CN108070257A - A kind of insulated type high thermal conductive silicon glue gasket - Google Patents
A kind of insulated type high thermal conductive silicon glue gasket Download PDFInfo
- Publication number
- CN108070257A CN108070257A CN201611012450.8A CN201611012450A CN108070257A CN 108070257 A CN108070257 A CN 108070257A CN 201611012450 A CN201611012450 A CN 201611012450A CN 108070257 A CN108070257 A CN 108070257A
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- parts
- particle
- type high
- high thermal
- alumina
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention discloses a kind of insulated type high thermal conductive silicon glue gaskets, by weight, 500 800 parts of alumina particle, 20 40 parts of polysiloxanes, 5 25 parts of silica 1,49 parts of methyl vinyl silicone rubber, 38 parts of silane coupling agent, 1 2.5 parts of containing hydrogen silicone oil, 13 parts of catalyst are included.The present invention is compared with prior art, the high heat conductive insulating heat conductive silica gel gasket of the present invention passes through rational proportion silica gel component, and to the screening of ball-aluminium oxide particle, realize the raising of reasonable distribution and aluminium oxide particles thermal conductivity factor of the aluminium oxide particles in silica gel matrix itself, make the good insulating of the silica gel pad of the present invention, and its thermal conductivity factor is increased to more than 5.0W, is that the prior art is unattainable.
Description
Technical field
The present invention relates to a kind of silicagel pads, particularly a kind of insulated type high thermal conductive silicon glue gasket.
Background technology
With the development of science and technology, electronic component increasingly levels off to densification and miniaturization, so as to electronics device
The stability of part proposes higher requirement, used by the reliability and its performance of electronic product depend greatly on
Whether heat sink material and heat sink conception are reasonable.Statistics shows that electronic component temperature often raises 2 DEG C, reliability decrease
10%, temperature reduces by 8 DEG C, and the service life of electronic component will double.Therefore, thermal interfacial material is played the part of in information technology field
The role drilled is more and more important.How to further improve the conductibility of thermal interfacial material and reduce thermal resistance, be still current electronic seal
The considerable problem that dress is faced with heat dissipation engineering.Envelope used at present fills and the polymerization of encapsulation predominantly synthesis
Object material, wherein with epoxy resin, polyurethane and rubber are most widely used.Silicon rubber can be grown within the scope of very wide temperature
Phase keeps the heat release that will not absorb heat when elasticity, vulcanization, and is electric assembling with excellent electric property and chemical stability
The preferred material of part embedding.
Silicon rubber is a kind of special synthetic rubber, and using silicon oxygen bond as main chain, and general rubber is using C-C keys as main chain
Structure.Since the particularity of its structure determines that it has high-low temperature resistant, high voltage withstanding, resistance to ozone aging, radiation resistance, height thoroughly
Gas and the media such as lubricating oil are shown with excellent chemical inertness.In addition, use temperature range（-50℃-250℃）It is wide
Extensively, elastic good, anti creepage trace and galvanic corrosion damage performance are good, the still existing good hydrophobicity performance especially after its surface contamination
Feature.Therefore, silicon rubber is used as heat conduction substrate, and the elastic heat conducting that a kind of excellent properties are combined with high heat conduction filler insulate
Material is of great significance.
Heat is mainly transferred by 3 kinds of heat transfer, thermal convection current and heat radiation modes, for heat conductive silica gel,
Main thermal conduction mechanism is exactly to be carried out by heat transfer, and passage of heat deficiency, causes inside currently used heat conductive silica gel
The heat conductivility of silicagel pad is poor, limits its application range.
The content of the invention
It is an object of the present invention to provide a kind of insulated type high thermal conductive silicon glue gaskets.The present invention have thermal conductivity it is good, insulation
Spend the characteristics of high.
Technical scheme：A kind of insulated type high thermal conductive silicon glue gasket, by weight, includes alumina particle
500-800 parts, 20-40 parts of polysiloxanes, 5-25 parts of silica 1,4-9 parts of methyl vinyl silicone rubber, silane coupling agent 3-8
Part, 1-2.5 parts of containing hydrogen silicone oil, 1-3 parts of catalyst.
Foregoing insulated type high thermal conductive silicon glue gasket by weight, includes 620-720 parts of alumina particle, poly- silicon
28-32 parts of oxygen alkane, 8-22 parts of silica 1,5-7 parts of methyl vinyl silicone rubber, 4-7 parts of silane coupling agent, containing hydrogen silicone oil
1.2-1.8 1.6-2 parts of part, catalyst.
