CN105960111B - A kind of IPM module and its welding method - Google Patents
A kind of IPM module and its welding method Download PDFInfo
- Publication number
- CN105960111B CN105960111B CN201610559837.9A CN201610559837A CN105960111B CN 105960111 B CN105960111 B CN 105960111B CN 201610559837 A CN201610559837 A CN 201610559837A CN 105960111 B CN105960111 B CN 105960111B
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- China
- Prior art keywords
- ipm
- circuit board
- welding
- pcb circuit
- auxiliary
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of IPM module and its welding method, which opens up IPM component welding hole and auxiliary welding hole the following steps are included: step 1 in PCB circuit board；The IPM contact pin of IPM component is arranged in IPM component welding hole by step 2；One end of auxiliary row's needle is welded in auxiliary welding hole by step 3, then by the other end joint welding of auxiliary row's needle on IPM contact pin.Compared with the existing technology, which raises operating efficiencies and operation quality by the present invention.Compared to the prior art, welding quality is solid and reliable by the present invention, meanwhile, when disassembly, only needs to cut short IPM contact pin, and it is simple to operate, conducive to the dismounting of PCB circuit board, cause to damage or scrap in disassembly process prevented also from PCB circuit board and IPM component.
Description
Technical field
The present invention relates to a kind of IPM module and its welding methods.
Background technique
In the prior art, the welding manner of IPM module is generally and directly welds IPM contact pin with PCB circuit board welding hole
It connects, although such mode is welded firm, is not easy to dismantle.The welding hole of IPM capillary or PCB circuit board is easily damaged when disassembly,
It is big to dismantle difficulty, causes components to be scrapped, is not easy to the maintenance of product and reprocesses.
Therefore, a kind of easy-to-dismount IPM module and its welding method are needed.
Summary of the invention
In order to solve the above-mentioned technical problems, the present invention provides a kind of IPM module and its welding methods.
In order to achieve the above object, technical scheme is as follows:
The present invention provides a kind of IPM module, comprising:
PCB circuit board offers IPM component welding hole and auxiliary welding hole in PCB circuit board；
IPM component, the IPM contact pin of IPM component are arranged in IPM component welding hole；
One end of auxiliary row's needle, auxiliary row's needle is welded in auxiliary welding hole, and the other end joint welding of auxiliary row's needle is in IPM component
IPM contact pin on.
Wherein, above-mentioned auxiliary welding hole is parallel with IPM component welding hole and setting interval is provided therebetween.
Cooling body, including fixing seat and multiple cooling fins are additionally provided with as a preferred technical solution, in fixing seat
It is provided with the first card slot and multiple second card slots, the first card slot of fixing seat is arranged in PCB circuit board, and cooling fins are arranged in
It is in contact in second card slot and with PCB circuit board and connect.Wherein, cooling fins are tabular or wavelike structure.
Using above-mentioned preferred embodiment, fixing seat is arranged in PCB circuit board, cooling fins directly with PCB circuit board phase
It connects, heat when absorbing welding in PCB circuit board avoids the excessively high damage PCB circuit board of temperature.
The present invention also provides a kind of welding methods of IPM module, comprising the following steps:
Step 1 opens up IPM component welding hole and auxiliary welding hole in PCB circuit board；
The IPM contact pin of IPM component is arranged in IPM component welding hole by step 2；
Step 3, by auxiliary row needle one end be welded in auxiliary welding hole in, then by auxiliary row needle other end joint welding in
On IPM contact pin；Meanwhile when welding, the first card slot of fixing seat is arranged in PCB circuit board and cooling fins and PCB circuit board
Be in contact connection.
Compared to the prior art, welding quality is solid and reliable by the present invention, meanwhile, when disassembly, only needs to cut short IPM contact pin i.e.
Can, it is simple to operate, conducive to the dismounting of PCB circuit board, made in disassembly process prevented also from PCB circuit board and IPM component
At damaging or scrap.
Specific embodiment
The following detailed description of the preferred embodiment of the present invention.
In order to reach the purpose of the present invention, a kind of IPM module is provided in one of embodiment of the invention, is wrapped
It includes:
PCB circuit board offers IPM component welding hole and auxiliary welding hole in PCB circuit board；
IPM component, the IPM contact pin of IPM component are arranged in IPM component welding hole；
One end of auxiliary row's needle, auxiliary row's needle is welded in auxiliary welding hole, and the other end joint welding of auxiliary row's needle is in IPM component
IPM contact pin on.
Wherein, above-mentioned auxiliary welding hole is parallel with IPM component welding hole and setting interval is provided therebetween.
In order to further optimize implementation result of the invention, in another embodiment of the invention, aforementioned interior
On the basis of appearance, present embodiment is additionally provided with cooling body, including fixing seat and multiple cooling fins, is provided in fixing seat
First card slot and multiple second card slots, the first card slot of fixing seat are arranged in PCB circuit board, and cooling fins are arranged in the second card
It is in contact in slot and with PCB circuit board and connect.Wherein, cooling fins are tabular or wavelike structure.
