CN105932136A - Wide-angle light-emitting LED inverted circuit board module and method - Google Patents
Wide-angle light-emitting LED inverted circuit board module and method Download PDFInfo
- Publication number
- CN105932136A CN105932136A CN201610389121.9A CN201610389121A CN105932136A CN 105932136 A CN105932136 A CN 105932136A CN 201610389121 A CN201610389121 A CN 201610389121A CN 105932136 A CN105932136 A CN 105932136A
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 81
- 238000005538 encapsulation Methods 0.000 claims abstract description 46
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 238000007639 printing Methods 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 35
- 238000004020 luminiscence type Methods 0.000 claims description 12
- 238000004806 packaging method and process Methods 0.000 claims description 11
- 238000009156 water cure Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 6
- 238000003466 welding Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 241001062009 Indigofera Species 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a wide-angle light-emitting LED inverted circuit board module and a method. The method comprises the following steps of: manufacturing a circuit board, wherein an LED chip is welded on a welding spot of the circuit board in an inverted manner before manufacturing of the circuit board is completed and boundary materials of the circuit board are not removed; printing surrounding dam glue on the boundary materials of the circuit board, and applying encapsulation glue in a surrounding dam formed by the surrounding dam glue after the surrounding dam glue is solidified; and, after the encapsulation glue is solidified, cutting the exterior of the LED circuit board inverted module along a predetermined cutting line and removing the boundary materials and the surrounding dam glue on the boundary materials, such that the edge of the LED circuit board inverted module is aligned or nearly aligned to the edge of the encapsulation glue, wherein the LED inverted circuit board module, the light emitting angle of which is greater than or equal to 180 DEG, is prepared. The invention provides the LED inverted circuit board module.
Description
Technical field
The invention belongs to circuit-board industry and LED application, be specifically related to the luminous LED upside-down mounting wiring board of wide-angle, module and preparation method thereof.
Background technology
The LED area light source of traditional COB and COF encapsulation, is all to be trapped among on single package module by box dam glue, causes light-emitting area less than wiring board all the time, and lighting angle is less than 180 degree.
How to realize large area and wide-angle luminous, and LED light source module is fabricated to three-dimensional contouring, technical problem that always this area is studied all the time and the target of sustained improvement.
Summary of the invention
Many aspects and the advantage of the present invention will partly illustrate, or can be by this explanation it is clear that or can be learned by practice of the present invention.
How to realize large area and wide-angle is luminous, and when module folds and is combined into three-dimensional contouring again, reach the uninterrupted photoluminescence of continuous curve surface completely, this just requires the completely the same luminescence in edge and the inside of the LED circuit board encapsulation module made, and when solid is abandoned in folding, by edge tightly by together, the three-dimensional module uniformly light-emitting without boundary line could be realized.Therefore it is necessary to by phosphor gel water droplet to wiring board edge, and the fluorescent material glue at edge and the inside are completely the same, just can ensure that uniformity no color differnece.After being folded into solid, the most just can ensure that the most consistent whole uniformly light-emitting.Additionally when making large-scale area source, needing multiple small-sized module splicing-in, after splicing-in, piece is without the threshold of luminescence, it is also necessary to phosphor gel be uniformly applied on whole.
Present inventor visualizes, and after wiring board completes, before not cutting external form, takes flip-chip packaged LED chip, before welding LED chip (or afterwards) make a circle on the rim charge of wiring board box dam glue, applies encapsulation glue the most again.During excision external form, make wiring board edge and packaging plastic level neat, it is achieved that wiring board extends to the luminescence at edge, and is greater than the luminescence equal to 180 degree.
The basic inventive concept of according to the present invention one, before not removing rim charge after wiring board completes, by on LED chip face-down bonding to wiring board solder joint, printing box dam glue is on circuit edges of boards material, in box dam, encapsulation glue is applied again after solidification, solidification rear cutout external form removes the box dam glue on rim charge and rim charge, makes wiring board upside-down mounting module edge concordant with packaging plastic waterside edge or close to concordant.Thus, the lighting angle LED upside-down mounting wiring board module more than or equal to 180 degree i.e. it is made for.
