CN105865136A - Heat radiation device of semiconductor refrigerator - Google Patents
Heat radiation device of semiconductor refrigerator Download PDFInfo
- Publication number
- CN105865136A CN105865136A CN201610373609.2A CN201610373609A CN105865136A CN 105865136 A CN105865136 A CN 105865136A CN 201610373609 A CN201610373609 A CN 201610373609A CN 105865136 A CN105865136 A CN 105865136A
- Authority
- CN
- China
- Prior art keywords
- semiconductor
- heat radiation
- aluminum liner
- cold
- guiding block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 34
- 230000005855 radiation Effects 0.000 title abstract description 10
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 25
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 235000012149 noodles Nutrition 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 14
- 238000004378 air conditioning Methods 0.000 abstract 2
- 230000000191 radiation effect Effects 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/10—Arrangements for mounting in particular locations, e.g. for built-in type, for corner type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat radiation device of a semiconductor refrigerator. The heat radiation device comprises an aluminum inner container, two left and right semiconductor refrigeration air-conditioning structures and two cold guide blocks, wherein the two left and right semiconductor refrigeration air-conditioning structures are positioned on an upper end surface of a door-shaped structure of the aluminum inner container; the two cold guide blocks are positioned on two sides of the door-shaped structure of the aluminum inner container and are of a same structure; the door-shaped structure of the aluminum inner container is made of a hard material; a boss is formed inside a concave pit below the aluminum inner container; the boss is connected with a first semiconductor refrigeration piece through a uniform temperature plate; heat radiation fins are arranged below the first semiconductor refrigeration piece. Due to special structural arrangement of the heat radiation fins of the heat radiation device and cooperative operation of multiple groups of heat radiation and refrigeration equipment, cold can be rapidly diffused into a refrigerator, the cold radiation effect is improved, and the property of the refrigerator is greatly improved.
Description
Technical field
The invention belongs to technical field of refrigeration equipment, more specifically, especially relate to a kind of semiconductor freezer
Heat abstractor.
Background technology
Traditional refrigerator semiconductor refrigeration chip heat radiation uses the mode of fin heat radiation, will fin and system
The directly fixing laminating of the hot junction of cold core sheet.
When refrigerator semiconductor refrigeration chip works, the cold end of refrigerating chip absorbs refrigerator semiconductor refrigeration chip
The heat that work produces quickly is delivered to the hot junction of refrigerating chip, passes through forced convertion in the hot junction of refrigerating chip
Or the disperses heat that hot junction is transmitted by the radiating mode such as free convection, to keep the low temperature of the cold end of refrigerating chip
The ability of heat absorption, thus reach the purpose to container of refrigerator cooling.
Owing to refrigerator semiconductor refrigeration chip is less relative to the area of fin, and traditional heat-dissipating sheet mostly is aluminum
Heat sink material, when hot junction heat transmits to fin, can form bigger temperature on radiator heat-dissipation surface
Degree gradient, i.e. the nearest away from thermal source, its heat and thermo-field thoery, distance thermal source is the most remote, and its heat and temperature are more
Low.Due to spreader surface temperature and heat be distributed uneven, thus can make refrigerator semiconductor refrigerating core
Sheet refrigerating efficiency reduces, and can make be greatly reduced the service life of refrigerator semiconductor refrigeration chip simultaneously.
Summary of the invention
It is an object of the invention to provide the heat abstractor of a kind of semiconductor freezer.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of heat abstractor of semiconductor freezer, including:
Aluminum liner, described aluminum liner is " Π " type structure hard material, sets below described aluminum liner in recess
There is boss, described boss connects the first semiconductor chilling plate, described first semiconductor refrigerating by temperature-uniforming plate
It it is fin below sheet；
It is positioned at two, the left and right semiconductor refrigerating air conditioner structure of aluminum liner " Π " type structure upper surface, described half
Conductor refrigeration air-conditioner structure includes copper fin, the huyashi-chuuka (cold chinese-style noodles) contact of described copper fin and the second semiconductor chilling plate,
The hot side of described second semiconductor chilling plate and water-cooled row contact, described water-cooled arrange be provided with respectively with water pipe
The water inlet being connected and outlet；
It is positioned at the cool guiding block that two structures of aluminum liner " Π " type structure both sides are identical, respectively left end conduction cooling
Block and right-hand member cool guiding block, described cool guiding block is freezed by refrigerating chip, and refrigerating chip points to aluminum liner inner chamber side
To installing cold scattering fan.
Beneficial effects of the present invention: the topology layout that the fin of the present invention is special, many group heat radiations and refrigeration set
Standby cooperation is run so that cold, quickly to refrigerator internal diffusion, improves cold scattering effect, and refrigerator performance obtains very
Big improvement.
Accompanying drawing explanation
Fig. 1 is present configuration schematic diagram.
1-aluminum liner, 2-left end cool guiding block, 3-right-hand member cool guiding block, 4-boss, 5-fin, 6-the first half leads
Body cooling piece, 7-cold scattering fan, 8-refrigerating chip, 9-copper fin, 10-the second semiconductor chilling plate, 11-water-cooled
Row, 12-outlet, 13 water inlets.
Detailed description of the invention
With specific embodiment, the present invention is described in further detail below in conjunction with the accompanying drawings.
