CN105870072A - Plastic shell for packaging electronic component - Google Patents
Plastic shell for packaging electronic component Download PDFInfo
- Publication number
- CN105870072A CN105870072A CN201610271700.3A CN201610271700A CN105870072A CN 105870072 A CN105870072 A CN 105870072A CN 201610271700 A CN201610271700 A CN 201610271700A CN 105870072 A CN105870072 A CN 105870072A
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- CN
- China
- Prior art keywords
- epoxy
- nano
- thermal
- electronic devices
- expansibility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
Abstract
The invention discloses a plastic shell for packaging an electronic component. The shell is made of high-thermal conductivity and low-expansion epoxy plastic, wherein the high-thermal conductivity and low-expansion epoxy plastic comprises the following raw materials in percentage by mass: 85%-90% of an epoxy resin mixture and 10%-15% of a high-thermal conductivity nano additive. In the manner, the plastic shell is made of the high-thermal conductivity and low-expansion epoxy plastic and has good mechanical property and thermal conductivity; and the condition that the electronic component stably works in a normal temperature range can be ensured.
Description
Technical field
The present invention relates to electronic devices and components field, particularly relate to a kind of electronic devices and components encapsulation plastic casing.
Background technology
Encapsulation, it is simply that refer to, the circuit pin on silicon chip, connect with wire and guide at external lug, in order to be connected with other device.Chip must be isolated from the outside; to prevent the impurity in air from causing electric property to decline the corrosion of chip circuit; packing forms refers to install the shell of semiconductor integrated circuit chip; it not only plays a part to install, fixes, seals, protects chip and strengthen the aspects such as electric heating property; but also be wired on the pin of package casing by the contact on chip; these pins are connected with other devices further through the wire on printed circuit board (PCB), thus realize the connection of inside chip and external circuit.Encapsulating housing material mainly includes metal, pottery and plastics, increase along with chip integration, caloric value is necessarily caused to improve, the operating temperature of circuit constantly rises, meanwhile, after electronic devices and components encapsulated moulding, owing to linear expansion coefficient is different, forming and hardening shrinks and causes packaging internal generation thermal stress, will result in the defects such as encapsulating housing intensity declines, heat shock resistance is poor, cracking absciss layer, thus affects electronic devices and components steady operation.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of electronic devices and components encapsulation plastic casing, high-thermal-conductivity low-expansibility epoxy-plastic packaging material is used to make, there is good mechanical property and heat conductivility, can ensure that electronic devices and components steady operation within the scope of normal temperature.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provide a kind of electronic devices and components encapsulation plastic casing, described housing uses high-thermal-conductivity low-expansibility epoxy plastics to make, the raw material that described high-thermal-conductivity low-expansibility epoxy plastics includes has: mixture of epoxy resins and high heat conducting nano filler, calculate according to mass percent, described mixture of epoxy resins accounts for 85%-90%, and described high heat conducting nano additive accounts for 10%-15%；
Described mixture of epoxy resins includes the composition of following mass parts: bisphenol A epoxide resin 55-60 part, phenolic resin 8-12 part, hexamethylenetetramine 2-5 part, flexible-epoxy 10-15 part, glass fibre 9-14 part, silane coupler 1-3 part, ethanol 2-4 part；
Described high heat conducting nano filler includes the composition of following mass parts: nano grade silica particles 20-40 part, nano aluminum nitride powder 60-80 part.
In a preferred embodiment of the present invention, the particle diameter of described nano grade silica particles is 20-40nm.
In a preferred embodiment of the present invention, the particle diameter of described Nano-sized Alumina Powder is 30-50nm.
In a preferred embodiment of the present invention, the thermal conductivity factor of described high-thermal-conductivity low-expansibility epoxy plastics is 3.8-4.0W/ (m K).
The invention has the beneficial effects as follows: by adding the high heat conducting nano filler of rational proportion in mixture of epoxy resins, the high-thermal-conductivity low-expansibility epoxy plastics making acquisition has good mechanical property and heat conductivility, can ensure that electronic devices and components steady operation within the scope of normal temperature.
