in the upper stationary of the second converter 12A.When the first crimp head 82 drops to the upper of testing jack 18
When the Z2a axis direction specified altitude of side, the beginning of track 188 engages with the guide roller 192 on base station 26 (Fig. 1), is positioned in Y2
The specified position of axis direction.
First crimp head 82 to testing jack 18 by further declining, track of the guide roller 182 from guiding parts 176
178 are detached from, so that the first crimp head 82 be made to separate (Figure 13 F) from horizontal drive portion (Y2 axis feed arrangement) 80 (Figure 11).Later,
The electronic equipment 14 (Fig. 6) that handle part 137 is held is loaded into corresponding survey in Z2a axis direction specified position by the first crimp head 82
Socket 18 is tried, press section 138 (Figure 10) works and electronic equipment 14 is crimped on testing jack 18.In this state, to first
The electronic equipment 14 that crimp head 82 is held starts electrical test.
During the electronic equipment 14 held to the first crimp head 82 carries out electrical test, the second lifting driving portion (Z2b axis
Feed arrangement) 145 (Figure 11) start, and under the engaging of guide roller 170 and track 168, the second crimp head 84 is to Z2b axis direction
Lower section is mobile (Figure 13 G).When the second crimp head 84 reach Z2b axis direction specified position when, second lifting driving portion (Z2b axis into
To device) 145 (Figure 11) stopping, the second conversion of electronic equipment 14 (Fig. 6) return that the second crimp head 84 holds handle part 137
The corresponding supporting part 110 (Fig. 4) of the second support plate 90 of device 12B.
When electronic equipment 14 terminates to return, second lifting driving portion (Z2b axis feed arrangement) 145 (Figure 11) restart,
Under the engaging of guide roller 170 and track 168, make the second crimp head 84 to mobile (Figure 13 H) above Z2b axis direction.?
To during movement above Z2b axis direction, the second converter 12B starts mobile from first position to the second position two crimp heads 84.
In addition, during this period, continuing the electronic equipment 14 held to the first crimp head 82 and carrying out electrical test.
When the second crimp head 84 reach Z2b axis direction specified position and the second converter 12B reach the second position and by the
One support plate 88 is configured at the lower section of the second crimp head 84, and horizontal drive portion (Y2 axis feed arrangement) 80 (Figure 11) start (figure
13I).Pass through the starting in horizontal drive portion 80, under the engaging of guide roller 184 and the track 180 of guiding parts 176, second
The desired electronics that crimp head 84 starts to hold to handle part 137 on the first support plate 88 of second converter 12B is set
The Y2 axis direction specified position of standby 14 (Fig. 6) is mobile (moving to the left in figure).During this period, to 82 institute of the first crimp head
The electronic equipment 14 of holding continues electrical test.
When the second crimp head 84 reaches Y2 axis direction specified position, horizontal drive portion (Y2 axis feed arrangement) 80 (Figure 11)
Stop, on the other hand, second lifting driving portion (Z2b axis feed arrangement) 145 (Figure 11) are started, in guide roller 170 and track 168
Engaging under, the second crimp head 84 is to mobile (Figure 13 J) below Z2b axis direction.When the second crimp head 84 reaches Z2b axis direction
When specified position, second lifting driving portion (Z2b axis feed arrangement) 145 (Figure 11) stop, and the second crimp head 84 will be by second turn
The electronic equipment 14 (Fig. 6) of desired supporting part 108 (Fig. 4) bearing of the first support plate 88 of parallel operation 12B is held to correspondence
Handle part 137.During this period, the electronic equipment 14 held to the first crimp head 82 continues electrical test.
When the second crimp head 84, which holds electronic equipment 14, arrives handle part 137, the second lifting driving portion (Z2b axis feeding
Device) 145 (Figure 11) start, and under the engaging of guide roller 170 and track 168, the second crimp head 84 is to above Z2b axis direction
Mobile (Figure 13 K).Concurrently, or after the second crimp head 84 reaches Z2b axis direction specified position, horizontal drive portion (Y2
Axis feed arrangement) 80 (Figure 11) starting, under the engaging of guide roller 184 and the track 180 of guiding parts 176, the second crimping
First 84 is mobile towards the position of readiness near testing jack 18 to Y2 axis direction rear (being right in figure).In the second crimp head
84 to during the movement of Y2 axis direction rear, and the second converter 12B starts mobile from the second position to first position.
