CN109777109A - A kind of preparation method of high thermal conductivity composite silica glue gasket - Google Patents
A kind of preparation method of high thermal conductivity composite silica glue gasket Download PDFInfo
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- CN109777109A CN109777109A CN201711123056.6A CN201711123056A CN109777109A CN 109777109 A CN109777109 A CN 109777109A CN 201711123056 A CN201711123056 A CN 201711123056A CN 109777109 A CN109777109 A CN 109777109A
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- thermal conductivity
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- composite silica
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Abstract
The invention discloses a kind of preparation methods of high thermal conductivity composite silica glue gasket, comprising the following steps: the screening of Spherical alumina particles；The sintering of Spherical alumina particles；The grinding of methyl-silicone oil, polysiloxanes, silica, methyl vinyl silicone rubber and silane coupling agent；Stirring；It vacuumizes；Sulfidization molding and etc..The present invention is compared with prior art, high heat conductive insulating heat conductive silica gel gasket of the invention passes through rational proportion silica gel component, and the screening to ball-aluminium oxide particle, realize the raising of reasonable distribution and aluminium oxide particles thermal coefficient of the aluminium oxide particles in silica gel matrix itself, make the good insulating of silica gel pad of the invention, and its thermal coefficient is increased to 6.0W or more, is that the prior art is unattainable.
Description
Technical field
The present invention relates to a kind of preparation method of silicagel pad, especially a kind of preparation side of high thermal conductivity composite silica glue gasket
Method.
Background technique
Silicon rubber is a kind of special synthetic rubber, and using silicon oxygen bond as main chain, and general rubber is using C-C key as main chain
Structure.Since the particularity of its structure determines that it has high-low temperature resistant, high voltage withstanding, ozone and aging resistance, radiation resistance, height thoroughly
Gas and the media such as lubricating oil are shown with excellent chemical inertness.In addition, (- 50 DEG C -250 DEG C) of use temperature range wide
Extensively, elasticity is good, anti creepage trace and galvanic corrosion damage performance are good, the still existing good hydrophobicity performance especially after its surface contamination
Feature.Therefore, use silicon rubber for heat conduction substrate, the elastic heat conducting for being combined a kind of excellent properties with high thermal conductivity filler insulate
Material is of great significance.
Heat is mainly transmitted by 3 kinds of heat transfer, thermal convection and heat radiation modes, for heat conductive silica gel,
Main thermal conduction mechanism is exactly to be carried out by heat transfer, and passage of heat is insufficient inside currently used heat conductive silica gel, is caused
The heating conduction of silicagel pad is poor, limits its scope of application.
Summary of the invention
The object of the present invention is to provide a kind of preparation methods of high thermal conductivity composite silica glue gasket.The method of the present invention letter
Single, the silicagel pad of preparation has the characteristics that thermal conductivity is good, insulativity is high.
A kind of technical solution of the present invention: preparation method of high thermal conductivity composite silica rubber mat, comprising the following steps:
(1) screening of Spherical alumina particles: Spherical alumina particles are sieved by sieve, obtain the spherical oxygen of two kinds of partial sizes
Change alumina particles；
(2) sintering of Spherical alumina particles: Spherical alumina particles are sintered at high temperature, obtain sintered spherical shape
Alumina particle；Sintering temperature is 1150-1400 DEG C；
(3) it grinds: methyl-silicone oil, polysiloxanes, silica, methyl vinyl silicone rubber and silane coupling agent is added to three
It is ground in roller mill, obtains uniformly mixed silicon rubber colloid；
(4) it stirs: silicon rubber colloid is put into container, Spherical alumina particles are added, are sufficiently stirred in high-speed mixer
After uniformly, catalyst and inhibitor, high-speed stirred is added, mixing speed is 2500-3800 rpm, obtains base-material；
(5) it vacuumizes: the base-material stirred evenly being placed in vacuum machine and is vacuumized, takes out the bubble being mixed in base-material completely
Out；
(6) sulfidization molding: by base-material cold moudling, by cooling down after hot-air cure to get high thermal conductivity composite silica rubber mat.
