JP2000208908A - Soldering method, printed wiring board, and mounting part suitable for them - Google Patents

Abstract

PROBLEM TO BE SOLVED: To positively increase a soldering rigidity for sufficient reliability when soldering with an automatic soldering machine, surely increasing the amount of solder sticking to the lead and land of a mounting part which requires match amount of sticking solder. SOLUTION: A through-hole 6, in which a lead 8 of a mounting part is inserted, is formed at a printed wiring board main body 3a, and a land 4 for soldering for connection, the lead 8 of mounting part inserted in the through-hole 6 is provided around the through-hole 6 on the rear surface side. A metal part 10a which is an auxiliary member for increasing the amount of sticking solder 2 to the lead 8 is provided by plural numbers, in the same land 4. Allocation of the metal parts 10a is automatically performed by a surface-mounting part attaching machine. A solder bridge takes place between the metal part 10a and the lead 8, so that the amount of solder 2 sticking to the lead 8 is increased.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering method and a printed wiring board for mounting components, such as electronic components, by soldering to a printed wiring board used in electronic equipment and the like, and a mounted component suitable for the method.

[0002]

2. Description of the Related Art FIG. 10 shows a lead 8 of a mounted component such as an electronic component and a printed wiring board 3 by a conventional soldering technique.
FIG. 4 is a cross-sectional view showing a state in which a land 4 on the back surface side of FIG.

A lead 8 of a mounted component is inserted into a through hole 6 formed in a main body 3a of the printed wiring board 3 in an insertion component mounting step, and is mounted in a state protruding from the back surface side of the printed wiring board 3. Thereafter, the printed wiring board 3 is transferred to a soldering process by an automatic soldering machine, and the printed wiring board 3 is immersed in the molten solder, thereby forming the land 4 formed around the through hole 6 on the back surface side.
The solder 2 is adhered to the lead 8 and the lead 8 projecting to the back side. Since the solder resist 5 is provided on the printed wiring board 3 further on the outer peripheral side than the land 4, the solder 2 does not adhere to this portion.

As a result of the above soldering, the lead 8 and the land 4 are connected by the solder 2 as shown in FIG. Generally, the state of adhesion of the solder 2 is shown in FIG.
In the case of a substantially triangular cross-sectional shape as described above, the soldering state is good.

[0005]

However, the components to be soldered are relatively heavy, relatively large in size, such as a transformer or a large electrolytic capacitor, or a printed wiring board 3. If the linear expansion coefficient of the printed wiring board 3 is significantly different from that of the printed wiring board 3,
Alternatively, the crack generation rate at the solder joint increases due to stress generated from a thermal cycle due to an environmental temperature change in an environment in which the printed wiring board 3 is used or a temperature change accompanying turning on / off of a power supply.

For this reason, in the above-described mounted components, the amount of the applied solder is not sufficient even if the solder 2 is attached in a sectional shape as shown in FIG.

Therefore, conventionally, at a place where a mounted component such as a heavy component, a component having a large size, or a component having a significantly different linear expansion coefficient from that of the printed wiring board 3 is soldered, an automatic soldering machine is used. After the connection, it is necessary to perform an operation of manually increasing the amount of the solder 2, and there is a problem that the number of steps is increased. In addition, depending on such work, there is a possibility that a secondary defect such as a solder bridge or the like due to work leakage or dripping of the solder 2 may occur, and sufficient reliability for soldering cannot be obtained. There was a problem.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and requires a large amount of solder to be applied while soldering by an automatic soldering machine or the like while reducing man-hours. It is a first object of the present invention to provide a soldering method capable of ensuring sufficient reliability by increasing the amount of solder adhering to leads and lands of a mounted component and increasing soldering strength. It is a second object to provide a printed wiring board soldered by the method. Further, a third object is to provide a mounting component suitable for the method.

[0009]

According to a first aspect of the present invention, a lead of a mounted component inserted into a through hole formed in a printed wiring board body is formed around the through hole. A soldering method for soldering to one land, wherein an arranging step of arranging a predetermined auxiliary member at a position near the through hole in the land, and inserting the lead into the through hole. A mounting step of mounting the mounted component on the printed wiring board main body; and a solder for soldering the auxiliary member, the lead, and the land all together to form a solder bridge between the auxiliary member and the lead. Attaching step.

According to a second aspect of the present invention, in the soldering method according to the first aspect, the auxiliary member has a bonding surface that is bonded to the land and a suction surface that can be suction-held by a surface mounting component mounting machine. It is a metal component formed at the height position, and the arranging step is a surface mounting component mounting step by the surface mounting component mounting machine.