Foregoing insulated type high thermal conductive silicon glue gasket by weight, includes 680 parts of alumina particle, polysiloxanes
30 parts, 20 parts of silica, 6 parts of methyl vinyl silicone rubber, 6 parts of silane coupling agent, 1.5 parts of containing hydrogen silicone oil, catalyst 1.8
Part.
Foregoing insulated type high thermal conductive silicon glue gasket, the alumina particle are Spherical alumina particles.
Foregoing insulated type high thermal conductive silicon glue gasket, the Spherical alumina particles include large-sized alumina particle and
The alumina particle of small particle, the grain size of large-sized alumina particle is 50-80 μm, the grain size of the alumina particle of small particle
For 3-7 μm；The mass ratio of large-sized alumina particle and the alumina particle of small particle is 1：1.5-4.
Foregoing insulated type high thermal conductive silicon glue gasket, the grain size of the large-sized alumina particle is 70 μm, small particle
Alumina particle grain size be 5 μm；The mass ratio of large-sized alumina particle and the alumina particle of small particle is 1：3.
Beneficial effects of the present invention：Compared with prior art, the present invention the high heat conductive insulating heat conductive silica gel gasket of the present invention
By rational proportion silica gel component, and to the screening of ball-aluminium oxide particle, realize conjunction of the aluminium oxide particles in silica gel matrix
Reason distribution and the raising of aluminium oxide particles thermal conductivity factor itself make the good insulating of the silica gel pad of the present invention, and its heat conduction system
Number is increased to more than 5.0W, is that the prior art is unattainable.
Specific embodiment
The embodiment of the present invention
Embodiment 1：A kind of insulated type high thermal conductive silicon glue gasket by weight, includes 680 parts of alumina particle, poly- silica
30 parts of alkane, 20 parts of silica, 6 parts of methyl vinyl silicone rubber, 6 parts of silane coupling agent, 1.5 parts of containing hydrogen silicone oil, catalyst 1.8
Part.
The alumina particle is Spherical alumina particles, and Spherical alumina particles include large-sized alumina particle
With the alumina particle of small particle, wherein the grain size of large-sized alumina particle be 70 μm, the alumina particle of small particle
Grain size is 5 μm；The mass ratio of large-sized alumina particle and the alumina particle of small particle is 1：3.
Embodiment 2：A kind of insulated type high thermal conductive silicon glue gasket by weight, includes 500 parts of alumina particle, gathers
20 parts of siloxanes, 5 parts of silica 1,4 parts of methyl vinyl silicone rubber, 3 parts of silane coupling agent, 1 part of containing hydrogen silicone oil, catalyst 1
Part.
The alumina particle is Spherical alumina particles, and Spherical alumina particles include large-sized alumina particle
With the alumina particle of small particle, the grain size of large-sized alumina particle is 50 μm, the grain size of the alumina particle of small particle
For 3 μm；The mass ratio of large-sized alumina particle and the alumina particle of small particle is 1：1.5.
Embodiment 3：A kind of insulated type high thermal conductive silicon glue gasket by weight, includes 800 parts of alumina particle, gathers
40 parts of siloxanes, 25 parts of silica, 9 parts of methyl vinyl silicone rubber, 8 parts of silane coupling agent, 2.5 parts of containing hydrogen silicone oil, catalysis
3 parts of agent.
The alumina particle is Spherical alumina particles, and Spherical alumina particles include large-sized alumina particle
With the alumina particle of small particle, the grain size of large-sized alumina particle is 80 μm, the grain size of the alumina particle of small particle
For 7 μm；The mass ratio of large-sized alumina particle and the alumina particle of small particle is 1：4.
