CN105873414B - 用于石墨导热散热贴片的制造工艺 - Google Patents

用于石墨导热散热贴片的制造工艺 Download PDF

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CN105873414B
CN105873414B CN201610250629.0A CN201610250629A CN105873414B CN 105873414 B CN105873414 B CN 105873414B CN 201610250629 A CN201610250629 A CN 201610250629A CN 105873414 B CN105873414 B CN 105873414B
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graphite
film
parts
kapton
heat dissipation
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CN105873414A (zh
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金闯
梁豪
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Jiangsu Stick New Materials Polytron Technologies Inc
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Jiangsu Stick New Materials Polytron Technologies Inc
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Abstract

本发明一种用于石墨导热散热贴片的制造工艺，其第一涂覆层由涂膜于聚酰亚胺薄膜上表面的石墨改性剂形成，该第一涂覆层由涂膜于聚酰亚胺薄膜上表面的石墨改性剂形成，该石墨改性剂涂由以下重量份的组分组成：二苯甲酮四酸二酐、均苯四甲酸二酐、二氨基二苯甲烷、二甲基甲酰胺、N‑甲基吡咯烷酮、乙二醇、聚二甲基硅氧烷、邻苯二甲酸二丁酯；将石墨改性剂涂膜于聚酰亚胺薄膜的上表面获得处理后的聚酰亚胺薄膜；将碳化膜升温至2350℃~2450℃，保温，再升温至2850℃~2950℃后冷却，从而获得主烧制的石墨膜。本发明避免局部过热，实现了导热性能的均匀性的同时，提高了产品的散热性能稳定性、可靠性，大大降低了产品的成本。