According to a third aspect of the present invention, in the soldering method according to the first aspect, an auxiliary through hole is formed in the printed wiring board main body near the through hole. An auxiliary lead provided at a peripheral position of the lead of the mounted component, wherein the arranging step inserts the auxiliary lead into the auxiliary through hole simultaneously with mounting of the mounted component in the mounting step. Features.

A printed wiring board according to a fourth aspect of the present invention is a printed wiring board body having a through hole formed in a land, a mounted component having a lead inserted through the through hole, and a printed circuit board having a lead in the land. An auxiliary member disposed at a nearby position, and a solder layer for electrically connecting the land and the lead and forming a solder bridge between the lead and the auxiliary member are provided.

According to a fifth aspect of the present invention, in the printed wiring board according to the fourth aspect, the auxiliary member is formed on a bonding surface to be bonded to the land and at a different height from the bonding surface. And a metal part separated from the mounting component.

According to a sixth aspect of the present invention, in the printed wiring board of the fourth aspect, the auxiliary member forms a part of the mounting component and is provided substantially parallel to the lead at a position near the lead. It is characterized in that it is an auxiliary lead.

According to a seventh aspect of the present invention, there is provided a mounting component to be mounted on a printed wiring board, wherein the main component has a main body function of the mounting component, and the main component is electrically connected to the main body. A lead protruding from the portion, and an auxiliary lead provided substantially parallel to the lead at a position near the lead.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Embodiment 1 of the present invention will be described with reference to FIGS. In each of the drawings, the same or corresponding members as those described above are denoted by the same reference numerals.

FIG. 1 is a sectional view of printed wiring board 3 in a state where leads 8 of a mounted component and printed wiring board main body 3a are soldered by a soldering method according to Embodiment 1 of the present invention. As shown in FIG. 1, a through hole 6 into which a lead 8 of a mounting component is inserted is formed in the printed wiring board main body 3a, and a mounting hole inserted into the through hole 6 is formed around the through hole 6 on the back surface side. One land 4 for solder connection of the lead 8 of the component is provided.

In the first embodiment, as an auxiliary member for increasing the amount of the solder 2 attached to the lead 8, a plurality of metal components 10a are provided in the same land 4 as the lead 8 at a predetermined distance from the lead 8. Are arranged.

FIG. 2 is a view showing an example of the metal part 10a. As shown in FIG. 2, the metal component 10a is a component formed by bending one plate-shaped base material, and has a flat portion that can be suction-held by a surface mount component mounting machine. It comprises a suction surface 11 to be configured, a bonding surface 12 for bonding to the land 4 of the printed wiring board 3, and a side surface 13 formed between the suction surface 11 and the bonding surface 12. Bent portion between suction surface 11 and side surface 13 and side surface 1
The bent portions of the joint 3 and the joint surface 12 each have a bending angle of approximately 90 degrees, and the suction surface 11 and the joint surface 12 are substantially parallel. Further, the suction surface 11 and the bonding surface 12 are
Are provided at different height positions determined by the height dimension of the head.

The plate-shaped base material used for the metal component 10a is made of a metal which can be soldered so as to be solderable to the entire surface of the component, or is plated with a metal which can be soldered. It is a thing. The term “metal part” in this specification includes not only the case where the whole is a metal (including both a single metal and an alloy), but also the case where only the surface portion is made of a metal. Is a term.

FIG. 3 is a conceptual perspective view showing an example of suction holding when the metal component 10a is arranged in the land 4 of the printed wiring board 3. As shown in FIG. 3, an adhesive 19 is applied to the joint surface 12 of the metal component 10a in order to temporarily fix the metal component 10a to the land 4 of the printed wiring board 3. Then, the suction surface 11 of the metal component 10 a is sucked and held by the suction holding nozzle 31 of the surface mount component mounting machine, and is arranged at a position around the through hole 6 in the land 4 of the printed wiring board 3. At this time, the metal component 10 a is temporarily fixed to the printed wiring board 3 by the adhesive 19 applied to the joint surface 12.

As described above, since the suction surface 11 of the metal component 10a can be suction-held by the suction holding nozzle 31 of the surface mounting component mounting machine, the metal component 10a can be mounted on the printed wiring board 3. This can be performed automatically in the surface mounting component mounting process in the surface mounting line.

