CN105917145A - 用于制造具有形状配合连接的外壳部件元件的电子模块的方法 - Google Patents

用于制造具有形状配合连接的外壳部件元件的电子模块的方法 Download PDF

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Publication number
CN105917145A
CN105917145A CN201480068598.6A CN201480068598A CN105917145A CN 105917145 A CN105917145 A CN 105917145A CN 201480068598 A CN201480068598 A CN 201480068598A CN 105917145 A CN105917145 A CN 105917145A
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CN
China
Prior art keywords
case member
circuit board
member element
board component
subregion
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Pending
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CN201480068598.6A
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English (en)
Inventor
H.奥特
G.韦策尔
G.卡默
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Robert Bosch GmbH
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Robert Bosch GmbH
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Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of CN105917145A publication Critical patent/CN105917145A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1432—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface direct heating of the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1632—Laser beams characterised by the way of heating the interface direct heating the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1677—Laser beams making use of an absorber or impact modifier
    • B29C65/168—Laser beams making use of an absorber or impact modifier placed at the interface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/60—Riveting or staking
    • B29C65/606—Riveting or staking the rivets being integral with one of the parts to be joined, i.e. staking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/72—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/13—Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
    • B29C66/131—Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
    • B29C66/3032—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined
    • B29C66/30321—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of protrusions belonging to at least one of the parts to be joined
    • B29C66/30322—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of protrusions belonging to at least one of the parts to be joined in the form of rugosity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B29C66/322—Providing cavities in the joined article to collect the burr
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B29C66/712—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined the composition of one of the parts to be joined being different from the composition of the other part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/721—Fibre-reinforced materials
    • B29C66/7212—Fibre-reinforced materials characterised by the composition of the fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7316—Surface properties
    • B29C66/73161—Roughness or rugosity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
    • B29K2309/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2663/00—Use of EP, i.e. epoxy resins or derivatives thereof for preformed parts, e.g. for inserts
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Abstract

描述一种用于制造电子模块的方法，其中提供电路板元件(1)并且在电路板元件(1)上安装外壳部件元件(15)。外壳部件元件(15)在此首先被单独地制造和提供。外壳部件元件(15)由一种可以可逆地塑化的材料形成，如例如热塑性塑料，例如聚酰胺。外壳部件元件(15)的表面的至少一个部分区域(18)然后被可逆地塑化，例如通过局部加热，尤其是通过用光照射。外壳部件元件(15)然后通过将外壳部件元件的表面的塑化的部分区域与电路板元件的一个微结构化的部分区域(7)接合在一起和接着凝固塑化的部分区域(18)被安装在电路板元件(1)上。由此在外壳部件元件(15)和电路板元件(1)之间产生一种形状配合的和气密的连接。

Description

用于制造具有形状配合连接的外壳部件元件的电子模块的方法
发明领域
本发明涉及一种用于制造具有电路板元件和安装在其上的外壳部件元件的电子模块的方法。
现有技术
电子模块一般用于形成电气电路。电气电路例如可以是控制器的一部分。尤其是在机动车制造中电子模块被用于提供机动车控制器。在电子模块中在此通常在一个电路板元件上设置许多电子元器件，它们借助于印制导线合适地相互电连接。
尤其是对于机动车中的变速器控制器，可以有利的是，在一个区域中布置相应的电子模块，在该区域中它承受腐蚀性介质。电子模块变速器控制器可以例如布置在机动车变速器内部中，在此处例如化学腐蚀性的变速器机油、脏物或碎屑可能与电子模块接触。由于至少设置在电子模块上的元器件，印制导线，等等的部分相对于这种腐蚀性介质或颗粒物可能是敏感的，因此可能需要通过气密的外壳来保护它们。
已经建议将一个安装电子元器件的电路板元件直接地作为这种外壳的一部分来使用并且在这个电路板元件安装一个或多个外壳部件元件。外壳部件元件在此例如可以是盖或框架，其必要时与其它的部件一起和尤其是与电路板元件一起形成外壳。电路板元件在此可以与这个外壳部件元件或这些外壳部件元件一起气密地围住一个空间，电子元器件可以被容纳在其中，保护其免受环境的介质影响。
