CN105925951A - Crystal control device with six wafers - Google Patents
Crystal control device with six wafers Download PDFInfo
- Publication number
- CN105925951A CN105925951A CN201610531104.4A CN201610531104A CN105925951A CN 105925951 A CN105925951 A CN 105925951A CN 201610531104 A CN201610531104 A CN 201610531104A CN 105925951 A CN105925951 A CN 105925951A
- Authority
- CN
- China
- Prior art keywords
- wafer
- rotating shaft
- wafers
- shell
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
- C23C14/546—Controlling the film thickness or evaporation rate using measurement on deposited material using crystal oscillators
Landscapes
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a crystal control device with six wafers, comprising a shell, a rotating shaft, an air cylinder, a shaft coupling and a probe assembly, wherein the shell is tubular, and the top of the shell is fixedly provided with an upper cover; the rotating shaft is located in the shell, and the top of the rotating shaft passes through the upper cover; a cylinder body of the air cylinder is fixedly arranged at the top of the upper cover through a support frame, and a piston rod of the air cylinder is connected with the rotating shaft through the shaft coupling; and the probe assembly comprising six sets of wafers is fixedly arranged at the bottom of the rotating shaft. According to the crystal control device, the dispersed parts of the crystal control device are integrated, the crystal control device is matched with the six sets of wafers, a wafer mounting rack is connected with the rotating shaft, and the rotating shaft drives the wafer mounting rack to rotate, so that the aim of automatically switching the wafers is achieved; meanwhile, six sets of limit switches arranged in the air cylinder can be used for precisely controlling the rotating angles of the wafers; and by using the crystal control device, the frequency for replacing the wafers is reduced, and the production rate is increased.
Description
Technical field
The present invention relates to field of vacuum coating, particularly to a kind of six wafer crystalline substance control devices.
Background technology
Brilliant control device is to utilize the relation between the resonant frequency of quartz wafer and thicknesses of layers to control the thickness of plated film, the internally installed wafer of existing coating machine only has 1 group, is required for changing after each plated film, owing to the process changed is the most loaded down with trivial details, therefore, the efficiency of coating machine is the highest；And existing brilliant control apparatus structure too disperses, the part of each several part is arranged in coating machine, easily collides these parts when laying the parts needing plated film every time, causes the damage of brilliant control device.
Summary of the invention
In order to solve the problems referred to above, the goal of the invention of the present invention there is provided a kind of six wafer crystalline substance control devices, and after solving present plated film, wafer is required for the problem changed in time.
It is an object of the invention to be achieved through the following technical solutions:
A kind of six wafer crystalline substance control devices, including shell, rotating shaft, cylinder, shaft coupling and probe assembly, shell is tubulose, cover top portion is further fixed on upper cover, rotating shaft is positioned at shell and rotating shaft top through upper cover, the cylinder body of cylinder is fixed on upper tops by support, and its piston rod is connected with rotating shaft by shaft coupling, is fixed on the bottom of rotating shaft including the probe assembly of 6 groups of wafers.
Described cylinder interior is provided with 6 groups of limit switches, and 6 groups of limit switches are uniformly distributed the top of cylinder ringwise.
On the sidewall of described cylinder, Pneumatic dividing head is installed.
Described probe assembly includes refrigerating seat, wafer mount, probe and sliding bearing, probe assembly is positioned at enclosure and is arranged on shell bottom, rotating shaft is fixed by latch through refrigerating seat with wafer mount, and probe is arranged on above wafer mount, and probe contacts with wafer mount.
Described wafer mount includes mounting flange, pallet and wafer, pallet is connected with refrigerating seat by mounting flange, and 6 groups of wafers are the most uniformly arranged in the groove of mounting flange, and pallet has bellmouth, wherein 1 group of wafer is positioned at bellmouth, and overlaps with the center line of bellmouth.
Being also equipped with cooling pipe in described shell, the two ends of cooling pipe are mounted on connector, and connector inserts upper cover and is connected with cooling pipe.