According to the present invention, disclose a kind of method making the luminous LED upside-down mounting wiring board module of wide-angle, including: make or provide a wiring board, wherein before described wiring board completes but do not removes its rim charge, by LED chip face-down bonding to the solder joint of wiring board；Printing box dam glue, on the rim charge of described wiring board, applies encapsulation glue after described box dam adhesive curing again in the box dam that described box dam glue is formed；After described packaging plastic water cure, the external form that LED circuit board upside-down mounting module cut by line the box dam glue removing on rim charge and rim charge is cut along predetermined, and make the edge of described LED circuit board upside-down mounting module concordant with the edge of described encapsulation glue or close to concordant, thus, the lighting angle LED upside-down mounting wiring board module more than or equal to 180 degree is i.e. made.
Specifically, according to the present invention, it is provided that a kind of method making the luminous LED upside-down mounting wiring board module of wide-angle, including: make or a wiring board is provided, wherein before described wiring board completes but do not removes its rim charge, by LED chip face-down bonding to the solder joint of wiring board；Printing box dam glue, on the rim charge of described wiring board, applies encapsulation glue after described box dam adhesive curing again in the box dam region that described box dam glue is formed；After described packaging plastic water cure, cut the external form of LED circuit board upside-down mounting module along predetermined line of cutting and remove the box dam glue on rim charge and rim charge and the packaging plastic on rim charge, and make the edge of described LED circuit board upside-down mounting module concordant with the edge of described encapsulation glue or close to concordant, thus, the lighting angle LED upside-down mounting wiring board module more than or equal to 180 degree is i.e. made.
According to one embodiment of present invention, described wiring board is can bending the FPC of fixing moulding or Rigid Flex, make the described LED upside-down mounting wiring board module in use can bending fixing moulding, thus the seam that realizes abandoning is limitless continuously uninterrupted luminous, and make curved surface or the multifaceted light-emitting face that light-emitting area is integrally formed.
According to one embodiment of present invention, described wiring board is rigid plate, wherein, can form any large-area luminescence in LED upside-down mounting wiring board module splicing described in multi-disc when using, and luminescence seamless, it is possible to be fabricated to the larger panel lamp of continuous luminescence free of discontinuities.
According to one embodiment of present invention, described method is additionally included on described LED upside-down mounting wiring board module the step providing the solder joint connecting external circuitry: after described packaging plastic water cure, strike off the encapsulation glue covering predetermined solder joint, to expose the described solder joint connected with external circuitry.
According to one embodiment of present invention, described method is additionally included on described LED upside-down mounting wiring board module the step providing the solder joint connecting external circuitry: before applying described encapsulation glue, around the solder joint of predetermined connection external circuitry, drip the most runny box dam glue form the box dam surrounding solder joint, in the box dam of described encirclement solder joint, not applying to encapsulate glue, thus exposing described solder joint to connect conducting with external circuitry.
According to one embodiment of present invention, described method is additionally included on described LED upside-down mounting wiring board module the step providing the solder joint connecting external circuitry: before applying described encapsulation glue, the solder joint of predetermined connection external circuitry welds wire or the solder connector terminal of setting, apply described encapsulation glue the most again, and make the wire of described setting or bonder terminal reach and outside encapsulating glue, provide the solder joint for being connected conducting with external circuitry after applying described encapsulation glue.
According to one embodiment of present invention, described wiring board is the single-sided circuit board of the hollow out of double-sided PCB or two sides conducting, and wherein, the junction point being connected with external circuitry designs at the back side of described wiring board.
The invention also discloses the LED upside-down mounting wiring board module of a kind of wide-angle luminescence made according to said method.
According to one embodiment of present invention, by power supply apparatus and described LED upside-down mounting wiring board module design on same circuit board, thus make power supply and the resource integrated LED upside-down mounting module of light.
According to one embodiment of present invention, described LED upside-down mounting wiring board module is the wide-angle illuminating module made of Rigid Flex, wherein, described LED upside-down mounting wiring board module is directly folded and is formed the all-round smooth module of self-fixing self-supporting, is thus assembled into all-round smooth bulb.
According to the present invention, provide the all-round smooth bulb of LED of a kind of LED upside-down mounting wiring board module including the all-round smooth module of above-mentioned formation, wherein, the back side of described LED upside-down mounting wiring board module sticks with glue agent and pastes on the three-dimensional radiator surface being pre-designed coupling, then assembles and forms the all-round smooth bulb of described LED.
