CN112365561A - Reverse drawing method for printed circuit board assembly circuit schematic diagram - Google Patents
Reverse drawing method for printed circuit board assembly circuit schematic diagram Download PDFInfo
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- CN112365561A CN112365561A CN202011210608.9A CN202011210608A CN112365561A CN 112365561 A CN112365561 A CN 112365561A CN 202011210608 A CN202011210608 A CN 202011210608A CN 112365561 A CN112365561 A CN 112365561A
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- 238000010586 diagram Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 238000004458 analytical method Methods 0.000 claims abstract description 17
- 238000002591 computed tomography Methods 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000011889 copper foil Substances 0.000 claims abstract description 5
- 238000012790 confirmation Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 2
- 238000009877 rendering Methods 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
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- 230000009471 action Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
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- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T11/00—2D [Two Dimensional] image generation
- G06T11/20—Drawing from basic elements, e.g. lines or circles
- G06T11/206—Drawing of charts or graphs
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06C—DIGITAL COMPUTERS IN WHICH ALL THE COMPUTATION IS EFFECTED MECHANICALLY
- G06C3/00—Arrangements for table look-up, e.g. menstruation table
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T17/00—Three dimensional [3D] modelling, e.g. data description of 3D objects
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T3/00—Geometric image transformations in the plane of the image
- G06T3/08—Projecting images onto non-planar surfaces, e.g. geodetic screens
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10072—Tomographic images
- G06T2207/10081—Computed x-ray tomography [CT]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a reverse drawing method of a printed circuit board assembly circuit schematic diagram, which is characterized by comprising the following steps of obtaining a three-dimensional model of the printed circuit board assembly through CT scanning; carrying out fault analysis processing on the three-dimensional model to obtain a metal wiring model and a component model of each layer of copper foil of the printed circuit board assembly; numbering the components in the component model; confirming the polarity and specification of the components to obtain polarity information and specification information corresponding to each component; and drawing a circuit schematic diagram by combining the metal wiring model, the component model, the polarity information and the specification information. The invention has the beneficial effects that: by adopting a method combining CT scanning analysis and manual searching, the metal wiring model, the component model, the polarity information and the specification information are respectively obtained, reverse analysis can be carried out on the printed circuit board assembly, and a circuit schematic diagram of the printed circuit board assembly is drawn.
Description
Technical Field
The invention relates to the technical field of reverse analysis of printed circuit board assemblies, in particular to a reverse drawing method of a circuit schematic diagram of a printed circuit board assembly.
Background
The optocoupler relay module has the advantages of long service life, high reliability, high switching speed, low discharge voltage, small action current, no action sound and the like, and is widely applied to power systems. In recent years, the reliability of the whole machine equipment has become a hot point of attention, and the performance of the optocoupler relay module, which is an important component in a power system, directly influences the stability of the whole machine. After the optocoupler relay module breaks down, failure analysis needs to be carried out, the failure mode of the optocoupler relay module is determined, a corresponding failure mechanism is found out, and in the failure analysis process, the structure and the circuit schematic diagram of the optocoupler relay module need to be thoroughly understood. Wuyantou et al published the application of cone beam CT in electronic components in digital technology and application, i.e. the inverse analysis of integrated circuit is performed by combining industrial cone beam CT, but this method is only suitable for identifying the metal wiring in integrated circuit, and for printed circuit board assembly with complex structure, such as optical coupling relay module, there are electronic components of various types in its interior, and at the same time, the model and specification of the components can not be identified, and the complete circuit schematic diagram can not be drawn reversely.
Disclosure of Invention
Aiming at the problems, the invention provides a reverse drawing method of a printed circuit board assembly circuit schematic diagram, which mainly solves the problem that the prior analysis method can not reversely draw a complete circuit schematic diagram.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a reverse drawing method for a printed circuit board assembly circuit schematic diagram comprises the following steps,
acquiring a three-dimensional model of the printed circuit board assembly through CT scanning; carrying out fault analysis processing on the three-dimensional model to obtain a metal wiring model and a component model of each layer of copper foil of the printed circuit board assembly; numbering the components in the component model; carrying out polarity confirmation and specification confirmation on the components to obtain polarity information and specification information corresponding to each component; and drawing a circuit schematic diagram by combining the metal wiring model, the component model, the polarity information and the specification information.
In some embodiments, the obtaining of the three-dimensional model of the printed circuit board assembly comprises: the method comprises the steps of placing the printed circuit board assembly on a precision sample table of CT scanning equipment, obtaining two-dimensional perspective views of the printed circuit board assembly at different angle positions by rotating the precision sample table, and carrying out three-dimensional reconstruction based on the two-dimensional perspective views to obtain a three-dimensional model of the printed circuit board assembly.
In some embodiments, the micro-focus radiation source and the detector of the CT scanning device are kept in a fixed position, the working voltage is adjusted to 180kV, and the working current is adjusted to 50 muA.
