CN105886154A - 一种环保型高效浓缩锡膏清洗剂及其制备方法 - Google Patents
一种环保型高效浓缩锡膏清洗剂及其制备方法 Download PDFInfo
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims description 10
- 239000012459 cleaning agent Substances 0.000 title abstract 8
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 claims abstract description 10
- HHBZZTKMMLDNDN-UHFFFAOYSA-N 2-butan-2-yloxybutane Chemical compound CCC(C)OC(C)CC HHBZZTKMMLDNDN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 claims abstract description 5
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229940087305 limonene Drugs 0.000 claims abstract description 5
- 235000001510 limonene Nutrition 0.000 claims abstract description 5
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000008367 deionised water Substances 0.000 claims abstract description 4
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 4
- 239000006071 cream Substances 0.000 claims description 27
- 239000012141 concentrate Substances 0.000 claims description 16
- 238000003756 stirring Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 10
- 239000003292 glue Substances 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 229910052736 halogen Inorganic materials 0.000 abstract description 2
- 150000002367 halogens Chemical class 0.000 abstract description 2
- 230000007935 neutral effect Effects 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 abstract description 2
- 229920003023 plastic Polymers 0.000 abstract description 2
- 239000004094 surface-active agent Substances 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract 1
- 238000002791 soaking Methods 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- 238000004506 ultrasonic cleaning Methods 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 3
- 229910000004 White lead Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000035943 smell Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/267—Heterocyclic compounds
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
- C11D7/248—Terpenes
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
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Abstract
本发明公开了一种环保型高效浓缩锡膏清洗剂，包括以下按重量比计的组分：四氢糠醇5～35％，一缩二丙二醇10～70％，柠檬烯1～10％，仲丁基醚0.5～10％，去离子水5～80％。本发明采用相似相容的原理，通过清洗剂将焊锡颗粒溶解，从而达到清洗的目的。该清洗剂的特点是无闪电；不含表面活性剂；不含卤素并易于生物降解，安全环保不会对环境造成污染；中性pH值使本产品对网板、绷网胶和塑料有出色的相容性，可用于清洗网板和误印电路板上的锡膏和表面贴装胶水。另外，该清洗剂可以在常温下使用，并兼容大多数标准网板清洗设备，可以用于浸泡式、喷淋式和超声波清洗系统中，是一款经济实用的清洗剂。
Description
技术领域
本发明涉及清洗剂技术领域，尤其是一种环保型高效浓缩锡膏清洗剂及其制备方法。
背景技术
锡膏是由焊锡粉、助焊剂以及其它的添加物加以混合，形成的乳脂状混合物。锡膏在常温下有一定的粘度，可将电子元器件初粘在既定位置，在焊接温度下，随着溶剂和部分添加剂的挥发，将被焊元器件与印制电路焊盘焊接在一起形成永久连接。
但是如果锡膏的误印或弄脏了的工具、干涸的锡膏、模板与板的不对位，都可能造成在模板底面甚至装配上有不希望有的锡膏。对于密间距模板，如果由于薄的模板横截面弯曲造成引脚之间的损伤，它会造成锡膏沉积在引脚之间，产生印刷缺陷和/或短路。低粘性的锡膏也可能造成印刷缺陷。例如，印刷机运行温度高或者刮刀速度高可以减小锡膏在使用中的粘性，由于沉积过多锡膏而造成印刷缺陷和桥接。且较多的焊剂残渣常会导致在要实行电接触的金属表层上有过多的残留物覆盖，妨碍电连接的建立。
目前国内众多厂商所用到的清洗剂都被德国品牌和美国品牌所垄断，国产清洗剂还没有成规模和品牌，性能和进口清洗剂相比，清洗效果差，一般都有毒性，不够环保，味道大，现在市场上急需一款性能和进口品牌像媲美的，价格又十分合理的高性价比高性能环保清洗剂。
