CN105956215B - PCB three dimensional mass displacement method is analyzed using radial flow - Google Patents
PCB three dimensional mass displacement method is analyzed using radial flow Download PDFInfo
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- 238000011549 displacement method Methods 0.000 title claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 41
- 239000000945 filler Substances 0.000 claims abstract description 29
- 230000006835 compression Effects 0.000 claims abstract description 24
- 238000007906 compression Methods 0.000 claims abstract description 24
- 238000004458 analytical method Methods 0.000 claims abstract description 21
- 238000012360 testing method Methods 0.000 claims abstract description 18
- 238000013461 design Methods 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 81
- 229910052802 copper Inorganic materials 0.000 claims description 68
- 239000010949 copper Substances 0.000 claims description 68
- 239000010410 layer Substances 0.000 claims description 60
- 239000004744 fabric Substances 0.000 claims description 22
- 239000011521 glass Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 235000014121 butter Nutrition 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- 239000011889 copper foil Substances 0.000 claims description 13
- 239000002356 single layer Substances 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 101100313203 Danio rerio tpt1 gene Proteins 0.000 claims description 7
- 238000004364 calculation method Methods 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims description 4
- 238000004220 aggregation Methods 0.000 claims description 3
- 230000002776 aggregation Effects 0.000 claims description 3
- 239000003086 colorant Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000006071 cream Substances 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 14
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 235000013336 milk Nutrition 0.000 description 2
- 239000008267 milk Substances 0.000 description 2
- 210000004080 milk Anatomy 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005206 flow analysis Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
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- Engineering & Computer Science (AREA)
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- Theoretical Computer Science (AREA)
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- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Architecture (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to PCB production fields, PCB three dimensional mass displacement method is analyzed more particularly to application radial flow, by the porefilling capability A value, cream thickness D value and pulling force E value of radial flow analytical PCB test board, plank difficulty FR and A value, D value, the relationship between E value are obtained.According to the plank difficulty FR of each layer of pcb board to be designed, each layer PCB material for choosing the condition that meets separately passes through the filler model analysis of 3DMD and superposition compression degree analyzes and determines the reliability of pcb board with the presence or absence of risk, if existed, then each layer PCB material/routing design can be appropriately modified until analyzing and determining that risk is not present in the reliability of pcb board by filler model analysis and superposition compression degree.
Description
Technical field
The present invention relates to PCB production fields, and in particular to analyzes PCB three dimensional mass displacement method using radial flow.
Background technique
Laminated multi-layer technique in printed circuit board industry needs to combine the various design speciality of copper/substrate/copper foil.But
These change meeting so that the thickness of insulating layer of prepreg binder course generates difference.And it is still applied when importing new material so far
Calculate the whether enough methods of total resin glue amount needed for bonding.
Although having many different measuring and calculating modes to estimate the reliability of new material, those are such as filled out containing additive
It fills agent and does not bathe the material of sex flame retardant, hundred parts of ratios of resin content can not be relied only on accurately to estimate its flow condition.
In addition the copper face that some high-end designs have large area ratio is removed (such as BGA component area), semi-curing glue need to be used by combining
The glue of piece is filled.When the area of required filling is greater than available combination resin glue, the combination of organdy and copper will become
Weak, this weaker region influences whether the reliability of monolith pcb board.
With the increasing of BGA part size, the line-spacing of BGA part is and then reduced so that the above effect is more serious.
Summary of the invention
To solve the above-mentioned problems, the present invention provides a kind of application radial flow analysis PCB tri- that can assess and correct pcb board
Tie up mass shift method.
In order to achieve the above object, the technical solution adopted by the present invention is that：PCB three dimensional mass position is analyzed using radial flow
Shifting method includes the following steps：
(1) radial flow point-score is to material analysis：
A. the section that PCB test board obtains PCB test board is cut, total hole count TH in section is read and is filled resin hole count
FH, porefilling capability value A=FH/TH；Specifically, PCB test board is cut using IPC_TM650-chapter2.1 and is tested.
