CN202106665U - Device for solidifying printing ink of flexible circuit board - Google Patents

Device for solidifying printing ink of flexible circuit board Download PDF

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Publication number
CN202106665U
CN202106665U CN2011201867256U CN201120186725U CN202106665U CN 202106665 U CN202106665 U CN 202106665U CN 2011201867256 U CN2011201867256 U CN 2011201867256U CN 201120186725 U CN201120186725 U CN 201120186725U CN 202106665 U CN202106665 U CN 202106665U
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CN
China
Prior art keywords
flex circuit
unit
circuit application
module
ink solidification
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Expired - Lifetime
Application number
CN2011201867256U
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Chinese (zh)
Inventor
牛建军
胡军
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ZHUHAI ZIXIANG ELECTRONIC TECHNOLOGY Co Ltd
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ZHUHAI ZIXIANG ELECTRONIC TECHNOLOGY Co Ltd
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Priority to CN2011201867256U priority Critical patent/CN202106665U/en
Application granted granted Critical
Publication of CN202106665U publication Critical patent/CN202106665U/en
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Abstract

The utility model relates to a device for solidifying printing ink of a flexible circuit board, which comprises a roll-in device, a drying device and a roll-out device, wherein the drying device comprises a transmitting unit. The width of the transmitting unit is over twice that of the flexible circuit board which needs to perform printing ink solidifying. The flexible circuit board enters the transmitting unit of the drying device through the roll-in device. The printing ink solidifying is performed to the flexible circuit board during the transmitting process of the transmitting unit, and the flexible circuit board is rolled out through the roll-out device. In addition, the method utilizing the device for solidifying the printing ink of the flexible circuit board is provided. The device for solidifying the printing ink of the flexible circuit board can perform roll-to-roll continuous solidifying to the flexible circuit board, improves production efficiency, can prevent the flexible circuit board from adsorbing foreign matters and generating creases in the process of printing ink solidifying, and improves quality of the flexible circuit board.