The invention have the benefit that the parts of scattered brilliant control device are integrated by the present invention, and it is furnished with 6 groups of wafers, wafer mount is connected with rotating shaft, rotating shaft drives wafer mount to rotate, realizing the purpose of automatic switchover wafer, meanwhile, 6 groups of limit switches that cylinder interior is installed can accurately control the anglec of rotation of wafer, The present invention reduces the number of times changing wafer, improve productivity ratio.
Accompanying drawing explanation
Below in conjunction with the detailed description of the invention of accompanying drawing illustrated embodiment, the foregoing of the present invention is described in further detail again.
Fig. 1 is present configuration schematic diagram；
Fig. 2 is profile of the present invention；
Fig. 3 is probe assembly profile of the present invention；
Fig. 4 is wafer mount profile of the present invention；
Fig. 5 is wafer scheme of installation of the present invention.
Figure marks: 1-shell, 11-upper cover, 12-rotating shaft, 13-cooling pipe, 14-connector, 2-cylinder, 21-support, 22-shaft coupling, 23-Pneumatic dividing head, 3-probe assembly, 31-refrigerating seat, 32-wafer mount, 321-latch, 322-mounting flange, 323-pallet, 324-wafer, 325-bellmouth, 33-probe, 34-sliding bearing.
Detailed description of the invention
As shown in Fig. 1 ~ 4, the present invention includes shell 1, upper cover 11, rotating shaft 12, cylinder 2, shaft coupling 22 and probe assembly 3, described shell 1 is tubulose, shell 1 top is provided with upper cover 11, rotating shaft 12 is arranged in shell 1, and rotating shaft 12 upper end is fixed on upper cover 11 top through upper cover 11, the cylinder body of cylinder 2 by support 21, the piston rod of cylinder 2 is connected with rotating shaft 12 by shaft coupling 22, and probe assembly 3 is fixed on the bottom of rotating shaft 12.Cylinder 2 is internally installed 6 groups of limit switches, and 6 groups of limit switches are evenly distributed on cylinder 2 top ringwise, for accurately controlling the anglec of rotation of rotating shaft 12, the sidewall of cylinder 2 is also equipped with two Pneumatic dividing heads 23, provides rotary power to rotating shaft 12.
Described probe assembly 3 includes refrigerating seat 31, wafer mount 32, probe 33 and sliding bearing 34, refrigerating seat 31 is positioned at shell 1 inside and is arranged on bottom shell 1 by sliding bearing 34, rotating shaft 12 is fixed by latch 321 through refrigerating seat 31 with wafer mount 32, probe 33 is arranged on above wafer mount 32, and probe 33 contacts with wafer mount 32.
Described wafer mount 32 includes mounting flange 322, pallet 323 and wafer 324, pallet 323 is connected with refrigerating seat 31 by mounting flange 322, described wafer 324 has 6 groups, 6 groups of wafers are uniformly distributed ringwise and are arranged in the groove of mounting flange 322, bellmouth 325 is had on pallet 323, wherein 1 group of wafer is positioned at bellmouth 325, and overlaps with the center line of bellmouth 325.
Described probe 33 overlaps with the center line of bellmouth 325.
Being also equipped with cooling pipe 13 in described shell 1, the two ends of cooling pipe 13 are mounted on connector 14, and connector 14 stretches out upper cover 11 and is connected with external pipe.
The use process of the present invention is: crystalline substance is controlled device and is arranged on inside coating machine, afterwards the connector 14 of Pneumatic dividing head 23 and cooling pipe 13 is connected with external interface, it is subsequently placed into the product needing plated film, shut the door of coating machine, then the material in heating crucible, material is made to volatilize, material is attached to product and the surface of wafer 324, heating is stopped when the material on wafer 324 surface reaches certain thickness, then take out product, it is subsequently placed into lower set product, now cylinder 2 drives rotating shaft 12 to rotate 60 °, accurately controlled the angle rotated by limit switch during rotation, make wafer mount 32 follow rotating shaft 12 and rotate 60 °, mobile lower group wafer is at bellmouth 325, then repeat the above steps continues processing, until after wafer 324 all uses, change wafer 324.