B. measure PCB test board butter layer thickness D, butter layer be prepreg solidification after be present in glass fabric with
Epoxy resin between layers of copper；Butter layer thickness=(thickness of insulating layer-glass fabric standard thickness)/2；
C. the minimum peel strength E of the slotted zones of PCB test board is measured, minimum peel strength E is single by measurement slotted zones
The copper foil pulling force of plane product obtains；The unit of minimum peel strength E is lb/in (pound per inch)；
D.PCB plate manufacture difficulty FR=CT* (1- residual copper ratio), CT are copper foil standard thickness；It is determined according to FR value required
The A value of PCB material, D value, E value claimed range；Here CT is identical with the CT (substrate copper is thick) in filler model, and residual copper ratio is
Refer to single layer residual copper ratio；When specific operation, every layer of material (general identical product, layers of material meeting are determined according to every layer of FR
With the same, also there is exception)；In the immovable situation of product pattern, residual copper ratio and copper thickness are fixation；Each laminar substrate is thick
Degree can be changed because of the change of glass fabric and resin material.Similarly, in the case where existing fixed substrate thickness or copper thickness require,
The type of glass fabric and resin material is just restricted, at this moment also to select the brand of substrate and prepreg, model is (no
Same chemical analysis).For macroscopic view, when problem analysis, it is restricted that institute can be broken, or even in copper on challenge client's Original manuscript design
Thickness, residual copper ratio, the regulation of each thickness degree.
(2) 3DMD is analyzed：
1) filler model analysis:
A. it is several small lattice by each single layer prepreg difference cutting of PCB multilayer board, calculates some small lattice residual copper ratio
I.e. some small lattice copper face product is divided by some small lattice gross area；Filler volume v1=(CT* (1-rcp%)) * a is needed, wherein CT:Base
Plate copper is thick, and rcp% is single layer residual copper ratio, and a is small lattice area；
B. comparison needs filler volume v1, can provide filler in some small lattice of the single layer prepreg of PCB multilayer board
Volume v2 judges enough filler volumes whether are provided in the small lattice；Calculation formula is that can provide filler volume v2=(PPT-
GFT-2F) * a, wherein PPT is epoxy resin standard thickness, and GFT is glass fabric standard thickness, and F is butter layer thickness, milk
Oil reservoir is to be present in the epoxy resin between glass fabric and layers of copper after prepreg solidifies, and a is small lattice area；Work as v2>V1,
That is (PPT-GFT-2F)>CT* (1-rcp%), then it is assumed that can provide enough filler volumes；
2) superposition compression degree is analyzed:
A., PCB multilayer board certain area is divided into the small lattice of low resolution, and each layer copper thickness of PCB multilayer board is added up,
Calculate the ratio that total copper thickness in PCB multilayer board certain area accounts for total plate thickness；Calculation formula is:Compression degree P=(TCT1-
TCT2)/BT, wherein BT is pcb board total thickness, and TCT1 is each layer native copper thickness summation in certain small lattice, and TCT2 is after generating conductive pattern type
Each layer copper thickness summation in certain small lattice；
B. result P value is divided into several grades, in being emulated in calculator, different brackets is set as different colours；When
The P of small lattice>10%, it is defined as low pressure grid area；There is low pressure grid area simultaneously in X and Y direction>=2 lattice, i.e. expression low pressure surface
Product is excessive, and being determined as the reliability of PCB multilayer board, there are risks.
After the analysis of superposition compression degree, it is the small lattice of high-resolution for the intensive pcb board region division of route and counts
Calculate compression degree；Each layer copper thickness aggregation of PCB multilayer board, the ratio that total copper thickness in pcb board certain area accounts for total plate thickness is calculated；Meter
Calculating formula is:Compression degree P=(TCT1-TCT2)/BT, wherein BT is pcb board total thickness, and TCT1 is that each layer native copper is thick in certain small lattice
Summation, TCT2 are each layer copper thickness summation in certain small lattice after generation pattern；It is respectively 50- that the small lattice of the low resolution, which are length and width,
The grid of 200mil；The small lattice of the high-resolution are that length and width are each<The grid of 50mil；The small lattice size of low resolution is greater than height
The small lattice size of resolution ratio；As the P of the small lattice of high-resolution>10%, it is defined as low pressure grid area, (X and Y-axis are respectively for X and Y-axis
The length and width direction of pcb board) there is low pressure grid area simultaneously in direction>=2 lattice, i.e. expression low pressure area is excessive, is determined as
There are risks for the reliability of PCB multilayer board.
The intensive pcb board region of route is the connector area that the area BGA or line-spacing are less than 1.0mm.
