CN105940458A - 导电糊料组合物及由其制成的半导体器件 - Google Patents
导电糊料组合物及由其制成的半导体器件 Download PDFInfo
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- CN105940458A CN105940458A CN201480074542.1A CN201480074542A CN105940458A CN 105940458 A CN105940458 A CN 105940458A CN 201480074542 A CN201480074542 A CN 201480074542A CN 105940458 A CN105940458 A CN 105940458A
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- oxide
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- alkaline
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- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 1
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- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
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- 239000011591 potassium Substances 0.000 description 1
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- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 1
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- ZYXPMOIHQRKWGT-UHFFFAOYSA-N silver;2,2,2-trifluoroacetic acid Chemical compound [Ag].OC(=O)C(F)(F)F ZYXPMOIHQRKWGT-UHFFFAOYSA-N 0.000 description 1
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- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- XROWMBWRMNHXMF-UHFFFAOYSA-J titanium tetrafluoride Chemical compound [F-].[F-].[F-].[F-].[Ti+4] XROWMBWRMNHXMF-UHFFFAOYSA-J 0.000 description 1
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- 238000004876 x-ray fluorescence Methods 0.000 description 1
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- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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- OMQSJNWFFJOIMO-UHFFFAOYSA-J zirconium tetrafluoride Chemical compound F[Zr](F)(F)F OMQSJNWFFJOIMO-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Sustainable Energy (AREA)
- Electromagnetism (AREA)
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Abstract
Description
Claims (20)
Applications Claiming Priority (3)
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US201361911026P | 2013-12-03 | 2013-12-03 | |
US61/911,026 | 2013-12-03 | ||
PCT/US2014/068085 WO2015084801A2 (en) | 2013-12-03 | 2014-12-02 | Conductive paste composition and semiconductor devices made therewith |
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CN105940458A true CN105940458A (zh) | 2016-09-14 |
CN105940458B CN105940458B (zh) | 2018-08-17 |
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CN201480074542.1A Active CN105940458B (zh) | 2013-12-03 | 2014-12-02 | 导电糊料组合物及由其制成的半导体器件 |
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US (1) | US9761742B2 (zh) |
CN (1) | CN105940458B (zh) |
WO (1) | WO2015084801A2 (zh) |
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US20180040751A1 (en) | 2015-02-26 | 2018-02-08 | Dynamic Solar Systems Ag | Obtaining a pv film structure by means of a room temperature method and room temperature method for producing a pv film structure |
DE112016000930A5 (de) | 2015-02-26 | 2017-11-02 | Dynamic Solar Systems Ag | Raumtemperatur-Verfahren zur Herstellung elektrotechnischer Dünnschichten und elektrotechnische Dünnschicht |
WO2017091782A1 (en) * | 2015-11-24 | 2017-06-01 | Plant Pv, Inc | Fired multilayer stacks for use in integrated circuits and solar cells |
Citations (4)
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CN1308345A (zh) * | 2000-02-09 | 2001-08-15 | 株式会社村田制作所 | 导电糊料和陶瓷电子元件 |
CN101816045A (zh) * | 2007-10-18 | 2010-08-25 | E.I.内穆尔杜邦公司 | 无铅导电组合物以及用于制造半导体装置的方法:含镁添加剂 |
CN102549763A (zh) * | 2009-07-30 | 2012-07-04 | 株式会社则武 | 太阳能电池电极用无铅导电性组合物 |
CN102652118A (zh) * | 2009-12-18 | 2012-08-29 | E·I·内穆尔杜邦公司 | 用于光伏电池的导体中的玻璃组合物 |
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US8093491B2 (en) | 2005-06-03 | 2012-01-10 | Ferro Corporation | Lead free solar cell contacts |
US7736546B2 (en) | 2008-01-30 | 2010-06-15 | Basf Se | Glass frits |
US8383011B2 (en) | 2008-01-30 | 2013-02-26 | Basf Se | Conductive inks with metallo-organic modifiers |
JP4754655B2 (ja) | 2008-08-07 | 2011-08-24 | 京都エレックス株式会社 | 太陽電池素子の電極形成用導電性ペースト及び太陽電池素子並びにその太陽電池素子の製造方法 |
US20130284256A1 (en) | 2009-04-09 | 2013-10-31 | E I Du Pont De Nemours And Company | Lead-free conductive paste composition and semiconductor devices made therewith |
US20130049148A1 (en) | 2011-02-22 | 2013-02-28 | E I Du Pont De Nemours And Company | Conductive paste composition and semiconductor devices made therewith |
US9039942B2 (en) | 2011-12-21 | 2015-05-26 | E I Du Pont De Nemours And Company | Lead-free conductive paste composition and semiconductor devices made therewith |
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2014
- 2014-11-25 US US14/552,637 patent/US9761742B2/en active Active
- 2014-12-02 WO PCT/US2014/068085 patent/WO2015084801A2/en active Application Filing
- 2014-12-02 CN CN201480074542.1A patent/CN105940458B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1308345A (zh) * | 2000-02-09 | 2001-08-15 | 株式会社村田制作所 | 导电糊料和陶瓷电子元件 |
CN101816045A (zh) * | 2007-10-18 | 2010-08-25 | E.I.内穆尔杜邦公司 | 无铅导电组合物以及用于制造半导体装置的方法:含镁添加剂 |
CN102549763A (zh) * | 2009-07-30 | 2012-07-04 | 株式会社则武 | 太阳能电池电极用无铅导电性组合物 |
CN102652118A (zh) * | 2009-12-18 | 2012-08-29 | E·I·内穆尔杜邦公司 | 用于光伏电池的导体中的玻璃组合物 |
Also Published As
Publication number | Publication date |
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CN105940458B (zh) | 2018-08-17 |
US9761742B2 (en) | 2017-09-12 |
WO2015084801A2 (en) | 2015-06-11 |
WO2015084801A3 (en) | 2015-11-12 |
US20150155403A1 (en) | 2015-06-04 |
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