The object of the invention, technical scheme and advantage are further described by the lifted embodiment of the present invention or embodiment; it is it should be understood that; embodiment provided above or embodiment are only the preferred embodiment of present invention; not in order to limit present invention; the any modification, equivalent substitution and improvement etc. within all spirit in the object of the invention and principle made present invention, within should be included in the object of the invention protection domain.
Claims (6)
1. a wafer crystalline substance control device, it is characterized in that: include shell, rotating shaft, cylinder, shaft coupling and probe assembly, shell is tubulose, cover top portion is fixed with upper cover, rotating shaft is positioned at shell and rotating shaft top through upper cover, the cylinder body of cylinder is fixed on upper tops by support, and its piston rod is connected with rotating shaft by shaft coupling, is fixed on the bottom of rotating shaft including the probe assembly of 6 groups of wafers.
Six wafer crystalline substance control devices the most according to claim 1, it is characterised in that: described cylinder interior is provided with 6 groups of limit switches, and 6 groups of limit switches are uniformly distributed the top of cylinder ringwise.
Six wafer crystalline substance control devices the most according to claim 2, it is characterised in that: on the sidewall of described cylinder, Pneumatic dividing head is installed.
Six wafer crystalline substance control devices the most according to claim 1, it is characterized in that: described probe assembly includes refrigerating seat, wafer mount, probe and sliding bearing, probe assembly is positioned at enclosure and is arranged on outer casing bottom, rotating shaft is fixed by latch through refrigerating seat with wafer mount, probe is arranged on above wafer mount, and probe contacts with wafer mount.
Six wafer crystalline substance control devices the most according to claim 4, it is characterized in that: described wafer mount includes mounting flange, pallet and wafer, pallet is connected with refrigerating seat by mounting flange, 6 groups of wafers are the most uniformly arranged in the groove of mounting flange, bellmouth is had on pallet, wherein 1 group of wafer is positioned at bellmouth, and overlaps with the center line of bellmouth.
Six wafer crystalline substance control devices the most according to claim 1, it is characterised in that: being also equipped with cooling pipe in described shell, the two ends of cooling pipe are mounted on connector, and connector inserts upper cover and is connected with cooling pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610531104.4A CN105925951B (en) | 2016-07-07 | 2016-07-07 | A kind of six chip crystalline substance control devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610531104.4A CN105925951B (en) | 2016-07-07 | 2016-07-07 | A kind of six chip crystalline substance control devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105925951A true CN105925951A (en) | 2016-09-07 |
| CN105925951B CN105925951B (en) | 2018-08-24 |
Family
ID=56827015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610531104.4A Active CN105925951B (en) | 2016-07-07 | 2016-07-07 | A kind of six chip crystalline substance control devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105925951B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002075017A1 (en) * | 2001-03-16 | 2002-09-26 | 4Wave, Inc. | System and method for controlling deposition thickness |
| CN2911757Y (en) * | 2006-05-09 | 2007-06-13 | 北京奥博泰科技有限公司 | Intelligent optical membrane full automatic monitoring system |
| CN101161856A (en) * | 2007-02-01 | 2008-04-16 | 河南中光学集团有限公司 | Optical coating film thickness monitoring automatic control system and monitoring method |
| CN202913055U (en) * | 2012-10-31 | 2013-05-01 | 上海膜林科技有限公司 | Discrete type crystal-controlled film thickness control device |
| CN203559116U (en) * | 2013-09-22 | 2014-04-23 | 无锡启晖光电科技有限公司 | Vacuum coating machine |
| CN104992734A (en) * | 2015-05-22 | 2015-10-21 | 中广核检测技术有限公司 | Reactor pressure vessel bottom head penetration piece outer wall inspection apparatus |