Compared with the existing technology, the beneficial effects of the invention are as follows：Through radial flow test board, a variety of materials difference group is analyzed
Under conjunction, porefilling capability value A, butter layer thickness D and minimum peel strength E value and the existing material 370HR of application do base
Standard obtains requirement of the difficulty FR of the plank of different designs to A value, D value, E value, to define the integration capability of a variety of materials
When to make certain PCB product, the PCB material for being able to satisfy manufacture difficulty value FR belonging to each layer of the PCB need to be selected, to ensure
In addition the reliability of material of the product, is analyzed by filler model analysis in 3DMD model and superposition compression degree, with judgement
Certain specific each localized design of PCB product pattern whether there is security risk, such as exists, then to fit to PCB routing design
When modification until analyzing and determining that risk is not present in the reliability of pcb board by filler model analysis and superposition compression degree.
Detailed description of the invention
Fig. 1 a is the schematic diagram that hole is full of resin glue；Fig. 1 b is the unfilled schematic diagram of partial hole resin glue；
Fig. 2 a is the analysis result of the former design drawing of PCB multilayer board；
Fig. 2 b is to be set according to the new PCB multilayer board that the layout of force analysis results modification PCB multilayer board is routed
The force analysis result figure of meter.
Specific embodiment
Further to disclose technical solution of the present invention, the embodiment that the invention will now be described in detail with reference to the accompanying drawings.
When PCB industry with Prepreg prepreg (resinous glue+glass fabric) when pressing process from B-stage
When being cured as C-stage, flowing can be first dissolved, and is inserted between each layer copper (or metal) route of PCB gap so that each layer bonding jail
Gu reliable then fully hardened.Because it is found that different brands, different resins/chemical analysis type, different resins/glass ratio, no
Is flowed by filling situation and different degrees of difference all occurs for different PCB routing designs with type glass fabric.I
Claim radial flow radial flow from center toward the ability of perimeter this prepreg.
Radial flow tool is the fluid ability that various prepregs are measured through experiment, is compared inhomogeneous
PCB routing design, radial flow tool are that an ability illustrates table, when illustrating that different materials compare different PCB design difficulty
Performance, its hardened fruit of data source self-test and makees benchmark with 370HR material.
Test board is designed with the PCB substrate (size of certain size:18"*24"；Thickness:47mil, 1/1oz copper), following table 1
Content drill out a variety of different apertures.Illustrate the size of the slotted zones (area slot) of PCB substrate in table 2.
| Pore size (mm) | 0.2 | 0.4 | 0.5 | 0.65 | 0.75 | 0.9 | 1.0 | 1.25 | Sum |
| Quantity | 37074 | 168 | 7668 | 168 | 168 | 168 | 168 | 168 | 45750 |
The hole number and aperture of 1 PCB substrate of table
| Slot size | 0.05*1” | 0.05*2” | 0.10*2” | 0.20*2” |
2 slotted zones size of table
Select it is various it is different produce boards, variety classes glass cloth, the prepreg of different type resin gel content (R/C), with
The substrate to have drilled is pressed into test board.Following table is that the glass cloth by taking material 370HR (the FR4 material of isola) as an example compares not
With the combination of gel content.Wherein, the model of 106,1080 etc. perpendicular row glass fabric refers to PCB material.
The gel content and glass fabric type of the different PCB materials of 3 370HR9 of table
Porefilling capability
The section that PCB test board (being made of substrate and prepreg) obtains PCB test board is cut, total hole in section is read
It counts TH and is filled resin hole count FH, porefilling capability value A (Radial Flow Via Fill Factor)=FH/TH, filling perforation energy
Power is the ability that resin glue can fill up hole, and result is shown in that Fig. 1 a fills up the situation of resin and Fig. 1 b partial hole is not filled out between 0-1
The situation of full resin.
Butter coat thickness resin surface butter layer thickness (D value, unit:mil)
Butter layer is to be present in the epoxy resin between glass fabric and layers of copper after prepreg solidifies.If butter layer is too
Thin, i.e., the glue for bonding glass fiber and copper foil is seldom, will affect bonding force.Butter layer thickness=(thickness of insulating layer-glass
Fiber cloth standard thickness)/2.
Minimum Peel strength Slotted area simulates the minimum peel strength of low-pressure area (E value:Unit:lb/
in)
There is the area slot that need to insert more resin, when consuming more therefore will affect the binding force with copper foil.Simulated experiment measurement
The area slot copper foil pulling force (establishing criteria IPC-TM-650 2.4.8) measures the reliability of certain material resin.