Using above-mentioned preferred embodiment, fixing seat is arranged in PCB circuit board, cooling fins directly with PCB circuit board phase
It connects, heat when absorbing welding in PCB circuit board avoids the excessively high damage PCB circuit board of temperature.
In order to further optimize implementation result of the invention, in another embodiment of the invention, aforementioned interior
On the basis of appearance, present embodiment also provides a kind of welding method of IPM module, comprising the following steps:
Step 1 opens up IPM component welding hole and auxiliary welding hole in PCB circuit board；
The IPM contact pin of IPM component is arranged in IPM component welding hole by step 2；
Step 3, by auxiliary row needle one end be welded in auxiliary welding hole in, then by auxiliary row needle other end joint welding in
On IPM contact pin；Meanwhile when welding, the first card slot of fixing seat is arranged in PCB circuit board and cooling fins and PCB circuit board
Be in contact connection.
Compared to the prior art, welding quality is solid and reliable for present embodiment, meanwhile, when disassembly, only needs to cut short IPM and inserts
Needle, it is simple to operate, conducive to the dismounting of PCB circuit board, prevented also from PCB circuit board and IPM component in disassembly process
In cause to damage or scrap.
What has been described above is only a preferred embodiment of the present invention, it is noted that for those of ordinary skill in the art
For, without departing from the concept of the premise of the invention, various modifications and improvements can be made, these belong to the present invention
Protection scope.
Claims (5)
1. a kind of IPM module characterized by comprising
PCB circuit board offers IPM component welding hole and auxiliary welding hole in the PCB circuit board；
IPM component, the IPM contact pin of the IPM component are arranged in the IPM component welding hole；
One end of auxiliary row's needle, the auxiliary row needle is welded in the auxiliary welding hole, the other end joint welding of the auxiliary row needle
In on the IPM contact pin of the IPM component；
The auxiliary welding hole is parallel with the IPM component welding hole and setting interval is provided therebetween.
2. IPM module according to claim 1, which is characterized in that be additionally provided with cooling body, including fixing seat and multiple
Cooling fins are provided with the first card slot and multiple second card slots in the fixing seat, and the first card slot of the fixing seat is arranged in
In PCB circuit board, the cooling fins are arranged in second card slot and are in contact with the PCB circuit board and connect.
3. IPM module according to claim 2, which is characterized in that the cooling fins are tabular or wavelike structure.
4. a kind of welding method of IPM module a method according to any one of claims 1-3, which comprises the following steps:
Step 1 opens up IPM component welding hole and auxiliary welding hole in PCB circuit board；
The IPM contact pin of IPM component is arranged in IPM component welding hole by step 2；
One end of auxiliary row's needle is welded in auxiliary welding hole by step 3, then inserts the other end joint welding of auxiliary row's needle in IPM
On needle.
5. the welding method of IPM module according to claim 4, which is characterized in that in the step 3, when welding, Gu
First card slot of reservation is arranged in PCB circuit board and cooling fins are in contact with PCB circuit board and connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610559837.9A CN105960111B (en) | 2016-07-15 | 2016-07-15 | A kind of IPM module and its welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610559837.9A CN105960111B (en) | 2016-07-15 | 2016-07-15 | A kind of IPM module and its welding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105960111A CN105960111A (en) | 2016-09-21 |
| CN105960111B true CN105960111B (en) | 2018-12-07 |
Family
ID=56900817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610559837.9A Active CN105960111B (en) | 2016-07-15 | 2016-07-15 | A kind of IPM module and its welding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105960111B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325712A (en) * | 2012-03-20 | 2013-09-25 | 西安永电电气有限责任公司 | IGBT module packaging welding auxiliary device and system |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09312466A (en) * | 1996-05-22 | 1997-12-02 | Sony Corp | Method for mounting component on printed circuit board |
| JP2000208908A (en) * | 1999-01-19 | 2000-07-28 | Mitsubishi Electric Corp | Soldering method, printed wiring board, and mounting part suitable for them |
-
2016
- 2016-07-15 CN CN201610559837.9A patent/CN105960111B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325712A (en) * | 2012-03-20 | 2013-09-25 | 西安永电电气有限责任公司 | IGBT module packaging welding auxiliary device and system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105960111A (en) | 2016-09-21 |
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| C10 | Entry into substantive examination | ||
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 215300 B District, A-2 building, 111 Songlu Road, Yushan Town, Kunshan, Suzhou, Jiangsu Applicant after: Yuyali electric (Jiangsu) Co., Ltd. Address before: 215300 room 4, 155 New Town Road, Yushan, Kunshan, Suzhou, Jiangsu. Applicant before: KUNSHAN YUELI ELECTRIC CO., LTD. |
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| GR01 | Patent grant |