例如在DE102012213917A1中描述，电路板元件的一个表面在一个环形部分区域中配置一个微结构和接着在这个微结构化的部分区域上喷注塑料，以便因此形成框架或盖元件。注塑的塑料在此可以在首先液态状态下侵入微结构化的部分区域中的空穴中和在接着的硬化期间与电路板元件进入形状配合的连接。
但是在这种用于将外壳部件元件安装在电路板元件上的方法中整个电路板元件必须置于注塑模具中。在注塑过程期间在此电路板元件和可能已经安装在其上的电子元器件可能被损坏或脏污。
本发明的公开
按照本发明的实施方式建议一种用于制造电子模块的方法，其中可以以有利的方式取消将电路板元件置于注塑模具中。与此相应地可以使损坏或脏污的危险最小化。
按照本发明的用于制造电子模块的方法至少具有以下步骤:提供电路板元件，它在电路板元件的表面上具有至少一个电子元器件以及一个微结构化的部分区域，和将外壳部件元件安装在电路板元件上。建议的方法的特征在于，在电路板元件上安装外壳部件元件的步骤具有以下的分步骤:首先提供单独制造的外壳部件元件，其中，外壳部件元件由可以可逆地塑化的材料构造成。然后这个外壳部件元件的表面的至少一个部分区域被可逆地塑化。接着，通过将外壳部件元件的表面的塑化的部分区域与电路板元件的微结构化的部分区域接合在一起和接着凝固外壳部件元件的表面的塑化的部分区域，将外壳部件元件安装在电路板元件上。
建议的方法的构思除了其它方面以外可以理解为基于以下描述的想法和认识:
用于电子模块的电路板元件常常由一种材料制成如例如热固性材料，例如环氧树脂，其可以通过常规的方法常常仅仅在借助于一些措施下与其它的材料连接，在这些措施中电子电路板元件上的电子部件可能被损坏。
由热固性塑料制造的电路板元件例如可以至今为止大多数仅仅在借助于温控步骤下与其它的材料粘接，其中，电子元器件在此期间产生的高温下可能受到损伤。尤其地，以简单的和低损伤的方式长期地不仅机械稳定地而且气密地将热固性电路板元件与其它的材料粘接起来，已经证明是非常困难的。
因此建议，电路板元件至少在部分区域中专门地配设有微结构。这种微结构与电路板元件的其它光滑的表面的区别在于，该表面具有一定的粗糙度，其通过在表面中的显微的凹部限定。微结构例如可以通过借助于激光照射产生，由此电路板元件的材料的一些部分通过激光射线的吸收被去除并且由此可以形成显微地小的凹部，它们形成微结构。
但是至今为止建议在电路板元件上固定外壳部件元件，其方式是外壳部件元件应该直接地借助于注塑工艺在微结构化的部分区域的区域中注塑到电路板元件上，而现在认识到，这种直接的注塑在制造技术上会带来缺陷。或者应该在对电路板元件装配电子元器件之前实施注塑过程，其中，在安装电子元器件之前，在注塑过程之后必须去除在此期间可能对电路板元件产生的脏污。或者备选地，在注塑过程之前已经安装在电路板元件上的电子元器件应该在注塑期间例如通过保护层保护，但是这要求附加的工作步骤和由此产生附加的费用。
作为对外壳部件元件注塑的替代方案，因此在此处建议，事前就单独地制造外壳部件元件，例如通过单独实施的注塑工艺。外壳部件元件在此情况下应该由可以可逆地塑化的材料构造成。例如外壳部件元件可以由热塑性塑料材料如例如聚酰胺，例如PA66，制造。这种材料应该通常是坚固的并且对于在电子模块中使用来说是足够机械稳定的。
另一方面，这种材料应该可以可逆地塑化，也就是说，可以可逆地转换到一种可塑的，即粘性的或液态的并且由此可塑性变形的状态并且可以接着再次凝固（硬化）。当在一个单独的注塑工艺中制造这种外壳部件元件时不存在电路板元件或安装在其上的电子元器件被损坏或脏污的危险。
为了将单独制造的外壳部件元件与电路板元件连接起来，外壳部件元件的表面的至少一个部分区域被可逆地塑化。
为此这个部分区域例如可以暂时地局部地被加热。通过这种局部加热外壳部件元件的至少一个靠近表面的层被暂时地塑化，即变软和可变形。在这种状态下，外壳部件元件和电路板元件被接合在一起。该接合这样地实施，外壳部件元件的表面的塑化的部分区域被置于与电路板元件的微结构化的部分区域相接触并且两者尽可能相互挤压。外壳部件元件的之前已经塑化的材料的部分此时可以流入在电路板元件的微结构化的部分区域中的凹部或微空穴中。在外壳部件元件的先前塑化的材料例如通过冷却再次凝固之后，由此在外壳部件元件和电路板元件之间形成至少部分地形状配合的连接。
为了暂时地和局部地加热外壳部件元件的表面的部分区域，该部分区域可以用光，尤其是激光，局部地照射。照射光在此应该具有足够高的功率密度，由此产生对外壳部件元件的热塑性塑料材料的加热，直到超过塑化温度。使用的光的波长在此应该这样地与外壳部件元件的材料特性相匹配，即照射的光尽可能完全地在外壳部件元件的靠近表面的层中被吸收并且该表面由此被加热。例如为了照射可以使用一种脉冲激光，它具有在200nm至10μm，最好在512nm和1064nm之间的区域中的波长，和大约1至100瓦的功率。