Detailed description of the invention
It is described in detail below in conjunction with to presently preferred embodiments of the present invention, so that advantages and features of the invention can be easier to be readily appreciated by one skilled in the art, thus protection scope of the present invention is made apparent clear and definite defining.
Embodiment one:
A kind of electronic devices and components encapsulation plastic casing, described housing uses high-thermal-conductivity low-expansibility epoxy plastics to make, the raw material that described high-thermal-conductivity low-expansibility epoxy plastics includes has: mixture of epoxy resins and high heat conducting nano filler, calculate according to mass percent, described mixture of epoxy resins accounts for 85%, and described high heat conducting nano additive accounts for 15%；
Described mixture of epoxy resins includes the composition of following mass parts: bisphenol A epoxide resin 55 parts, 10 parts of phenolic resin, hexamethylenetetramine 5 parts, flexible-epoxy 12 parts, 13 parts of glass fibre, silane coupler 3 parts, ethanol 2 parts；
Described high heat conducting nano filler includes the composition of following mass parts: nano grade silica particles 20 parts, nano aluminum nitride powder 80 parts.
Wherein, the particle diameter of described nano grade silica particles is 20nm, and the particle diameter of described Nano-sized Alumina Powder is 30nm.
The thermal conductivity factor of described high-thermal-conductivity low-expansibility epoxy plastics is 3.8W/ (m K).
Embodiment two:
A kind of electronic devices and components encapsulation plastic casing, described housing uses high-thermal-conductivity low-expansibility epoxy plastics to make, the raw material that described high-thermal-conductivity low-expansibility epoxy plastics includes has: mixture of epoxy resins and high heat conducting nano filler, calculate according to mass percent, described mixture of epoxy resins accounts for 88%, and described high heat conducting nano additive accounts for 12%；
Described mixture of epoxy resins includes the composition of following mass parts: bisphenol A epoxide resin 56 parts, 12 parts of phenolic resin, hexamethylenetetramine 2 parts, flexible-epoxy 10 parts, 14 parts of glass fibre, silane coupler 2 parts, ethanol 4 parts；
Described high heat conducting nano filler includes the composition of following mass parts: nano grade silica particles 30 parts, nano aluminum nitride powder 70 parts.
Wherein, the particle diameter of described nano grade silica particles is 30nm, and the particle diameter of described Nano-sized Alumina Powder is 40nm.
The thermal conductivity factor of described high-thermal-conductivity low-expansibility epoxy plastics is 3.9W/ (m K).
Embodiment three:
A kind of electronic devices and components encapsulation plastic casing, described housing uses high-thermal-conductivity low-expansibility epoxy plastics to make, the raw material that described high-thermal-conductivity low-expansibility epoxy plastics includes has: mixture of epoxy resins and high heat conducting nano filler, calculate according to mass percent, described mixture of epoxy resins accounts for 90%, and described high heat conducting nano additive accounts for 10%；
Described mixture of epoxy resins includes the composition of following mass parts: bisphenol A epoxide resin 60 parts, 8 parts of phenolic resin, hexamethylenetetramine 3 parts, flexible-epoxy 15 parts, 9 parts of glass fibre, silane coupler 1 part, ethanol 4 parts；
Described high heat conducting nano filler includes the composition of following mass parts: nano grade silica particles 40 parts, nano aluminum nitride powder 60 parts.
Wherein, the particle diameter of described nano grade silica particles is 40nm, and the particle diameter of described Nano-sized Alumina Powder is 50nm.
The thermal conductivity factor of described high-thermal-conductivity low-expansibility epoxy plastics is 4W/ (m K).