The preparation method of high thermal conductivity composite silica rubber mat above-mentioned, in step (1), the Spherical alumina particles include
The alumina particle of large-sized alumina particle and small particle, the partial size of large-sized alumina particle are 50-80 μm, granule
The partial size of the alumina particle of diameter is 3-7 μm；The mass ratio of large-sized alumina particle and the alumina particle of small particle is
1:1.5-4.
The preparation method of high thermal conductivity composite silica rubber mat above-mentioned, in step (2), sintering temperature is 1350 DEG C.
The preparation method of high thermal conductivity composite silica rubber mat above-mentioned, in step (5), the time vacuumized is 15-
20min。
The preparation method of high thermal conductivity composite silica rubber mat above-mentioned, in step (6), hot-air cure temperature is 120-
180 DEG C, vulcanization time 15-20min.
The preparation method of high thermal conductivity composite silica rubber mat above-mentioned, by weight, the high thermal conductivity composite silica rubber mat
In include 500 parts of alumina particle, 190 parts of methyl-silicone oil, 15 parts of polysiloxanes, 9 parts of silica 1, methyl ethylene silicon
10 parts of rubber, 5 parts of silane coupling agent, 2 parts of catalyst and 0.6 part of inhibitor.
The preparation method of high thermal conductivity composite silica rubber mat above-mentioned, it is characterised in that: the inhibitor is the suppression of alkynol class
Preparation.
Beneficial effects of the present invention: compared with prior art, the present invention high heat conductive insulating heat conductive silica gel gasket of the invention
By rational proportion silica gel component, and the screening to ball-aluminium oxide particle, realize conjunction of the aluminium oxide particles in silica gel matrix
The raising of reason distribution and aluminium oxide particles thermal coefficient itself, makes the good insulating of silica gel pad of the invention, and its thermally conductive system
Number is increased to 6.0W or more, is that the prior art is unattainable.
Specific embodiment
The embodiment of the present invention
A kind of embodiment 1: preparation method of high thermal conductivity composite silica rubber mat, comprising the following steps:
(1) screening of Spherical alumina particles: Spherical alumina particles are sieved by sieve, obtain big partial size and small particle two
The Spherical alumina particles of kind partial size, wherein the partial size of large-sized alumina particle is 70 μm, the alumina particle of small particle
Partial size be 5 μm；The mass ratio of large-sized alumina particle and the alumina particle of small particle is 1:3.；
(2) sintering of Spherical alumina particles: Spherical alumina particles are sintered at high temperature, obtain sintered spherical shape
Alumina particle；Sintering temperature is 1350 DEG C；
(3) it grinds: methyl-silicone oil, polysiloxanes, silica, methyl vinyl silicone rubber and silane coupling agent is added to three
It is ground in roller mill, obtains uniformly mixed silicon rubber colloid；
(4) it stirs: silicon rubber colloid is put into container, Spherical alumina particles are added, are sufficiently stirred in high-speed mixer
After uniformly, catalyst and inhibitor, high-speed stirred is added, mixing speed is 3100 rpm, obtains base-material；
(5) it vacuumizes: the base-material stirred evenly being placed in vacuum machine and vacuumizes 18min, keeps the bubble being mixed in base-material complete
It is extracted；
(6) sulfidization molding: compound to get high thermal conductivity by cooling after 150 DEG C of hot-air cure 18min by base-material cold moudling
Type silicagel pad.
It by weight, include 500 parts of alumina particle, methyl-silicone oil 190 in the high thermal conductivity composite silica rubber mat
Part, 15 parts of polysiloxanes, 9 parts of silica 1,10 parts of methyl vinyl silicone rubber, 5 parts of silane coupling agent, 2 parts of catalyst and suppression
0.6 part of preparation.