Incidentally, such a metal component 10a has been used as a component for another use, for example, a jumper wire, a check terminal, or the like. In the first embodiment, such a metal component is used. Is effective because no new parts cost or the like is generated.

Then, the printed wiring board 3 in a state where the metal component 10a is arranged and mounted in the land 4 and the lead 8 of a mounted component such as an electronic component is inserted into the through hole 6 is immersed in the molten solder. The metal part 10a
A solder bridge is generated between the lead 2 and the lead 8, and the solder 2 is attached as shown in FIG.

That is, the solder 2 at least as high as the height of the side surface 13 of the metal component 10a adheres to the periphery of the lead 8 by the solder bridge, whereby the soldering strength of the lead 8 increases, The reliability of the attachment can be sufficiently ensured.

Since the space formed between the suction surface 11 and the joining surface 12 of the metal component 10a is an open space into which the solder 2 flows, the solder 2 is also provided on the inner side of the metal component 10a. They will adhere and contribute to the improvement of the soldering strength.

Next, a process of mounting the metal component 10a on the printed wiring board body 3a and soldering the mounted component to the lead 8 will be described. FIG.
FIG. 6 is a process chart when manufacturing the printed wiring board 3 in which the amount of the solder 2 attached to the lead 8 is increased by using a.

First, prior to each step, a through hole 6 into which a lead 8 of a mounting component is inserted as shown in FIG. 1 is formed, and a printed wiring board main body 3a having a land 4 formed around the through hole 6 is formed. As well as the metal component 10a and other mounting components.

Then, in the surface mounting component mounting step S1, the suction holding nozzle 31 of the surface mounting component mounting machine suctions and holds the suction surface 11 of the metal component 10a and is applied in advance to the land 4 of the printed wiring board main body 3a. Adhesive 19
It is automatically arranged and mounted so that the joint surface 12 rides upward. Note that other surface mount components are also mounted in this step.

Then, after the adhesive 19 is cured, the process proceeds to the insertion mounting component insertion step S2, where the mounting component having the lead 8 and other insertion components are automatically transferred to the printed wiring board main body 3a by the insertion mounting component insertion machine. Insert At this time, the lead 8 of the mounted component is inserted into the through hole 6 and projects downward from the land 4 on the back surface side of the printed wiring board main body 3a.

Next, proceeding to the soldering step S3, the printed wiring board main body 3a and its accompanying structure are immersed in the molten solder by an automatic soldering machine, so that the lands 4, the metal parts 10a and the leads 8 are connected. Perform soldering all at once. At this time, a solder bridge occurs between the metal component 10a and the lead 8, and a large amount of solder 2 adheres to the periphery of the lead 8.

As described above, the solder 2 adhering to the lead 8 of the mounted component can be obtained in a sufficient amount. As a result, the soldering strength of the lead 8 can be increased, and the crack generation rate at the solder joint portion due to vibration, shock, stress due to temperature change, etc. during transportation of the printed wiring board 3 thus obtained is reduced. It can be reduced, and the reliability of soldering is improved.

In the surface mounting component mounting step S1, the time for applying the adhesive 19 and the time required for mounting increase as the number of metal components 10a to be mounted increases, but all operations are performed at high speed. Since the operation is automatically performed by the surface mounting component mounting machine that performs the operation, the operation can be performed extremely efficiently as compared with the manual operation, and a great effect is achieved in reducing the number of steps. In addition, the amount of solder adhering to the leads 8 and the lands 4 of the mounted component is reliably increased without occurrence of work leakage or the like, and the reliability is sufficiently ensured.

In order to uniformly increase the amount of the solder 2 attached to the periphery of the lead 8, it is preferable to dispose a plurality of metal parts 10a at positions symmetrical with respect to the lead 8 in the land 4. The lead 8 and the metal component 10
The distance from “a” may be any distance that can appropriately generate a solder bridge.

As described above, in the first embodiment, in the surface mounting component mounting step S1, the metal component 10a, which is an auxiliary member for generating a solder bridge with respect to the lead 8, is formed in the land 4 of the printed wiring board 3. Is mounted automatically in the vicinity of the through hole 6 in the step S2, and the lead 8 is automatically or manually inserted into the through hole 6 in the insertion mounting component insertion step S2 to print the mounting component to which the amount of solder adhesion increases. It is inserted into the wiring board 3 and, in the soldering step S3, is realized by such a method that the metal component 10a, the lead 8 and the land 4 are collectively soldered.
Can be reliably increased, the soldering strength and the reliability of soldering can be improved, and the amount of solder 2 can be efficiently increased by reducing the number of steps.

