CN203156193U - Solder machine heat compensating device - Google Patents
Solder machine heat compensating device Download PDFInfo
- Publication number
- CN203156193U CN203156193U CN 201320143215 CN201320143215U CN203156193U CN 203156193 U CN203156193 U CN 203156193U CN 201320143215 CN201320143215 CN 201320143215 CN 201320143215 U CN201320143215 U CN 201320143215U CN 203156193 U CN203156193 U CN 203156193U
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- CN
- China
- Prior art keywords
- cabin body
- pipeline
- compensation device
- oblique
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a solder machine heat compensating device. The solder machine heat compensating device mainly comprises a cabin body and a pipeline, a plurality of heating pipes used for providing a hot airstream into the cabin body are arranged on one side face of the cabin body, one tail ends of the heating tubes are connected with the cabin body, the other tail ends of the heating tubes are connected with a heated and compressed air source, and a plurality of first through holes for exhausting the hot air stream are formed in the other opposite side face of the cabin body; the two tail ends of the pipeline are respectively connected with the side face, provided the through holes, of the cabin body, the pipeline defines an encircling circle, a tin groove used for welding printed circuit boards in a tin wave mode is arranged in the pipeline in the shape of the encircling circle, the pipeline is hollow, and a plurality of air holes for exhausting the hot airstream to heat the printed circuit boards are formed in the inner side of the pipeline at intervals. The solder machine heat compensating device not only effectively reduces energy consumption, but also reduces occurrence of the condition that the preheating effect of the solder machine heat compensating device is greatly weakened due to moving of the printed circuit boards, and the scrapping risk caused by excessive corroded copper, falling off of copper foil, and the like is reduced.
Description
Technical field
The utility model relates to tin stove technical field, relates in particular to a kind of tin stove thermal compensation device.
Background technology
The printed circuit board (PCB) number of plies of server and some high-end products is more and more, and area is increasing, and the element radiating Copper Foil on it is big, traditional little tin stove has seemed that thermal capacity is not enough when the dismounting of carrying out element and welding, the wicking time is long, and last tin degree is not enough, even not molten tin.
Preheater in the existing equipment and the separate design of molten tin bath, though track mobile printing circuit board is arranged, in moving process, owing to left thermal source, the temperature of printed circuit board (PCB) reduces rapidly, and pre-heat effect is had a greatly reduced quality, and erosion copper excessively, Copper Foil comes off etc. and to scrap risk and raise significantly thereupon.
Summary of the invention
In view of above-mentioned the problems referred to above, the utility model provides a kind of tin stove thermal compensation device that does not need the mobile printing circuit board can carry out heat compensation to this printed circuit board (PCB) in the scolding tin process.
In order to achieve the above object, the utility model has adopted following technical scheme: a kind of tin stove thermal compensation device, mainly comprise: the cabin body, this cabin body one side is provided with several in order to the heating tube of thermal current to this cabin body to be provided, described heating tube one end is connected with this cabin body, another compressed gas source terminal and through heating is connected, and this another opposite flank of cabin body is provided with first through hole that several heat supply air-flows are discharged; And pipeline, the side that these pipeline two ends are provided with first through hole with this cabin body respectively connects establishes, this pipeline is enclosed to form a ring of encirclement, this is and is provided with in the pipeline of the ring of encirclement in order to printed circuit board (PCB) is carried out the molten tin bath that the tin wave soldering connects, and discharges pore so that printed circuit board (PCB) is heated for hollow and its clear width are provided with several heat supply air-flows in this pipeline.
Preferable, the utility model provides a kind of tin stove thermal compensation device, wherein, this tin stove thermal compensation device also includes the oblique cabin body of discharging for through the thermal current of cabin body, this body one side, oblique cabin is the side that this cabin body is provided with first through hole, and its another opposite flank is provided with several for second through hole of discharging through the thermal current of cabin body.
Preferable, the utility model provides a kind of tin stove thermal compensation device, and wherein, this tin stove thermal compensation device and attemperating unit electrically connect.
Preferable, the utility model provides a kind of tin stove thermal compensation device, and wherein, this oblique cabin body also includes the inclined-plane.
Preferable, the utility model provides a kind of tin stove thermal compensation device, and wherein, this oblique cabin body also comprises the transfer chamber body, and a side of this transfer chamber body communicates with this oblique cabin body, and another opposite side is provided with the side of second through hole for this oblique cabin body.
Compared to prior art, the utility model provides a kind of tin stove thermal compensation device, in the scolding tin process, do not need the mobile printing circuit board to carry out heat compensation to this printed circuit board (PCB), not only reduced energy resource consumption effectively, and reduced because the mobile printing circuit board makes its pre-heat effect and had a greatly reduced quality, erosion copper excessively, Copper Foil come off etc. scrap risk.
Description of drawings
Fig. 1 is schematic diagram of the present utility model
The specific embodiment
Please refer to shown in Figure 1ly, be schematic diagram of the present utility model.The utility model provides a kind of tin stove thermal compensation device 10, in the scolding tin process, do not need the mobile printing circuit board to carry out heat compensation to this printed circuit board (PCB), not only reduced energy resource consumption effectively, and reduced because the mobile printing circuit board makes its pre-heat effect and had a greatly reduced quality, erosion copper excessively, Copper Foil come off etc. scrap risk.
Wherein, this tin stove thermal compensation device 10 mainly comprises cabin body 101, oblique cabin body 102 and pipeline 104.
Again, these cabin body 101 1 sides 1011 are provided with several heating tubes 1012, described heating tube 1,012 one ends are connected with this cabin body 101, another compressed gas source (not shown) terminal and through heating is connected, in order to provide thermal current to this cabin body 101, these cabin body 101 another opposite flanks 1013 are provided with several first through holes 10131.
