CN105979709B - Multilayer board boring method - Google Patents
Multilayer board boring method Download PDFInfo
- Publication number
- CN105979709B CN105979709B CN201610559864.6A CN201610559864A CN105979709B CN 105979709 B CN105979709 B CN 105979709B CN 201610559864 A CN201610559864 A CN 201610559864A CN 105979709 B CN105979709 B CN 105979709B
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- CN
- China
- Prior art keywords
- hole
- multilayer board
- via hole
- section
- copper
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention discloses a kind of multilayer board boring method.It drills the method includes choosing a printed circuit board, and on the printed circuit board, to form the first through hole for running through the multilayer board；Black holes process is carried out to the first through hole；The copper facing in the first through hole Jing Guo black holes process, and copper-plated thickness is greater than copper-plated actual demand thickness in the first through hole in the first through hole, to form via hole；Drill on the multilayer board from the direction opposite with one section of via hole retaining is needed, to form depth to the metal layer of the one section of via hole connection for needing to retain until the second hole；Conditioner is filled into one section of via hole for needing to retain and second hole；The conditioner is washed, the length for reducing useless hole copper is realized with this, guarantees the integrality of signal transmission, while avoiding the problem that the height of technique price caused by blind hole and buried via hole are set on a printed circuit and low efficiency.
Description
Technical field
The present invention relates to printed-board technology fields, more particularly to a kind of multilayer board boring method.
Background technique
The stepped construction of existing multilayer board is as shown in Figure 1, be wherein to be connected between metal layer by via hole
Connect, however in these via holes one section be not used in signal transmission, useless hole wall copper part will increase in printed circuit board and believes
The loss of number transmission, or even destroy the integrality of signal, therefore blind hole commonly used in the trade or buried via hole substitute these via holes (such as Fig. 2
It is shown), but the technique price height and low efficiency of blind hole or buried via hole.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of low price and efficient multilayer board drills
Method guarantees the integrality of signal transmission to reduce the length of useless hole copper.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: a kind of multilayer board is provided
Boring method, comprising:
A printed circuit board is chosen, and is drilled on the printed circuit board, runs through the multilayer printed circuit to be formed
The first through hole of plate；
Black holes process is carried out to the first through hole；
The copper facing in the first through hole Jing Guo black holes process, and copper-plated thickness is greater than in the first through hole
Copper-plated actual demand thickness in the first through hole, to form via hole；
It drills on the multilayer board from the direction opposite with the one section of via hole retained is needed, to form depth
The second hole until the metal layer of the one section of via hole connection for needing to retain；
Conditioner is filled into one section of via hole for needing to retain and second hole；And
Wash the conditioner.
Wherein, the diameter in second hole is greater than or equal to the diameter of the first through hole.
Wherein, the conditioner is the mixture of ink and acidic or alkaline substances.
Wherein, the multilayer board is flexible printed circuit board.
Wherein, the diameter for one section of via hole that the needs after washing the conditioner retain is 0.1 millimeter.
In order to solve the above technical problems, another technical solution used in the present invention is: providing a kind of multilayer printed circuit
Plate boring method, comprising:
A printed circuit board is chosen, and is drilled on the printed circuit board, runs through the multilayer printed circuit to be formed
The first through hole of plate；
Black holes process is carried out to the first through hole；
The copper facing in the first through hole Jing Guo black holes process, and copper-plated thickness is greater than in the first through hole
Copper-plated actual demand thickness in the first through hole, to form via hole；
It is bored respectively to the direction for one section of via hole for needing to retain from the upper surface and the lower surface of the multilayer board
Hole, with formed depth to it is described need retain one section of via hole connection metal layer until the second hole；
Conditioner is filled into one section of via hole for needing to retain and second hole；And
Wash the conditioner.
Wherein, the diameter in second hole is greater than or equal to the diameter of the first through hole.
Wherein, the conditioner is the mixture of ink and acidic or alkaline substances.
Wherein, the multilayer board is flexible printed circuit board.
Wherein, the diameter for one section of via hole that the needs after washing the conditioner retain is 0.1 millimeter.
The beneficial effects of the present invention are: being in contrast to the prior art, the multilayer board of the invention is bored
Hole method forms second hole by drilling to reduce the length of useless hole copper, guarantees the integrality of signal transmission, simultaneously
It avoids the problem of high technique price caused by blind hole and buried via hole and low efficiency are set on multilayer board.
Detailed description of the invention
Fig. 1 is the stepped construction schematic diagram of existing multilayer board；
Fig. 2 is the structural schematic diagram of the blind hole and buried via hole on existing multilayer board；
Fig. 3 is the flow chart of the first embodiment of multilayer board boring method of the invention；
Fig. 4 is the process flow chart of Fig. 3；
Fig. 5 is the flow chart of the second embodiment of multilayer board boring method of the invention；
Fig. 6 is the process flow chart of Fig. 5.