The metal part 10a as an auxiliary member is
Since the bonding surface 12 to be bonded to the land 4 and the suction surface 11 that can be sucked and held by the surface mount component mounting machine are metal components formed at different height positions, around the lead 8,
The solder 2 adheres at least as much as the height of the metal component 10a due to the solder bridge, thereby increasing the soldering strength of the lead 8.

The shape applicable to the metal part in the first embodiment is not limited to the shape shown in FIG. 2, but may be another shape. For example, FIG.
FIG. 9 is a perspective view showing a metal component 10b which is another example as an auxiliary member. The metal component 10b shown in FIG. 5 has a structure in which the bonding surface 12 is bent outward unlike the above-described metal component 10a, but it goes without saying that the same effect as that obtained by the metal component 10a is produced. .

Embodiment 2 Next, a second embodiment of the present invention will be described with reference to FIGS. In each of the drawings, the same or corresponding members as those described above are denoted by the same reference numerals.

FIG. 6 is a sectional view of printed wiring board 3 in a state where leads 8 of a mounted component and printed wiring board main body 3a are soldered by the soldering method according to the second embodiment of the present invention. In the second embodiment, an auxiliary lead 9 for increasing the amount of adhesion is used as an auxiliary member for increasing the amount of adhesion of the solder 2 to the lead 8 of the mounting component to be solder-increased.

For this reason, the printed wiring board main body 3a is provided with a through hole 6 for inserting the lead 8 at the center of the land 4, and an auxiliary position is provided in the same land 4 and at a peripheral position of the through hole 6. An auxiliary through hole 7 for inserting a lead 9 is provided.

On the other hand, the auxiliary lead 9 is provided on the mounting component itself. FIGS. 7 to 9 are views showing examples of mounted components provided with the auxiliary leads 9, respectively. FIG. 7 shows a transformer 20a, and FIG. 8 shows a large electrolytic capacitor 20b.
FIG. 9 shows a radiation fin (radiator) 20c.
Is shown.

First, a transformer 20a shown in FIG. 7 includes a main body 21a that includes a magnetic core and a winding to perform the main function of the transformer 20a, and is electrically connected to the main body 21a to be lower than the main body 21a. And six leads 8 projecting from each other.
A book auxiliary lead 9 is provided. Each of the four auxiliary leads 9 is provided so as to project downward substantially in parallel with the lead 8 located at the center thereof.

The large electrolytic capacitor 20 shown in FIG.
Similarly, b includes a main body portion 21b that performs an electric main body function of the large electrolytic capacitor 20b, and two leads 8 that are electrically connected to the main body portion 21b and protrude downward from the main body portion 21b. In addition, two semi-cylindrical auxiliary leads 9 are provided near the periphery of each lead 8. Each 2
The auxiliary lead 9 of the book is provided so as to protrude downward substantially parallel to the lead 8 located at the center thereof.

Further, the radiation fin 20c shown in FIG.
It has a main body portion 21c which performs a main body function for dissipating heat of the radiation fins 20c, and two leads 8 protruding downward from the main body portion 21c. The lead 9 is branched and attached. Each of the two auxiliary leads 9 is provided so as to protrude downward substantially parallel to the lead 8 located at the center thereof.

As described above, since the mounted components (the transformer 20a, the large electrolytic capacitor 20b, etc.) themselves have the auxiliary leads 9, the auxiliary leads 9 are inserted into the auxiliary through holes 7 at the same time as the mounted components are automatically mounted. You can do it. In addition, each auxiliary lead 9 may be electrically connected to one lead 8 to be reinforced inside each main body.

Then, such mounted components are arranged and mounted on the printed wiring board main body 3a, and the printed wiring is in a state where the lead 8 is inserted into the through hole 6 and the auxiliary lead 9 is inserted into the auxiliary through hole 7. Board body 3a
Is immersed in the molten solder, a solder bridge is generated between the lead 8 and the auxiliary lead 9, and the solder 2 is attached as shown in FIG.

That is, the solder 2 is adhered to the periphery of the lead 8 by the solder bridge in an amount corresponding to at least the dimension of the auxiliary lead 9 projecting to the lower surface side of the printed wiring board 3. The soldering strength is increased, and the reliability of the soldering can be sufficiently ensured.

Next, a process of mounting such a mounted component on the printed wiring board main body 3a and performing soldering will be described with reference to FIG.

First, in the surface mount component mounting step S1, the surface mount component to be mounted is mounted on the printed wiring board main body 3a.