Description

A kind of device that is used for the flex circuit application ink solidification
Technical field
The utility model relates to a kind of device that is used for the flex circuit application ink solidification.
Background technology
At present, often through printing photosensitive solder resist printing ink on flex circuit application, the precision of welding property and welding spot size with the resistance that guarantees flex circuit application! And resistance solder paste ink print process mainly comprises following 5 steps, is respectively ink printing, printing ink preparation drying, printing ink exposure, printing ink phenomenon, ink solidification.And hinder the curing of solder paste China ink at present, and to carry out through baking oven often, each time of solidifying is about 2 hours, can only handle individual goods at every turn, and production efficiency is low; And when printed flex circuit application is ultra-thin product when (thickness is about 150 μ m), its take and the arrangement process in as easy as rolling off a log generation folding line, thereby reduce the quality of flex circuit application; In addition; Flex circuit application is being placed before baking oven carries out ink solidification; Need treat to add all-glass paper between the flex circuit application of ink solidification, and all-glass paper adheres to foreign matter easily, under the baking oven hot conditions; The foreign matter that adheres on the all-glass paper shifts easily and is adsorbed on the flex circuit application, thereby causes the flex circuit application quality low.
The utility model content
In order to overcome the above-mentioned deficiency of prior art; The utility model provides a kind of device that is used for the flex circuit application ink solidification; This device can carry out continuous ink solidification to flex circuit application; Improved production efficiency, can also prevent that flex circuit application from adsorbing foreign matter and folding line occurring in the ink solidification process, improved the quality of flex circuit application.In addition, the utility model also provides a kind of and utilizes the above-mentioned device that is used for the flex circuit application ink solidification to carry out the method for ink solidification.
The utility model is achieved in that a kind of device that is used for the flex circuit application ink solidification, comprising: be involved in device, drying unit with roll out device; Said drying unit comprises delivery unit and heating unit; Said heating unit is used for the ink solidification of flex circuit application; Be that said heating unit surrounding space to said delivery unit under the control of said control module heats, thereby realize the ink solidification of flex circuit application; Said delivery unit is used to transmit flex circuit application, and the width of said delivery unit is more than 2 times of flex circuit application width that need carry out ink solidification; Flex circuit application enters into the delivery unit of drying unit through being involved in device, and in being transmitted the process that transmits the unit, realizes ink solidification, and then rolls out through rolling out device.
Through said apparatus, can carry out the continuous ink solidification of volume to volume to flex circuit application, improved production efficiency, can also prevent that flex circuit application from adsorbing foreign matter and folding line occurring in the ink solidification process, improved the quality of flex circuit application.
Said delivery unit comprises conveyer belt, and said conveyer belt is the network chain shape, is processed by metal material.Like this, in transport process, it is more even to be heated for flex circuit application (no matter being single face or two-sided), fully, has further improved the speed and the quality of ink solidification.
In order further to realize the automatic control in the flex circuit application ink solidification process, said drying unit adopts reflow soldering apparatus, also comprises:
Control module is used to control the duty of drying unit;
Driver element, said driver element drive delivery unit and transmit under the control of said control module;
Said heating unit adopts at least a in Infrared Heating mechanism, Far-infrared Heating mechanism and the hot body.
Said Infrared Heating mechanism realizes heating function through the emission infrared ray, thereby is used for the ink solidification of flex circuit application.Said Far-infrared Heating mechanism is through emitting far-infrared realization heating function, thereby is used for the ink solidification of flex circuit application.Said hot body blows to described delivery unit with hot blast then through air is heated, thereby realizes the ink solidification of flex circuit application.
Preferably, said heating unit adopts Infrared Heating mechanism and hot body; Said Infrared Heating mechanism comprises the first Infrared Heating module and the second Infrared Heating module; The said first Infrared Heating module and the second Infrared Heating module include a plurality of infrared heaters, and the said first Infrared Heating module and the second Infrared Heating module are located at the both sides up and down of said delivery unit relatively; Be equipped with infrared blocking unit between the said first Infrared Heating module and the second Infrared Heating module and the delivery unit; Said infrared blocking unit is provided with a plurality of through holes; Can prevent that so the complete direct irradiation of infrared ray from flex circuit application, causing hot-spot, burn out flex circuit application; Said hot body comprises heating module, flow-guiding channel, air-supply module and exhausting module, and heating module is used to add hot-air, forms hot blast; Said exhausting module is located at the top of drying unit; Said air-supply module is sent the hot blast that said heating module forms into flow-guiding channel, by flow-guiding channel the hot blast water conservancy diversion is passed through said through hole then, thereby blows to said delivery unit, and last hot blast is extracted out by said exhausting module.Through said apparatus, heating unit can make the temperature in delivery unit space on every side remain on certain scope, and the temperature homogeneous, has guaranteed the quality of flex circuit application.
Preferably, said heating module adopts at least a in warm braw sheet or the heating wire.