At the time of the second crimp head 84 reaches position of readiness and the second converter 12B reaches first position, press first
The electronic equipment 14 that connector 82 is held terminates electrical test.Therefore, the first lifting driving portion (Z2a axis feed arrangement) 144 (figure
11) it starts, under the engaging of guide roller 158 and track 156, the first crimp head 82 starts to mobile (figure above Z2a axis direction
13L).Later, the first crimp head 82 executes movement identical with the movement of the second crimp head 84 shown in Figure 13 A~Figure 13 K, separately
Outside, the second crimp head 84 executes movement identical with the movement of the first crimp head 82 shown in Figure 13 A~Figure 13 K.By repeatedly
Above-mentioned movement is executed, the second transfer mechanism 22 can imitate between first and second converter 12A, 12B and testing jack 18
Rate transfers electronic equipment 14 well.
By operation control part 86 (Fig. 1) control the second transfer mechanism 22 execute carried out by the second transfer mechanism 22 it is upper
Equipment transfer movement is stated, so that the slave electronic equipment 14 carried out in either the first crimp head 82 and the second crimp head 84
During being fetched into the movement until crimping, the slave electronics of another party's progress of the first crimp head 82 and the second crimp head 84 is carried out
The movement of equipment 14 being crimped onto until returning.Control in this way can shorten the first and second crimp head 82,84
Stand-by time, no matter high temperature or room temperature, can reduce equipment processing circulation time.
According to the second transfer mechanism 22 with above structure, pass through combination the first and second crimp head 82,84 difference
Linear movement to the linear movement of Y2 axis direction and to Z2a axis direction and Z2b axis direction is able to carry out 14 phase of electronic equipment
For the taking-up movement of converter 12 and return action and electronic equipment 14 relative to testing jack 18 packed action with
And therefore recycling movement compared with for example including the structure including the crimp head for carrying out moving in rotation, can reduce crimp head
82,84 inertia, so as to realize the high speed motion of low vibration.Also, it is moved originally in mutually independent YZ coordinate system
The first and second crimp head 82,84 made can pass through the first lifting driving portion (Z2a axis by using power transfering part 146
Feed arrangement) 144, second lifting driving portion (Z2b axis feed arrangement) 145 and horizontal drive portion (Y2 axis feed arrangement) 80 this
Three axis driving portions are acted.As a result, the whole lightweight of the second transfer mechanism 22 can be made, it is reliably achieved low vibration
Dynamic high speed motion, and can reduce the manufacturing cost of processor 10, maintain cost and consumption electric power.
Figure 14 shows the overall structure of the processor 200 of second embodiment.Figure 15 and Figure 16 schematically shows processing
A part of device 200.Processor 200 is supplied the experimental rig for the electrical test for carrying out the electronic equipments such as IC equipment, LSI equipment
Give and be discharged the device of electronic equipment.
As shown in top view in Figure 14, processor 200 includes: that can load multiple electronic equipments 201 (Figure 16) respectively
Multiple pallets 202 of supply and discharge;Can with multiple testing jacks possessed by experimental rig (not shown)
The 204 corresponding baseline configuration of configuration loads the converter 206 of multiple electronic equipments 201;From pallet 202 to converter 206
Transfer the first transfer mechanism 208 of the supply of electronic equipment 201;Electronics is transferred between converter 206 and testing jack 204
Equipment 201 and the second transfer mechanism 210 that electronic equipment 201 is crimped on the test of testing jack 204 (is represented by dashed line dynamic
Make region);The third transfer mechanism 212 of the discharge of electronic equipment 201 is transferred from converter 206 to pallet 202;Control conversion
The operation control part of the movement of device 206, the first transfer mechanism 208, the second transfer mechanism 210 and third transfer mechanism 212
214;Carry pallet 202, converter 206, the first transfer mechanism 208, the second transfer mechanism 210 and third transfer mechanism 212
Base station 216.
Processor 200 has the second transfer mechanism 210 of rotary index formula to replace the second transfer mechanism 22 of Direct Action Type,
And have single converter 206 to replace the first converter 12A and the second converter 12B, other than this two o'clock, tie
Structure and processor 10 are essentially identical.Thus, for the details with the structure of equipment processing movement associated of processor 200
It omits the description.
Converter 206 has the first bearing of the supply side supported to the electronic equipment 201 come from the transfer of pallet 202
Second support plate 220 of plate 218 and the discharge side that the electronic equipment 201 come from the transfer of testing jack 204 is supported.Conversion
Device 206 can move between first position (such as position shown in Figure 14) and the second position, and first position is the first transfer
Mechanism 208 can enable that electronic equipment 201 is placed in the first support plate 218 and the second transfer mechanism 210 makes electronic equipment 201
It is placed in the position of the second support plate 220, the second position is that the second transfer mechanism 210 can take out electricity from the first support plate 218
Sub- equipment 201 and third transfer mechanism 212 can take out the position of electronic equipment 201 from the second support plate 220.
