MY191597A - Stencil concept and inspection - Google Patents

Stencil concept and inspection

Info

Publication number
MY191597A
MY191597A MYPI2017704521A MYPI2017704521A MY191597A MY 191597 A MY191597 A MY 191597A MY PI2017704521 A MYPI2017704521 A MY PI2017704521A MY PI2017704521 A MYPI2017704521 A MY PI2017704521A MY 191597 A MY191597 A MY 191597A
Authority
MY
Malaysia
Prior art keywords
semiconductor dies
station
untested
stencil
test
Prior art date
Application number
MYPI2017704521A
Inventor
Kuang Eng Oh
Original Assignee
Mi Equipment M Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mi Equipment M Sdn Bhd filed Critical Mi Equipment M Sdn Bhd
Priority to MYPI2017704521A priority Critical patent/MY191597A/en
Priority to PH12018000378A priority patent/PH12018000378A1/en
Priority to TW107140974A priority patent/TWI678758B/en
Priority to KR1020180146209A priority patent/KR102103086B1/en
Publication of MY191597A publication Critical patent/MY191597A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Abstract

A hard docking test system (1), comprising: at least one buffer cavity station (10) receiving a plurality of untested semiconductor dies (12) of an upstream process therefrom, returning tested semiconductor dies (12T) thereto, supplying untested semiconductor dies (12) and receiving tested semiconductor dies (12T) of a stencil station (20) therefrom and thereto, comprising at least one pick up head (11) capable of transporting the untested and tested semiconductor dies (12, 12T) to a buffer cavity (14) comprising a plurality of cavities; at least one test site station (30) receiving untested semiconductor dies (12) and returning tested semiconductor dies (12T) of the stencil station (20) therefrom and thereto, comprising at least one test arm (32) capable of transporting the untested and tested semiconductor dies (12, 12T) to a test site (34) to perform probe mark test; at least one vision camera (16) disposed the buffer cavity station (10) and the stencil station (20) therebetween. (FIG. 4)
MYPI2017704521A 2017-11-27 2017-11-27 Stencil concept and inspection MY191597A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
MYPI2017704521A MY191597A (en) 2017-11-27 2017-11-27 Stencil concept and inspection
PH12018000378A PH12018000378A1 (en) 2017-11-27 2018-11-16 Stencil concept and inspection
TW107140974A TWI678758B (en) 2017-11-27 2018-11-19 The hard docking test system
KR1020180146209A KR102103086B1 (en) 2017-11-27 2018-11-23 Stencil concept and inspection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2017704521A MY191597A (en) 2017-11-27 2017-11-27 Stencil concept and inspection

Publications (1)

Publication Number Publication Date
MY191597A true MY191597A (en) 2022-06-30

Family

ID=66844632

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017704521A MY191597A (en) 2017-11-27 2017-11-27 Stencil concept and inspection

Country Status (4)

Country Link
KR (1) KR102103086B1 (en)
MY (1) MY191597A (en)
PH (1) PH12018000378A1 (en)
TW (1) TWI678758B (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000111613A (en) * 1998-10-07 2000-04-21 Nippon Eng Kk Loader unloader device for burn-in board
JP5040538B2 (en) * 2007-09-05 2012-10-03 セイコーエプソン株式会社 Electronic component temperature control device, electronic component temperature control method, and IC handler
JP2013167474A (en) * 2012-02-14 2013-08-29 Seiko Epson Corp Handler and component inspection apparatus
TWM439797U (en) * 2012-04-02 2012-10-21 Fittech Co Ltd Defect inspection device for LED die
CN105980869B (en) * 2013-12-03 2019-05-21 株式会社幸福日本 The processor of electronic equipment

Also Published As

Publication number Publication date
KR20190062233A (en) 2019-06-05
KR102103086B1 (en) 2020-04-23
PH12018000378A1 (en) 2019-07-24
TW201926526A (en) 2019-07-01
TWI678758B (en) 2019-12-01

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