Then, the process proceeds to the insertion mounting component insertion step S2, in which the mounting component having the auxiliary lead 9 near the lead 8 and other insertion components are automatically or manually inserted by the insertion mounting component insertion machine. 3a. At this time, the lead 8 and the auxiliary lead 9 of the mounted component are inserted into the through hole 6 and the auxiliary through hole 7, respectively, and project below the land 4 on the back surface side of the printed wiring board main body 3a.

Next, proceeding to the soldering step S3, the printed wiring board 3 is immersed in the molten solder by an automatic soldering machine, so that the lands 4, the leads 8 and the auxiliary leads 9 are formed.
And soldering all together. At this time, a solder bridge occurs between the auxiliary lead 9 and the lead 8, and a large amount of solder 2 adheres to the periphery of the lead 8.

As described above, the solder 2 adhering to the lead 8 of the mounted component can be obtained in a sufficient amount. As a result, the soldering strength of the lead 8 can be increased, and the crack generation rate at the solder joint portion due to vibration, shock, stress due to temperature change, etc. during transportation of the printed wiring board 3 thus obtained is reduced. Thus, the soldering reliability can be improved.

In each of the above steps, there is no special step for increasing the amount of the solder 2 attached to the lead 8, and the work of manually increasing the amount of the solder 2 after being connected by soldering with a soldering machine. Since it is not necessary to perform the above, a great effect is achieved in reducing man-hours.

In the second embodiment, the auxiliary lead 9 is inserted and arranged in the same land 4 as the lead 8, and the adjacent leads in the same land 4 cause a solder bridge so that a large amount of solder 2 adheres. Is realized. Here, if the auxiliary leads 9 and the leads 8 are arranged in a line in the same land 4, the amount of the solder 2 can be increased only in the longitudinal direction, and the effect is reduced. For this reason, in the second embodiment, it is ideally desirable to dispose a plurality of auxiliary leads 9 on a concentric circle centered on the lead 8, thereby uniformly increasing the amount of solder attached in each direction. And the soldering strength and reliability can be made uniform in each direction.

As described above, in the second embodiment, in the insertion mounting component insertion step S2, the mounting component whose solder adhesion amount is to be increased is inserted into the printed wiring board 3, and the solder is connected to the lead 8. An auxiliary lead 9 serving as an auxiliary member for generating a bridge is automatically arranged at a position near the through hole 6 in the land 4 of the printed wiring board 3. Since the solder bridge is realized by a technique such as soldering, the amount of the solder 2 attached can be reliably increased by the solder bridge, and the soldering strength and the reliability of the soldering can be improved, and the number of steps can be reduced. Accordingly, it is possible to efficiently increase the amount of the solder 2 attached.

Since the auxiliary lead 9 as an auxiliary member is an auxiliary lead arranged and formed at a peripheral position of the lead 8 of the mounted component to which the amount of solder attached is to be increased, the solder 2 is applied to the lead 8 of the mounted component. No special process is required to increase the amount of adhesion, and the amount of adhesion of the solder 2 can be efficiently increased.

[0057]

As described above, in the soldering method according to the first aspect of the present invention, a predetermined auxiliary member is disposed at a position near a through hole in a land, and a lead is inserted into the through hole. The mounting parts are mounted on the main body of the printed wiring board, and the auxiliary member, the lead and the land are collectively soldered to form a solder bridge between the auxiliary member and the lead. Can be. Therefore, the soldering strength and the reliability of the soldering can be improved while reducing the number of steps.

According to a second aspect of the present invention, in the soldering method, the auxiliary member is a metal part having a bonding surface to be bonded to the land and a suction surface which can be suction-held by the surface mounting component mounting machine at different heights. In addition, since the automatic placement is performed in the surface mounting component mounting process by the surface mounting component mounting machine, it is not necessary to manually increase the amount of solder, so that the amount of solder to be attached can be efficiently increased by reducing the number of steps.

According to a third aspect of the present invention, in the soldering method, an auxiliary through hole is formed in the vicinity of the through hole in the printed wiring board main body, and the auxiliary member is provided at a peripheral position of the lead of the mounted component. Since it is a lead and the auxiliary lead is inserted into the auxiliary through hole at the same time as mounting of the mounted component, it is not necessary to manually increase the amount of solder, so it is possible to efficiently increase the amount of solder attached by reducing man-hours .

The printed wiring board according to the fourth aspect of the present invention electrically connects the lands and the leads, and has a solder layer for forming a solder bridge between the leads and the auxiliary member. High reliability of soldering.