In some embodiments, the fault analysis process uses VGstudio three-dimensional reconstruction software.
In some embodiments, the components include passive components, discrete devices, and integrated circuits, and the polarity information and specification information of the passive components, discrete devices, and integrated circuits are confirmed using a multimeter and a microscope.
In some embodiments, the metal routing model is an interconnection state relationship between the components.
In some embodiments, the component model is a spatial arrangement relationship of the components on the printed circuit board assembly.
The invention has the beneficial effects that: by adopting a method combining CT scanning analysis and manual searching, the metal wiring model, the component model, the polarity information and the specification information are respectively obtained, the optical coupling relay module can be reversely analyzed, and a circuit schematic diagram of the optical coupling relay module can be drawn.
Drawings
Fig. 1 is a schematic implementation flow diagram of a method for reversely drawing a schematic circuit diagram of a printed circuit board assembly according to an embodiment of the present invention;
fig. 2 illustrates a placement manner of a printed circuit board assembly to be tested according to a second embodiment of the present invention;
fig. 3 is a two-dimensional perspective view of an optocoupler relay module disclosed in the second embodiment of the invention at different angular positions;
fig. 4 is a three-dimensional reconstruction diagram of an optocoupler relay module disclosed in the second embodiment of the invention;
fig. 5 is a schematic diagram of CT scanning results of metal traces of each layer of a printed circuit board in the optocoupler relay module according to the second embodiment of the invention;
fig. 6 is a schematic diagram of numbers of components inside the optocoupler relay module disclosed in the second embodiment of the invention;
fig. 7 is a schematic circuit diagram of an optocoupler relay module disclosed in the second embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and clearer, the following detailed description of the present invention is provided with reference to the accompanying drawings and detailed description. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the relevant aspects of the present invention are shown in the drawings.
According to fig. 1, the embodiment proposes a method for reversely drawing a schematic circuit diagram of a printed circuit board assembly, comprising the following steps,
acquiring a three-dimensional model of a printed circuit board assembly through CT scanning; the process of obtaining the three-dimensional model of the printed circuit board assembly comprises the following steps: the method comprises the steps of placing a printed circuit board assembly on a precision sample table of the CT scanning device, obtaining two-dimensional perspective views of the printed circuit board assembly at different angle positions by rotating the precision sample table, and carrying out three-dimensional reconstruction based on the two-dimensional perspective views to obtain a three-dimensional model of the printed circuit board assembly.
And step two, carrying out fault analysis processing on the three-dimensional model to obtain a metal wiring model and a component model of each layer of copper foil of the printed circuit board assembly, wherein the metal wiring model is the interconnection state relation between components, and the component model is the spatial arrangement relation of the components on the printed circuit board assembly.
Numbering the components in the component model;
step four, carrying out polarity confirmation and specification confirmation on the components to obtain polarity information and specification information corresponding to each component;
and step five, drawing a circuit schematic diagram by combining the metal wiring model, the component model, the polarity information and the specification information.
According to the invention, by adopting a method combining CT scanning analysis and manual searching, a metal wiring model, a component model, polarity information and specification information are respectively obtained, the optical coupling relay module can be reversely analyzed, and a circuit schematic diagram of the optical coupling relay module can be drawn.
The components comprise discrete devices and integrated circuits, the polarity information of the discrete devices is confirmed by using a universal meter, the specification information of the passive elements and the integrated circuits is confirmed by using a microscope, and a circuit schematic diagram is drawn by contrasting a metal wiring model and a component model according to the polarity information and the specification information.
The printed circuit board assembly and CT are defined as follows:
printed circuit board assembly: printed circuit Board Assembly, referred to as PCBA for short, is a component that uses a Printed circuit Board as a mounting substrate, on which various electronic components or parts are mounted, and that realizes electrical interconnection by means of Printed circuits of the Printed circuit Board.
CT: computed Tomography, CT for short, refers to scanning an object to be measured with X-rays, receiving the X-rays transmitted through the object to be measured by a detector, forming a corresponding perspective image by the detector due to different transmittances of materials with different densities in a sample to the X-rays, and reconstructing a three-dimensional image of the sample to be measured by analysis software.
The embodiment provides a method for reversely drawing a schematic circuit diagram of a printed circuit board assembly, which comprises the following steps,
referring to fig. 2, a placement mode of a printed circuit board assembly to be tested is illustrated, and an acquisition process of a three-dimensional model of the printed circuit board assembly is as follows: the method comprises the steps of placing a printed circuit board assembly on a precision sample table of the CT scanning device, obtaining two-dimensional perspective views of the printed circuit board assembly at different angle positions by rotating the precision sample table, and showing the two-dimensional perspective views of an optocoupler relay module at multiple angles in figure 3. And performing three-dimensional reconstruction by combining a corresponding reconstruction algorithm based on the two-dimensional perspective view to obtain a three-dimensional model of the printed circuit board assembly, as shown in fig. 4. The positions of a micro-focus ray source and a detector of the CT scanning device are kept still, the working voltage is adjusted to 180kV, and the working current is adjusted to 50 muA.