Description

用于石墨导热散热贴片的制造工艺
技术领域
本发明涉及一种用于石墨导热散热贴片的制造工艺，属于胶带技术领域。
背景技术
随着现代微电子技术高速发展，电子设备（如笔记本电脑、手机、平板电脑等）日益变得超薄、轻便，这种结构使得电子设备内部功率密度明显提高，运行中所产生的热量不易排出、易于迅速积累而形成高温。另一方面，高温会降低电子设备的性能、可靠性和使用寿命。因此，当前电子行业对于作为热控系统核心部件的散热材料提出越来越高的要求，迫切需要一种高效导热、轻便的材料迅速将热量传递出去，保障电子设备正常运行。
现有技术中聚酰亚胺薄膜大多用于柔性电路板，虽然有采用聚酰亚胺薄膜烧结获得石墨散热片，从而贴覆在热源上，但是受限于聚酰亚胺薄膜的产品质量和性能的良莠不齐，影响到了散热双面贴膜散热性能的发挥，存在以下技术问题：散热不均匀，易出现胶带局部过热，提高了产品的散热性能不稳定、可靠性性能差，不利于产品质量管控，影响产品的竞争力。
发明内容
本发明发明目的是提供一种用于石墨导热散热贴片的制造工艺，该用于石墨导热散热贴片的制造工艺在垂直方向和水平方向均提高了导热性能，避免局部过热，实现了导热性能的均匀性的同时，提高了产品的散热性能稳定性、可靠性，大大降低了产品的成本。
为达到上述发明目的，本发明采用的技术方案是：一种用于石墨导热散热贴片的制造工艺，所述石墨导热散热贴片表面涂覆有导热胶粘层、此导热胶粘层与石墨导热散热贴片相背的表面贴合有离型材料层；所述石墨导热散热贴片由聚酰亚胺薄膜、第一涂覆层和第二涂覆层组成，所述第一涂覆层位于聚酰亚胺薄膜上表面；
所述第一涂覆层由涂膜于聚酰亚胺薄膜上表面的石墨改性剂形成，该石墨改性剂涂由以下重量份的组分组成：二苯甲酮四酸二酐22份、均苯四甲酸二酐12.5份、二氨基二苯甲烷26份、二甲基甲酰胺22.5份、N-甲基吡咯烷酮9.5份、 乙二醇 2.2份、聚二甲基硅氧烷2.8份、邻苯二甲酸二丁酯0.9份；所述石墨改性剂的粘度为30000~48000cP；
所述石墨导热散热贴片通过以下步骤获得：
步骤一、将石墨改性剂涂膜于聚酰亚胺薄膜的上表面获得处理后的聚酰亚胺薄膜；
步骤二、将处理后的聚酰亚胺薄膜升温至 1200℃ 后冷却，从而获得预烧制的碳化膜；
步骤三、采用压延机压延所述预烧制的碳化膜；
步骤四、将碳化膜升温至2350℃~2450℃，保温，再升温至2850℃~2950℃后冷却，从而获得主烧制的石墨膜；
步骤五、然后将所得的主烧制的石墨膜进行压延从而获得所述石墨导热散热贴片。
由于上述技术方案运用，本发明与现有技术相比具有下列优点和效果：
1、本发明用于石墨导热散热贴片的制造工艺，其结构中石墨层由上表面均涂覆一层石墨改性剂的聚酰亚胺薄膜制备而成，提高了在垂直方向和水平方向的导热性能，避免胶带局部过热，实现了胶带导热性能的均匀性；其次，其位于聚酰亚胺薄膜表面的石墨改性剂由二苯甲酮四酸二酐22份、均苯四甲酸二酐12.5份、二氨基二苯甲烷26份、二甲基甲酰胺22.5份、乙二醇2.2份、聚二甲基硅氧烷2.8份组成，涂覆于聚酰亚胺薄膜上，填充了加热过程中的针孔，提高了结晶度同时，也克服了热收缩过大导致的不均匀，提高了石墨层双向拉伸性能。
2、本发明用于石墨导热散热贴片的制造工艺，其位于聚酰亚胺薄膜表面的石墨改性剂由二苯甲酮四酸二酐20~25份、均苯四甲酸二酐12~18份、二氨基二苯甲烷20 ~28份、二甲基甲酰胺20~25份、N-甲基吡咯烷酮8~10份、乙二醇1.5~2.5份、聚二甲基硅氧烷2~3份组成，采用二甲基甲酰胺20~25份、N-甲基吡咯烷酮8~10份降低了共沸点并且平滑的沸点区，改善了最终产品成膜的平坦性和柔韧性；；其次，二甲基甲酰胺20~25份、N-甲基吡咯烷酮8~10份和邻苯二甲酸二丁酯0.8~1.5 份聚酰亚胺薄膜表面，防止气泡产生，更有利于填充聚酰亚胺薄膜的微小针孔，改善了散热贴片导热性能的均匀性。
3、本发明用于石墨导热散热贴片的制造工艺，在预烧制的碳化膜和石墨化之间增加压延步骤，以及再形成导热石墨贴片后再次压延，避免了褶皱和石墨化烧结过程中的体积收缩，提高了致密性和结晶度，进一步提高了在垂直方向和水平方向的导热性能。
附图说明
附图1为本发明石墨导热散热贴片结构示意图；
附图2为附图1的局部结构示意图。
以上附图中：1、石墨导热散热贴片；11、聚酰亚胺薄膜；12、第一涂覆层；13、第二涂覆层；2、导热胶粘层；3、离型材料层。
具体实施方式
下面结合实施例对本发明作进一步描述：
实施例：一种用于石墨导热散热贴片的制造工艺，所述石墨导热散热贴片1表面涂覆有导热胶粘层2、此导热胶粘层2与石墨导热散热贴片1相背的表面贴合有离型材料层3；所述石墨导热散热贴片1由聚酰亚胺薄膜11、第一涂覆层12和第二涂覆层13组成，所述第一涂覆层12位于聚酰亚胺薄膜11上表面；
所述第一涂覆层由涂膜于聚酰亚胺薄膜上表面的石墨改性剂形成，该石墨改性剂涂由以下重量份的组分组成：二苯甲酮四酸二酐22份、均苯四甲酸二酐12.5份、二氨基二苯甲烷26份、二甲基甲酰胺22.5份、N-甲基吡咯烷酮9.5份、 乙二醇 2.2份、聚二甲基硅氧烷2.8份、邻苯二甲酸二丁酯0.9份；所述石墨改性剂的粘度为30000~48000cP；
所述石墨导热散热贴片1通过以下步骤获得：
步骤一、将石墨改性剂涂膜于聚酰亚胺薄膜2的上表面获得处理后的聚酰亚胺薄膜；
步骤二、将处理后的聚酰亚胺薄膜升温至 1200℃ 后冷却，从而获得预烧制的碳化膜；
步骤三、采用压延机压延所述预烧制的碳化膜；
步骤四、将碳化膜升温至2350℃~2450℃，保温，再升温至2850℃~2950℃后冷却，从而获得主烧制的石墨膜；
步骤五、然后将所得的主烧制的石墨膜进行压延从而获得所述石墨导热散热贴片1。
采用上述用于石墨导热散热贴片的制造工艺时，其结构中石墨层由上表面均涂覆一层石墨改性剂的聚酰亚胺薄膜制备而成，提高了在垂直方向和水平方向的导热性能，避免胶带局部过热，实现了胶带导热性能的均匀性；其次，其位于聚酰亚胺薄膜表面的石墨改性剂由二苯甲酮四酸二酐20~25份、均苯四甲酸二酐12~18份、二氨基二苯甲烷20 ~28份、二甲基甲酰胺30~35份、乙二醇1.5~2.5份、聚二甲基硅氧烷2~3份组成，涂覆于聚酰亚胺薄膜上，填充了加热过程中的针孔，提高了结晶度同时，也克服了热收缩过大导致的不均匀，提高了石墨层双向拉伸性能，也降低了共沸点并且平滑的沸点区，改善了最终产品成膜的平坦性和柔韧性；再次，聚酰亚胺薄膜表面具有石墨改性剂，改善了双面贴膜中石墨层与导热胶粘层导热性能，且采用压延机压延所述预烧制的碳化膜，避免了褶皱和石墨化烧结过程中的体积收缩，提高了致密性和结晶度，进一步提高了在垂直方向和水平方向的导热性能；再次，二甲基甲酰胺20~25份、N-甲基吡咯烷酮8~10份和邻苯二甲酸二丁酯0.8~1.5 份聚酰亚胺薄膜表面，防止气泡产生，更有利于填充聚酰亚胺薄膜的微小针孔，改善了散热贴片导热性能的均匀性。
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围。凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。