According to the present invention, it is provided that the flip LED wiring board module that a kind of wide-angle is luminous, including: wiring board；Face-down bonding LED chip on described wiring board；For the encapsulation glue that described LED chip is encapsulated on described wiring board, wherein, all or part of edge of described wiring board is concordant with the edge of described encapsulation glue, and, wherein, connecting the junction point of external circuitry on described wiring board is the solder joint exposed in the front or back of described wiring board, or has imbedded and be welded on described wiring board and exposed the wire outside described encapsulation glue or adapter.
According to one embodiment of present invention, described wiring board is the single-sided circuit board of the hollow out of double-sided PCB or two sides conducting, and wherein, the junction point being connected with external circuitry designs at the back side of described wiring board.
According to one embodiment of present invention, by power supply apparatus and described LED upside-down mounting wiring board module design on same circuit board, thus make power supply and the resource integrated LED upside-down mounting module of light.
According to one embodiment of present invention, described LED upside-down mounting wiring board module is the wide-angle illuminating module made of Rigid Flex, wherein, described LED upside-down mounting wiring board module is directly folded and is formed the all-round smooth module of self-fixing self-supporting, is thus assembled into all-round smooth bulb.
According to the present invention, additionally provide the all-round smooth bulb of LED of a kind of LED upside-down mounting wiring board module including the all-round smooth module of above-mentioned formation, wherein, the back side of described LED upside-down mounting wiring board module sticks with glue agent and pastes on the three-dimensional radiator surface being pre-designed coupling, then assembles and forms the all-round smooth bulb of described LED.
According to the present invention, additionally provide the flip LED wiring board module that a kind of wide-angle is luminous, including: wiring board；Face-down bonding LED chip on described wiring board；For the encapsulation glue that described LED chip is encapsulated on described wiring board, wherein, all or part of edge of described wiring board is concordant with the edge of described encapsulation glue, and wherein, connecting the junction point of external circuitry on described wiring board is the solder joint exposed in the front or back of described wiring board, or has imbedded and be welded on described wiring board and exposed the wire outside described encapsulation glue or adapter.
In the following description to the drawings and specific embodiments, the details of one or more embodiments of the invention will be illustrated.From these descriptions, accompanying drawing and claim, the other features, objects and advantages of the present invention can be understood.
With reference to following description and claims, these and other features, aspect and the advantage of the present invention are better understood with.In conjunction with in the description and constitute the accompanying drawing of a description part and illustrate embodiments of the invention, and for explaining the principle of the present invention together with explanation.
Accompanying drawing explanation
The disclosure describing the complete of the present invention for those of ordinary skill in the art in description and can implement, including its optimal mode, wherein refer to accompanying drawing as follows.
Fig. 1 is the schematic diagram of the wiring board according to the present invention one exemplary embodiment, which show and cuts line by the flip chip type LED module of slitting by be pre-designed, and shows wiring board peripheral edge to be punched.
Fig. 2 is the schematic diagram of wiring board shown in Fig. 1, is wherein applied with box dam glue.
Fig. 3 is the schematic diagram of another angle according to the wiring board shown in one embodiment of the invention, Fig. 2, wherein has been completed the encapsulation of flip chip type LED module, it is illustrated that encapsulation glue.
Fig. 4 be according to one embodiment of the invention, from circuit board shown in Fig. 3, cut the enlarged diagram of the flip chip type LED module got off along predetermined line of cutting, wherein schematically illustrate the junction point pad connecting external circuitry on predetermined wiring board by two circles.
Fig. 5 be according to one embodiment of the invention, from circuit board shown in Fig. 3, cut the enlarged diagram of the flip chip type LED module got off along predetermined line of cutting, wherein schematically illustrate the structure exposed after striking off the encapsulation glue covered at extraneous circuit connection point.
Fig. 6 is the LED upside-down mounting wiring board module of the wide-angle luminescence manufactured according to one embodiment of the invention, and it such as can become the finished product of diagram according to module assembled folding shown in Fig. 5.
Description of reference numerals
1 wiring board
1.1 be pre-designed cut line when cutting profile
The junction point (solder joint) of external circuitry is connected on 1.2 wiring boards
2 LED flip chip
3 box dam glue
4 encapsulation glue
4.1 strike off the encapsulation glue covered at extraneous circuit connection point after the structure exposed
Detailed description of the invention
Below with reference to the accompanying drawings multiple non-limiting examples of the present invention are described in detail.
