CN105957950A - 一种led焊线方法 - Google Patents

一种led焊线方法 Download PDF

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CN105957950A
CN105957950A CN201610501242.8A CN201610501242A CN105957950A CN 105957950 A CN105957950 A CN 105957950A CN 201610501242 A CN201610501242 A CN 201610501242A CN 105957950 A CN105957950 A CN 105957950A
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wire bonding
terminal pad
led
welding line
assembly welding
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CN105957950B (zh
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钟云
陈华斌
易瑞吕
王跃飞
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Guangzhou Hongli Tronic Co Ltd
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Guangzhou Hongli Tronic Co Ltd
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Abstract

一种LED焊线方法，包括分组焊线方法，所述分组焊线方法包括以下步骤：（1）在焊线机中设置正极焊盘的焊线方式为第一组焊线方式，设置负极焊盘的焊线方式为第二组焊线方式；（2）焊线机完成第一组焊线方式或第二组焊线方式后再采用另一组焊线方式进行焊线，从而完成整个焊线过程。由于目前SMD产品多样化，根据芯片的大小选择，产品尺寸选择，本发明针对SMD产品搭配芯片时当焊盘不够位置时候，需使用分组焊线方式作业，通过分组参数设定与同组参数设定比对，分组设定状况下更容易保持倾角的稳定性，同时对焊线效率无影响，固采用分组焊线品质可靠可靠性更全面，产品性能进一步提升。

Description

一种LED焊线方法
技术领域
本发明涉及LED封装技术领域，尤其是一种LED焊线方法。
背景技术
随着LED封装产品性能要求越来越苛刻，目前LED封装大多是还处于是传统封装如采用键合线焊线方式。经自动焊线机作业使芯片正负极完成焊线为LED工作提供导通电源。LED元器件焊线是LED封装的重点核心部分，对LED内部结构线弧具有相当高要求。现有LED焊线一般采用正负极同组线弧焊线，目前芯片尺寸的多样化使得贴片式LED光源中采用不同尺寸的芯片，但是由于某些LED芯片正极焊盘与基板正极焊盘的距离跟LED芯片负极焊盘与基板负极焊盘之间的距离不同，若正极焊盘焊线参数与负极焊盘焊线参数设置成一样，容易引起线弧漂移，后倾不良导致LED光源冷热冲击时易存在断线失效，可靠性明显下降。
发明内容
本发明所要解决的技术问题是提供一种LED焊线方法，解决现有技术出现的线弧漂移问题，提升产品的可靠性。
为解决上述技术问题，本发明的技术方案是：一种LED焊线方法，包括同组焊线方法或分组焊线方法，其特征在于，所述分组焊线方法包括以下步骤：
（1）在焊线机中设置正极焊盘的焊线方式为第一组焊线方式，设置负极焊盘的焊线方式为第二组焊线方式；
（2）焊线机完成第一组焊线方式或第二组焊线方式后再采用另一组焊线方式进行焊线，从而完成整个焊线过程。
由于目前芯片尺寸的多样化使得贴片式LED光源中采用不同尺寸的芯片，本发明针对贴片式LED产品搭配芯片时当焊盘不够位置时候，需使用分组焊线方式作业，通过分组参数设定与同组参数设定比对，分组设定状况下更容易保持倾角的稳定性，同时对焊线效率无影响，从而采用分组焊线品质可靠可靠性更全面，产品性能进一步提升。
作为改进，焊线前启动识别程序识别LED芯片正、负极焊盘以及基板上正、负极焊盘位置，并计算LED芯片正极焊盘与基板正极焊盘之间的距离D1，以及LED芯片负极焊盘与基板负极焊盘之间的距离D2，若D1小于D2/2或D2小于D1/2时，则启动分组焊线方法，在比较焊盘位置并在正负极焊盘之间距离确定启动分组焊线方法，能有效地提高焊线品质的可靠性。
作为改进，还包括同组焊线方式，若D1不小于D2/2或D1不小于D1/2时，则启动同组焊线方式，通过在比对芯片正负极焊盘与基板上正负极焊盘之间的间距确定采用分组焊线方式还是同组焊线方式，能有效地减少焊线时间。
作为改进，所述识别程序包括步骤：（1）从上往下对固晶好的LED进行拍照；（2）对照片上的LED芯片的正负极和基板上的正、负极进行识别；（3）照片由计算机分析，计算出LED芯片正极焊盘与基板正极焊盘之间的距离D1，以及LED芯片负极焊盘与基板负极焊盘之间的距离D2。
作为改进，所述同组焊线方法中，正极焊盘和负极焊盘的焊接方式为同组焊线方式。
本发明与现有技术相比所带来的有益效果是：
通过分组参数设定与同组参数设定比对，分组设定状况下更容易保持倾角的稳定性，同时对焊线效率无影响，固采用分组焊线品质可靠可靠性更全面，产品性能进一步提升。
附图说明
图1为LED俯视图。
图2为本发明焊线流程图。
图3为利用分组焊线方式的负极线弧形状。
图4为利用同组焊线方式的负极线弧形状。
具体实施方式
下面结合说明书附图对本发明作进一步说明。
实施例1
一种LED焊线方法，包括同组焊线方法或分组焊线方法。所述同组焊线方法中，正极焊盘和负极焊盘的焊接参为同种焊线方式。所述分组焊线方法包括以下步骤：
如图1所示，首先启动识别程序识别LED芯片1正、负极焊盘11、12以及基板上正、负极焊盘2、3位置，并计算LED芯片1正极焊盘11与基板正极焊盘2之间的距离D1，以及LED芯片1负极焊盘12与基板负极焊盘3之间的距离D2，若D1小于D2/2或D2小于D1/2，则启动分组焊线方法，若D1不小于D2/2或D2不小于D1/2，采用同组焊线方法。如图2所示，分组焊线方法包括以下步骤：
（1）在焊线机中设置正极焊盘的焊线方式为第一组焊线方式，设置负极焊盘的焊线方式第二组焊线方式；其中焊线方式主要包括：焊线的线弧形状（如QA线弧）、正极2焊盘或负极3焊盘的位置等。
（2）焊线机完成第一组焊线方式或第二组焊线方式后再采用另一组焊线方式进行焊线，从而完成整个焊线过程。
本实施例需要采用将芯片正负极焊线采用分组的方式实现，仍然是同一套程序完成。
所述识别程序包括步骤：（1）从上往下对固晶后的LED进行拍照；（2）对照片上的LED芯片1的正负极焊盘和基板上的正、负极焊盘进行识别；（3）照片由计算机分析，计算出LED芯片1正极焊盘与基板正极焊盘之间的距离D1，以及LED芯片1负极焊盘与基板负极焊盘之间的距离D2。
实施例2
与实施例1所不同的是采用两套程序实现分组焊线方法：如图2所示，首先设置正极焊盘的焊线参数为第一组焊线方式，然后设置负极焊盘的焊线参数为第二组焊线方式，然后完成第一组焊线方式或第二组焊线方式后再采用另一组焊线方式进行焊线，从而完成整个焊线过程，无需比对正极焊盘和负极焊盘的位置即可实现焊线过程。
综上实施例1和2，分别采用同组焊线和分组焊线得到的实验结果：
上述表格中，
正极（1焊）：芯片正极焊盘位置，正极（2焊）：基板上正极焊盘位置；负极（1焊）：芯片负极焊盘位置，负极（2焊）：基板上负极焊盘位置；
距离（D1）：正极（1焊）与正极（2焊）之间的差值；
距离（D2）：负极（1焊）与负极（2焊）之间的差值；
落差值：距离（D1）与距离（D2）之间差值的绝对值，落差值用来反映正负极两边的间距是否存在较大差异。
实验证明，如图4所示，采用同组焊线方式下，当一边短线位置时，会存在线弧度不稳定后倾或者前倾现象；如图3所示，而采用分组焊线方式则线弧正常，所以需要根据芯片的长短及焊盘窄宽不同，焊线位置长短需识别后选择分组焊线。