发明内容
本发明的目的在于提供一种环保型高效浓缩锡膏清洗剂及其制备方法。该清洗剂气味清淡，可以在常温下使用，并兼容大多数标准网板清洗设备，可以用于浸泡式、喷淋式和超声波清洗系统中，使用纯水漂洗后，采用热风或循环风干燥即可。
本发明的技术方案如下：
所述环保型高效浓缩锡膏清洗剂的制备方法，包括以下步骤：
(1)将搅拌器中先加入适量的去离子水，然后在搅拌状态下，依次缓慢加入四氢糠醇、一缩二丙二醇、柠檬烯、仲丁基醚；
(2)提高转速至1000～1200转/分钟，搅拌15～25分钟，即可。
本发明的有益效果：
该清洗剂的特点是无闪电；不含卤素并易于生物降解，安全环保不会对环境造成污染；中性pH值使本产品对网板、绷网胶和塑料有出色的相容性，可用于清洗网板和误印电路板上的锡膏和表面贴装胶水；不含表面活性剂，无残留，无白粉，能整体有效的降低清洗和维护成本，清洗效果好，是一款经济实用的清洗剂。
具体实施方式
下面将对本发明实例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获的所有其它实施例，都属于本发明保护的范围。
实施例1
一种环保型高效浓缩锡膏清洗剂，其特征在于，包括按重量比计的以下组分：
所述环保型高效浓缩锡膏清洗剂的制备方法，包括以下步骤：
(1)将搅拌器中先加入适量的去离子水，然后在搅拌状态下，依次缓慢加入四氢糠醇、一缩二丙二醇、柠檬烯、仲丁基醚；
(2)提高转速至1000～1200转/分钟，搅拌15～25分钟，即可。
实施例2
一种环保型高效浓缩锡膏清洗剂，其特征在于，包括按重量比计的以下组分：
所述环保型高效浓缩锡膏清洗剂的制备方法同实施例1。
实施例3
一种环保型高效浓缩锡膏清洗剂，其特征在于，包括按重量比计的以下组分：
所述环保型高效浓缩锡膏清洗剂的制备方法同实施例1。
实施例4
一种环保型高效浓缩锡膏清洗剂，其特征在于，包括按重量比计的以下组分：
所述环保型高效浓缩锡膏清洗剂的制备方法同实施例1。
实施例中所述环保型高效浓缩锡膏清洗剂用于清洗网板和误印电路板上的锡膏，经过显微镜观察，表面洁净，无残留，无白粉，能整体有效的降低清洗和维护成本，清洗效果好。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本发明的专利保护范围内。
Claims (3)
1.一种环保型高效浓缩锡膏清洗剂，其特征在于，包括按重量比计的以下组分：
2.根据权利要求1所述的环保型高效浓缩锡膏清洗剂，其特征在于，所述的清洗剂的组分为四氢糠醇、一缩二丙二醇、柠檬烯、仲丁基醚其中的三种或三种以上的组合物。
3.根据权利要求1所述环保型高效浓缩锡膏清洗剂的制备方法，其特征在于，包括以下步骤：将搅拌器中先加入适量的去离子水，在低转速状态下，依次缓慢加入四氢糠醇、一缩二丙二醇、柠檬烯、仲丁基醚；然后提高转速至1000～1200转/分钟，搅拌15～25分钟，即可。
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110846151A (zh) * | 2019-11-22 | 2020-02-28 | 深圳市伯斯特科技有限公司 | 一种水性锡膏清洗剂、该清洗剂制作工艺及清洗方法 |
| CN112500938A (zh) * | 2020-12-22 | 2021-03-16 | 苏州柏越纳米科技有限公司 | 半水基型半导体元器件清洗剂 |
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|---|---|---|---|---|
| CN102703256A (zh) * | 2012-06-15 | 2012-10-03 | 东莞优诺电子焊接材料有限公司 | 多功能水基清洗剂 |
| SG188366A1 (en) * | 2010-09-03 | 2013-05-31 | Kanto Kagaku | Photoresist residue and polymer residue removing liquid composition |
| CN103555443A (zh) * | 2013-10-30 | 2014-02-05 | 合肥市华美光电科技有限公司 | 一种水基印刷电路板锡膏清洗剂及其制备方法 |
| US20150133356A1 (en) * | 2011-11-08 | 2015-05-14 | Dynaloy, Llc | Photoresist and post etch residue cleaning solution |
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- 2016-04-08 CN CN201610218048.9A patent/CN105886154A/zh active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG188366A1 (en) * | 2010-09-03 | 2013-05-31 | Kanto Kagaku | Photoresist residue and polymer residue removing liquid composition |
| US20150133356A1 (en) * | 2011-11-08 | 2015-05-14 | Dynaloy, Llc | Photoresist and post etch residue cleaning solution |
| CN102703256A (zh) * | 2012-06-15 | 2012-10-03 | 东莞优诺电子焊接材料有限公司 | 多功能水基清洗剂 |
| CN103555443A (zh) * | 2013-10-30 | 2014-02-05 | 合肥市华美光电科技有限公司 | 一种水基印刷电路板锡膏清洗剂及其制备方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110846151A (zh) * | 2019-11-22 | 2020-02-28 | 深圳市伯斯特科技有限公司 | 一种水性锡膏清洗剂、该清洗剂制作工艺及清洗方法 |
| CN112500938A (zh) * | 2020-12-22 | 2021-03-16 | 苏州柏越纳米科技有限公司 | 半水基型半导体元器件清洗剂 |
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