The utility model also provides and has utilized the above-mentioned device that any is used for the flex circuit application ink solidification to carry out the method for ink solidification, may further comprise the steps:
A. at least 2 volumes are treated the parallel delivery unit of sending into drying unit of flex circuit application of ink solidification through being involved in device;
B. the delivery unit of the drying unit flex circuit application of treating ink solidification transmits, and the heating unit of drying unit carries out ink solidification to flex circuit application simultaneously;
C. rolling out device will accomplish the flex circuit application of ink solidification and roll out.
Through above-mentioned steps, realize the continuous ink solidification of flex circuit application volume to volume, and can carry out ink solidification to 2 volume flex circuit applications at least simultaneously, when enhancing productivity, also improved the quality of flex circuit application.
The hot blast that said hot body blows out is extremely relevant with the quality of flex circuit application and production efficiency, and temperature is too high, can burn out flex circuit application; Temperature is low excessively, can make the speed of flex circuit application ink solidification reduce; When therefore said printing ink was the UV photosensitive-ink, the hot blast temperature that said hot body blows out was between 190 to 230 ℃.
In addition, the transfer rate of said delivery unit is same extremely relevant with the quality and the production efficiency of flex circuit application, and therefore, the transfer rate of said delivery unit is good between 0.7 meter/minute to 1 meter/minute.
Compared with prior art; The utility model utilizes the alternative baking oven of drying unit to carry out ink solidification; Be involved in device and roll out device through setting simultaneously, realized that the volume to volume of flex circuit application is solidified continuously, improved production efficiency; Can also prevent that flex circuit application from adsorbing foreign matter and producing folding line in the ink solidification process, improved the quality of flex circuit application.
Description of drawings
Fig. 1 is the building-block of logic of the utility model.
Fig. 2 is the structural representation of an embodiment of the device that is used for the flex circuit application ink solidification of the utility model.
The specific embodiment
Below in conjunction with specific embodiment and accompanying drawing the utility model is done further explain.
As depicted in figs. 1 and 2, a kind of device that is used for the flex circuit application ink solidification comprises: be involved in device 1, drying unit 2 with roll out device 3; Said drying unit comprises delivery unit 21 and heating unit 22; Said heating unit is used for the ink solidification of flex circuit application; Said delivery unit is used to transmit flex circuit application, and the width of said delivery unit is more than 2 times of flex circuit application width that need carry out ink solidification; Flex circuit application enters into the delivery unit of drying unit through being involved in device, and in being transmitted the process that transmits the unit, realizes ink solidification, and then rolls out through rolling out device.
Wherein, said delivery unit comprises conveyer belt, and said conveyer belt is the network chain shape, is processed by metal material.
Wherein, said drying unit also comprises:
Control module 23 is used to control the duty of drying unit;
Driver element 24, said driver element drive delivery unit and transmit under the control of said control module;
Said heating unit comprises at least a in Infrared Heating mechanism, Far-infrared Heating mechanism and the hot body.
Wherein, said heating unit comprises Infrared Heating mechanism 221 and hot body 222; Said Infrared Heating mechanism comprises the first Infrared Heating module 2211 and the second Infrared Heating module 2212; The said first Infrared Heating module and the second Infrared Heating module include a plurality of infrared heaters 220, and the said first Infrared Heating module and the second Infrared Heating module are located at the both sides up and down of said delivery unit relatively; Be provided with infrared blocking unit 25 between the said first Infrared Heating module and the second Infrared Heating module and the delivery unit, said infrared blocking unit is provided with a plurality of through holes 251; Said hot body 222 comprises heating module 2221, flow-guiding channel, air-supply module 2222 and exhausting module 2223, and heating module is used to add hot-air, forms hot blast; Said exhausting module is located at the top of drying unit; Said air-supply module is sent the hot blast that said heating module forms into flow-guiding channel, by flow-guiding channel the hot blast water conservancy diversion is passed through said through hole then, thereby blows to said delivery unit, and last hot blast is extracted out by said exhausting module.
Wherein, said heating module adopts at least a in warm braw sheet or the heating wire.
In addition, the utility model also provides and has utilized the above-mentioned device that any is used for the flex circuit application ink solidification to carry out the method for ink solidification, may further comprise the steps:
A. at least 2 volumes are treated the parallel delivery unit of sending into drying unit of flex circuit application of ink solidification through being involved in device;
B. the delivery unit of the drying unit flex circuit application of treating ink solidification transmits, and the heating unit of drying unit carries out ink solidification to flex circuit application simultaneously;
C. rolling out device will accomplish the flex circuit application of ink solidification and roll out.
Wherein, said printing ink is the UV photosensitive-ink, and the hot blast temperature that said hot body blows out is between 190 to 230 ℃.
Wherein, the transfer rate of said delivery unit is between 0.7 meter/minute to 1 meter/minute.
Above content is the further explain that combines concrete preferred implementation that the utility model is done, and can not assert that the practical implementation of the utility model is confined to these explanations.For the those of ordinary skill of technical field under the utility model, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be regarded as belonging to the protection domain of the utility model.