Embodiment 4：The preparation method of above-mentioned insulated type high thermal conductive silicon glue gasket, includes the following steps：
（1）The screening of Spherical alumina particles：Spherical alumina particles by sieve are sieved, obtain big grain size and small particle two
The Spherical alumina particles of kind grain size, wherein the grain size of large-sized alumina particle is 80 μm, the alumina particle of small particle
Grain size be 7 μm；The mass ratio of large-sized alumina particle and the alumina particle of small particle is 1： 4；
（2）The sintering of Spherical alumina particles：Spherical alumina particles are sintered at high temperature, obtain sintered spherical shape
Alumina particle；Sintering temperature is 1400 DEG C；
（3）The grinding of polysiloxanes, silica, containing hydrogen silicone oil and methyl vinyl silicone rubber：By polysiloxanes, titanium dioxide
Silicon, containing hydrogen silicone oil and methyl vinyl silicone rubber, which are added in three-roll grinder, to be ground, and obtains uniformly mixed silicon rubber
Colloid；
（4）Stirring：Silicon rubber colloid is put into container, Spherical alumina particles is added in, is sufficiently stirred in homogenizer
After uniformly, catalyst, high-speed stirred are added in, mixing speed is 3800 rpm, obtains base-material；
（5）It vacuumizes：The base-material stirred evenly is placed in vacuum machine and vacuumizes 20min, the bubble for making to be mixed in base-material is complete
It is extracted；
（6）Sulfidization molding：By base-material cold moudling, led by 180 DEG C of hot-air cure 20min postcoolings to get insulated type height
Hot silicagel pad.
Claims (6)
1. a kind of insulated type high thermal conductive silicon glue gasket, it is characterised in that：By weight, alumina particle 500-800 is included
It is part, 20-40 parts of polysiloxanes, 5-25 parts of silica 1,4-9 parts of methyl vinyl silicone rubber, 3-8 parts of silane coupling agent, hydrogeneous
1-2.5 parts of silicone oil, 1-3 parts of catalyst.
2. insulated type high thermal conductive silicon glue gasket according to claim 1, it is characterised in that：By weight, including aerobic
Change 620-720 parts of alumina particles, 28-32 parts of polysiloxanes, 8-22 parts of silica 1,5-7 parts of methyl vinyl silicone rubber, silane
4-7 parts of coupling agent, 1.2-1.8 parts of containing hydrogen silicone oil, 1.6-2 parts of catalyst.
3. insulated type high thermal conductive silicon glue gasket according to claim 2, it is characterised in that：By weight, including aerobic
Change 680 parts of alumina particles, 30 parts of polysiloxanes, 20 parts of silica, 6 parts of methyl vinyl silicone rubber, 6 parts of silane coupling agent, contain
1.5 parts of hydrogen silicone oil, 1.8 parts of catalyst.
4. according to claim 1-3 any one of them insulated type high thermal conductive silicon glue gaskets, it is characterised in that：The aluminium oxide
Particle is Spherical alumina particles.
5. insulated type high thermal conductive silicon glue gasket according to claim 4, it is characterised in that：The Spherical alumina particles bag
Large-sized alumina particle and the alumina particle of small particle are included, the grain size of large-sized alumina particle is 50-80 μm, small
The grain size of the alumina particle of grain size is 3-7 μm；The mass ratio of large-sized alumina particle and the alumina particle of small particle
For 1：1.5-4.
6. insulated type high thermal conductive silicon glue gasket according to claim 5, it is characterised in that：The large-sized aluminium oxide granule
The grain size of grain is 70 μm, and the grain size of the alumina particle of small particle is 5 μm；The oxidation of large-sized alumina particle and small particle
The mass ratio of alumina particles is 1：3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611012450.8A CN108070257A (en) | 2016-11-17 | 2016-11-17 | A kind of insulated type high thermal conductive silicon glue gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611012450.8A CN108070257A (en) | 2016-11-17 | 2016-11-17 | A kind of insulated type high thermal conductive silicon glue gasket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108070257A true CN108070257A (en) | 2018-05-25 |
Family
ID=62163536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611012450.8A Pending CN108070257A (en) | 2016-11-17 | 2016-11-17 | A kind of insulated type high thermal conductive silicon glue gasket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108070257A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108516735A (en) * | 2018-06-21 | 2018-09-11 | 东莞市摩充电子科技有限公司 | A kind of automobile storage box wireless charging silicagel pad |
| CN110684359A (en) * | 2019-10-28 | 2020-01-14 | 深圳市傲川科技有限公司 | Silica gel gasket and preparation method thereof |
-
2016
- 2016-11-17 CN CN201611012450.8A patent/CN108070257A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108516735A (en) * | 2018-06-21 | 2018-09-11 | 东莞市摩充电子科技有限公司 | A kind of automobile storage box wireless charging silicagel pad |
| CN110684359A (en) * | 2019-10-28 | 2020-01-14 | 深圳市傲川科技有限公司 | Silica gel gasket and preparation method thereof |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180525 |
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| WD01 | Invention patent application deemed withdrawn after publication |