According to a fifth aspect of the present invention, there is provided a printed wiring board including a joining surface where the auxiliary member is joined to the land, and a flat portion formed at a height different from the joining surface, and is separate from the mounting component. It is a printed wiring board that can be efficiently obtained with a small number of steps because it is a metal part.

In the printed wiring board according to the sixth aspect, since the auxiliary component forms a part of the mounted component and is an auxiliary lead provided substantially parallel to the lead near the lead, the auxiliary component is efficiently obtained with a small number of man-hours. Printed wiring board.

According to a seventh aspect of the present invention, there is provided a mounting part which is provided substantially in parallel with the lead at a position in the vicinity of the lead, a lead electrically connected to the main part and projecting from the main body. With auxiliary leads
Since a solder bridge can be generated between the auxiliary lead and the lead, it is possible to surely increase the amount of solder to be attached, and to improve the soldering strength and the reliability of the soldering.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a printed wiring board in a state where leads of mounted components and a printed wiring board main body are soldered by a soldering method according to Embodiment 1 of the present invention.

FIG. 2 is a diagram illustrating an example of a metal component.

FIG. 3 is a conceptual perspective view showing an example of suction holding when a metal component is arranged in a land of a printed wiring board.

FIG. 4 is a process chart for manufacturing a printed wiring board in which the amount of solder attached to the leads is increased using metal components.

FIG. 5 is a diagram showing an example of another metal component.

FIG. 6 is a cross-sectional view of a printed wiring board in a state where leads of mounted components and a printed wiring board main body are soldered by a soldering method according to a second embodiment of the present invention.

FIG. 7 is a diagram illustrating a transformer provided with auxiliary leads.

FIG. 8 is a diagram showing a large electrolytic capacitor provided with auxiliary leads.

FIG. 9 is a view showing a radiation fin provided with an auxiliary lead.

FIG. 10 is a cross-sectional view showing a state in which leads of mounted components such as electronic components and lands on the back side of a printed wiring board are connected by soldering by a conventional soldering method.

[Explanation of symbols]

2 solder, 3 printed wiring board, 3a printed wiring board main body, 4 land, 6 through hole, 7 auxiliary through hole, 8 lead, 9 auxiliary lead, 10a, 10
b Metal parts, 11 suction surface, 12 bonding surface, 31 suction holding nozzle, 20a transformer, 20b large electrolytic capacitor, 20c heat radiation fin, 21a to 21c main body.

Claims (7)

[Claims] 1. A soldering method for soldering a lead of a mounted component to be inserted into a through hole formed in a printed wiring board body to one land formed around the through hole, the method comprising: An arranging step of arranging an auxiliary member at a position near the through hole in the land; an attaching step of attaching the mounting component to the printed wiring board main body by inserting the lead into the through hole; A soldering step of batch-soldering the auxiliary member, the lead, and the land to form a solder bridge between the auxiliary member and the lead. 2. The soldering method according to claim 1, wherein the auxiliary member is formed at a different height position between a bonding surface to be bonded to the land and a suction surface that can be suction-held by a surface mount component mounting machine. A soldering method, wherein the placing step is a surface mounting component mounting step by the surface mounting component mounting machine. 3. The soldering method according to claim 1, wherein an auxiliary through hole is formed in the printed wiring board main body in the vicinity of the through hole, and the auxiliary member is provided with the lead of the mounting component. A soldering method, wherein the arranging step inserts the auxiliary lead into the auxiliary through-hole simultaneously with the mounting of the mounting component in the mounting step. . 4. A printed wiring board main body having a through hole formed in a land, a mounting component having a lead inserted through the through hole, an auxiliary member disposed at a position near the lead in the land, A printed wiring board, comprising: a solder layer that electrically connects the land and the lead and that forms a solder bridge between the lead and the auxiliary member. 5. The printed wiring board according to claim 4, wherein the auxiliary member includes a joining surface joined to the land and a flat portion formed at a height different from the joining surface. And a printed wiring board, which is a metal component separated from the mounted component. 6. The printed wiring board according to claim 4, wherein the auxiliary member is an auxiliary lead that forms a part of the mounting component and is provided substantially parallel to the lead at a position near the lead. A printed wiring board characterized by the above. 7. A mounting component to be mounted on a printed wiring board, the main component having a main function of the mounting component, and a lead electrically connected to the main component and protruding from the main component. And an auxiliary lead provided substantially parallel to the lead at a position near the lead.