| CN105506560A (en) * | 2016-01-13 | 2016-04-20 | 中国科学院上海光学精密机械研究所 | Method for raising refractive index of hafnium oxide film |
-
2016
- 2016-07-07 CN CN201610531104.4A patent/CN105925951B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002075017A1 (en) * | 2001-03-16 | 2002-09-26 | 4Wave, Inc. | System and method for controlling deposition thickness |
| CN2911757Y (en) * | 2006-05-09 | 2007-06-13 | 北京奥博泰科技有限公司 | Intelligent optical membrane full automatic monitoring system |
| CN101161856A (en) * | 2007-02-01 | 2008-04-16 | 河南中光学集团有限公司 | Optical coating film thickness monitoring automatic control system and monitoring method |
| CN202913055U (en) * | 2012-10-31 | 2013-05-01 | 上海膜林科技有限公司 | Discrete type crystal-controlled film thickness control device |
| CN203559116U (en) * | 2013-09-22 | 2014-04-23 | 无锡启晖光电科技有限公司 | Vacuum coating machine |
| CN104992734A (en) * | 2015-05-22 | 2015-10-21 | 中广核检测技术有限公司 | Reactor pressure vessel bottom head penetration piece outer wall inspection apparatus |
| CN105506560A (en) * | 2016-01-13 | 2016-04-20 | 中国科学院上海光学精密机械研究所 | Method for raising refractive index of hafnium oxide film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105925951B (en) | 2018-08-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203156747U (en) | Automatic feeding and discharging mechanical arm | |
| CN108906476B (en) | Automatic coating machine for plastic film surface | |
| JP2015162677A (en) | substrate processing apparatus and substrate processing method | |
| WO2020124692A1 (en) | Glass hot bending loading and unloading machine | |
| CN204039274U (en) | Drawer type batch leaching glaze device | |
| CN104230384B (en) | Drawer type batch leaching glaze device | |
| KR101299843B1 (en) | Processing device and maintenance method thereof | |
| CN106827768B (en) | Application of a surface equipment and its applying method | |
| CN104086226B (en) | Conveyor type box-shaped leaching glaze device | |
| KR102243370B1 (en) | Substrate processing equipment | |
| CN105925951A (en) | Crystal control device with six wafers | |
| CN104086227B (en) | A kind of conveyor type automatic infiltration glaze device | |
| CN220027520U (en) | Paint spraying device for gas valve | |
| CN103602950B (en) | Evaporation source and evaporation source apparatus | |
| CN211075049U (en) | Full-automatic glove screen printing machine | |
| KR101003725B1 (en) | Vacuum Processing Apparatus | |
| CN104086232A (en) | Rotary plate type automatic glaze dipping device | |
| CN105200387B (en) | Heating control apparatus and Pvd equipment | |
| CN107962501B (en) | The anti-dazzle surface processing equipment of special-shaped glass cover board with angle | |
| CN104086228B (en) | Adjustable swing arm glaze spraying device | |
| CN205984931U (en) | Positioner suitable for different dimensions wafers | |
| KR101587335B1 (en) | Apparatus for Transferring Substrate | |
| CN207504698U (en) | A kind of motor hold-down support | |
| CN204162608U (en) | Adjustable swing arm glaze spraying device | |
| CN216514107U (en) | Coating device of silicon carbide single crystal wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210224 Address after: 628017 no.059 Fushun street, Weizi Town, Zhaohua District, Guangyuan City, Sichuan Province Patentee after: Wang Wei Address before: 618 Kelin West Road, Chengdu cross strait science and Technology Industrial Development Park, Wenjiang District, Chengdu, Sichuan 610000 Patentee before: CHENGDU GUOTAI VACUUM EQUIPMENT Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210820 Address after: 618 Kelin West Road, Chengdu cross strait science and Technology Industrial Development Park, Wenjiang District, Chengdu, Sichuan 610000 Patentee after: Sichuan Jincheng Guotai Vacuum Equipment Co.,Ltd. Address before: 628017 no.059 Fushun street, Weizi Town, Zhaohua District, Guangyuan City, Sichuan Province Patentee before: Wang Wei |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220107 Address after: 618 Kelin West Road, Chengdu cross strait science and Technology Industrial Development Park, Wenjiang District, Chengdu, Sichuan 610000 Patentee after: CHENGDU GUOTAI VACUUM EQUIPMENT CO.,LTD. Address before: 618 Kelin West Road, Chengdu cross strait science and Technology Industrial Development Park, Wenjiang District, Chengdu, Sichuan 610000 Patentee before: Sichuan Jincheng Guotai Vacuum Equipment Co.,Ltd. |