The inhibitor is alkyne inhibitor.
A kind of embodiment 2: preparation method of high thermal conductivity composite silica rubber mat, comprising the following steps:
(1) screening of Spherical alumina particles: Spherical alumina particles are sieved by sieve, obtain big partial size and small particle two
The Spherical alumina particles of kind partial size, wherein the partial size of large-sized alumina particle is 50 μm, the alumina particle of small particle
Partial size be 3 μm；The mass ratio of large-sized alumina particle and the alumina particle of small particle is 1:1.5.；
(2) sintering of Spherical alumina particles: Spherical alumina particles are sintered at high temperature, obtain sintered spherical shape
Alumina particle；Sintering temperature is 1150 DEG C；
(3) it grinds: methyl-silicone oil, polysiloxanes, silica, methyl vinyl silicone rubber and silane coupling agent is added to three
It is ground in roller mill, obtains uniformly mixed silicon rubber colloid；
(4) it stirs: silicon rubber colloid is put into container, Spherical alumina particles are added, are sufficiently stirred in high-speed mixer
After uniformly, catalyst and inhibitor, high-speed stirred is added, mixing speed is 2500 rpm, obtains base-material；
(5) it vacuumizes: the base-material stirred evenly being placed in vacuum machine and vacuumizes 15min, keeps the bubble being mixed in base-material complete
It is extracted；
(6) sulfidization molding: compound to get high thermal conductivity by cooling after 120 DEG C of hot-air cure 15min by base-material cold moudling
Type silicagel pad.
It by weight, include 500 parts of alumina particle, methyl-silicone oil 190 in the high thermal conductivity composite silica rubber mat
Part, 15 parts of polysiloxanes, 9 parts of silica 1,10 parts of methyl vinyl silicone rubber, 5 parts of silane coupling agent, 2 parts of catalyst and suppression
0.6 part of preparation.
The inhibitor is alkyne inhibitor.
A kind of embodiment 3: preparation method of high thermal conductivity composite silica rubber mat, comprising the following steps:
(1) screening of Spherical alumina particles: Spherical alumina particles are sieved by sieve, obtain big partial size and small particle two
The Spherical alumina particles of kind partial size, wherein the partial size of large-sized alumina particle is 80 μm, the alumina particle of small particle
Partial size be 7 μm；The mass ratio of large-sized alumina particle and the alumina particle of small particle is 1:4.；
(2) sintering of Spherical alumina particles: Spherical alumina particles are sintered at high temperature, obtain sintered spherical shape
Alumina particle；Sintering temperature is 1400 DEG C；
(3) it grinds: methyl-silicone oil, polysiloxanes, silica, methyl vinyl silicone rubber and silane coupling agent is added to three
It is ground in roller mill, obtains uniformly mixed silicon rubber colloid；
(4) it stirs: silicon rubber colloid is put into container, Spherical alumina particles are added, are sufficiently stirred in high-speed mixer
After uniformly, catalyst and inhibitor, high-speed stirred is added, mixing speed is 3800 rpm, obtains base-material；
(5) it vacuumizes: the base-material stirred evenly being placed in vacuum machine and vacuumizes 20min, keeps the bubble being mixed in base-material complete
It is extracted；
(6) sulfidization molding: compound to get high thermal conductivity by cooling after 180 DEG C of hot-air cure 20min by base-material cold moudling
Type silicagel pad.
It by weight, include 500 parts of alumina particle, methyl-silicone oil 190 in the high thermal conductivity composite silica rubber mat
Part, 15 parts of polysiloxanes, 9 parts of silica 1,10 parts of methyl vinyl silicone rubber, 5 parts of silane coupling agent, 2 parts of catalyst and suppression
0.6 part of preparation.
The inhibitor is alkyne inhibitor.