Plank rating：When internal layer copper is thicker, residual copper face product is fewer, indicates to need to be used as the resin for filling up depletion region
Glue is more, also illustrates that and requires glue amount provided by layer of prepreg bigger.Can be tighter to the selection of layer of prepreg, i.e. plank
Difficulty is higher.We refer to common PCB type, on the basis of glue amount needed for it.The design of PCB internal layer is divided into 4 kinds of difficulty, is seen
Table 4:
Formula:The sub- manufacture difficulty FR=CT* of pcb board (1- residual copper ratio), CT=copper foil standard is thick, the sub- manufacture difficulty of pcb board
It is directly proportional to filler amount is needed.
The design of the common PCB internal layer of table 4 and FR lower limit tables
| Common PCB internal layer design | FR value lower limit |
| 1/2oz copper foil+(1- residual copper ratio)<50% | 0.6* (1-100%)=0 |
| 1oz copper foil+(1- residual copper ratio)>=50% | 1.2* (1-50%)=0.6 |
| 2oz copper foil+(1- residual copper ratio)<50-80% | 2.4* (1-50%)=1.2 |
| 2oz copper foil+(1- residual copper ratio)>80% | 2.4* (1-80%)=1.9 |
Note:1oz copper foil=1.2mil is thick
Using above formula its FR value, i.e. difficulty value can be conversed to any multiple-plate any layer.
On the basis of performance with reference to material 370HR more reliable and more stable in the application of current industry, using its result as standard,
Acceptable standard is made to above three characteristics, it is tentative such as the following table 5 at present:
Requirement of the 5 plank difficulty FR of table to material
| Plank difficulty FR | 0-0.6 | 0.6-1.2 | 1.2-1.9 | 1.9-2.4 |
| To material requirements | A>0.8 | A=1.0 | A>1.0&；D>=0.3 | A>1.0；D>=0.3；E>4 |
The various glass cloth of the material of every kind of possible application are combined with glue content, it is right to test to obtain its by radial flow
The A answered, D, E value then can be appreciated which kind of PCB design this kind of material is suitable for.
Filler model analysis:
Each single layer prepreg difference cutting of PCB multilayer board is several small lattice by a, calculates some small lattice residual copper ratio i.e.
Some small lattice copper face product is divided by some small lattice gross area；Filler volume v1=(CT* (1-rcp%)) * a is needed, wherein CT:Substrate
Copper is thick, and rcp% is single layer residual copper ratio, and a is small lattice area；For example a is 1 square inch；
B. comparison needs filler volume v1, can provide filler in some small lattice of the single layer prepreg of PCB multilayer board
Volume v2 judges enough filler volumes whether are provided in the small lattice；Calculation formula is that can provide filler volume v2=(PPT-
GFT-2F) * a, wherein PPT is epoxy resin standard thickness, and GFT is glass fabric standard thickness, and F is butter layer thickness, milk
Oil reservoir is to be present in the epoxy resin between glass fabric and layers of copper after prepreg solidifies, and a is small lattice area；Work as v2>V1,
That is (PPT-GFT-2F)>CT* (1-rcp%), then it is assumed that can provide enough filler volumes；
The analysis of superposition compression degree:
A., PCB multilayer board certain area is divided into the small lattice of low resolution, and each layer copper thickness of PCB multilayer board is added up,
Calculate the ratio that total copper thickness in PCB multilayer board certain area accounts for total plate thickness；Calculation formula is:Compression degree P=(TCT1-
TCT2)/BT, wherein BT is pcb board total thickness, and TCT1 is each layer native copper thickness summation in certain small lattice, and TCT2 is after generating conductive pattern type
Each layer copper thickness summation in certain small lattice；Wherein when copper is retained at the small lattice in each layer, TCT1=TCT2, i.e. P value are 0,
It indicates to be pressurized maximum；Otherwise as when copper is removed at the small lattice in each layer, TCT2=0, P value is larger, indicate compression compared with
It is low.
B. result P value is divided into several grades, in being emulated in calculator, different brackets is set as different colours；When
The P of small lattice>10%, it is defined as low pressure grid area；X and Y direction (the length and width direction that X and Y-axis are respectively pcb board) are same
When there is low pressure grid area>=2 lattice, i.e. expression low pressure area is excessive, be determined as the reliability of PCB multilayer board there are risk,
Then can with the position of the copper of revisions on drawings with change conductive pattern or select different parameters PCB material again into
The preparation of row PCB multilayer board, can also be in the case where unmodified, and being tested by standardized PCB proves that PCB multilayer board is (a
Case) qualified reliable (rarer).