As shown in figure 15, processor 200 has set on converter 206 and to the electronic equipment 201 for being placed in converter 206
The heating mechanism 222 of the heater contacts mode heated.Heating mechanism 222 to the first support plate 218 of converter 206 into
Row heating, and the second support plate 220 is not heated substantially.In the shown embodiment, heating mechanism 222 has and is clamped in
First support plate 218 and support the first support plate 218 substrate 224 between plate shape heater (such as be known as rubber-heating
Device) 226.Heater 226 by being uniformly heated up possessed by the first support plate 218 all multiple supporting parts 228, indirectly plus
Heat is allowed to warm to predetermined temperature by the electronic equipment 201 that any supporting part 218 supports.
Heating mechanism 222 is connect with the heater circuit with power supply 230 and switch portion 231.Pass through on-off switch portion
231, allow hand over the work and stopping of heating mechanism 222.Switch portion 231 can both be led to by operator by manual working
It is disconnected, 231 auto switching of switch portion can also be made by operation control part 214.Processor 200 is by having switch portion 231, energy
It is enough selectively to implement that electronic equipment 201 is heated to the high-temperature process of predetermined temperature before the test and thermionic device is not added
201 room temperature processing.
Processor 200 be also equipped with the temperature of object that perception heating mechanism 222 is heated temperature sensor 232 and according to
The temperature that temperature sensor 232 is perceived is come control heating mechanism 222 plus thermally operated temperature control part 233.It is real in diagram
It applies in mode, temperature sensor 232 perceives the respective of the multiple supporting parts 228 for the first support plate 218 that heater 226 is heated
Temperature.Temperature control part 233 is controlled referring to the real-time temperature data of the supporting part 228 obtained from temperature sensor 232
It is attached to the switching circuit 226a of heater 226, the temperature of supporting part 228 is adjusted to predetermined target temperature.It needs
Illustrating, temperature sensor 232 is also configured to perceive the temperature of the electronic equipment 201 supported by supporting part 228, or
It is configured to the temperature that the substrate 224 of the first support plate 218 is fixed in perception.
As shown in figure 16, the second transfer mechanism 210 has: the rotary index device 234 supported by base station 216;Pass through Za
The driving of axis feed arrangement 236 and carry out feed motion to the Za axis direction parallel with the rotation axis of rotary index device 234
The first crimp head 238;By the driving of Zb axis feed arrangement 240 to parallel with the rotation axis of rotary index device 234
Zb axis direction carry out feed motion the second crimp head 242.First crimp head 238 and the second crimp head 242 pass through rotation
The driving of indexing means 234 and the specified position of the specified position of the top of converter 206 and the top of testing jack 220 it
Between carry out rotary index movement, and by the driving of Za axis feed arrangement 236 or Zb axis feed arrangement 240 relative to converter
206 or testing jack 220 carry out lifting action, thereby, it is possible to from converter 206 take out regulation number electronic equipment 201, will
The electronic equipment 201 of taking-up is loaded into testing jack 220 and is crimped with defined pressing force, is recycled from testing jack 220
Electronic equipment 201 after crimping simultaneously returns it into converter 206.First crimp head 238 and the second crimp head 242 can be alternately real
Apply taking-up movement and return action of the above-mentioned electronic equipment 201 relative to converter 206 and electronic equipment 201 relative to
The packed action of testing jack 220 and recycling movement.It should be noted that Figure 16 locally elliptically shows the branch of converter 206
Bearing portion 228, the handle part 244 of the first crimp head 238, the second crimp head 242 handle part 246 and testing jack 220.
In the processor 200 with above structure, in order to by electronic equipment 201 from 202 efficiency of pallet well to survey
The transfer of examination socket 220 and the converter 206 equipped has the heating of the heater contacts mode heated to electronic equipment 201
Mechanism 222, therefore, with load in equipment transfer midway relative to the preheating unit independently of equipment transfer mechanism/recycle electronics
The previous processor of equipment is compared, and circulation time when carrying out high-temperature process can be shortened.Especially, if being configured to pass through
Operation switch portion 231 switches the work and stopping of heating mechanism 222, then processor 200 can selectively be implemented at high temperature
Reason and room temperature handle both sides.Also, since equipment processing acts substantially the same, the energy in high-temperature process and room temperature processing
Enough make carry out high-temperature process when circulation time close to carry out room temperature processing when circulation time.