Claims (7)
1. a kind of preparation method of high thermal conductivity composite silica rubber mat, it is characterised in that: the following steps are included:
(1) screening of Spherical alumina particles: Spherical alumina particles are sieved by sieve, obtain the spherical oxygen of two kinds of partial sizes
Change alumina particles；
(2) sintering of Spherical alumina particles: Spherical alumina particles are sintered at high temperature, obtain sintered spherical shape
Alumina particle；Sintering temperature is 1150-1400 DEG C；
(3) it grinds: methyl-silicone oil, polysiloxanes, silica, methyl vinyl silicone rubber and silane coupling agent is added to three
It is ground in roller mill, obtains uniformly mixed silicon rubber colloid；
(4) it stirs: silicon rubber colloid is put into container, Spherical alumina particles are added, are sufficiently stirred in high-speed mixer
After uniformly, catalyst and inhibitor, high-speed stirred is added, mixing speed is 2500-3800 rpm, obtains base-material；
(5) it vacuumizes: the base-material stirred evenly being placed in vacuum machine and is vacuumized, takes out the bubble being mixed in base-material completely
Out；
(6) sulfidization molding: by base-material cold moudling, by cooling down after hot-air cure to get high thermal conductivity composite silica rubber mat.
2. the preparation method of high thermal conductivity composite silica rubber mat according to claim 1, it is characterised in that: in step (1),
The Spherical alumina particles include the alumina particle of large-sized alumina particle and small particle, large-sized aluminium oxide granule
The partial size of grain is 50-80 μm, and the partial size of the alumina particle of small particle is 3-7 μm；Large-sized alumina particle and small particle
Alumina particle mass ratio be 1:1.5-4.
3. the preparation method of high thermal conductivity composite silica rubber mat according to claim 1, it is characterised in that: in step (2),
Sintering temperature is 1350 DEG C.
4. the preparation method of high thermal conductivity composite silica rubber mat according to claim 1, it is characterised in that: in step (5),
The time vacuumized is 15-20min.
5. the preparation method of high thermal conductivity composite silica rubber mat according to claim 1, it is characterised in that: in step (6),
Hot-air cure temperature is 120-180 DEG C, vulcanization time 15-20min.
6. the preparation method of high thermal conductivity composite silica rubber mat according to claim 1, it is characterised in that: by weight,
It include 500 parts of alumina particle, 190 parts of methyl-silicone oil, 15 parts of polysiloxanes, dioxy in the high thermal conductivity composite silica rubber mat
19 parts of SiClx, 10 parts of methyl vinyl silicone rubber, 5 parts of silane coupling agent, 2 parts of catalyst and 0.6 part of inhibitor.
7. the preparation method of high thermal conductivity composite silica rubber mat according to claim 1, it is characterised in that: the inhibitor
For alkyne inhibitor.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711123056.6A CN109777109A (en) | 2017-11-14 | 2017-11-14 | A kind of preparation method of high thermal conductivity composite silica glue gasket |
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| CN201711123056.6A CN109777109A (en) | 2017-11-14 | 2017-11-14 | A kind of preparation method of high thermal conductivity composite silica glue gasket |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111732931A (en) * | 2020-06-29 | 2020-10-02 | 王朝鹏 | Heat-conducting adhesive silica gel |
| CN112538268A (en) * | 2020-12-08 | 2021-03-23 | 东莞烯事达新材料有限公司 | Preparation method and device of heat conduction gasket with high heat conductivity coefficient |
-
2017
- 2017-11-14 CN CN201711123056.6A patent/CN109777109A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111732931A (en) * | 2020-06-29 | 2020-10-02 | 王朝鹏 | Heat-conducting adhesive silica gel |
| CN112538268A (en) * | 2020-12-08 | 2021-03-23 | 东莞烯事达新材料有限公司 | Preparation method and device of heat conduction gasket with high heat conductivity coefficient |
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Application publication date: 20190521 |