Specific embodiment
Please refer to Fig. 3 and Fig. 4, be the first embodiment of multilayer board boring method of the invention flow chart and
Process flow chart.In the present embodiment, the multilayer board is flexible printed circuit board, the flexible printed circuit board
Being take polyimides (PI) or polyester film (PET) as a kind of high reliability and flexible printed circuit, letter made of substrate
Claim soft board, it has the characteristics that Distribution density is high, light-weight, thickness is thin, is mainly used in mobile phone, laptop, PDA, number
In the products such as code camera, LCM.And in the present embodiment, the flexible printed circuit board is 4 layer printed circuit boards, wherein wrapping
The insulating layer 15 for including first to fourth metal layer 11-14 and being spaced between every two metal layer.
The multilayer board boring method includes:
Step S1: choosing a printed circuit board, and drill on the printed circuit board, is printed with being formed through the multilayer
The first through hole of printed circuit board.
Step S2: black holes process is carried out to the first through hole；
Step S3: the copper facing in the first through hole Jing Guo black holes process, and it is copper-plated in the first through hole
Thickness is greater than copper-plated actual demand thickness in the first through hole, to form via hole 20.Wherein, in the multilayer printed circuit
It drills on plate and black holes process and the copper-plated work in the first through hole is carried out to the first through hole that drilling is formed
Skill is the prior art, and in this not go into detail.
Step S4: drilling on the multilayer board from the direction opposite with the one section of via hole retained is needed, with
The second hole 30 until forming depth to the metal layer of the one section of via hole connection for needing to retain.In the present embodiment, described
The diameter in the second hole 30 is greater than or equal to the diameter of the first through hole, is guaranteed with this by the way that the second hole 30 is arranged by useless one
Copper on section 20 inner wall of via hole cleans up.It is illustrated below: if it is desired to being electrically connected the first metal layer 11,
The via hole 20 of two metal layers 12 and the third metal layer 13, then it is described to be formed in the drilling of the side of the 4th metal layer 14
Second hole 30, and make the depth d in second hole 30 since the 4th metal layer 14 up to the third metal layer 13
Until, i.e., one section of via hole 20 for needing to retain and second hole 30 are formd at this time.
Step S5: conditioner 40 is filled into one section of via hole 20 for needing to retain and second hole 30.Wherein,
The conditioner 40 is a kind of material similar to ink, is in solid-state under room temperature, has mobility under the conditions of unconventional, and can be with
Chemical reaction occurs for the copper on surface layer and solidification is attached to copper surface, no longer reacts with the copper of deeper inside, the conditioner is
The mixture of ink and acidic or alkaline substances, wherein the mixed proportion of ink and acidic or alkaline substances is selected as needed
It selects.In step s3, copper-plated thickness is greater than copper-plated actual demand thickness in the first through hole in the first through hole,
It is when the conditioner being filled into second hole 30 to carry out clearing up residual copper to second hole 30 in order to prevent, it is described whole
Hole agent is filled into a small amount of copper etched away in the via hole 20 in the via hole 20 and hole wall copper is made accordingly to be thinned and pass to signal
It is defeated to impact, therefore its thickness to be made in the first through hole to be greater than the thickness of actual demand less when copper facing.
Step S6: the conditioner 40 is washed, has copper in the via hole 20 of only reservation in need at this time, is washed described whole
The diameter c1 for one section of via hole 20 that the needs after hole agent 40 retain is 0.1 millimeter, and the metal layer that will need to connect is electrical
It connects, and without attachment copper in the second hole 30, to reduce the length of useless hole copper, guarantee signal integrity.
Please refer to Fig. 5 and Fig. 6, be the second embodiment of multilayer board boring method of the invention flow chart and
Process flow chart.The second embodiment of the multilayer board boring method and the multilayer board boring method
The difference of first embodiment be: step S4: from the upper surface and the lower surface of the multilayer board respectively to needs
The direction drilling of the one section of via hole retained, until forming depth to the metal layer of the one section of via hole connection for needing to retain
Second hole.In the present embodiment, the diameter in second hole 30 is greater than or equal to the diameter of the first through hole, guarantees to lead to this
The second hole 30 of setting is crossed to clean up the copper on one section of useless via hole inner wall.It is illustrated below: if it is desired to being formed electrically
The via hole 20 of the second metal layer 12 and the third metal layer 13 is connected, then is drilled in the side of the first metal layer 11
To form the second hole 30, and make the depth d1 in second hole 30 since the first metal layer 11 up to second gold medal
Until belonging to layer 12, while drilling in the side of the 4th metal layer 14 to form second hole 30, and make described second
The depth d2 in hole 30 until the third metal layer 13, i.e., is formd at this time since the 4th metal layer 14 and is needed to protect
The one section of via hole 20 stayed and two second holes 30.
The multilayer board boring method forms second hole by drilling to reduce the length of useless hole copper
Degree, guarantees the integrality of signal transmission, while avoiding and technique price caused by blind hole and buried via hole is arranged on a printed circuit
The problem of high and low efficiency.