Claims (1)

1.一种用于石墨导热散热贴片的制造工艺，所述石墨导热散热贴片（1）表面涂覆有导热胶粘层（2）、此导热胶粘层（2）与石墨导热散热贴片（1）相背的表面贴合有离型材料层（3）；其特征在于：所述石墨导热散热贴片（1）由聚酰亚胺薄膜（11）、第一涂覆层（12）和第二涂覆层（13）组成，所述第一涂覆层（12）位于聚酰亚胺薄膜（11）上表面；
所述第一涂覆层由涂膜于聚酰亚胺薄膜上表面的石墨改性剂形成，石墨改性剂由以下重量份的组分组成：二苯甲酮四酸二酐22份、均苯四甲酸二酐12.5份、二氨基二苯甲烷26份、二甲基甲酰胺22.5份、N-甲基吡咯烷酮9.5份、 乙二醇 2.2份、聚二甲基硅氧烷2.8份、邻苯二甲酸二丁酯0.9份；所述石墨改性剂的粘度为30000~48000cP；
所述石墨导热散热贴片（1）通过以下步骤获得：
步骤一、将石墨改性剂涂膜于聚酰亚胺薄膜（11）的上表面获得处理后的聚酰亚胺薄膜；
步骤二、将处理后的聚酰亚胺薄膜升温至 1200℃ 后冷却，从而获得预烧制的碳化膜；
步骤三、采用压延机压延所述预烧制的碳化膜；
步骤四、将碳化膜升温至2350℃~2450℃，保温，再升温至2850℃~2950℃后冷却，从而获得主烧制的石墨膜；
步骤五、然后将所得的主烧制的石墨膜进行压延从而获得所述石墨导热散热贴片（1）。
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