CN107520470A - A kind of method for lifting drilling efficiency - Google Patents
A kind of method for lifting drilling efficiency Download PDFInfo
- Publication number
- CN107520470A CN107520470A CN201710937464.9A CN201710937464A CN107520470A CN 107520470 A CN107520470 A CN 107520470A CN 201710937464 A CN201710937464 A CN 201710937464A CN 107520470 A CN107520470 A CN 107520470A
- Authority
- CN
- China
- Prior art keywords
- drilling
- 8mil
- copper sheet
- select
- deficiency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
Abstract
A kind of method for lifting drilling efficiency, including herein below:1)Take out T definition:On the basis of drilling is existing, picks out a part and made by higher order drilling;2)It is automatic to select the principle and step for taking out T drillings;Principle:Select in the range of internal layer/outer layer copper sheet, away from copper sheet side at least 8mil, and drilling is more than 8mil with the spacing of wells, and orifice ring deficiency and pitch-row deficiency are not interfered with after increasing;Step:A:Drilling is selected again by normal compensatory takes out T drillings;B:The copper sheet of circuit composition need to be converted into copper billet;C:Select the drilling in per sandwich circuit copper sheet 8mil;D:Pick out hole and delete drilling away from other pitch-rows less than 8mil.The present invention not select the VIA holes that can be increased manually, and data is not interfered with after increasing, reduce the utilization rate of bradawl nozzle, bradawl nozzle is replaced by the brill nozzle of big one-level.
Description
Technical field
The present invention relates to a kind of method for lifting drilling efficiency.
Background technology
Client provides firsthand information and made to engineering, and VIA holes general indemnity 0-0.05mm, VIA aperture compensation crosses conference shadow
Ring the engineering data optimization time, and spacing deficiency can will reduce boring aperture, be not carried out selecting the drilling that can be increased, so,
It is presented as:
1. BGA is only distinguished in existing drilling;
2. same drilling is substantially unified increasing or reduced;
3. causing spacing insufficient after increasing, optimize circuit manually or move hole, shrinkage cavity, spend the time very long.
The shortcomings that prior art:
Drilling routinely compensates 0-0.05mm, and the aperture for having spacing deficiency after compensating unifies uncompensation or compensates too small and use
Smaller brill nozzle, causing bradawl nozzle, each side cost is higher using excessively.
The content of the invention
The technical problem to be solved by the invention is to provide a kind of method for lifting drilling efficiency, this method should not be manual
The VIA holes that can be increased are selected, data is not interfered with after increasing, reduce the utilization rate of bradawl nozzle, are replaced by the brill nozzle of big one-level
Bradawl nozzle.
Take out T definition:On the basis of drilling is existing, picks out a part and made by higher order drilling.
Such as:VIA boring apertures are 0.25mm, select part and are made by 0.3mm;
Non-standard brill nozzle 0.025mm single orders, standard bore nozzle 0.05mm single orders;
High using non-standard brill nozzle cost, the brill nozzle cost using the ratio higher order of low single order is high(Grind number);
Boring nozzle size influences plank number of laminations and rig drilling speed;
Bore easier broken needle in the smaller production of nozzle.
The technical solution adopted for the present invention to solve the technical problems is:A kind of method for lifting drilling efficiency, including with
Lower content:
1)Take out T definition:On the basis of drilling is existing, picks out a part and made by higher order drilling;
2)It is automatic to select the principle and step for taking out T drillings
Principle:Select in the range of internal layer/outer layer copper sheet, away from copper sheet side at least 8mil, and drilling is more than 8mil with the spacing of wells,
Orifice ring deficiency and pitch-row deficiency are not interfered with after increasing;
Step:
A:Drilling is selected again by normal compensatory takes out T drillings;
B:The copper sheet of circuit composition need to be converted into copper billet;
C:Select the drilling in per sandwich circuit copper sheet 8mil;
D:Pick out hole and delete drilling away from other pitch-rows less than 8mil.
Step A-D is the step of formula performs, and producer is selected by shortcut one-key operation.
The technical characterstic of the present invention:
When engineering data makes, the VIA holes for not influenceing engineering data are picked out, made by higher order;1. after increasing not
Engineering data optimization is influenceed, only the hole for taking out T need to be carried out a point knife on the basis of original copy;2. the borehole data ratio for take out T does not have
The borehole data bradawl nozzle for having optimization will lack;3. aperture ratio is reduced during production can improve the efficiency of drilling and reduce brill nozzle use
Cost.
