CN105977223B - 不规则形状的封装结构及其制造方法 - Google Patents
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Abstract
本发明是关于一种不规则形状的封装结构及其制造方法。该封装结构包括一基板、一管芯及一封胶。该管芯附着至该基板的一表面,且电性连接至该基板。该封胶包覆该管芯,具有至少一封胶缺口。如此,其它组件可置放于该封胶缺口,或者该封装结构可对应于电路板边缘的缺口而设置。
Description
本申请是申请人于2012年3月1日提交的、申请号为“201210051256.6”的、发明名称为“不规则形状的封装结构及其制造方法”的发明专利申请的分案申请。
技术领域
本发明是关于一种半导体封装结构及其制造方法,详言之,是关于一种不规则形状的封装结构及其制造方法。
背景技术
已知半导体封装结构的外观形状,大多为立方体结构。因此,该已知半导体封装结构在封装完成后即无法再设置任何组件(例如被动组件或连接器)于其上,亦即其没有多余的可利用空间。此外,承载该已知半导体封装结构的电路板的边缘通常会有缺口,使得该已知半导体封装结构无法对应该缺口而设置于电路板的边缘,导致电路布局受到限制。
因此,有必要提供一创新且富进步性的不规则形状的封装结构及其制造方法,以解决上述问题。
发明内容
本发明提供一种不规则形状的封装结构,其包括一基板、一管芯及一封胶。该基板具有一表面。该管芯附着至该基板的该表面,且电性连接至该基板。该封胶位于该基板的该表面,且包覆该管芯,该封胶具有至少一封胶缺口,其中该基板具有至少一外露部分,该至少一外露部分未被该封胶所覆盖且对应该至少一封胶缺口。如此,其它组件可置放于该封胶缺口,进而增加电路布局的弹性。
本发明另提供一种不规则形状的封装结构,其包括一基板、一管芯及一封胶。该基板具有一表面与一基板缺口。该管芯附着至该基板的该表面,且电性连接至该基板。该封胶位于该基板的该表面,且包覆该管芯,该封胶具有至少一封胶缺口,其中该基板缺口对应该封胶缺口。如此,该封装结构可对应于一位于电路板边缘的缺口而设置,进而增加电路布局的弹性。
本发明另提供一种不规则形状的封装结构的制造方法,其包括以下步骤:(a)提供一基板,该基板具有一表面;(b)附着至少一管芯至该基板的该表面,其中该至少一管芯电性连接至该基板;(c)形成一封胶于该基板的该表面以包覆该至少一管芯,其中该封胶具有至少一封胶开口;及(d)沿着多条切割线切割该基板及该封胶,以形成多个封装结构,其中每一封装结构的封胶具有至少一封胶缺口,该至少一封胶缺口对应该至少一封胶开口。
附图说明
图1显示本发明不规则形状的封装结构的一实施例的示意图;
图2显示本发明不规则形状的封装结构的另一实施例的示意图;
图3显示图2的封装结构置放于第一种电路板的示意图;
图4显示图2的封装结构置放于第二种电路板的示意图;
图5显示本发明不规则形状的封装结构的另一实施例的示意图;
图6显示本发明不规则形状的封装结构的另一实施例的示意图;
图7显示本发明不规则形状的封装结构的另一实施例的示意图;
图8显示本发明不规则形状的封装结构的另一实施例的示意图;
图9显示本发明不规则形状的封装结构的另一实施例的示意图;
图10显示本发明不规则形状的封装结构的另一实施例的示意图;
图11显示本发明不规则形状的封装结构的另一实施例的示意图;
图12至图15显示本发明不规则形状的封装结构的制造方法的一实施例的示意图;
图16至图20显示本发明不规则形状的封装结构的制造方法的另一实施例的示意图;及
图21至图25显示本发明不规则形状的封装结构的制造方法的另一实施例的示意图。
具体实施方式
参考图1,绘示本发明不规则形状的封装结构的一实施例的示意图。该不规则形状的封装结构1包括一基板11、一管芯12及一封胶13。该基板11具有一表面111及至少一外露部分112。
该管芯12附着至该基板11的该表面111,且电性连接至该基板11。在本实施例中,该管芯12利用多条焊线121电性连接至该基板11;然而在其它实施例中,该管芯12以覆晶方式电性连接至该基板11,亦即其通过数个焊球电性连接于该基板11。
该封胶13位于该基板11的该表面111,且包覆该管芯12。该封胶13具有至少一封胶缺口131与一封胶上表面。该基板11的外露部分112未被该封胶上表面所覆盖且对应该至少一封胶缺口131。亦即,该基板11的外露部分112的表面未被封胶13所覆盖而被该封胶缺口131所显露。换言之,该封胶13并未延伸至该基板11的外露部分112的表面的上方。