Mode classification is shown in Table 6 and Fig. 2 at present.
The current mode classification of table 6
| P | Color | Compression degree |
| >10% | Pink colour | It is low |
| 10%-3% | Green | In |
| <3% | Blue | It is high |
Wherein in Fig. 2, high risk refers to high risk (low compression degree), optimum 3DMD correspond to risk (in by
Pressure degree), high mass corresponds to low-risk (high compression degree), in fact, mode classification can also be more kinds of.
It is the small lattice of high-resolution for the intensive pcb board region division of route and calculates compression degree；PCB multilayer board is each
Layer copper thickness aggregation calculates the ratio that total copper thickness in pcb board certain area accounts for total plate thickness；Calculation formula is:Compression degree P=
(TCT1-TCT2)/BT, wherein BT is pcb board total thickness, and TCT1 is each layer native copper thickness summation in certain small lattice, and TCT2 is to generate pattern
Each layer copper thickness summation in certain small lattice afterwards；The small lattice of the low resolution are the grid that length and width are respectively 50-200mil；The height
The small lattice of resolution ratio are that length and width are each<The grid of 50mil；The small lattice size of low resolution is greater than high-resolution small lattice size.Determine
The whether risky method of pcb board is same as above.
Pass through the A value of the PCB test board of radial flow analytical different materials (glass fabric and resin glue), D
Value and E value, different pcb board material (it is formed for substrate and prepreg, constitutes the single layer structure of PCB multilayer board) are different
Material composition, different A values, D value, E value can be obtained.
It is tested using existing material 370HR, obtains plank difficulty FR and A value, D value, the relationship between E value, when wanting
When making certain PCB product, the PCB material for being able to satisfy manufacture difficulty value FR belonging to each layer of the PCB need to be selected, to ensure the production
The reliability of material of product.According to the plank difficulty FR of each layer of pcb board to be designed, each layer PCB material for the condition that meets is chosen.
3DMD analyzes and determines that the reliability of pcb board whether there is risk by filler model analysis and superposition compression degree, such as exists, then
Each layer PCB material can be appropriately modified until analyzing and determining pcb board by filler model analysis and superposition compression degree
Reliability be not present risk.
Radial flow and 3DMD analysis method are carrying out using the above principle, and recycled with PDCA, are continued with reference to actual result
It updates measurement method and requires standard.Therefore unlimited 3 kinds of measurement projects mentioned above, 4 kinds of plank difficulty standards.And it can be according to new
Developing material or new product require after proposing, lasting to modify.
Basic principles and main features and advantage of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe originals of the invention
Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements
It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle
It is fixed.
Claims (4)
1. a kind of application radial flow analyzes PCB three dimensional mass displacement method, include the following steps：
(1) radial flow method is to material analysis：
A. the section that PCB test board obtains PCB test board is cut, total hole count TH in section is read and is filled resin hole count FH,
Porefilling capability value A=FH/TH；
B. the butter layer thickness D of PCB test board is measured, butter layer is to be present in glass fabric and layers of copper after prepreg solidifies
Between epoxy resin；Butter layer thickness=(thickness of insulating layer-glass fabric standard thickness)/2；
C. the minimum peel strength E of the slotted zones of PCB test board is measured, minimum peel strength E is drawn by measurement slotted zones copper foil
Power obtains；
D.PCB plate manufacture difficulty FR=CT* (1- residual copper ratio), CT are that substrate copper is thick；Required PCB material is determined according to FR value
A value, D value, the claimed range of E value；
(2) 3DMD is analyzed:
1) filler model analysis：
A. be several small lattice by the difference cutting of each single layer prepreg of PCB multilayer board, calculate some small lattice residual copper ratio i.e. certain
A small lattice copper face product is divided by some small lattice gross area；Filler volume v1=(CT* (1-rcp%)) * a is needed, wherein CT:Substrate copper
Thickness, rcp% are single layer residual copper ratio, and a is small lattice area；
B. comparison needs filler volume v1, can provide filler volume in some small lattice of the single layer prepreg of PCB multilayer board
V2 judges enough filler volumes whether are provided in the small lattice；Calculation formula is that can provide filler volume v2=(PPT-GFT-
2F) * a, wherein PPT is epoxy resin standard thickness, and GFT is glass fabric standard thickness, and F is butter layer thickness, butter layer
The epoxy resin being present between glass fabric and layers of copper after solidifying for prepreg, a are small lattice area；Work as v2>V1, i.e.,
(PPT-GFT-2F)>CT* (1-rcp%), then it is assumed that can provide enough filler volumes；
2) superposition compression degree is analyzed:
A., PCB multilayer board certain area is divided into the small lattice of low resolution, and each layer copper thickness of PCB multilayer board is added up, is calculated
Total copper thickness accounts for the ratio of total plate thickness in PCB multilayer board certain area；Calculation formula is:Compression degree P=(TCT1-TCT2)/BT,
Wherein BT is pcb board total thickness, and TCT1 is each layer native copper thickness summation in certain small lattice, and TCT2 is each in certain small lattice after generating conductive pattern type
Layer copper thickness summation；
B. result P value is divided into several grades, in being emulated in calculator, different brackets is set as different colours；When small lattice
P>10%, it is defined as low pressure grid area；There is low pressure grid area simultaneously in X and Y direction>=2 lattice, i.e. expression low pressure area mistake
Greatly, being determined as the reliability of PCB multilayer board, there are risks.