Beneficial effects of the present invention:
VIA holes generally are the hole of consent, and increasing single order, which is not interfered with factory, to be produced and on plank performance without influence;The method is
It is excessive to solve aperture, time and the difficulty for by making is increased, not interfering with engineering data making then can be increased, also reduced small in plate
What hole can increase makes without by increasing;Execution take out T spend the time it is seldom, carry out drilling take out T to drilling operating production have it is very big
Help.
Embodiment
The invention will be further described with reference to embodiments.
Embodiment
A kind of method for lifting drilling efficiency, including herein below:
1. take out T definition:On the basis of drilling is existing, picks out a part and made by higher order drilling;
2. automatic select the principle and step for taking out T drillings
Principle:Select in the range of internal layer/outer layer copper sheet, away from copper sheet side at least 8mil, and drilling is more than 8mil with the spacing of wells,
Orifice ring deficiency and pitch-row deficiency are not interfered with after increasing;
Step:
A:Drilling is selected again by normal compensatory takes out T drillings;
B:The copper sheet of circuit composition need to be converted into copper billet;
C:Select the drilling in per sandwich circuit copper sheet 8mil;
D:Pick out hole and delete drilling away from other pitch-rows less than 8mil;
Above step is the step of formula performs, and producer is selected by shortcut one-key operation.
The present invention not select the VIA holes that can be increased manually, and data is not interfered with after increasing, reduce the use of bradawl nozzle
Rate, bradawl nozzle is replaced by the brill nozzle of big one-level.
Claims (2)
- A kind of 1. method for lifting drilling efficiency, it is characterised in that including herein below:1)Take out T definition:On the basis of drilling is existing, picks out a part and made by higher order drilling;2)It is automatic to select the principle and step for taking out T drillingsPrinciple:Select in the range of internal layer/outer layer copper sheet, away from copper sheet side at least 8mil, and drilling is more than 8mil with the spacing of wells, Orifice ring deficiency and pitch-row deficiency are not interfered with after increasing;Step:A:Drilling is selected again by normal compensatory takes out T drillings;B:The copper sheet of circuit composition need to be converted into copper billet;C:Select the drilling in per sandwich circuit copper sheet 8mil;D:Pick out hole and delete drilling away from other pitch-rows less than 8mil.
- 2. the method for lifting drilling efficiency according to claim 1, it is characterised in that step A-D is the step that formula performs Suddenly, producer is selected by shortcut one-key operation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710937464.9A CN107520470A (en) | 2017-09-30 | 2017-09-30 | A kind of method for lifting drilling efficiency |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710937464.9A CN107520470A (en) | 2017-09-30 | 2017-09-30 | A kind of method for lifting drilling efficiency |
Publications (1)
Publication Number | Publication Date |
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CN107520470A true CN107520470A (en) | 2017-12-29 |
Family
ID=60684588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201710937464.9A Pending CN107520470A (en) | 2017-09-30 | 2017-09-30 | A kind of method for lifting drilling efficiency |
Country Status (1)
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CN (1) | CN107520470A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1889810A (en) * | 2005-07-02 | 2007-01-03 | 鸿富锦精密工业(深圳)有限公司 | Printed circuit board with improved hole |
CN102159040A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for drilling hole on four-layered circuit board |
CN104735913A (en) * | 2015-03-23 | 2015-06-24 | 华进半导体封装先导技术研发中心有限公司 | Manufacturing method for package substrate via hole |
CN105979709A (en) * | 2016-07-15 | 2016-09-28 | 武汉华星光电技术有限公司 | Multilayer printed circuit board drilling method |
JP2016212579A (en) * | 2015-05-07 | 2016-12-15 | ビアメカニクス株式会社 | Drill boring device and drill boring method |
-
2017
- 2017-09-30 CN CN201710937464.9A patent/CN107520470A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1889810A (en) * | 2005-07-02 | 2007-01-03 | 鸿富锦精密工业(深圳)有限公司 | Printed circuit board with improved hole |
CN102159040A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for drilling hole on four-layered circuit board |
CN104735913A (en) * | 2015-03-23 | 2015-06-24 | 华进半导体封装先导技术研发中心有限公司 | Manufacturing method for package substrate via hole |
JP2016212579A (en) * | 2015-05-07 | 2016-12-15 | ビアメカニクス株式会社 | Drill boring device and drill boring method |
CN105979709A (en) * | 2016-07-15 | 2016-09-28 | 武汉华星光电技术有限公司 | Multilayer printed circuit board drilling method |
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RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171229 |
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RJ01 | Rejection of invention patent application after publication |