但是备选地也可以设想，外壳部件元件的表面的要塑化的部分区域借助于其它的技术来塑化或尤其是来加热。该部分区域例如可以通过热空气，热辐射，与加热板或其它的加热物体等等接触，被加热。但是，在这些备选方法中的大多数中，与用光照射不同，不总是保证，用于塑化部分区域的能量仅仅被局部地引入到该部分区域中或者该部分区域被弄脏。
电路板元件的表面的微结构化的部分区域可以具有凹部，这些凹部具有在0.1至500μm，最好在1和100μm之间的范围中的结构尺寸。外壳部件元件的塑化的材料在其与电路板元件接合时可以很好地流入这种凹部或微型空穴中，在其中分布并且在接着凝固之后形成形状配合的连接。
这种凹部或微型空穴尤其可以通过借助于激光的局部照射产生。在此处激光的波长和功率密度也应该合适地选择，其中，但是通过借助于激光的照射使电路板元件的材料仅仅塑化或熔化是不够的。相反，该材料应该局部地去除掉，例如通过蒸发或消融。相应地，为此目的使用的激光束一般地比在用于仅仅塑化热塑性塑料材料的情况下必须具有更高的功率密度。为此例如可以使用脉冲式的激光，其具有200nm至10μm，最好在512nm和1064nm之间的范围中的波长，和大约1至100瓦的功率。
尤其是对于开头所述的将电子模块作为变速器控制器的应用，可以有利的或必要的是，将外壳部件元件不仅机械固定地与电路板元件连接，而且借助于该连接将容纳在其之间的内腔向外气密地密封。尤其地为此外壳部件元件可以具有环形封闭的接触面并且外壳部件元件的表面的要塑化的部分区域可以是框架的这个接触面。电路板元件的表面的微结构化的部分区域也可以是环形封闭的并且在此情况下在它的几何形状上对应于外壳部件元件的接触面。由此外壳部件元件和电路板元件可以沿着一个环形封闭的接触面相互接合起来，其中，沿着整个接触面外壳部件元件的塑化的材料流入电路板元件的微结构化的材料中和接着可以在其中凝固。由此沿着整个环形封闭的接触面形成形状配合的连接，其也是气密的。
注意，在此处建议的方法的实施方式的可能的特性和优点可以以合适的方式组合或交换，以实现本发明的其它的实施方式。
附图简述
以下参照附图描述本发明的实施方式，其中，该描述和附图都不应该理解为是对本发明的限制。
图1示出用于按照本发明地制造的电子模块的电路板元件的透视俯视图。
图2示出用于按照本发明地制造的电子模块的外壳部件元件的从下方看的透视图。
图3示出沿着图1中的线A-A的放大的剖视图。
图4示出沿着图2中的线B-B的放大的剖视图。
图5示出在图3和4中示出的一些区域在按照本发明的制造方法的范围中被接合起来之后，这些区域的放大的剖视图。
图6示出通过一个按照本发明制造的电子模块的剖视图。
图7示出通过另一个按照本发明制造的电子模块的部分剖视图。
图仅仅是示意性的并且没有按照真实的比例尺。相同的附图标记在各个附图中表示相同的或作用相同的特征。
本发明的实施方式
图1示出用于电子模块的电路板元件1，例如用在变速器控制器中。电路板元件1在它的表面上具有多个电子元器件3例如电阻，线圈，电容，IC，等等。元器件3相互间通过导电的印制导线5连接。印制导线5可以在电路板元件1的表面上延伸或者在电路板元件的内部中作为中间支承的层布置。电路板元件1由通过玻璃纤维加强的热固性材料例如环氧树脂制成，部分地也称为Prepreg（半固化片，预浸材料）。
在电路板元件1的一个表面上设置环形封闭的部分区域7，在该区域中引入微结构。图3在横截面上示出这个配有微结构9的部分区域7。微结构具有显微凹部11，其例如在几个微米上延伸深入电路板元件1的表面内。微结构化的部分区域7是环形封闭的并且围绕电路板元件1的部分表面13布置。在该部分表面13内可以设置元器件3，它们例如应该被保护防止受到环境中的腐蚀性介质的影响。
图2示出矩形框架形式的外壳部件元件15。外壳部件元件15由热塑性塑料材料例如聚酰胺制成。外壳部件元件15的矩形形状在此基本上对应于电路板元件1的微结构化的部分区域7的形状。
图4示出通过外壳部件元件15的横截面图。为了将与外壳部件元件15的接触面17相邻的部分区域18暂时地塑化，该接触面17借助于激光器用合适的波长和功率的光19照射。光19在此情况下在靠近表面地在接触面17处被吸收，由此在那里的材料被加热直到超过它的塑化温度，在使用聚酰胺的情况下例如直到超过220°C，最好250°C，并且由此变成可塑的。在侧面上在接触面17旁边分别设置材料溢流凹坑或槽21。
图5示出一个剖视图，其中在图3和4中示出的一方面电路板元件1和另一方面外壳部件元件15的部分被相互连接。在外壳部件元件15的与接触面17相邻的部分区域18中的塑化的材料此时流入到电路板元件1的微结构化的部分区域7的凹部11中和在接着的冷却期间在其中凝固。多余的塑化的材料被部分地推向一侧并且可以被容纳在材料溢流槽21中。