It will be understood by those skilled in the art, however, that these embodiments only list some the preferred embodiments of the present invention, without any restrictions to the present invention and protection domain thereof.The embodiment related in this specification be intended merely to explain the present invention principle and and unrestricted the scope of the present invention.
Before describing the present invention in detail, skilled artisan would appreciate that, in addition, term " wiring board " and " circuit board " have identical meanings in the application and can be used interchangeably, and term " circuit " and " circuit " also have identical meanings in the application and can be used interchangeably.
Skilled artisan would appreciate that, flip type LED chip (or claiming " LED flip chip ") in the present invention can be any kind of LED chip, including assorted long wave LED chip, indigo plant, green LED chip, emit white light or the illumination LED chip of gold-tinted, all kinds of high-power LED chips, etc..
First, can directly provide or produce one-sided circuit board 1 as shown in Figure 1 by traditional method, as shown in Figure 1.Certainly, the present invention is also the same double-sided wiring board or the double-sided wiring board of multilayer circuit board, such as the following stated, or hollow out wiring board, light bar.
The some embodiments of the method for the present invention are further elucidated below.
Specific embodiment 1
Use tin cream die bond to wiring board 1 flip type LED chip 2 by bonder, such as, pass through Reflow Soldering by LED flip chip 2 face-down bonding to wiring board 1 (as shown in Figure 1).Wherein, such as, LED flip chip 2 can be flip-chip mounted on wiring board 1 by COB or COF mode, and pull in advance according to predetermined design and cut line 1.1 for cut that wiring board obtains LED upside-down mounting wiring board module in the future.
Afterwards, line 1.1 is cut preferably about whole, and drip upper or print box dam glue 3 to the peripheral rim charge of wiring board 1, such as, the box dam glue 3 of available printing opacity or lighttight box dam glue 3 surround or block encapsulation glue 4, make on the junction point 1.2 of the external external circuitry that encapsulation glue 4 do not flows to wiring board 1, thus obtain circuit board structure the most as shown in Figure 2.Or, as another alternative embodiment, the wire erect in solder connector or welding on one-sided circuit board 1, dropping encapsulation glue 4 the most again.
Afterwards, after heated baking cure package glue 4, available mould along cutting the die-cut wiring board of line 1.1 1, such as, makes wiring board 1 edge the most concordant with packaging plastic waterside edge or close to concordant, thus, LED upside-down mounting module (the most as seen in figs. 5-6) that wide-angle is luminous i.e. it is made for.
Specific embodiment 2
After one-sided circuit board 1 is made, by bonder by LED chip 2 tin cream die bond to wiring board 1, Reflow Soldering makes LED chip 2 be welded on wiring board 1, drip box dam glue 3 to the peripheral rim charge of wiring board 1, dropping encapsulation glue 4 is in box dam glue 3 the most again, after heated baking cure package glue 4, along the predetermined line 1.1 die-cut wiring board of mould 1 of cutting, and make wiring board 1 edge concordant with encapsulation glue 4 edge.Divest/strike off the structure after the encapsulation glue covered at extraneous circuit connection point 1.2 with blade, expose the structure 4.1 exposed after striking off the encapsulation glue covered at extraneous circuit connection point on wiring board 1, i.e. with solder joint or the pad of external circuitry conductive communication.By such as cutting after line 1.1 cuts along predetermined, i.e. can be made into LED upside-down mounting module (the most as seen in figs. 5-6) that wide-angle is luminous.
Specific embodiment 3
After double-sided PCB or hollow out wiring board 1 are made, the junction point 1.2 connecting extraneous power supply it is provided with at the back side of wiring board 1, and the Flip-chip solder joint of LED chip 2 is set in the front of wiring board 1, by bonder by LED chip 2 tin cream upside-down mounting die bond to the front of wiring board 1, Reflow Soldering makes LED chip 2 be welded on wiring board 1 front, then to the peripheral rim charge in wiring board 1 front and heating is allowed to solidify to drip box dam glue 3, dropping encapsulation glue 4 is in box dam glue 3 the most again, after heated baking cure package glue 4, such as make the edge of wiring board 1 concordant with the edge of encapsulation glue 4 along the predetermined die-cut wiring board of line 1.1 1 of cutting with mould, thus, i.e. it is made for LED upside-down mounting module (the most as seen in figs. 5-6) that wide-angle is luminous.
