CN105957800B - A kind of process of surface treatment of substrate - Google Patents
A kind of process of surface treatment of substrate Download PDFInfo
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- CN105957800B CN105957800B CN201610301332.2A CN201610301332A CN105957800B CN 105957800 B CN105957800 B CN 105957800B CN 201610301332 A CN201610301332 A CN 201610301332A CN 105957800 B CN105957800 B CN 105957800B
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- substrate
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- surface treatment
- adhesive force
- liquid
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- 239000000758 substrate Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000004381 surface treatment Methods 0.000 title claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 19
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000011521 glass Substances 0.000 claims abstract description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000008367 deionised water Substances 0.000 claims abstract description 12
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000004140 cleaning Methods 0.000 claims abstract description 11
- 239000003960 organic solvent Substances 0.000 claims abstract description 9
- 239000003599 detergent Substances 0.000 claims abstract description 7
- 238000002360 preparation method Methods 0.000 claims abstract description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 30
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 20
- 241000195493 Cryptophyta Species 0.000 claims description 10
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 10
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims description 10
- 239000004927 clay Substances 0.000 claims description 10
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims description 10
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 10
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 4
- 235000019441 ethanol Nutrition 0.000 claims description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000004575 stone Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
- 239000000356 contaminant Substances 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 238000001035 drying Methods 0.000 abstract description 2
- 238000007654 immersion Methods 0.000 abstract description 2
- 238000002604 ultrasonography Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000007888 film coating Substances 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 125000005909 ethyl alcohol group Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0075—Cleaning of glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/31—Pre-treatment
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Geochemistry & Mineralogy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Detergent Compositions (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The present invention relates to a kind of process of surface treatment of substrate, and substrate is immersed in glass detergent, are cleaned with deionized water after cleaning；It immerses adhesive force to promote in liquid, supersound process is then taken out to be added after acetone supersound process is taken out and be rinsed using deionized water, then dries up substrate using nitrogen；It is immersed in organic solvent, is kept in dark place.The present invention using cleaning, ultrasound, rinsing, drying, immersion treatment process baseplate material, the slow reaction of organic solvent and substrate surface can be utilized to remove surface and oil contaminant residual to greatest extent, and improve substrate surface wellability, the adhesive force and uniformity of the follow-up plated film of substrate can be enhanced, this method is easy to operate, without other processing equipments, can prepare in air at room temperature, it is mutually compatible to commercially produce preparation process with large area.
Description
Technical field
The present invention relates to field of surface treatment, and in particular to a kind of improvement substrate surface wellability, enhancing substrate film coating are attached
Put forth effort and the process of surface treatment of the substrate of uniformity.
Background technology
In recent years, baseplate material is widely used in electronic product, the fields such as semiconductor devices.
Generally for manufacture solar cell, semiconductor devices and flat-panel display device, need to be formed on the surface of the substrate
Scheduled film layer, thin film circuit pattern or optics group.Hidden thorn needs to carry out semiconductor fabrication process, for example, sinking on substrate
The thin film deposition processes of the film of product predetermined material, carry out film using light-sensitive material the optical technology of the exposure of selectivity,
And the etch process of pattern is formed by the exposed portion of the film of going out of selectivity.
Baseplate material needs to remove surface and oil contaminant using ultrasonic cleaning mode before use.Being cleaned by ultrasonic has following ask
Topic：Short time ultrasonic cleaning can not remove all greasy dirts of substrate, improve unobvious to substrate surface wellability, if ultrasonic metacoxal plate
The secondary pollution it will cause substrate is not used at once, therefore, the cleaning performance of substrate is affected and limits.
Invention content
Unobvious, attached are improved to substrate surface wellability after being cleaned by ultrasonic the purpose of the present invention is to solve existing substrate
It the defect of force difference and a kind of table for the substrate improving substrate surface wellability, enhancing substrate film coating adhesive force and uniformity is provided
Surface treatment technique.
To achieve the goals above, the present invention uses following technical scheme：
A kind of process of surface treatment of substrate, includes the following steps：
A) it cleans：Substrate is immersed in glass detergent, is cleaned with deionized water after cleaning；
B) it is ultrasonically treated：The substrate that step a) is obtained immerses adhesive force and promotes in liquid, is ultrasonically treated 45-60min；Then
It takes out and acetone supersound process 15-30min is added, rinsed using deionized water after taking-up, then dried up substrate using nitrogen；
C) it impregnates and preserves：The obtained substrates of step b) are immersed in organic solvent, are kept in dark place.In the technical program
In, first by substances such as the oil stain dirts on glass detergent cleaning base plate surface, then promote liquid to promote substrate with adhesive force
The adhesive force and wellability on surface soak for a long time subsequently to improve substrate film coating adhesive force and the uniformity when follow-up plated film
Bubble contributes to substrate surface slowly to react with organic solvent, thoroughly removes substrate surface greasy residues and improves substrate surface
Wellability.
Preferably, adhesive force promotes liquid to be made of the raw material of following parts by weight in step b)：Hydroxyethyl cellulose 10-15
Part, 20-35 parts of methyl orthosilicate, 5-10 parts of algae clay, 80-100 parts of ethyl acetate, 15-25 parts of silane coupling agent and hydrofluoric acid
1-5 parts.