Claims (5)

1. a device that is used for the flex circuit application ink solidification is characterized in that, comprising: be involved in device, drying unit with roll out device; Said drying unit comprises delivery unit and heating unit; Said heating unit is used for the ink solidification of flex circuit application; Said delivery unit is used to transmit flex circuit application, and the width of said delivery unit is more than 2 times of flex circuit application width that need carry out ink solidification; Flex circuit application enters into the delivery unit of drying unit through being involved in device, and in being transmitted the process that transmits the unit, realizes ink solidification, and then rolls out through rolling out device.
2. the device that is used for the flex circuit application ink solidification as claimed in claim 1 is characterized in that said delivery unit comprises conveyer belt, and said conveyer belt is the network chain shape, is processed by metal material.
3. the device that is used for the flex circuit application ink solidification as claimed in claim 1 is characterized in that, said drying unit adopts reflow soldering apparatus, also comprises:
Control module is used to control the duty of drying unit;
Driver element, said driver element drive delivery unit and transmit under the control of said control module;
Said heating unit adopts at least a in Infrared Heating mechanism, Far-infrared Heating mechanism and the hot body.
4. like claim 2 or the 3 described devices that are used for the flex circuit application ink solidification, it is characterized in that said heating unit comprises Infrared Heating mechanism and hot body; Said Infrared Heating mechanism comprises the first Infrared Heating module and the second Infrared Heating module; The said first Infrared Heating module and the second Infrared Heating module include a plurality of infrared heaters, and the said first Infrared Heating module and the second Infrared Heating module are located at the both sides up and down of said delivery unit relatively; Be provided with infrared blocking unit between the said first Infrared Heating module and the second Infrared Heating module and the delivery unit, said infrared blocking unit is provided with through hole; Said hot body comprises heating module, flow-guiding channel, air-supply module and exhausting module, and heating module is used to add hot-air, forms hot blast; Said exhausting module is located at the top of drying unit; Said air-supply module is sent the hot blast that said heating module forms into flow-guiding channel, by flow-guiding channel the hot blast water conservancy diversion is passed through said through hole then, thereby blows to said delivery unit, and last hot blast is extracted out by said exhausting module.
5. the device that is used for the flex circuit application ink solidification as claimed in claim 4 is characterized in that, said heating module adopts at least a in warm braw sheet or the heating wire.
CN2011201867256U 2011-06-03 2011-06-03 Device for solidifying printing ink of flexible circuit board Expired - Lifetime CN202106665U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011201867256U CN202106665U (en) 2011-06-03 2011-06-03 Device for solidifying printing ink of flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011201867256U CN202106665U (en) 2011-06-03 2011-06-03 Device for solidifying printing ink of flexible circuit board

Publications (1)

Publication Number Publication Date
CN202106665U true CN202106665U (en) 2012-01-11

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102328504A (en) * 2011-06-03 2012-01-25 珠海紫翔电子科技有限公司 Device and method for solidifying ink on flexible circuit board
CN102806763A (en) * 2012-08-09 2012-12-05 江苏广发光电科技有限公司 Ink curing device
CN105034584A (en) * 2015-09-16 2015-11-11 湖州佳宁印刷有限公司 Letterpress printing machine equipped with drying mechanism
CN110740588A (en) * 2019-09-29 2020-01-31 武汉大学 FPC automatic solder mask production line and method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102328504A (en) * 2011-06-03 2012-01-25 珠海紫翔电子科技有限公司 Device and method for solidifying ink on flexible circuit board
CN102806763A (en) * 2012-08-09 2012-12-05 江苏广发光电科技有限公司 Ink curing device
CN102806763B (en) * 2012-08-09 2014-12-10 江苏广发光电科技有限公司 Ink curing device
CN105034584A (en) * 2015-09-16 2015-11-11 湖州佳宁印刷有限公司 Letterpress printing machine equipped with drying mechanism
CN105034584B (en) * 2015-09-16 2017-10-31 湖州佳宁印刷有限公司 It is equipped with the letterpress of drying mechanism
CN110740588A (en) * 2019-09-29 2020-01-31 武汉大学 FPC automatic solder mask production line and method
CN110740588B (en) * 2019-09-29 2021-01-15 武汉大学 FPC automatic solder mask production line and method

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C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20120111

Effective date of abandoning: 20130417

RGAV Abandon patent right to avoid regrant