图6在横截面图中示例性地示出一种按照本发明制造的电子模块23。其中多个可选择的特征显示，它们如何可以设置在一个电子模块上，但是并不需要。电路板元件1与由框架构造成的外壳部件元件15通过微结构化的部分区域7形状配合地连接。在外壳部件元件15的环形的框架上安装盖25，它与外壳部件元件15例如通过焊接部27气密地连接。电路板元件1，外壳部件元件15以及盖25由此气密地包围内腔13。通过开口29，内腔13可以选择地被填充保护性胶31。该开口29可以接着借助于栓塞，例如球，封闭。外壳部件元件15可以补充地通过至少一个铆钉头33保持在电路板元件1上。在组装时，铆钉头33在未变形的状态下插入电路板元件1中的开口35中并且然后被热填塞（压实）。
外壳部件元件15在示出的示例中分别作为环形的框架示出，但是该外壳部件元件15也可以具有其它的合适的形状。例如外壳部件元件15可以实施成盖元件，其可以具有盆形的形状，由此内腔13单独地通过一体地实施的外壳部件元件15和电路板元件1围住。
备选地，作为外壳部件元件15，可以设置例如由聚酰胺构成的薄膜，其在合适的区域中被塑化和被挤压在电路板元件1的微结构化的部分区域7中。该薄膜此时可以覆盖电子元器件并且保护其免受外部的影响。必要时该薄膜可以用金属层覆层，金属层可以用作扩散屏障和/或作为EMV-保护层。
在图7中示出通过另一个按照本发明制造的电子模块23的部分剖视图。在该电子模块23中，作为外壳部件元件15构造成的盖是两个部分地实施的。一个盆形的主部件37由可透过激光的塑料构造成。在该主部件37的边缘处设置由吸收激光的塑料制成的附件39。该附件39环形地围住主部件37并且一直延伸到一个区域中，在该区域中在电路板元件1处设置微结构化的部分区域7。在安装电子模块23时，激光41从上方通过可透过激光的主部件37，朝着附件39发射，在此处它被吸收。通过在吸收激光41时产生的热量，一方面主部件和附件37，39相互焊接起来和另一方面附件39的塑料在部分区域18中被如此地塑化，即它可以与电路板元件1的微结构化的部分区域7连接。

Claims (10)

1. 用于制造电子模块(23)的方法，具有步骤:
提供电路板元件(1)，在电路板元件(1)的表面上具有至少一个电子元器件(3)以及一个微结构化的部分区域(7);
在电路板元件(1)上安装外壳部件元件(15);
其特征在于，在电路板元件(1)上安装外壳部件元件(15)的步骤具有以下的分步骤:
提供单独制造的外壳部件元件(15)，其中，外壳部件元件(15)用可以可逆地塑化的材料构造成;
可逆地塑化外壳部件元件(15)的表面的至少一个部分区域(18);
通过将外壳部件元件(15)的该表面的塑化的部分区域(18)与电路板元件(1)的微结构化的部分区域(7)接合在一起和接着凝固外壳部件元件(15)的该表面的塑化的部分区域(18)将外壳部件元件(15)安装在电路板元件(1)上。
2. 根据权利要求1所述的方法，其中，外壳部件元件(15)的表面的部分区域(18)通过暂时的局部加热被塑化。
3. 根据权利要求2所述的方法，其中，外壳部件元件(15)的表面的部分区域(18)通过用光(19)，尤其是激光，局部照射，被加热。
4. 根据权利要求1至3中任一项所述的方法，其中，电路板元件(1)的表面的微结构化的部分区域(7)具有凹部(11)，该凹部具有在0.1和500μm之间，最好在1和100μm之间的结构尺寸。
5. 根据权利要求4所述的方法，其中，通过借助于激光的局部照射产生所述凹部(11)。
6. 根据权利要求1至5中任一项所述的方法，其中，外壳部件元件(15)具有一个环形封闭的接触面(17)并且外壳部件元件(15)的表面的要塑化的部分区域(18)与接触面(17)相邻地布置和其中，电路板元件(1)的表面的微结构化的部分区域(7)是环形封闭的并且对应于外壳部件元件的接触面(17)。
7. 根据权利要求1至6中任一项所述的方法，其中，外壳部件元件(15)用热塑性材料构造成。
8. 根据权利要求1至7中任一项所述的方法，其中，电路板元件(1)用热固性材料构造成。
9. 根据权利要求1至8中任一项所述的方法，其中，外壳部件元件(15)由一体的盖元件构造成或用一个框架和一个单独的盖(25)多个部分地构造成。
10. 根据权利要求1至9中任一项所述的方法，其中，外壳部件元件(15)用一个可透过激光的主部件(37)和一个吸收激光的附件(39)两个部分地构造成和其中，通过照射激光(41)不仅主部件(37)被与附件(39)焊接而且附件(39)被塑化。
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