And step two, acquiring a metal wiring model and a component model of each layer of copper foil of the printed circuit board assembly by carrying out fault analysis processing on the three-dimensional model, wherein the metal wiring model is the interconnection state relation between components and the component model is the spatial arrangement relation of the components on the printed circuit board assembly as shown in fig. 5. The fault analysis process uses VGstudio three-dimensional reconstruction software.
Numbering the components in the component model, as shown in fig. 6, numbering each component in the graph, laying a foundation for reverse drawing, being beneficial to distinguishing each component in the drawing process and preparing a bill of materials after drawing;
step four, carrying out polarity confirmation and specification confirmation on the components to obtain polarity information and specification information corresponding to each component; the components comprise passive components, discrete devices and integrated circuits, and polarity information and specification information of the passive components, the discrete devices and the integrated circuits are confirmed by using a multimeter and a microscope.
And step five, drawing a circuit schematic diagram by combining the metal wiring model, the component model, the polarity information and the specification information, as shown in fig. 7. Therefore, after the optocoupler relay module customized and typeset by one PCB is reversely drawn, a relatively clean and complete circuit schematic diagram can be obtained, and the failure mechanism corresponding to the optocoupler relay module can be analyzed in the later period.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention accordingly, and not to limit the protection scope of the present invention accordingly. All equivalent changes or modifications made in accordance with the spirit of the present disclosure are intended to be covered by the scope of the present disclosure.
Claims (7)
1. A reverse drawing method for a printed circuit board assembly circuit schematic diagram is characterized by comprising the following steps,
acquiring a three-dimensional model of the printed circuit board assembly through CT scanning; carrying out fault analysis processing on the three-dimensional model to obtain a metal wiring model and a component model of each layer of copper foil of the printed circuit board assembly; numbering the components in the component model; carrying out polarity confirmation and specification confirmation on the components to obtain polarity information and specification information corresponding to each component; and drawing a circuit schematic diagram by combining the metal wiring model, the component model, the polarity information and the specification information.
2. The printed circuit board assembly schematic circuit diagram reverse drawing method of claim 1, wherein the obtaining process of the three-dimensional model of the printed circuit board assembly is as follows: the method comprises the steps of placing the printed circuit board assembly on a precision sample table of CT scanning equipment, obtaining two-dimensional perspective views of the printed circuit board assembly at different angle positions by rotating the precision sample table, and carrying out three-dimensional reconstruction based on the two-dimensional perspective views to obtain a three-dimensional model of the printed circuit board assembly.
3. The printed circuit board assembly schematic circuit diagram reverse drawing method of claim 2, wherein the micro-focus radiation source and the detector of the CT scanning device are kept at a fixed position, the operating voltage is adjusted to 180kV, and the operating current is adjusted to 50 μ a.
4. The printed circuit board assembly schematic circuit diagram reverse rendering method of claim 1, wherein the fault analysis process uses VGstudio three-dimensional reconstruction software.
5. A printed circuit board assembly schematic circuit diagram reverse drawing method as claimed in claim 1, wherein said components include passive components, discrete devices and integrated circuits, and polarity information and specification information of said discrete passive components, discrete devices and integrated circuits are confirmed using a multimeter and a microscope.
6. The printed circuit board assembly schematic circuit diagram reverse drawing method of claim 1, wherein the metal trace model is a relationship of interconnection states between the components.
7. The printed circuit board assembly schematic circuit diagram reverse drawing method of claim 1, wherein the component model is a spatial arrangement relationship of the components on the printed circuit board assembly.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011210608.9A CN112365561A (en) | 2020-11-03 | 2020-11-03 | Reverse drawing method for printed circuit board assembly circuit schematic diagram |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011210608.9A CN112365561A (en) | 2020-11-03 | 2020-11-03 | Reverse drawing method for printed circuit board assembly circuit schematic diagram |
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| CN112365561A true CN112365561A (en) | 2021-02-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116542188A (en) * | 2023-07-06 | 2023-08-04 | 深圳市鑫迅维科技有限公司 | PCB schematic diagram generation method, electronic equipment and storage medium |
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2020
- 2020-11-03 CN CN202011210608.9A patent/CN112365561A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116542188A (en) * | 2023-07-06 | 2023-08-04 | 深圳市鑫迅维科技有限公司 | PCB schematic diagram generation method, electronic equipment and storage medium |
| CN116542188B (en) * | 2023-07-06 | 2024-04-05 | 深圳市鑫迅维科技有限公司 | PCB schematic diagram generation method, electronic equipment and storage medium |
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