Description of symbols
10 processors
12 converters
The first converter of 12A
The second converter of 12B
14 electronic equipments
16 pallets
18 testing jacks
20 first transfer mechanisms
22 second transfer mechanisms
24 third transfer mechanisms
80 horizontal drive portions (Y2 axis feed arrangement)
82 first crimp heads
84 second crimp heads
86 operation control parts
88 first support plates
90 second support plates
112 heating mechanisms
114 heaters
117 switch portions
118 temperature sensors
119 temperature control parts
124 displacement mechanisms
126 link mechanisms
144 first liftings driving portion (Z2a axis feed arrangement)
145 second liftings driving portion (Z2b axis feed arrangement)
146 power transfering parts
186 positioning regions
200 processors
201 electronic equipments
202 pallets
204 testing jacks
206 converters
208 first transfer mechanisms
210 second transfer mechanisms
212 third transfer mechanisms
218 first support plates
220 second support plates
222 heating mechanisms
226 heaters
231 switch portions
232 temperature sensors
233 temperature control parts
Claims (18)
1. a kind of processor, has:
The pallet of supply and discharge, can load multiple electronic equipments;
Converter can be loaded with corresponding with the configuration of multiple testing jacks possessed by experimental rig baseline configuration
Multiple electronic equipments;
First transfer mechanism of supply transfers electronic equipment from the pallet to the converter;
Second transfer mechanism of test transfers electronic equipment between the converter and testing jack, and electronics is set
It is standby to be crimped on testing jack;
The third transfer mechanism of discharge, from the converter to the tray conveying electronic equipment;And
Heating mechanism is set to the converter, and heats to the electronic equipment for being placed in the converter,
The converter has the first support plate of the supply side supported to the electronic equipment come from the tray conveying,
First support plate has multiple supporting parts of the number more than testing jack possessed by experimental rig, can be at these
Multiple electronic equipments are supported with the baseline configuration on desired supporting part in supporting part,
The electronic equipment that the heating mechanism supports the supporting part heats.
2. processor according to claim 1, wherein
The multiple supporting part is configured with the closely spaced spacing than testing jack.
3. processor according to claim 1, wherein
The heating mechanism has the heater that uniformly heated plate shape is carried out to all the multiple supporting parts.
4. processor according to claim 1, wherein
First transfer mechanism can will be taken out from the pallet with spacing corresponding with the spacing of the baseline configuration
Multiple electronic equipments are placed into from the supporting part selected in the multiple supporting part.
5. processor according to claim 4, wherein
The processor, which has, moves first transfer mechanism, second transfer mechanism and the third transfer mechanism
The operation control part controlled,
The operation control part controls the transfer movement repeatedly of first transfer mechanism, so as to will be than the baseline configuration
Electronic equipment more than number is placed on the multiple supporting part, also, the operation control part controls second drag-over unit
The transfer movement of structure, so as to sequence substantially corresponding with the sequence being placed on the multiple supporting part by the baseline configuration
Electronic equipment be transplanted on testing jack from the desired supporting part.
6. processor according to claim 4, wherein
First transfer mechanism has: multiple handle parts of multiple electronic equipments are taken out from the pallet;And it so as to takes out
The spacing modes corresponding with the spacing of the baseline configuration of multiple electronic equipments make the multiple handle part relative displacement
Displacement mechanism.
7. processor according to claim 6, wherein
Institute's displacement mechanism has multiple link mechanisms, and the multiple link mechanism makes other in addition to a handle part
All handle parts are displaced in the way of direct proportion relative to the handle part by mutual distance.
8. processor according to claim 1, wherein
The converter has the second support plate of the discharge side supported to the electronic equipment come from testing jack transfer, institute
The second support plate multiple supporting parts equal with testing jack possessed by experimental rig with number and spacing are stated, at these
On supporting part multiple electronic equipments can be supported with the baseline configuration.
9. processor according to claim 8, wherein
The third transfer mechanism has: multiple handle parts of multiple electronic equipments are taken out from second support plate;And with
The mode for changing the spacing of the multiple electronic equipments taken out since the spacing of the baseline configuration makes the multiple handle part
Carry out the displacement mechanism of relative displacement.
10. processor according to claim 9, wherein
Institute's displacement mechanism has multiple link mechanisms, and the multiple link mechanism makes other in addition to a handle part
All handle parts are displaced in the way of direct proportion relative to the handle part by mutual distance.
11. processor according to claim 8, wherein
The converter can move between the first position and the second position, and the first position is first transfer mechanism
It can enable that electronic equipment is placed in first support plate and second transfer mechanism makes electronic equipment be placed in institute
The position of the second support plate is stated, the second position is that second transfer mechanism can take out electronics from first support plate
Equipment and the third transfer mechanism can take out the position of electronic equipment from second support plate.