较佳地,该不规则形状的封装结构1还包括至少一连接器14及一线路层15,该连接器14位于该基板11的该外露部分112,而该线路层15位于该基板11上,且该线路层15的一部分被该封胶13所覆盖,另一部分则被该封胶缺口131所显露。该管芯12及该连接器14分别电性连接至该线路层15,使得该连接器14得以电性连接至该基板11及该管芯12,如此,外部讯号即可借由一与该连接器电性连接的软性电路板(Flexible Print Circuit Board,FPCB)而传送至该连接器14,进而为该管芯12所接收。因此,该外露部分112为可利用的空间而可再设置组件于其上。亦即,其它组件例如:被动组件、封装结构或发光二极管(Light-Emitting Diode,LED)可置放于基板11的外露部分112的表面而与基板11电性连接,亦即设置于该封胶缺口131。
在本实施例中,该封胶缺口131位于该封胶13的一角落,使得该封胶13以俯视观之为L形。
参考图2,绘示本发明不规则形状的封装结构的另一实施例的示意图。本实施例的封装结构1a与图1所示的封装结构1大致相同,其不同处在于,在该封装结构1a中,该基板11还具有至少一基板缺口113,该至少一基板缺口113对应该至少一封胶缺口131。亦即,以俯视观之,该基板11的形状与该封胶13的形状相同。因此,在本实施例中,该基板11具有多个侧面114,该封胶13具有多个侧面133,且该基板11的这些侧面114分别与该封胶13的这些侧面133实质上共平面。
参考图3,绘示图2的封装结构置放于第一种电路板的示意图。该电路板2的一边缘具有一电路板缺口21。该封装结构1a置放于该电路板2时,仅需将该基板缺口113及该封胶缺口131对准该电路板缺口21即可。如此,可增加电路布局的弹性。然而本发明并不局限于此,例如该基板缺口113及该封胶缺口131也可对准电路板上的贯孔,且该贯孔并非设置于电路板2的边缘。
参考图4,绘示图2的封装结构置放于第二种电路板的示意图。该电路板2a的一边缘不具有缺口,然而却因为电路布局之故而设置一电性组件22(例如:被动组件、封装结构或连接器等),该封装结构1a置放于该电路板2时,仅需将该基板缺口113及该封胶缺口131对应该电性组件22设置即可。如此,可增加电路布局的弹性,且增加该电路板2a所承载的电性组件22的数目。
参考图5,绘示本发明不规则形状的封装结构的另一实施例的示意图。本实施例的封装结构1b与图1所示的封装结构1大致相同,其不同处在于,在该封装结构1b中,该基板11具有四个外露部分112,分别位于该基板11的四角落。同时,该封胶13具有四个封胶缺口131,分别位于该封胶13的四角落,且分别对应于基板11的这些外露部分112。因此,该封胶13以俯视观之为十字形,且于基板11的这些外露部分112可再置放四个连接器14或其它电性组件。
参考图6,绘示本发明不规则形状的封装结构的另一实施例的示意图。本实施例的封装结构1c与图2所示的封装结构1a大致相同,其不同处在于,在该封装结构1c中,该基板11具有四个基板缺口113,分别位于该基板11的四角落。同时,该封胶13具有四个封胶缺口131,分别位于该封胶13的四角落,且分别对应这些基板缺口113。因此,该封胶13及该基板11以俯视观之皆为十字形。
参考图7,绘示本发明不规则形状的封装结构的另一实施例的示意图。本实施例的封装结构1d与图1所示的封装结构1大致相同,其不同处在于,在该封装结构1d中,该基板11具有一个外露部分112,位于该基板11的一侧边。同时,该封胶13具有一个封胶缺口131,位于该封胶13的一侧边,且对应该基板11的外露部分112。因此,该封胶13以俯视观之为ㄈ形,且可再置放一个连接器14或其它电性组件于该基板11的外露部分112。
参考图8,绘示本发明不规则形状的封装结构的另一实施例的示意图。本实施例的封装结构1e与图2所示的封装结构1a大致相同,其不同处在于,在该封装结构1e中,该基板11具有一个基板缺口113,位于该基板11的一侧边。同时,该封胶13具有一个封胶缺口131,位于该封胶13的一侧边,且对应该基板缺口113。因此,该封胶13及该基板11以俯视观之皆为ㄈ形。