Mode the above is only the implementation of the present invention is not intended to limit the scope of the invention, all to utilize this
Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field is included within the scope of the present invention.
Claims (8)
1. a kind of multilayer board boring method, which is characterized in that the multilayer board boring method includes:
A printed circuit board is chosen, and is drilled on the printed circuit board, to be formed through the multilayer board
First through hole；
Black holes process is carried out to the first through hole；
The copper facing in the first through hole Jing Guo black holes process, and in the first through hole copper-plated thickness be greater than it is described
Copper-plated actual demand thickness in first through hole, to form via hole；
It drills on the multilayer board from the direction opposite with the one section of via hole retained is needed, to form depth to institute
State the second hole until the metal layer for the one section of via hole connection for needing to retain；
Conditioner is filled into one section of via hole for needing to retain and second hole；And
Wash the conditioner；
The conditioner is the mixture of ink and acidic or alkaline substances.
2. multilayer board boring method according to claim 1, which is characterized in that the diameter in second hole is big
In or equal to the first through hole diameter.
3. multilayer board boring method according to claim 1, which is characterized in that the multilayer board
For flexible printed circuit board.
4. multilayer board boring method according to claim 1, which is characterized in that after washing the conditioner
The needs retain one section of via hole diameter be 0.1 millimeter.
5. a kind of multilayer board boring method, which is characterized in that the multilayer board boring method includes:
A printed circuit board is chosen, and is drilled on the printed circuit board, to be formed through the multilayer board
First through hole；
Black holes process is carried out to the first through hole；
The copper facing in the first through hole Jing Guo black holes process, and in the first through hole copper-plated thickness be greater than it is described
Copper-plated actual demand thickness in first through hole, to form via hole；
It drills respectively to the direction for one section of via hole for needing to retain from the upper surface and the lower surface of the multilayer board, with
The second hole until forming depth to the metal layer of the one section of via hole connection for needing to retain；
Conditioner is filled into one section of via hole for needing to retain and second hole；And
Wash the conditioner；
The conditioner is the mixture of ink and acidic or alkaline substances.
6. multilayer board boring method according to claim 5, which is characterized in that the diameter in second hole is big
In or equal to the first through hole diameter.
7. multilayer board boring method according to claim 5, which is characterized in that the multilayer board
For flexible printed circuit board.
8. multilayer board boring method according to claim 5, which is characterized in that after washing the conditioner
The needs retain one section of via hole diameter be 0.1 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610559864.6A CN105979709B (en) | 2016-07-15 | 2016-07-15 | Multilayer board boring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610559864.6A CN105979709B (en) | 2016-07-15 | 2016-07-15 | Multilayer board boring method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105979709A CN105979709A (en) | 2016-09-28 |
| CN105979709B true CN105979709B (en) | 2019-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610559864.6A Active CN105979709B (en) | 2016-07-15 | 2016-07-15 | Multilayer board boring method |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107520470A (en) * | 2017-09-30 | 2017-12-29 | 奥士康科技股份有限公司 | A kind of method for lifting drilling efficiency |
| CN109673112B (en) * | 2017-10-13 | 2021-08-20 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and manufacturing method thereof |
| CN107801308A (en) * | 2017-11-15 | 2018-03-13 | 奥士康科技股份有限公司 | A kind of boring method of printed circuit board (PCB) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7337537B1 (en) * | 2003-09-22 | 2008-03-04 | Alcatel Lucent | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board |
| CN101815404A (en) * | 2010-04-08 | 2010-08-25 | 梅州五洲电路板有限公司 | High-frequency mixed compression process for printed circuit board |
| CN101861058A (en) * | 2010-06-04 | 2010-10-13 | 深南电路有限公司 | Method of PCB board processing technology |
| CN103517581A (en) * | 2012-06-15 | 2014-01-15 | 深南电路有限公司 | Manufacturing method of multilayer PCB board and multilayer PCB board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6350064B2 (en) * | 2013-10-09 | 2018-07-04 | 日立化成株式会社 | Manufacturing method of multilayer wiring board |
-
2016
- 2016-07-15 CN CN201610559864.6A patent/CN105979709B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7337537B1 (en) * | 2003-09-22 | 2008-03-04 | Alcatel Lucent | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board |
| CN101815404A (en) * | 2010-04-08 | 2010-08-25 | 梅州五洲电路板有限公司 | High-frequency mixed compression process for printed circuit board |
| CN101861058A (en) * | 2010-06-04 | 2010-10-13 | 深南电路有限公司 | Method of PCB board processing technology |
| CN103517581A (en) * | 2012-06-15 | 2014-01-15 | 深南电路有限公司 | Manufacturing method of multilayer PCB board and multilayer PCB board |
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| Publication number | Publication date |
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| CN105979709A (en) | 2016-09-28 |
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