Preferably, the preparation method of adhesive force promotion liquid is：By hydroxyethyl cellulose, methyl orthosilicate, silane coupled
Agent is added to algae clay in ethyl acetate, and hydrofluoric acid is added after stirring and dissolving is complete, after ultrasonic 60KHz processing 35-50min
It arrives.
Preferably, it is 65-80 DEG C that adhesive force, which promotes the temperature of liquid, in step b).
Preferably, supersonic frequency 85-100KHz in step b).
Preferably, organic solvent is ethyl alcohol, isopropanol, acetone, methanol, ethylene glycol ethyl ether or propylene glycol first in step c)
One kind in ether.
Preferably, the substrate is PET, and glass, quartz, silicon chip, ITO electro-conductive glass, FTO electro-conductive glass, ZnO conductions
One kind in glass.
Beneficial effects of the present invention：The present invention using cleaning, ultrasound, rinsing, drying, immersion treatment process substrate
Material can utilize the slow reaction of organic solvent and substrate surface to remove surface and oil contaminant residual to greatest extent, and improve base
Plate surface wellability can enhance the adhesive force and uniformity of the follow-up plated film of substrate, and this method is easy to operate, without other processing
Equipment can be prepared in air at room temperature, and it is mutually compatible to commercially produce preparation process with large area.
Specific implementation mode
Technical solution in the embodiment of the present invention is subjected to clear, complete description below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
All other embodiment that technical staff is obtained without making creative work belongs to the model that the present invention protects
It encloses.
Embodiment 1
A kind of process of surface treatment of substrate, includes the following steps：
A) it cleans：Substrate (substrate selects ITO electro-conductive glass) is immersed in glass detergent, it is clear with deionized water after cleaning
It washes；
B) it is ultrasonically treated：The substrate that step a) is obtained immerses the adhesive force that temperature is 65 DEG C and promotes in liquid, supersonic frequency
85KHz handles 45min；It then takes out and acetone supersonic frequency 85KHz processing 15min is added, rinsed using deionized water after taking-up,
Then substrate is dried up using nitrogen；Wherein adhesive force promotes liquid to be made of the raw material of following parts by weight：Hydroxyethyl cellulose 10
1 part of part, 20 parts of methyl orthosilicate, 5 parts of algae clay, 80 parts of ethyl acetate, 15 parts of silane coupling agent and hydrofluoric acid；Adhesive force promotes
The preparation method of liquid is：Hydroxyethyl cellulose, methyl orthosilicate, silane coupling agent and algae clay are added in ethyl acetate,
Hydrofluoric acid is added after stirring and dissolving is complete, is obtained after ultrasonic 60KHz processing 35min；；
C) it impregnates and preserves：The obtained substrates of step b) are immersed in ethyl alcohol, seal bottle cap are screwed, and be put in and be protected from light the moon
Liang Chu.Place 24 hours or more, for use.
Embodiment 2
A kind of process of surface treatment of substrate, includes the following steps：
A) it cleans：Substrate (substrate selects ZnO electro-conductive glass) is immersed in glass detergent, it is clear with deionized water after cleaning
It washes；
B) it is ultrasonically treated：The substrate that step a) is obtained immerses the adhesive force that temperature is 70 DEG C and promotes in liquid, supersonic frequency
90KHz handles 50min；It then takes out and acetone supersonic frequency 90KHz processing 20min is added, rinsed using deionized water after taking-up,
Then substrate is dried up using nitrogen；Wherein adhesive force promotes liquid to be made of the raw material of following parts by weight：Hydroxyethyl cellulose 12
3 parts of part, 25 parts of methyl orthosilicate, 5 parts of algae clay, 95 parts of ethyl acetate, 20 parts of silane coupling agent and hydrofluoric acid；Adhesive force promotes
The preparation method of liquid is：Hydroxyethyl cellulose, methyl orthosilicate, silane coupling agent and algae clay are added in ethyl acetate,
Hydrofluoric acid is added after stirring and dissolving is complete, is obtained after ultrasonic 60KHz processing 40min；；
C) it impregnates and preserves：The obtained substrates of step b) are immersed in propylene glycol monomethyl ether, seal bottle cap is screwed, and is put in
It is protected from light shady place.Place 24 hours or more, for use.
Embodiment 3
A kind of process of surface treatment of substrate, includes the following steps：
A) it cleans：Substrate (substrate selects FTO electro-conductive glass) is immersed in glass detergent, it is clear with deionized water after cleaning
It washes；
B) it is ultrasonically treated：The substrate that step a) is obtained immerses the adhesive force that temperature is 80 DEG C and promotes in liquid, supersonic frequency
100KHz handles 60min；It then takes out and acetone supersonic frequency 100KHz processing 30min is added, rushed using deionized water after taking-up
It washes, is then dried up substrate using nitrogen；Wherein adhesive force promotes liquid to be made of the raw material of following parts by weight：Hydroxyethyl cellulose
5 parts of 15 parts, 35 parts of methyl orthosilicate, 10 parts of algae clay, 100 parts of ethyl acetate, 25 parts of silane coupling agent and hydrofluoric acid；Adhesive force
Promote liquid preparation method be：Hydroxyethyl cellulose, methyl orthosilicate, silane coupling agent and algae clay are added to ethyl acetate
In, hydrofluoric acid is added after stirring and dissolving is complete, is obtained after ultrasonic 60KHz processing 50min；；
C) it impregnates and preserves：The obtained substrates of step b) are immersed in organic solvent, seal bottle cap are screwed, and be put in and keep away
Light shady place.Place 24 hours or more, for use.