Present invention is disclosed a kind of electronic devices and components encapsulation plastic casing, by adding the high heat conducting nano filler of rational proportion in mixture of epoxy resins, the high-thermal-conductivity low-expansibility epoxy plastics making acquisition has good mechanical property and heat conductivility, can ensure that electronic devices and components steady operation within the scope of normal temperature.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the invention content to be made or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical fields, the most in like manner it is included in the scope of patent protection of the present invention.
Claims (4)
1. an electronic devices and components encapsulation plastic casing, it is characterized in that, described housing uses high-thermal-conductivity low-expansibility epoxy plastics to make, the raw material that described high-thermal-conductivity low-expansibility epoxy plastics includes has: mixture of epoxy resins and high heat conducting nano filler, calculate according to mass percent, described mixture of epoxy resins accounts for 85%-90%, and described high heat conducting nano additive accounts for 10%-15%；
Described mixture of epoxy resins includes the composition of following mass parts: bisphenol A epoxide resin 55-60 part, phenolic resin 8-12 part, hexamethylenetetramine 2-5 part, flexible-epoxy 10-15 part, glass fibre 9-14 part, silane coupler 1-3 part, ethanol 2-4 part；
Described high heat conducting nano filler includes the composition of following mass parts: nano grade silica particles 20-40 part, nano aluminum nitride powder 60-80 part.
Electronic devices and components encapsulation plastic casing the most according to claim 1, it is characterised in that the particle diameter of described nano grade silica particles is 20-40nm.
Electronic devices and components encapsulation plastic casing the most according to claim 1, it is characterised in that the particle diameter of described Nano-sized Alumina Powder is 30-50nm.
Electronic devices and components encapsulation plastic casing the most according to claim 1, it is characterised in that the thermal conductivity factor of described high-thermal-conductivity low-expansibility epoxy plastics is 3.8-4.0W/ (m K).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610271700.3A CN105870072A (en) | 2016-04-28 | 2016-04-28 | Plastic shell for packaging electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610271700.3A CN105870072A (en) | 2016-04-28 | 2016-04-28 | Plastic shell for packaging electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105870072A true CN105870072A (en) | 2016-08-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610271700.3A Pending CN105870072A (en) | 2016-04-28 | 2016-04-28 | Plastic shell for packaging electronic component |
Country Status (1)
| Country | Link |
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| CN (1) | CN105870072A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106336617A (en) * | 2016-08-22 | 2017-01-18 | 中国科学院合肥物质科学研究院 | Room temperature low-thermal-expansion epoxy resin material and preparation method thereof |
| CN107057272A (en) * | 2016-12-11 | 2017-08-18 | 安徽兆利光电科技有限公司 | A kind of LED wiring board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080039555A1 (en) * | 2006-08-10 | 2008-02-14 | Michel Ruyters | Thermally conductive material |
| CN103525012A (en) * | 2013-09-27 | 2014-01-22 | 昆山市奋发绝缘材料有限公司 | Heat conduction and insulating packaging material |
| CN104479291A (en) * | 2014-12-04 | 2015-04-01 | 中国科学院过程工程研究所 | Heat-conducting insulated epoxy resin composition and preparation method and use thereof |
-
2016
- 2016-04-28 CN CN201610271700.3A patent/CN105870072A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080039555A1 (en) * | 2006-08-10 | 2008-02-14 | Michel Ruyters | Thermally conductive material |
| CN103525012A (en) * | 2013-09-27 | 2014-01-22 | 昆山市奋发绝缘材料有限公司 | Heat conduction and insulating packaging material |
| CN104479291A (en) * | 2014-12-04 | 2015-04-01 | 中国科学院过程工程研究所 | Heat-conducting insulated epoxy resin composition and preparation method and use thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106336617A (en) * | 2016-08-22 | 2017-01-18 | 中国科学院合肥物质科学研究院 | Room temperature low-thermal-expansion epoxy resin material and preparation method thereof |
| CN107057272A (en) * | 2016-12-11 | 2017-08-18 | 安徽兆利光电科技有限公司 | A kind of LED wiring board |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160817 |
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| WD01 | Invention patent application deemed withdrawn after publication |