参考图9,绘示本发明不规则形状的封装结构的另一实施例的示意图。本实施例的封装结构1f与图1所示的封装结构1大致相同,其不同处在于,在该封装结构1f中,该基板11具有二个外露部分112,分别位于该基板11的二角落。同时,该封胶13具有二个封胶缺口131,分别位于该封胶13的二角落,且分别对应这些外露部分112。因此,该封胶13以俯视观之为凸字形,且可再置放二个连接器14或其它电性组件于该基板11的外露部分112。
参考图10,绘示本发明不规则形状的封装结构的另一实施例的示意图。本实施例的封装结构1g与图2所示的封装结构1a大致相同,其不同处在于,在该封装结构1g中,该基板11具有二个基板缺口113,分别位于该基板11的二角落。同时,该封胶13具有二个封胶缺口131,分别位于该封胶13的二角落,且分别对应这些基板缺口113。因此,该封胶13及该基板11以俯视观之皆为凸字形。
参考图11,绘示本发明不规则形状的封装结构的另一实施例的示意图。本实施例的封装结构1h与图1所示的封装结构1大致相同,其不同处在于,在该封装结构1h中,该基板11具有一个外露部分112,且该外露部分112位于该基板11的中间。同时,该封胶13具有一个封胶缺口131,且该封胶缺口131位于该封胶13的中间,且对应该基板11的外露部分112。因此,该封胶13以俯视观之为回字形。一实施例中,一发光二极管(Light-Emitting Diode,LED)对应该封胶缺口131而设置于基板11,因此发光二极管的亮光可以通过该封胶缺口131而发散,较佳地,该封胶缺口131可以填充一透明胶以保护该发光二极管。
参考图12至图15,绘示本发明不规则形状的封装结构的制造方法的一实施例的示意图。
参考图12,提供一基板11。该基板11具有一表面111。接着,附着至少一管芯12至该基板11的该表面111,其中该管芯12电性连接至该基板11。在本实施例中,该管芯12利用多条焊线121电性连接至该基板11;然而在其它实施例中,该管芯12以覆晶方式电性连接至该基板11。
参考图13,形成一封胶13于该基板11的该表面111以包覆该管芯12。
参考图14,移除部分该封胶13,以形成至少一封胶开口132,使得部分该基板11未被该封胶13所覆盖而被该封胶开口132所显露。较佳地,利用激光或刀具移除部分该封胶13。
参考图15,沿着多条切割线16切割该基板11及该封胶13,以形成多个如图1所示的封装结构1。每一封装结构1的封胶13具有至少一封胶缺口131,该封胶缺口131对应该至封胶开口132。在本实施例中,部分这些切割线16穿过该封胶开口132的一中间位置使得一个封胶开口132被切割成多个(例如:二个)封胶缺口131。
参考图16至图20,绘示本发明不规则形状的封装结构的制造方法的另一实施例的示意图。
参考图16,提供一基板11。该基板11具有一表面111及至少一基板贯穿孔115。
参考图17,附着至少一管芯12至该基板11的该表面111,其中该管芯12电性连接至该基板11。在本实施例中,该管芯12利用多条焊线121电性连接至该基板11;然而在其它实施例中,该管芯12以覆晶方式电性连接至该基板11。
参考图18,提供一下模具31。该下模具31具有至少一突柱32。接着,置放该基板11于该下模具31上,其中该至少一突柱32穿设该至少一基板贯穿孔115。接着,设置一上模具33于该下模具31上,以形成至少一模穴34,其中该上模具33接触该至少一突柱32。亦即,该至少一突柱32的顶部抵该上模具33。
参考图19,充填一封胶13于该至少一模穴34,以形成该封胶13于该基板11的该表面111上且包覆该至少一管芯12及这些焊线121。该封胶13具有至少一封胶开口134,该至少一封胶开口134对应该至少一突柱32及该至少一基板贯穿孔115。亦即,该封胶开口134因该封胶13围绕该突柱32而形成。
参考图20,移除该上模具33及该下模具31。接着,沿着多条切割线16切割该基板11及该封胶13,以形成多个如图2所示的封装结构1a。每一封装结构1a的封胶13具有至少一封胶缺口131,该封胶缺口131对应该至封胶开口134。在本实施例中,部分这些切割线16穿过该封胶开口134,使得一个封胶开口134被切割成多个(例如:四个)封胶缺口131,较佳地,这些切割线16穿过该封胶开口134的中间位置。
参考图21至图25,绘示本发明不规则形状的封装结构的制造方法的另一实施例的示意图。
参考图21,提供一基板11。该基板11具有一表面111及至少一基板贯穿孔116,较佳地,该至少一基板贯穿孔116设置于基板边缘。