Above-mentioned embodiment is only a preferred solution of the present invention, not the present invention is made in any form
Limitation, on the premise of not exceeding the technical scheme recorded in the claims also other variations and modifications.
Claims (6)
1. a kind of process of surface treatment of substrate, which is characterized in that include the following steps：
a）Cleaning：Substrate is immersed in glass detergent, is cleaned with deionized water after cleaning；
b）It is ultrasonically treated：By step a）Obtained substrate immerses adhesive force and promotes in liquid, is ultrasonically treated 45-60min；It then takes out
Acetone is added and is ultrasonically treated 15-30min, is rinsed using deionized water after taking-up, is then dried up substrate using nitrogen；Adhesive force
Liquid is promoted to be made of the raw material of following parts by weight：10-15 parts of hydroxyethyl cellulose, 20-35 parts of methyl orthosilicate, algae clay 5-10
1-5 parts of part, 80-100 parts of ethyl acetate, 15-25 parts of silane coupling agent and hydrofluoric acid；
c）It impregnates and preserves：By step b）Obtained substrate is immersed in organic solvent, is kept in dark place.
2. a kind of process of surface treatment of substrate according to claim 1, which is characterized in that adhesive force promotes the preparation of liquid
Method is：Hydroxyethyl cellulose, methyl orthosilicate, silane coupling agent and algae clay are added in ethyl acetate, stirring and dissolving
Hydrofluoric acid is added after complete, is obtained after ultrasonic 60kHz processing 35-50min.
3. a kind of process of surface treatment of substrate according to claim 1, which is characterized in that step b）Middle adhesive force promotes
The temperature of liquid is 65-80 DEG C.
4. a kind of process of surface treatment of substrate according to claim 1, which is characterized in that step b）Middle supersonic frequency
85-100kHz。
5. a kind of process of surface treatment of substrate according to claim 1, which is characterized in that step c）Middle organic solvent is
One kind in ethyl alcohol, isopropanol, acetone, methanol, ethylene glycol ethyl ether or propylene glycol monomethyl ether.
6. a kind of process of surface treatment of substrate according to claim 1, which is characterized in that the substrate is PET, stone
English, silicon chip, ITO electro-conductive glass, FTO electro-conductive glass, one kind in ZnO electro-conductive glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610301332.2A CN105957800B (en) | 2016-05-09 | 2016-05-09 | A kind of process of surface treatment of substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610301332.2A CN105957800B (en) | 2016-05-09 | 2016-05-09 | A kind of process of surface treatment of substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105957800A CN105957800A (en) | 2016-09-21 |
| CN105957800B true CN105957800B (en) | 2018-11-06 |
Family
ID=56915127
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610301332.2A Active CN105957800B (en) | 2016-05-09 | 2016-05-09 | A kind of process of surface treatment of substrate |
Country Status (1)
| Country | Link |
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| CN (1) | CN105957800B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109267050A (en) * | 2018-08-15 | 2019-01-25 | 天长市京发铝业有限公司 | Substrate surface process technique |
| CN109267057A (en) * | 2018-08-15 | 2019-01-25 | 天长市京发铝业有限公司 | Substrate corrosion resistant surfaces method for oxidation |
| CN113083818B (en) * | 2021-03-30 | 2022-09-16 | 河北中天兰清环境科技有限公司 | Processing method for cleaning and recycling polytetrafluoroethylene reaction kettle |
| CN115093903A (en) * | 2022-07-19 | 2022-09-23 | 广州天极电子科技股份有限公司 | Cleaning agent and application thereof, cleaning method of thin film circuit board substrate and preparation method of thin film circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103509420A (en) * | 2012-06-21 | 2014-01-15 | 南京工业大学 | NiO-doped AZO glass heat insulation paint and preparation method thereof |
| CN105038397A (en) * | 2015-07-08 | 2015-11-11 | 合肥旭阳铝颜料有限公司 | Ultrasonic cleaning resistant mirror ink for mobile phone lens |
-
2016
- 2016-05-09 CN CN201610301332.2A patent/CN105957800B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103509420A (en) * | 2012-06-21 | 2014-01-15 | 南京工业大学 | NiO-doped AZO glass heat insulation paint and preparation method thereof |
| CN105038397A (en) * | 2015-07-08 | 2015-11-11 | 合肥旭阳铝颜料有限公司 | Ultrasonic cleaning resistant mirror ink for mobile phone lens |
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| CN105957800A (en) | 2016-09-21 |
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