Above in association with accompanying drawing, the present invention is described in detail by some specific embodiments of the present invention.It will be understood by those skilled in the art, however, that the above is merely illustrative and describes some detailed description of the invention, the scope to the scope of the present invention, especially claim, not there is any restriction.
Those of ordinary skill in the art, when understanding basic idea of the present invention, can carry out some obviously change and changes to these, and these broadly fall in the scope of the present invention.Those skilled in the art is it is appreciated that many is retrofited and change.It will thus be appreciated that appended claims is intended to these type of remodeling whole and the change covering in the spirit falling into the present invention.The scope of the present invention is defined solely by the appended claims.
Claims (12)
1. the method making the luminous LED upside-down mounting wiring board module of wide-angle, including:
Make a wiring board, wherein described wiring board complete but do not remove its rim charge it
Before, by LED chip face-down bonding to the solder joint of wiring board；
Printing box dam glue is on the rim charge of described wiring board, again in institute after described box dam adhesive curing
Encapsulation glue is applied in stating the box dam region that box dam glue is formed；
After described packaging plastic water cure, cut LED circuit board upside-down mounting along predetermined line of cutting
The external form of module also removes the box dam glue on rim charge and rim charge and the packaging plastic on rim charge, and
Make the edge of described LED circuit board upside-down mounting module concordant with the edge of described encapsulation glue or connect
The most concordant, thus, i.e. make the lighting angle LED upside-down mounting circuit more than or equal to 180 degree
Template die group.
Method the most according to claim 1, it is characterised in that described wiring board is can
Bending the FPC of fixing moulding or Rigid Flex so that described LED upside-down mounting line
Road template die group in use can bending fixing moulding, thus the seam that realizes abandoning is limitless continuously
Uninterrupted luminous, and make curved surface or the multifaceted light-emitting face that light-emitting area is integrally formed.
Method the most according to claim 1, it is characterised in that described wiring board is rigidity
Plate, wherein, can be formed arbitrarily when using in LED upside-down mounting wiring board module splicing described in multi-disc
Large-area luminescence, and luminous seamless, it is possible to be fabricated to continuous luminescence free of discontinuities
Larger panel lamp.
Method the most according to claim 1, it is characterised in that described method is additionally included in
The step of the solder joint of offer connection external circuitry on described LED upside-down mounting wiring board module:
After described packaging plastic water cure, strike off the encapsulation glue covering predetermined solder joint, with
Expose the described solder joint connected with external circuitry.
Method the most according to claim 1, it is characterised in that described method is additionally included in
The step of the solder joint of offer connection external circuitry on described LED upside-down mounting wiring board module:
Before applying described encapsulation glue, drip around the solder joint of predetermined connection external circuitry
Add the most runny box dam glue and form the box dam surrounding solder joint, in the box dam of described encirclement solder joint
Do not apply to encapsulate glue, thus expose described solder joint to connect conducting with external circuitry.
Method the most according to claim 1, it is characterised in that described method is additionally included in
The step of the solder joint of offer connection external circuitry on described LED upside-down mounting wiring board module:
Before applying described encapsulation glue, the solder joint of predetermined connection external circuitry welds
The wire erect or solder connector terminal, apply described encapsulation glue the most again, and
The wire of described setting or bonder terminal is made to reach packaging plastic after applying described encapsulation glue
The external offer of water for being connected the solder joint of conducting with external circuitry.
Method the most according to claim 1, it is characterised in that described wiring board is two-sided
The single-sided circuit board of the hollow out of circuit board or two sides conducting, wherein, is connected with external circuitry
Junction point design at the back side of described wiring board.
8. the wide-angle made according to the method according to any one of claim 1-8 is sent out
The LED upside-down mounting wiring board module of light.
LED upside-down mounting wiring board module the most according to claim 8, it is characterised in that
By power supply apparatus and described LED upside-down mounting wiring board module design on same circuit board, thus make
Become power supply and the resource integrated LED upside-down mounting module of light.