参考图22,附着至少一管芯12至该基板11的该表面111,其中该管芯12电性连接至该基板11。在本实施例中,该管芯12利用多条焊线121电性连接至该基板11;然而在其它实施例中,该管芯12以覆晶方式电性连接至该基板11。
参考图23,提供一下模具31。该下模具31具有至少一突柱32。接着,置放该基板11于该下模具31上,其中该至少一突柱32穿设该至少一基板贯穿孔116。接着,设置一上模具33于该下模具31上,以形成至少一模穴34,其中该上模具33接触该至少一突柱32。亦即,该至少一突柱32的上表面与该上模具33接合。
参考图24,充填一封胶13于该至少一模穴34,以形成该封胶13于该基板11的该表面111上且包覆该至少一管芯12及这些焊线121。该封胶13具有至少一封胶开口135,且该至少一封胶开口135对应该至少一突柱32及该至少一基板贯穿孔116。亦即,该封胶开口135因该封胶13围绕该突柱32而形成。
参考图25,移除该上模具33及该下模具31。接着,沿着多条切割线16切割该基板11及该封胶13,以形成多个如图2所示的封装结构1a。每一封装结构1a的封胶13具有至少一封胶缺口131,该封胶缺口131对应该至封胶开口134。在本实施例中,部分这些切割线16穿过该至少一封胶开口135的一侧边位置使得一个封胶开口135被切割成一个封胶缺口131。
惟上述实施例仅为说明本发明的原理及其功效,而非用以限制本发明。因此,了解此技术的人士对上述实施例进行修改及变化仍不脱本发明的精神。本发明的权利范围应如后述的权利要求范围所列。
Claims (10)
1.一种不规则形状的封装结构,包括:
一基板,具有一表面;
一管芯,附着至该基板的该表面,且电性连接至该基板;及
一封胶,位于该基板的该表面,且包覆该管芯,该封胶具有至少一封胶缺口;
其中该基板具有至少一外露部分,该至少一外露部分未被该封胶所覆盖,且对应该至少一封胶缺口而被该封胶缺口所显露;及
至少一组件,该至少一组件选自被动组件、封装结构及发光二极管其中之一,且位于该至少一外露部分,並电性连接至该基板。
2.如权利要求1的封装结构,其特征在于,其中该基板还包括一线路层,该管芯及该至少一组件电性连接该线路层。
3.如权利要求1的封装结构,其特征在于,其中该至少一封胶缺口位于该封胶的中间。
4.如权利要求1的封装结构,其特征在于,其中该至少一封胶缺口位于该封胶的一侧边。
5.如权利要求1的封装结构,其特征在于,其中该至少一封胶缺口位于该封胶的一角落。
6.一种不规则形状的封装结构的制造方法,包括:
(a)提供一基板,该基板具有一表面;
(b)附着至少一管芯至该基板的该表面,其中该至少一管芯电性连接至该基板;
(c)形成一封胶于该基板的该表面以包覆该至少一管芯,其中该封胶具有至少一封胶开口,该至少一封胶开口是移除部分该封胶所形成,且该基板的该表面具有至少一外露部分,该至少一外露部分未被该封胶所覆盖;
(d)沿着多条切割线切割该基板及该封胶,以形成多个封装结构,其中每一封装结构的封胶具有至少一封胶缺口,该至少一封胶缺口对应该至少一封胶开口;及
(e)在该至少一外露部分置放至少一组件,该至少一组件选自被动组件、封装结构及发光二极管其中之一,且电性连接至该基板。
7.如权利要求6的制造方法,其特征在于,其中该步骤(c)中利用激光移除部分该封胶。
8.如权利要求6的制造方法,其特征在于,其中该步骤(a)中,该基板还具有至少一基板贯穿孔,且该步骤(c)包括:
(cl)提供一下模具,该下模具具有至少一突柱;
(c2)置放该基板于该下模具上,其中该至少一突柱穿设该至少一基板贯穿孔;
(c3)设置一上模具于该下模具上,以形成至少一模穴,其中该上模具接触该至少一突柱;
(c4)充填该封胶于该至少一模穴以形成于该基板的该表面上且包覆该至少一管芯,其中该封胶具有至少一封胶开口,该至少一封胶开口对应该至少一突柱及该至少一基板贯穿孔;及
(c5)移除该上模具及该下模具。
9.如权利要求8的制造方法,其特征在于,其中该步骤(d)中,部分这些切割线穿过该至少一封胶开口的一中间位置使得一个封胶开口被切割成多个封胶缺口。
10.如权利要求8的制造方法,其特征在于,其中该步骤(d)中,部分这些切割线穿过该至少一封胶开口的一侧边位置使得一个封胶开口被切割成一个封胶缺口。
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