Claims (5)

1.一种LED焊线方法，包括分组焊线方法，其特征在于，所述分组焊线方法包括以下步骤：
（1）在焊线机中设置正极焊盘的焊线方式为第一组焊线方式，设置负极焊盘的焊线方式为第二组焊线方式；
（2）焊线机完成第一组焊线方式或第二组焊线方式后再采用另一组焊线方式进行焊线，从而完成整个焊线过程。
2.根据权利要求1所述的一种LED焊线方法，其特征在于：焊线前启动识别程序识别LED芯片正、负极焊盘以及基板上正、负极焊盘位置，并计算LED芯片正极焊盘与基板正极焊盘之间的距离D1，以及LED芯片负极焊盘与基板负极焊盘之间的距离D2，若D1小于D2/2或D2小于D1/2，则启动分组焊线方法。
3.根据权利要求2所述的一种LED焊线方法，其特征在于：还包括同组焊线方式，若D1不小于D2/2或D1不小于D1/2时，则启动同组焊线方式。
4.根据权利要求2所述的一种LED焊线方法，其特征在于：所述识别程序包括步骤：
（1）从上往下对固晶后的LED进行拍照；
（2）对照片上的LED芯片正极焊盘、负极焊盘和基板上的正、负极焊盘进行识别；
（3）照片由计算机分析，计算出LED芯片正极焊盘与基板正极焊盘之间的距离D1，以及LED芯片负极焊盘与基板负极焊盘之间的距离D2。
5.根据权利要求3所述的一种LED焊线方法，其特征在于：所述同组焊线方法中，正极焊盘和负极焊盘的焊接方式为同组焊线方式。
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