12. processor according to claim 8, wherein
First support plate and second support plate, which are interconnected, to be integrated.
13. processor according to claim 1, wherein
The processor is also equipped with the switch portion switched over to the work and stopping of the heating mechanism.
14. processor according to claim 1, wherein
The temperature sensor and root that the temperature that the processor is also equipped with the object heated to the heating mechanism is perceived
The heating mechanism is controlled according to the temperature that the temperature sensor is perceived adds thermally operated temperature control part.
15. processor according to claim 1, wherein
The converter has the first converter and the configured in the mutual opposite side of the testing jack across experimental rig
Two converters.
16. processor according to claim 15, wherein
Second transfer mechanism has the first crimp head and the second crimp head, and first crimp head is from first converter
Electronic equipment is taken out, the electronic equipment of taking-up is crimped on testing jack, and the electronic equipment after crimping is returned to described first
Converter, second crimp head take out electronic equipment from second converter, the electronic equipment of taking-up are crimped on test
Socket, and the electronic equipment after crimping is returned into second converter.
17. processor according to claim 16, wherein
The processor has the operation control part controlled the movement of second transfer mechanism, the operation control part
Control second transfer mechanism so that either in first crimp head and second crimp head carry out from
It is another in progress first crimp head and second crimp head during the movement of electronic equipment being fetched into until crimping
The movement of the slave electronic equipment that one side carries out being crimped onto until returning.
18. processor according to claim 16, wherein
Second transfer mechanism has: the first lifting driving portion makes first crimp head relative to first conversion
Device and testing jack carry out lifting action;Second lifting driving portion, makes second crimp head relative to described second turn
Parallel operation and testing jack carry out lifting action;Horizontal drive portion makes first crimp head in first converter
It is moved horizontally between top position and the top position of testing jack, and makes second crimp head in second converter
It is moved horizontally between top position and the top position of testing jack;And power transfering part, driving force can be released
Mode transmits driving force between the horizontal drive portion and first crimp head and second crimp head.
Applications Claiming Priority (1)
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PCT/JP2013/082487 WO2015083241A1 (en) | 2013-12-03 | 2013-12-03 | Electronic device handler |
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CN105980869A CN105980869A (en) | 2016-09-28 |
CN105980869B true CN105980869B (en) | 2019-05-21 |
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CN201380081371.0A Active CN105980869B (en) | 2013-12-03 | 2013-12-03 | The processor of electronic equipment |
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JP (1) | JP6351623B2 (en) |
KR (1) | KR102058008B1 (en) |
CN (1) | CN105980869B (en) |
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KR102483359B1 (en) * | 2015-12-09 | 2023-01-02 | (주)테크윙 | Handler for testing semiconductor devices and information processing method thereof |
MY191597A (en) * | 2017-11-27 | 2022-06-30 | Mi Equipment M Sdn Bhd | Stencil concept and inspection |
KR102422649B1 (en) * | 2017-12-19 | 2022-07-19 | (주)테크윙 | Handler for testing electronic devices |
JP6719784B2 (en) * | 2018-12-21 | 2020-07-08 | 株式会社 Synax | handler |
KR102150628B1 (en) * | 2020-04-24 | 2020-09-02 | 주식회사 디에스케이 | variable probe unit |
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JP2000111613A (en) * | 1998-10-07 | 2000-04-21 | Nippon Eng Kk | Loader unloader device for burn-in board |
KR100451586B1 (en) * | 2002-03-13 | 2004-10-08 | 미래산업 주식회사 | Appratus for teaching a height for work of semiconductor transfer in handler and method for teaching the height for work using the same |
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JP5040538B2 (en) * | 2007-09-05 | 2012-10-03 | セイコーエプソン株式会社 | Electronic component temperature control device, electronic component temperature control method, and IC handler |
JP5375528B2 (en) * | 2009-10-30 | 2013-12-25 | セイコーエプソン株式会社 | Electronic component inspection equipment |
JP2013167474A (en) * | 2012-02-14 | 2013-08-29 | Seiko Epson Corp | Handler and component inspection apparatus |
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2013
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CN105980869A (en) | 2016-09-28 |
JPWO2015083241A1 (en) | 2017-03-16 |
KR20160093043A (en) | 2016-08-05 |
WO2015083241A1 (en) | 2015-06-11 |
KR102058008B1 (en) | 2019-12-20 |
JP6351623B2 (en) | 2018-07-04 |
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