Moreover, described oblique cabin body 102 connects with this cabin body 101 and establishes, to form the space of discharging for through the thermal current of cabin body 101, one side of this oblique cabin body 102 is the side 1013 that this cabin body 101 is provided with first through hole 10131, and its another opposite flank 1031 is provided with several for second through hole 10311 of discharging through the thermal current of cabin body 101.Wherein, this oblique cabin body 102 also includes inclined-plane 1021, these inclined-plane 1021 auxiliary heat air-flows move to the direction of pipeline 104 more smoothly, speed the heat speed of service, this oblique cabin body 102 also comprises transfer chamber body 103, one side of this transfer chamber body 103 communicates with this oblique cabin body 102, and another opposite side is provided with the side 1031 of second through hole 10311 for this oblique cabin body 102.
Described pipeline 104 is enclosed to form a ring of encirclement, this is in the pipeline 104 of the ring of encirclement and is provided with the molten tin bath (not shown), this molten tin bath is used in the scolding tin process printed circuit board (PCB) to be carried out the tin wave soldering and connects, and these pipeline 104 clear widths are provided with the pore 1041 of several heat supply air-flows discharges so that printed circuit board (PCB) is heated, be hollow in this pipeline 104, the heat supply air-flow is discharged heat in interior motion and from pore 1041, thereby the printed circuit board (PCB) that is positioned over the molten tin bath top is heated.
Moreover this tin stove thermal compensation device 10 electrically connects with the attemperating unit (not shown), and this attemperating unit can use the temperature control device of routine, utilizes this attemperating unit to control the heat of these tin stove thermal compensation device 10 printed circuit board (PCB)s that are sent to.In circuit control, used the baroswitch interlock, cause the too high or damage heater of printed circuit plate temperature when avoiding air pressure not enough, linked switch can be chosen in and continue to carry out thermal compensation in the welding process simultaneously, or stop thermal compensation in welding process, compressed air can select nitrogen as source of the gas, is not described in detail in this.
The tin stove thermal compensation device 10 that assembles is positioned over the carrier top, make molten tin bath be positioned at the center that its pipeline that is the ring of encirclement 104 is the ring of encirclement, and the printed circuit board (PCB) that will treat scolding tin is positioned over this molten tin bath top, weld, simultaneously, open attemperating unit, make this tin stove thermal compensation device 10 work, with the thermal current after the heating in turn through heating tube 1012, cabin body 101, tiltedly behind cabin body 102 and the pipeline 104, be expelled to this printed circuit board (PCB) from pore 1041, thereby reach the purpose of the temperature of the printed circuit board (PCB) in the control welding process.
In above-described embodiment, also can omit oblique cabin body 102, directly cabin body 101 is communicated with pipeline 104, the neck thermal current is directly on first through hole 10131 that cabin body 101 and pipeline 104 are provided with and pore 1041 are expelled to printed circuit board (PCB) in the ring of encirclement that is positioned over pipeline 104, so, also can reach the purpose of the temperature of the printed circuit board (PCB) in the control welding process.
Claims (5)
1. tin stove thermal compensation device is characterized in that this device mainly comprises:
The cabin body, this cabin body one side is provided with several in order to the heating tube of thermal current to this cabin body to be provided, described heating tube one end is connected with this cabin body, and another compressed gas source terminal and through heating is connected, and this another opposite flank of cabin body is provided with first through hole that several heat supply air-flows are discharged; And
Pipeline, the side that these pipeline two ends are provided with first through hole with this cabin body respectively connects establishes, this pipeline is enclosed to form a ring of encirclement, this is and is provided with in the pipeline of the ring of encirclement in order to printed circuit board (PCB) is carried out the molten tin bath that the tin wave soldering connects, and discharges pore so that printed circuit board (PCB) is heated for hollow and its clear width are provided with several heat supply air-flows in this pipeline.
2. tin stove thermal compensation device according to claim 1, it is characterized in that, this tin stove thermal compensation device also includes the oblique cabin body of discharging for through the thermal current of cabin body, this body one side, oblique cabin is the side that this cabin body is provided with first through hole, and its another opposite flank is provided with several for second through hole of discharging through the thermal current of cabin body.
3. tin stove thermal compensation device according to claim 1 is characterized in that, this tin stove thermal compensation device and attemperating unit electrically connect.
4. tin stove thermal compensation device according to claim 2 is characterized in that, this oblique cabin body also includes the inclined-plane.
5. tin stove thermal compensation device according to claim 2 is characterized in that, this oblique cabin body also comprises the transfer chamber body, and a side of this transfer chamber body communicates with this oblique cabin body, and another opposite side is provided with the side of second through hole for this oblique cabin body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320143215 CN203156193U (en) | 2013-03-26 | 2013-03-26 | Solder machine heat compensating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320143215 CN203156193U (en) | 2013-03-26 | 2013-03-26 | Solder machine heat compensating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203156193U true CN203156193U (en) | 2013-08-28 |
Family
ID=49017417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320143215 Expired - Fee Related CN203156193U (en) | 2013-03-26 | 2013-03-26 | Solder machine heat compensating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203156193U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104801809A (en) * | 2014-01-29 | 2015-07-29 | 气体产品与化学公司 | Device and method for providing inert gas during welding |
-
2013
- 2013-03-26 CN CN 201320143215 patent/CN203156193U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104801809A (en) * | 2014-01-29 | 2015-07-29 | 气体产品与化学公司 | Device and method for providing inert gas during welding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130828 Termination date: 20150326 |
|
| EXPY | Termination of patent right or utility model |