LED upside-down mounting wiring board module the most according to claim 8, it is characterised in that
Described LED upside-down mounting wiring board module is the wide-angle illuminating module made of Rigid Flex, its
In, described LED upside-down mounting wiring board module is directly folded and is formed the all-round of self-fixing self-supporting
Light module, is thus assembled into all-round smooth bulb.
11. 1 kinds of LED including the all-round smooth module of formation according to claim 10 fall
The all-round smooth bulb of LED of wiring road template die group, wherein, described LED upside-down mounting wiring board module
The back side stick with glue agent and paste on the three-dimensional radiator surface being pre-designed coupling, then assemble
Form the all-round smooth bulb of described LED.
The flip LED wiring board module that 12. 1 kinds of wide-angles are luminous, including:
Wiring board；
Face-down bonding LED chip on described wiring board；
For the encapsulation glue that described LED chip is encapsulated on described wiring board,
Wherein, all or part of edge of described wiring board is put down with the edge of described encapsulation glue
Together, and
Wherein, the junction point described wiring board connecting external circuitry at described wiring board is just
The solder joint that face or reverse side expose, or imbedded and be welded on described wiring board and exposed institute
State the wire outside encapsulation glue or adapter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610389121.9A CN105932136B (en) | 2016-06-02 | 2016-06-02 | A kind of LED upside-down mounting wiring board modules and method that wide-angle is luminous |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610389121.9A CN105932136B (en) | 2016-06-02 | 2016-06-02 | A kind of LED upside-down mounting wiring board modules and method that wide-angle is luminous |
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| Publication Number | Publication Date |
|---|---|
| CN105932136A true CN105932136A (en) | 2016-09-07 |
| CN105932136B CN105932136B (en) | 2018-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610389121.9A Active CN105932136B (en) | 2016-06-02 | 2016-06-02 | A kind of LED upside-down mounting wiring board modules and method that wide-angle is luminous |
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| CN109869648A (en) * | 2019-02-26 | 2019-06-11 | 上海应用技术大学 | One kind exempting from stem LED filament lamp and preparation method thereof |
| WO2021042968A1 (en) * | 2019-09-05 | 2021-03-11 | 王定锋 | Waterproof led lamp strip made of light-transmitting and waterproof glue and manufacturing method therefor |
| CN112705915A (en) * | 2020-01-21 | 2021-04-27 | 羽源洋(宁波)科技有限公司 | Light source manufacturing method of rotary type curved surface light source production robot |
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| WO2021212696A1 (en) * | 2020-04-25 | 2021-10-28 | Wang Dingfeng | Led glue dripping light strip, and manufacturing method therefor |
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| CN106601134A (en) * | 2016-10-26 | 2017-04-26 | 上海得倍电子技术有限公司 | Display screen module structure and manufacturing method of display screen module |
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| CN109869648B (en) * | 2019-02-26 | 2021-05-18 | 上海应用技术大学 | Core-stem-free LED filament lamp and preparation method thereof |
| WO2021042968A1 (en) * | 2019-09-05 | 2021-03-11 | 王定锋 | Waterproof led lamp strip made of light-transmitting and waterproof glue and manufacturing method therefor |
| CN112705915A (en) * | 2020-01-21 | 2021-04-27 | 羽源洋(宁波)科技有限公司 | Light source manufacturing method of rotary type curved surface light source production robot |
| CN112705915B (en) * | 2020-01-21 | 2022-07-01 | 深圳市佳康捷科技有限公司 | Light source manufacturing method of rotary type curved surface light source production robot |
| WO2021212704A1 (en) * | 2020-04-25 | 2021-10-28 | 王定锋 | Waterproof led lamp strip manufactured by waterproof adhesive, and manufacturing method therefor |
| WO2021212696A1 (en) * | 2020-04-25 | 2021-10-28 | Wang Dingfeng | Led glue dripping light strip, and manufacturing method therefor |
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Effective date of registration: 20190605 Address after: 516006 May 1 Industrial Zone, Chenjiang Town, Huicheng District, Huizhou City, Guangdong Province Patentee after: Huizhou State Fair Electronics Co., Ltd. Address before: 516000 National Exhibition Industrial Zone of Chenjiang Avenue, Chenjiang Town, Huizhou City, Guangdong Province (Huizhou National Exhibition Electronics Co., Ltd.) Patentee before: Wang Dingfeng |