2. a kind of application radial flow according to claim 1 analyzes PCB three dimensional mass displacement method, which is characterized in that
After the analysis of superposition compression degree, it is the small lattice of high-resolution for the intensive pcb board region division of route and calculates compression degree；
Each layer copper thickness aggregation of PCB multilayer board, the ratio that total copper thickness in the intensive region of pcb board route accounts for total plate thickness is calculated；It calculates public
Formula is:Compression degree P=(TCT1-TCT2)/BT, wherein BT is pcb board total thickness, and TCT1 is that each layer native copper is thick total in certain small lattice
It is each layer copper thickness summation in certain small lattice after generating pattern with, TCT2；It is respectively 50- that the small lattice of the low resolution, which are length and width,
The grid of 200mil；The small lattice of the high-resolution are that length and width are each<The grid of 50mil；The small lattice size of low resolution is greater than height
The small lattice size of resolution ratio；As the P of small lattice>10%, it is defined as low pressure grid area, low pressure grid area occur simultaneously in X and Y direction
>=2 lattice, i.e. expression low pressure area is excessive, and being determined as the reliability of PCB multilayer board, there are risks.
3. a kind of application radial flow according to claim 1 analyzes PCB three dimensional mass displacement method, it is characterised in that：
Relative to different PCB design difficulty, there is different material property requirements：
4. a kind of application radial flow according to claim 2 analyzes PCB three dimensional mass displacement method, which is characterized in that line
The intensive pcb board region in road is the connector area that the area BGA or line-spacing are less than 1.0mm.
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| US5541450A (en) * | 1994-11-02 | 1996-07-30 | Motorola, Inc. | Low-profile ball-grid array semiconductor package |
| TW503681B (en) * | 2001-10-04 | 2002-09-21 | Wus Printed Circuit Co Ltd | Manufacture method of resistor layer of multi-layer printed circuit board |
| TW200415965A (en) * | 2003-02-06 | 2004-08-16 | Wus Printed Circuit Co Ltd | Micro blind hole of printed circuit board and manufacturing method thereofor |
| CN105129408A (en) * | 2015-09-15 | 2015-12-09 | 黄石沪士电子有限公司 | Automatic optics testing device and method for PCBs |
| CN105334706A (en) * | 2015-11-19 | 2016-02-17 | 黄石沪士电子有限公司 | Method for detecting exposure jig film on basis of sample plate jig film |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5541450A (en) * | 1994-11-02 | 1996-07-30 | Motorola, Inc. | Low-profile ball-grid array semiconductor package |
| TW503681B (en) * | 2001-10-04 | 2002-09-21 | Wus Printed Circuit Co Ltd | Manufacture method of resistor layer of multi-layer printed circuit board |
| TW200415965A (en) * | 2003-02-06 | 2004-08-16 | Wus Printed Circuit Co Ltd | Micro blind hole of printed circuit board and manufacturing method thereofor |
| CN105129408A (en) * | 2015-09-15 | 2015-12-09 | 黄石沪士电子有限公司 | Automatic optics testing device and method for PCBs |
| CN105334706A (en) * | 2015-11-19 | 2016-02-17 | 黄石沪士电子有限公司 | Method for detecting exposure jig film on basis of sample plate jig film |
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