As it is shown in figure 1, the heat abstractor of a kind of semiconductor freezer, including:
Aluminum liner 1, described aluminum liner 1 is " Π " type structure hard material, recess below described aluminum liner 1
Inside it is provided with boss 4, described boss 4 connects the first semiconductor chilling plate 6 by temperature-uniforming plate, described the first half
It it is fin 5 below conductor cooling piece 6；
It is positioned at two, the left and right semiconductor refrigerating air conditioner structure of aluminum liner 1 " Π " type structure upper surface, described half
Conductor refrigeration air-conditioner structure includes copper fin 9, described copper fin 9 and the huyashi-chuuka (cold chinese-style noodles) of the second semiconductor chilling plate 10
Contact, the hot side of described second semiconductor chilling plate 10 contacts with water-cooled row 11, and described water-cooled row 11 sets
It is equipped with the water inlet 13 and outlet 12 being connected respectively with water pipe；
It is positioned at the cool guiding block that two structures of aluminum liner 1 " Π " type structure both sides are identical, respectively left end conduction cooling
Block 2 and right-hand member cool guiding block 3, described cool guiding block is freezed by refrigerating chip 8, and refrigerating chip 8 points to aluminum liner
In 1, cavity direction installs cold scattering fan 7.
Above content is only to present configuration example and explanation, the technology of affiliated the art
Described specific embodiment is made various amendment or supplements or use similar mode to substitute by personnel,
Without departing from invention structure or surmount scope defined in the claims, the present invention all should be belonged to
Protection domain.
Claims (1)
1. the heat abstractor of a semiconductor freezer, it is characterised in that including:
Aluminum liner (1), described aluminum liner (1) is " Π " type structure hard material, described aluminum liner (1)
Being provided with boss (4) in the recess of lower section, described boss connects the first semiconductor chilling plate by temperature-uniforming plate on (4)
(6), described first semiconductor chilling plate (6) lower section is fin (5)；
It is positioned at two, the left and right semiconductor refrigerating air conditioner structure of aluminum liner (1) " Π " type structure upper surface, institute
State semiconductor refrigerating air conditioner structure and include copper fin (9), described copper fin (9) and the second semiconductor chilling plate
(10) huyashi-chuuka (cold chinese-style noodles) contact, the hot side of described second semiconductor chilling plate (10) contacts with water-cooled row (11),
It is provided with, in described water-cooled row (11), the water inlet (13) and outlet (12) being connected respectively with water pipe；
It is positioned at the cool guiding block that two structures of aluminum liner (1) " Π " type structure both sides are identical, respectively left end
Cool guiding block (2) and right-hand member cool guiding block (3), described cool guiding block is freezed by refrigerating chip (8), cold core
Sheet (8) points to aluminum liner (1) interior cavity direction and installs cold scattering fan (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610373609.2A CN105865136A (en) | 2016-05-26 | 2016-05-26 | Heat radiation device of semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610373609.2A CN105865136A (en) | 2016-05-26 | 2016-05-26 | Heat radiation device of semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105865136A true CN105865136A (en) | 2016-08-17 |
Family
ID=56643069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610373609.2A Pending CN105865136A (en) | 2016-05-26 | 2016-05-26 | Heat radiation device of semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105865136A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2229638Y (en) * | 1995-01-25 | 1996-06-19 | 夏俊峰 | semiconductor refrigerator |
| JP2000055524A (en) * | 1998-08-07 | 2000-02-25 | Zojirushi Corp | Electronic refrigerator |
| CN2497243Y (en) * | 2001-09-11 | 2002-06-26 | 李生铭 | Electronic refrigerator |
| EP1253387A1 (en) * | 2001-04-24 | 2002-10-30 | Samsung Electronics Co., Ltd. | Storage box |
| CN201116819Y (en) * | 2007-11-05 | 2008-09-17 | 广东富信电子科技有限公司 | Modified semiconductor refrigerator structure |
| CN204739708U (en) * | 2015-03-31 | 2015-11-04 | 五邑大学 | Semiconductor refrigeration air conditioner structure |
| CN205825570U (en) * | 2016-05-26 | 2016-12-21 | 安徽明辉成美科技发展有限公司 | A kind of heat abstractor of semiconductor freezer |
-
2016
- 2016-05-26 CN CN201610373609.2A patent/CN105865136A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2229638Y (en) * | 1995-01-25 | 1996-06-19 | 夏俊峰 | semiconductor refrigerator |
| JP2000055524A (en) * | 1998-08-07 | 2000-02-25 | Zojirushi Corp | Electronic refrigerator |
| EP1253387A1 (en) * | 2001-04-24 | 2002-10-30 | Samsung Electronics Co., Ltd. | Storage box |
| CN2497243Y (en) * | 2001-09-11 | 2002-06-26 | 李生铭 | Electronic refrigerator |
| CN201116819Y (en) * | 2007-11-05 | 2008-09-17 | 广东富信电子科技有限公司 | Modified semiconductor refrigerator structure |
| CN204739708U (en) * | 2015-03-31 | 2015-11-04 | 五邑大学 | Semiconductor refrigeration air conditioner structure |
| CN205825570U (en) * | 2016-05-26 | 2016-12-21 | 安徽明辉成美科技发展有限公司 | A kind of heat abstractor of semiconductor freezer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160817 |